CN216087369U

CN216087369U - Heat radiation structure of ultra-high-definition fluorescent intelligent navigation endoscope system

Info

Publication number: CN216087369U
Application number: CN202122037900.1U
Authority: CN
Inventors: 陈东; 赵建; 孙文龙
Original assignee: Xinguangwei Medical Technology Suzhou Co ltd
Current assignee: Xinguangwei Medical Technology Suzhou Co ltd
Priority date: 2021-08-27
Filing date: 2021-08-27
Publication date: 2022-03-18
Anticipated expiration: 2031-08-27

Abstract

The utility model discloses a heat dissipation structure of an ultra-high-definition fluorescent intelligent navigation endoscope system, which comprises a fluorescent host, wherein a control panel is installed on the front side surface of the fluorescent host, a heat dissipation fan is installed on the right side surface of the fluorescent host, a switching power supply and a CPU (central processing unit) board are installed on the inner bottom surface of the fluorescent host, a storage board is arranged on the inner bottom surface of the fluorescent host, and a metal protection cover is installed on the surface of the storage board. According to the utility model, the heat dissipation plate is arranged on the main board of the fluorescent host, and the plurality of aluminum plates on the heat dissipation plate can disperse hot air, so that wind blown by the heat dissipation fan can carry away heat on the heat dissipation plate, the heat dissipation effect on the main board is improved, and the heat dissipation effect of the heat dissipation fan is improved.

Description

Heat radiation structure of ultra-high-definition fluorescent intelligent navigation endoscope system

Technical Field

The utility model relates to the technical field of medical instruments, in particular to a heat dissipation structure of an ultra-high-definition fluorescent intelligent navigation endoscope system.

Background

With the continuous improvement of the level, great convenience is brought to the life of people, the health condition of people can be known, prevented and treated early, the optimal treatment stage is provided for a plurality of diseases, the treatment time and period are saved, the probability of serious diseases is reduced, the advanced medical level depends on advanced medical instruments, and endoscopes and camera systems can be used in the conventional surgical operation or medical examination.

When the existing endoscope system works, a circuit main board, a CPU (central processing unit) board and other electronic components in a main machine of the endoscope system can generate larger heat. If the heat is not discharged to the outside of the equipment in time and good heat dissipation and ventilation are maintained, internal devices can be damaged, and medical accidents can be caused if the internal devices are seriously damaged. For example, an endoscope main unit disclosed in application No. 202021351510.0 has a problem that the main unit has a short life span due to too much heat in the main unit when in use.

Therefore, it is necessary to invent a heat dissipation structure of an ultra-high-definition fluorescent intelligent navigation endoscope system to solve the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a heat dissipation structure of an ultra-high-definition fluorescent intelligent navigation endoscope system, which aims to solve the problem of overhigh heat of a main board and a CPU (central processing unit) board in a fluorescent host machine in the technology.

In order to achieve the above purpose, the utility model provides the following technical scheme: the utility model provides a heat radiation structure of clear fluorescence intelligence navigation endoscope system of superelevation, includes the fluorescence host computer, fluorescence host computer front side installs control panel, fluorescence host computer right flank installs radiator fan, switching power supply and CPU board are installed to the bottom surface in the fluorescence host computer, the bottom surface is provided with the accumulator board in the fluorescence host computer, accumulator board surface mounting has the metal safety cover, the mainboard is installed to the bottom surface in the fluorescence host computer, mainboard surface mounting has the heating panel, the adhesion of heating panel surface has heat dissipation silica gel piece for mainboard and CPU board surface in the fluorescence host computer all install heat dissipation mechanism.

Preferably, a plurality of buttons are uniformly distributed on the surface of the control panel, an included angle between the control panel and the object at the front side of the fluorescent host is 15-35 degrees, and a signal cable interface, a switch key, a recording interface and various functional keys are further arranged on the surface of the control panel. The signal cable interface is electrically connected with the fluorescence camera and used for inputting signals of the fluorescence camera. The switch key controls the power-on and power-off of the fluorescent host. The recording interface can be connected with the mobile storage device and is used for recording pictures or videos. Various functional keys are used for sending control instructions.

Preferably, the cooling fan is fixedly connected to the casing on the right side face of the fluorescent host, the surface of the cooling fan is provided with a protection plate through screws, the height of the cooling fan is matched with the thickness of the fluorescent host, and air blown by the cooling fan drives the fluorescent host to circulate.

Preferably, the area of the storage plate is close to that of the metal protection cover, the metal protection cover is of a rectangular hollow structure, four top points of the metal protection cover are fixed on the inner bottom surface of the fluorescent host around the storage plate through screws, and heat on the surface of the storage plate is transferred into the metal protection cover.

Preferably, the side is provided with a plurality of heat dissipation meshs around the metal protection cover, and is a plurality of the heat dissipation meshs are the circular port, and are a plurality of the heat dissipation meshs diameter is all the same, the metal protection cover left and right sides is provided with "U" type hole of falling, it leaves the space for the electric wire to fall "U" type hole for heat in the metal protection cover is carried away along with a plurality of louvres.

Preferably, the heating panel constitutes for a plurality of rectangle aluminum plates that the size is the same, distance between a plurality of aluminum plates is all the same, heating panel basal area is the half of mainboard area, the heating panel left and right sides is provided with the hole that can supply the screw installation, concentrates the heat on the mainboard between a plurality of aluminum plates, is taken away by a plurality of aluminum plates.

Preferably, the bottom of the heat dissipation plate is adhered to the heat dissipation silica gel sheet, the bottom of the heat dissipation silica gel sheet is adhered to the inner bottom surface of the fluorescent host, and the heat dissipation plate can collect heat on the mainboard in a centralized manner.

Preferably, the heat dissipation silica gel piece is provided with a plurality ofly, and is a plurality of heat dissipation silica gel piece size all diverse, it is a plurality of the even distribution of heat dissipation silica gel piece is in the heating panel bottom, and the heat on the mainboard can be collected to the heat dissipation silica gel piece.

In the technical scheme, the utility model provides the following technical effects and advantages:

1. the heat dissipation plate is arranged on the main board of the fluorescent host, and the plurality of aluminum plates on the heat dissipation plate can disperse hot air, so that the air blown by the heat dissipation fan can carry away heat on the heat dissipation plate, the heat dissipation effect on the main board is improved, and the heat dissipation effect of the heat dissipation fan is improved;

2. through installing the metal protection cover on the CPU board, the louvre on the metal protection cover can form air circulation with the wind that radiator fan blown in the fluorescence host computer, takes away the heat when moving on the CPU board, improves the operating efficiency of CPU board, prolongs the life of whole fluorescence host computer.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic perspective view of a control panel according to the present invention;

FIG. 3 is a schematic perspective view of a metal protective cover according to the present invention;

fig. 4 is a schematic perspective view of the heat dissipation plate of the present invention.

Description of reference numerals:

1. a fluorescent host; 2. a control panel; 3. a heat radiation fan; 4. a switching power supply; 5. a CPU board; 6. a reservoir plate; 7. a metal protective cover; 8. a main board; 9. a heat dissipation plate; 10. and a heat dissipation silica gel sheet.

Detailed Description

In order to make the technical solutions of the present invention better understood, those skilled in the art will now describe the present invention in further detail with reference to the accompanying drawings.

The utility model provides a heat dissipation structure of an ultra-high-definition fluorescent intelligent navigation endoscope system as shown in figures 1-4, which comprises a fluorescent host 1, wherein a control panel 2 is arranged on the front side surface of the fluorescent host 1, a heat dissipation fan 3 is arranged on the right side surface of the fluorescent host 1, a switching power supply 4 and a CPU (central processing unit) board 5 are arranged on the inner bottom surface of the fluorescent host 1, a storage board 6 is arranged on the inner bottom surface of the fluorescent host 1, a metal protection cover 7 is arranged on the surface of the storage board 6, a main board 8 is arranged on the inner bottom surface of the fluorescent host 1, a heat dissipation plate 9 is arranged on the surface of the main board 8, and a heat dissipation silica gel sheet 10 is adhered to the surface of the heat dissipation plate 9.

A plurality of buttons are uniformly distributed on the surface of the control panel 2, the included angle between the control panel 2 and the object on the front side of the fluorescent host 1 is 15-35 degrees, a signal cable interface, a switch key, a recording interface and various functional keys are further arranged on the surface of the control panel 2, the cooling fan 3 is fixedly connected onto a shell on the right side face of the fluorescent host 1, a protection plate is mounted on the surface of the cooling fan 3 through screws, and the height of the cooling fan 3 is matched with the thickness of the fluorescent host 1.

The area of the storage plate 6 is close to that of the metal protection cover 7, the metal protection cover 7 is of a rectangular hollow structure, the inner bottom surface of the fluorescent host machine 1 around the storage plate 6 is fixed at four top points of the metal protection cover 7 through screws, the front side and the rear side of the metal protection cover 7 are provided with a plurality of heat dissipation meshes, the plurality of heat dissipation meshes are circular holes, the diameters of the plurality of heat dissipation meshes are the same, the left side and the right side of the metal protection cover 7 are provided with inverted U-shaped holes, and the inverted U-shaped holes are used for leaving space for electric wires.

The heat dissipation plate 9 is composed of a plurality of rectangular aluminum plates with the same size, the distances among the aluminum plates are the same, the bottom area of the heat dissipation plate 9 is one half of the area of the main plate 8, and holes for mounting screws are formed in the left side and the right side of the heat dissipation plate 9.

The bottom of the heat dissipation plate 9 is adhered to the heat dissipation silicon sheet 10, the bottom of the heat dissipation silicon sheet 10 is adhered to the inner bottom surface of the fluorescent host 1, the heat dissipation silicon sheets 10 are arranged in a plurality, the sizes of the heat dissipation silicon sheets 10 are different, and the heat dissipation silicon sheets 10 are uniformly distributed at the bottom of the heat dissipation plate 9.

This practical theory of operation:

referring to the attached drawings 1-4 of the specification, when the device is used, firstly, a fluorescent camera is connected with a signal cable interface of a control panel 2 on a fluorescent host 1 through a signal cable, a mobile storage device is connected with a recording interface, a switch case of the control panel 2 on the fluorescent host 1 is opened, the on-off of a switch power supply is controlled, the start and stop of the fluorescent host 1 are controlled through the switch power supply 4, after the fluorescent host 1 is started, a CPU board 5, a storage board 6 and a mainboard 8 run, and when the CPU board 5, the storage board 6 and the mainboard 8 run, the temperature in the fluorescent host 1 is higher;

referring to the attached drawings 1-4 of the specification, when the device is used, because the image processing operation amount of a camera system in the fluorescent host 1 is huge, a chip on the mainboard 8 can generate heat seriously, the service life can be influenced by long-time use, the metal protection cover 7 arranged on the surface of the storage board 6 can shield the interference of other signals to the storage board 6, heat dissipation holes on two sides of the metal protection cover 7 are favorable for heat dissipation of the storage board 6, meanwhile, the heat dissipation silica gel sheets 10 on the mainboard 8 can absorb most of heat, the residual heat can form air flow in the fluorescent host 1 through the rotation of the heat dissipation fan 3, the hot air is blown to the surface of the heat dissipation plate 9, the heat dissipation plate 9 can drive the heat on the residual mainboard 8, and the heat on the mainboard 8 is taken away.

Claims

1. The utility model provides a heat radiation structure of clear fluorescence intelligence navigation endoscope system of superelevation, includes fluorescence host computer (1), its characterized in that: control panel (2) are installed to fluorescence host computer (1) leading flank, radiator fan (3) are installed to fluorescence host computer (1) right flank, switching power supply (4) and CPU board (5) are installed to bottom surface in fluorescence host computer (1), the bottom surface is provided with storage board (6) in fluorescence host computer (1), storage board (6) surface mounting has metal safety cover (7), bottom surface mounting has mainboard (8) in fluorescence host computer (1), mainboard (8) surface mounting has heating panel (9), heating panel (9) surface bonding has heat dissipation silica gel piece (10).

2. The heat dissipation structure of ultra-high-definition fluorescent intelligent navigation endoscope system according to claim 1, characterized in that: the surface of the control panel (2) is uniformly distributed with a plurality of buttons, the included angle between the control panel (2) and the object at the front side of the fluorescent host (1) is 15-35 degrees, and the surface of the control panel (2) is also provided with a signal cable interface, a switch key, a burning interface and various functional keys.

3. The heat dissipation structure of ultra-high-definition fluorescent intelligent navigation endoscope system according to claim 1, characterized in that: radiator fan (3) fixedly connected with fluorescence host computer (1) right flank casing on, radiator fan (3) surface installs the guard plate through the screw, radiator fan (3) height and fluorescence host computer (1) thickness phase-match.

4. The heat dissipation structure of ultra-high-definition fluorescent intelligent navigation endoscope system according to claim 1, characterized in that: the area of the storage plate (6) is close to that of the metal protection cover (7), the metal protection cover (7) is of a rectangular hollow structure, and four top points of the metal protection cover (7) are fixed on the inner bottom surface of the fluorescent host (1) around the storage plate (6) through screws.

5. The heat dissipation structure of ultra-high-definition fluorescent intelligent navigation endoscope system according to claim 4, characterized in that: the side is provided with a plurality of heat dissipation meshs around metal protection cover (7), and is a plurality of the heat dissipation meshs are the circular port, and are a plurality of heat dissipation meshs diameter is all the same, the metal protection cover (7) left and right sides is provided with "U" type hole of falling, it is used for leaving the space for the electric wire to fall "U" type hole.

6. The heat dissipation structure of ultra-high-definition fluorescent intelligent navigation endoscope system according to claim 1, characterized in that: heating panel (9) constitute for a plurality of rectangle aluminum plates that the size is the same, distance between a plurality of aluminum plates is all the same, heating panel (9) bottom area is half of mainboard (8) area, heating panel (9) left and right sides is provided with the hole that can supply the screw installation.

7. The heat dissipation structure of ultra high definition fluorescence intelligent navigation endoscope system of claim 6, characterized in that: the bottom of the heat dissipation plate (9) is adhered to the heat dissipation silicon sheet (10), and the bottom of the heat dissipation silicon sheet (10) is adhered to the inner bottom surface of the fluorescence host (1).

8. The heat dissipation structure of ultra high definition fluorescence intelligent navigation endoscope system of claim 7, characterized in that: the heat dissipation silica gel piece (10) is provided with a plurality of, and is a plurality of heat dissipation silica gel piece (10) size all diverse, a plurality of heat dissipation silica gel piece (10) even distribution is in heating panel (9) bottom.