CN216099757U - Heat emission treatment device for solar silicon wafer processing - Google Patents

Heat emission treatment device for solar silicon wafer processing Download PDF

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Publication number
CN216099757U
CN216099757U CN202122267023.7U CN202122267023U CN216099757U CN 216099757 U CN216099757 U CN 216099757U CN 202122267023 U CN202122267023 U CN 202122267023U CN 216099757 U CN216099757 U CN 216099757U
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fixedly connected
silicon wafer
left fixed
plate
processing apparatus
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CN202122267023.7U
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谢立平
林锐
李唐
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Kunshan Laiqilong Precision Technology Co ltd
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Kunshan Laiqilong Precision Technology Co ltd
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Abstract

The utility model discloses a heat emission treatment device for processing a solar silicon wafer, which comprises a left fixed side plate, wherein a reserved leakage net is arranged inside the bottom end of the left fixed side plate, the left side of the bottom end of the left fixed side plate is fixedly connected with an installation plate, a first blowing fan is fixedly connected inside the installation plate, and an adsorption block is fixedly connected to the right side of the bottom end of the left fixed side plate. This heat emission processing apparatus is used in processing of solar energy silicon chip, left side fixed curb plate top can laminate in the outside of solar energy silicon chip processingequipment, processing apparatus's practicality has been improved, reserve simultaneously that the strainer can aim at solar energy silicon chip processingequipment's air outlet when using, induced draft with it itself, processing apparatus's practicality has been improved, the adsorption block can help the inseparable laminating of left side fixed curb plate in processing apparatus's the outside, blower fan one can both normal use with blower fan two simultaneously, induced draft to solar energy silicon chip processingequipment inside, the normal result of use of this processing apparatus has been increased.

Description

Heat emission treatment device for solar silicon wafer processing
Technical Field
The utility model relates to the technical field of solar silicon wafers, in particular to a heat emission treatment device for processing a solar silicon wafer.
Background
The solar cell is divided into a crystalline silicon type and an amorphous silicon type, wherein the crystalline silicon type cell can be divided into a single crystal cell and a polycrystalline cell; single crystal silicon differs more efficiently than crystalline silicon. The photovoltaic semiconductor sheet is a photovoltaic semiconductor sheet which directly generates electricity by utilizing sunlight, is also called as a solar chip or a photovoltaic cell, and can output voltage and generate current under the condition of a loop as long as the sheet is illuminated under a certain illumination condition.
However, the existing solar silicon wafer can generate a large amount of heat during production, so that certain dangerousness can be caused during the use process, and the solar silicon wafer can not be better processed.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a heat emission treatment device for processing a solar silicon wafer, which is used for solving the problems that the existing solar silicon wafer in the background technology can generate a large amount of heat during production, so that certain danger can be caused during the use process, and the better processing of the solar silicon wafer is not facilitated.
In order to achieve the purpose, the utility model provides the following technical scheme: a heat emission treatment device for processing solar silicon wafers comprises a left fixed side plate, a reserved leakage net is arranged inside the bottom end of the left fixed side plate, the left side of the bottom end of the left fixed side plate is fixedly connected with a mounting plate, the interior of the mounting plate is fixedly connected with a first blowing fan, the right side of the bottom end of the left fixed side plate is fixedly connected with an adsorption block, the right side of the top end of the left fixed side plate is fixedly connected with a telescopic rod, the right side of the telescopic rod is fixedly connected with a connecting block, the inside of the connecting block is movably connected with a sheathing plate, the outer part of the right side of the sheathing board is movably connected with a movable outer cylinder, the right side of the movable outer cylinder is fixedly connected with a motor, the top end of the movable outer barrel is internally provided with a sunken leak hole, the left side of the motor is fixedly connected with a blowing fan II, and the front side and the rear side of the inner wall of the movable outer barrel are fixedly connected with side fixing fans.
Preferably, the left fixed side plate is designed in an L shape, the reserved drain net is hollow, and the reserved drain net is connected with the mounting plate in a sleeved mode.
Preferably, the number of the adsorption blocks is two, the adsorption blocks are in adhesive connection with the left fixed side plate, and the first blowing fan and the second blowing fan are designed to be symmetrical left and right.
Preferably, the number that the telescopic link set up is two, the telescopic link is the telescopic design, the board is established for the cover with the connecting block and is connected to the cover.
Preferably, the inner part of the movable outer cylinder is designed to be hollow, the left side of the movable outer cylinder is designed to be concave, and the concave leak hole is designed to be hollow.
Preferably, the number of the side fixing fans is two, and the motor is electrically connected with the second blowing fan.
Compared with the prior art, the utility model has the beneficial effects that: the heat emission treatment device for processing the solar silicon wafer has the advantages that the top end of the left fixed side plate can be attached to the outer side of the solar silicon wafer processing device, the practicability of the treatment device is improved, the leakage net is reserved and can be aligned to the air outlet of the solar silicon wafer processing device when in use, air suction is carried out by the leakage net, the practicability of the treatment device is improved, the adsorption block can help the left fixed side plate to be closely attached to the outer side of the treatment device, the first air blowing fan and the second air blowing fan can be normally used simultaneously, air suction is carried out in the solar silicon wafer processing device, the normal use effect of the treatment device is improved, the telescopic rod can be normally stretched, the device can be clamped and installed outside the solar silicon wafer processing devices with different sizes, the application range of the device is improved, ventilation can be utilized in the movable outer barrel, and hot air can be discharged through the concave leakage holes, the practicability of the processing device is improved, the side fixing fan can suck air, and the motor ensures the normal operation of the device.
Drawings
FIG. 1 is an overall structural view of the present invention;
FIG. 2 is a front view of the present invention;
FIG. 3 is a front cross-sectional view of the present invention;
FIG. 4 is a side view of the present invention.
In the figure: 1. a left fixed side plate; 2. reserving a leakage net; 3. mounting a plate; 4. a first blowing fan; 5. an adsorption block; 6. a telescopic rod; 7. connecting blocks; 8. sleeving a plate; 9. a movable outer cylinder; 10. a recessed leak; 11. an electric motor; 12. a second blowing fan; 13. the fan is fixed to the side.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a heat emission processing apparatus is used in processing of solar energy silicon chip, including left fixed curb plate 1, left fixed curb plate 1's bottom is inside to be seted up and to be reserved strainer 2, left fixed curb plate 1's bottom left side fixedly connected with mounting panel 3, mounting panel 3's inside fixedly connected with blower 4, left fixed curb plate 1's bottom right side fixedly connected with adsorbs piece 5, left fixed curb plate 1's top right side fixedly connected with telescopic link 6, telescopic link 6's right side fixedly connected with connecting block 7, the inside swing joint of connecting block 7 has the cover and establishes board 8, the outside swing joint in right side of cover establishing board 8 has movable urceolus 9, the right side fixedly connected with motor 11 of movable urceolus 9, sunken small opening 10 has been seted up to the top of movable urceolus 9 inside, motor 11's left side fixedly connected with blower two 12, both sides fixedly connected with side fixed fan 13 around the inner wall department of movable urceolus 9.
In the utility model: the left fixed side plate 1 is designed in an L shape, the interior of the reserved leakage net 2 is designed in a hollow way, and the reserved leakage net 2 is connected with the mounting plate 3 in a sleeved mode; the top end of the left fixed side plate 1 can be attached to the outer side of the solar silicon wafer processing device, the practicability of the processing device is improved, the air outlet of the solar silicon wafer processing device can be aligned to the leakage net 2 when the processing device is used, air suction is performed through the air outlet, and the practicability of the processing device is improved.
In the utility model: the number of the adsorption blocks 5 is two, the adsorption blocks 5 are in adhesive connection with the left fixed side plate 1, and the first blowing fan 4 and the second blowing fan 12 are designed to be symmetrical left and right; the adsorption block 5 can help the left fixed side plate 1 to be tightly attached to the outer side of the processing device, and the first blowing fan 4 and the second blowing fan 12 can be normally used to suck air inside the solar silicon wafer processing device, so that the normal use effect of the processing device is improved.
In the utility model: the number of the telescopic rods 6 is two, the telescopic rods 6 are of telescopic design, and the sleeving plate 8 is connected with the connecting block 7 in a sleeving manner; the telescopic rod 6 can be extended normally, so that the device can be clamped and installed outside the solar silicon wafer processing devices with different sizes, and the application range of the device is widened.
In the utility model: the inner part of the movable outer cylinder 9 is designed to be hollow, the left side of the movable outer cylinder 9 is designed to be concave, and the concave leak hole 10 is designed to be hollow; the inside of the movable outer cylinder 9 can be ventilated, and the sunken weep holes 10 can also discharge hot air, thereby improving the practicability of the treatment device.
In the utility model: the number of the side edge fixed fans 13 is two, and the motor 11 is electrically connected with the second blowing fan 12; the side fixed fan 13 can be used for air suction, and the motor 11 ensures the normal operation and use of the device.
The working principle is as follows: can install this heat emission processing apparatus block in the solar energy silicon chip processingequipment outside that needs use during the use, utilize adsorption block 5 and solar energy silicon chip processingequipment closely to laminate, guarantee that processing apparatus's activity urceolus 9 middle-end position and the position of reserving hourglass net 2 are corresponding with hot-blast discharge port, after guaranteeing that processing apparatus connects the upper power, motor 11 drives blower fan two 12 and rotates, side fixed air blower 13 and blower fan 4 can both induced draft simultaneously, absorb the inside steam of solar energy silicon chip processingequipment, and discharge from sunken small opening 10, can also take off this processing apparatus fast after using the completion, the convenience of this processing apparatus use has been improved.
In summary, the following steps: the heat emission treatment device for processing the solar silicon wafer has the advantages that the top end of the left fixed side plate 1 can be attached to the outer side of the solar silicon wafer processing device, the practicability of the treatment device is improved, meanwhile, the leakage net 2 is reserved and can be aligned to the air outlet of the solar silicon wafer processing device when in use, air suction is carried out by the leakage net, the practicability of the treatment device is improved, the adsorption block 5 can help the left fixed side plate 1 to be closely attached to the outer side of the treatment device, the first blowing fan 4 and the second blowing fan 12 can be normally used simultaneously, air suction is carried out in the solar silicon wafer processing device, the normal use effect of the treatment device is improved, the telescopic rod 6 can be normally stretched and stretched, the device can be clamped and installed outside the solar silicon wafer processing devices with different sizes, the application range of the device is improved, ventilation can be utilized in the movable outer barrel 9, and hot air can be discharged from the concave leakage hole 10, the practicability of the processing device is improved, the side fixing fan 13 can suck air, and the motor 11 ensures the normal operation and use of the device.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The heat emission treatment device for processing the solar silicon wafer comprises a left fixed side plate (1) and is characterized in that a reserved leakage net (2) is arranged inside the bottom end of the left fixed side plate (1), a mounting plate (3) is fixedly connected to the left side of the bottom end of the left fixed side plate (1), a first blowing fan (4) is fixedly connected to the inside of the mounting plate (3), an adsorption block (5) is fixedly connected to the right side of the bottom end of the left fixed side plate (1), a telescopic rod (6) is fixedly connected to the right side of the top end of the left fixed side plate (1), a connecting block (7) is fixedly connected to the right side of the telescopic rod (6), a sheathing plate (8) is movably connected to the inside of the connecting block (7), a movable outer barrel (9) is movably connected to the outside of the right side of the sheathing plate (8), and a motor (11) is fixedly connected to the right side of the movable outer barrel (9), the novel electric hair drier is characterized in that a sunken leak hole (10) is formed in the top end of the movable outer barrel (9), a blowing fan II (12) is fixedly connected to the left side of the motor (11), and side fixing fans (13) are fixedly connected to the front side and the rear side of the inner wall of the movable outer barrel (9).
2. The heat discharge processing apparatus for processing solar silicon wafer according to claim 1, wherein: the left fixed side plate (1) is designed in an L shape, the reserved leakage net (2) is hollow, and the reserved leakage net (2) is connected with the mounting plate (3) in a sleeved mode.
3. The heat discharge processing apparatus for processing solar silicon wafer according to claim 1, wherein: the adsorption blocks (5) are arranged in two pairs, the adsorption blocks (5) are in adhesive connection with the left fixed side plate (1), and the first blowing fan (4) and the second blowing fan (12) are in bilateral symmetry.
4. The heat discharge processing apparatus for processing solar silicon wafer according to claim 1, wherein: the number that telescopic link (6) set up is two, telescopic link (6) are the telescopic design, cover and establish board (8) and connecting block (7) and establish for the cover and be connected.
5. The heat discharge processing apparatus for processing solar silicon wafer according to claim 1, wherein: the inner part of the movable outer cylinder (9) is designed to be hollow, the left side of the movable outer cylinder (9) is designed to be concave, and the concave leak holes (10) are designed to be hollow.
6. The heat discharge processing apparatus for processing solar silicon wafer according to claim 1, wherein: the number of the side fixing fans (13) is two, and the motor (11) is electrically connected with the second blowing fan (12).
CN202122267023.7U 2021-09-18 2021-09-18 Heat emission treatment device for solar silicon wafer processing Active CN216099757U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122267023.7U CN216099757U (en) 2021-09-18 2021-09-18 Heat emission treatment device for solar silicon wafer processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122267023.7U CN216099757U (en) 2021-09-18 2021-09-18 Heat emission treatment device for solar silicon wafer processing

Publications (1)

Publication Number Publication Date
CN216099757U true CN216099757U (en) 2022-03-22

Family

ID=80734615

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122267023.7U Active CN216099757U (en) 2021-09-18 2021-09-18 Heat emission treatment device for solar silicon wafer processing

Country Status (1)

Country Link
CN (1) CN216099757U (en)

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