CN216107260U - Part partition electroplating structure - Google Patents
Part partition electroplating structure Download PDFInfo
- Publication number
- CN216107260U CN216107260U CN202121830100.9U CN202121830100U CN216107260U CN 216107260 U CN216107260 U CN 216107260U CN 202121830100 U CN202121830100 U CN 202121830100U CN 216107260 U CN216107260 U CN 216107260U
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- CN
- China
- Prior art keywords
- electroplating
- material belt
- silver plating
- silver
- forming material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000009713 electroplating Methods 0.000 title claims abstract description 41
- 238000005192 partition Methods 0.000 title abstract description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052709 silver Inorganic materials 0.000 claims abstract description 27
- 239000004332 silver Substances 0.000 claims abstract description 27
- 238000007747 plating Methods 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 20
- 239000012778 molding material Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 2
- 238000004080 punching Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses a part partition electroplating structure. The silver plating device comprises a forming material belt formed by punching and a plurality of silver plating areas uniformly distributed on the forming material belt, silver plating is directly carried out on each silver plating area, and the silver plated material belt is punched to form a product. After adopting foretell structure, because directly carry out stamping forming to the material area before electroplating, still effectively reduced the weight of part when reducing the surface area of part, reduced the part cost, the electroplated surface area that has significantly reduced only needs carry out silvering on electroplating the particular position of part, can satisfy superior electric conductive property, effectively reduced the electroplating cost when guaranteeing the superior electric conductive property of part from this to realized reaching the purpose that the part is electroplated and is fallen originally, moreover, electroplating process is stable, and efficiency is high, improved the electroplating effect, satisfy the productivity requirement in the future completely.
Description
Technical Field
The utility model relates to a structure for electroplating parts, in particular to a part partition electroplating structure.
Background
In order to enable parts to have better conductivity, silver plating of the parts is a common process in electroplating, however, if the parts are subjected to silver plating integrally during silver plating, the cost is very high, the resource waste is large, and the overall cost of part production is high, and in addition, the large area and the heavy weight of the parts of the existing electroplating parts are also one of the reasons for high overall cost; therefore, how to reduce the cost of the parts while satisfying the requirement that the parts have excellent conductive performance becomes a technical problem to be solved urgently.
Disclosure of Invention
The utility model aims to provide a part partition electroplating structure which can ensure excellent conductivity and effectively reduce electroplating cost.
In order to solve the technical problem, the part partition electroplating structure comprises a forming material belt formed by stamping and a plurality of silver-plated areas uniformly distributed on the forming material belt, wherein silver is directly plated on each silver-plated area, and the silver-plated material belt is stamped to form a product.
And the silver plating areas are arranged on the forming material belt in parallel.
The forming material belt is provided with a positioning hole, and the silver plating can be accurately positioned through the positioning of the positioning hole.
And a stamping groove for reducing weight is arranged on the molding material belt.
Silver plating areas are arranged on the front surface and the back surface of the molding material belt.
After adopting foretell structure, because directly carry out stamping forming to the material area before electroplating, still effectively reduced the weight of part when reducing the surface area of part, the part cost is reduced, a plurality of silver-plating regions of evenly arranging at the tow sides in shaping material area carry out silver-plating, the surface area of electroplating has significantly reduced, only need to carry out silver-plating on the particular position of electroplating the part, can satisfy superior electric conductive property, effectively reduced the electroplating cost when guaranteeing the superior electric conductive property of part from this, thereby realized reaching the part and electroplated the mesh of reducing the cost, moreover, regard the locating hole on the material area as the location benchmark, realize the electroplating in accurate electroplating region through electroplating the mould, electroplating process is stable, and efficiency is high, improve the electroplating effect, satisfy the productivity requirement in the future completely.
Drawings
FIG. 1 is a schematic front view of a part partitioned electroplating structure according to the present invention;
FIG. 2 is a schematic view of a backside structure of a part-partitioned electroplating structure according to the present invention.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings and embodiments.
As shown in the figure, the part partition electroplating structure comprises a stamping forming material belt 1 and a plurality of silver plating areas 2 which are uniformly and parallelly arranged on the front surface and the back surface of the forming material belt, wherein the forming material belt 1 is provided with positioning holes, so that the positioning holes on the material belt are used as positioning references, electroplating of the precise electroplating areas can be realized through an electroplating mold, the silver plating process is stable, the electroplating efficiency and the electroplating quality are improved, the electroplating areas are accurately positioned, the performance and the requirements of parts are completely met, particularly, the electroplating surface area is reduced through the designed plurality of silver plating areas, only the areas needing silver plating are electroplated, the waste of silver plating is reduced, a large amount of electroplating cost is reduced, after silver plating is carried out on each silver plating area 2, final forming and blanking of the parts are completed through stamping, and the manufactured products can be widely applied to the automobile electronic industry, not only reduces the electroplating cost of parts, but also saves silver element resources, and completely meets the requirements of cost reduction and environmental protection in the current manufacturing industry.
Furthermore, before electroplating, stamping grooves 3 for reducing weight can be arranged on the molding material belt 1, so that the weight of parts of the molding material belt is further reduced.
Claims (5)
1. A part subregion electroplates structure which characterized in that: the silver plating device comprises a forming material belt (1) formed by stamping and a plurality of silver plating areas (2) uniformly distributed on the forming material belt, wherein silver plating is directly carried out on each silver plating area (2) and the silver plated material belt is stamped to form a product.
2. The part-partitioned electroplating structure as claimed in claim 1, wherein: the silver-plated regions (2) are arranged on the molding material belt (1) in parallel.
3. The part-partitioned electroplating structure as claimed in claim 1 or 2, wherein: the forming material belt (1) is provided with a positioning hole, and accurate positioning during silver plating can be achieved through positioning of the positioning hole.
4. The part-partitioned electroplating structure as claimed in claim 3, wherein: and a stamping groove (3) for reducing weight is arranged on the molding material belt (1).
5. The part-partitioned electroplating structure as claimed in claim 4, wherein: the front surface and the back surface of the molding material belt (1) are provided with silver plating areas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121830100.9U CN216107260U (en) | 2021-08-06 | 2021-08-06 | Part partition electroplating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121830100.9U CN216107260U (en) | 2021-08-06 | 2021-08-06 | Part partition electroplating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216107260U true CN216107260U (en) | 2022-03-22 |
Family
ID=80724882
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121830100.9U Active CN216107260U (en) | 2021-08-06 | 2021-08-06 | Part partition electroplating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216107260U (en) |
-
2021
- 2021-08-06 CN CN202121830100.9U patent/CN216107260U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240617 Address after: Germany Patentee after: Ebb & C Co.,Ltd. Country or region after: Germany Address before: NO.119, Weisan Road, Zhenjiang City, Jiangsu Province, 212009 Patentee before: ZHENJIANG FINEMETAL AUTOMOTIVE COMPONENTS CO.,LTD. Country or region before: China |