Detailed Description
The technical solutions in the exemplary embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the exemplary embodiments of the present disclosure. The example embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the present disclosure, and it is, therefore, to be understood that various modifications and changes may be made to the example embodiments without departing from the scope of the present disclosure.
The utility model provides a signal acquisition wiring harness assembly, as shown in fig. 1 and 2, the signal acquisition wiring harness assembly comprises a flexible flat cable device 1, a flexible circuit board 2 and a target acquisition structure 3, the flexible flat cable device 1 comprises a signal acquisition branch 11, the signal acquisition branch 11 is connected with the target acquisition structure 3 through the flexible circuit board 2, the flexible circuit board 2 comprises a fuse 22, and an acquisition end 12 of the signal acquisition branch 11 acquires information of the target acquisition structure 3 through the fuse 22.
Specifically, in the signal collecting harness assembly provided by the present invention, as shown in fig. 1 and 2, the flexible flat cable device 1 has signal collecting branches 11, each signal collecting branch 11 is connected to the target collecting structure 3 through the flexible circuit board 2, the flexible circuit board 2 is provided with the fuse 22, one end of the fuse 22 is connected to the collecting end 12 of the signal collecting branch 11, and the other end is connected to the target collecting structure 3, that is, in the present application, the fuse 22 required by the signal collecting harness assembly is dispersedly connected to the signal collecting branch 11, the fuse 22 is connected to each signal collecting branch 11 by using the flexible circuit board 2, so that each flexible circuit board 2 has a small volume, the scattered space in the battery device can be fully utilized, compared with the way of arranging a whole printed circuit board at one end of the main body of the flexible flat cable device 1, the fuse 22 connection way can reduce the whole required space harness of the information collecting assembly, the arrangement of the information acquisition wiring harness assembly in the battery device is facilitated.
In some embodiments, as shown in fig. 1 and fig. 2, the signal acquisition branches 11, the flexible circuit boards 2 and the target acquisition structures 3 correspond to each other one by one, and each signal acquisition branch 11 is connected to a corresponding one of the target acquisition structures 3 through a corresponding one of the flexible circuit boards 2. For the setting mode that adopts a big flexible circuit board 2 to link to each other with a plurality of signal acquisition branch road 11, in this embodiment, every flexible circuit board 2 only corresponds with a signal acquisition branch road 11 and links to each other, and the flexible circuit board 2's that links to each other with every signal acquisition branch road 11 volume is all very little, can reduce the size of information acquisition pencil subassembly, reduces the volume of whole information acquisition pencil subassembly, further makes things convenient for information acquisition pencil subassembly to arrange in battery device.
In some embodiments, as shown in fig. 2 and 3, the acquisition end 12 of the signal acquisition branch 11 is welded to the flexible circuit board 2; and/or the target collecting structure 3 is welded with the flexible circuit board 2.
Preferably, the acquisition end 12 of the signal acquisition branch 11 and the target acquisition structure 3 are both welded on the flexible circuit board 2.
In some embodiments, as shown in fig. 2 and 3, the target acquisition structure 3 may comprise a nickel plate; the nickel sheet has the advantages of good electric and heat conducting properties, high hardness, high welding strength, low price and the like; specifically, the nickel plate may be welded to the bus bar, thereby achieving connection of the collecting terminal 12 to the bus bar.
In the embodiment of the application, as shown in fig. 1 and fig. 2, the acquisition end 12 of the signal acquisition branch 11 and/or the target acquisition structure 3 are welded on the flexible circuit board 2, and the connection is realized through the flexible circuit board 2, and the connection strength and stability between the signal acquisition branch 11 and the target acquisition structure 3 can be improved by adopting a welding connection mode; moreover, compared with a connection process in which the acquisition end 12 and the nickel sheet are welded firstly and then crimped in the related art, the welding process adopted in the embodiment of the application is simpler.
In some embodiments, as shown in fig. 1, 2 and 4, the flexible circuit board 2 is further provided with a pad for soldering, and a first insulating film 24 covering the fuse 22 and the pad. For example, the first insulating film 24 may be an insulating material such as a polyimide film (PI film), and may serve to insulate and protect the fuse 22 and the pad.
Specifically, as shown in fig. 1, 2 and 4, the pads include a first pad 21 connected to one end of a fuse 22; the first insulating film 24 is provided with a first opening 23, the first opening 23 exposing the first pad 21; the pickup end 12 of the signal pickup branch 11 is soldered to the first pad 21 at the first opening 23. And/or, the pad includes a second pad 25 connected to the other end of the fuse 22; the first insulating film 24 is provided with a second opening 26, the second opening 26 exposing the second pad 25; the target collection structure 3 is soldered to the second solder pad 25 at the second opening 26. The first insulating film 24 cannot be directly soldered, and before soldering, it is necessary to open an opening in the first insulating film 24 to expose the first pad 21 and then perform soldering at the first opening 23. Preferably, the area of the first opening 23 is larger than that of the first pad 21, and the orthographic projection of the first pad 21 on the plane of the first insulating film 24 is completely located within the range of the first opening 23, i.e. the first opening 23 completely exposes the first pad 21 for facilitating the welding; similarly, the area of the second opening 26 is larger than that of the second pad 25 to facilitate soldering.
In some embodiments, the fuse 22 is shaped by an etching process, as shown in fig. 1 and 2.
Illustratively, the bonding pad may also be shaped by an etching process.
Specifically, since the conductive pattern can be formed on the flexible circuit board 2 by an etching process, and a pattern with a small size and high accuracy can be formed by the etching process, a fine fuse 22 pattern can be formed on the flexible circuit board 2. For example, the fuse 22 and the pad may be etched using copper foil, and both may be simultaneously formed through one etching process.
In some embodiments, as shown in fig. 1, 2 and 4, the flexible circuit board 2 is further provided with a second insulating film; the second insulating film covers the connection between the collecting end 12 of the signal collecting branch 11 and the fuse 22.
And/or, the flexible circuit board 2 is also provided with a third insulating film; the third insulating film covers the junction of the target collection structure 3 and the fuse 22.
The second insulating film and the third insulating film can be made of ultraviolet curing glue (UV glue) or polyimide film (PI film) and other insulating materials, the second insulating film and/or the third insulating film can enhance the connection strength of a welding part, the connection strength between the acquisition end 12 of the signal acquisition branch 11 and the fuse 22 and/or between the target acquisition structure 3 and the fuse 22 is improved, and the connection strength between the signal acquisition branch 11 and the target acquisition structure 3 is further improved; the welding position can also be insulated, and the protection effect is increased. Preferably, the area of the second insulating film is larger than the area of the first opening 23 of the first insulating film 24, i.e., the second insulating film completely covers the first opening 23 of the first insulating film 24; similarly, the area of the third insulating film is larger than the area of the second opening 26 of the first insulating film 24; thus, the second insulating film and the third insulating film can be fitted to the first insulating film 24 to insulate and protect the entire conductive pattern of the flexible circuit board 2 and the electrical connection with the external structure.
In some embodiments, as shown in fig. 1, 2 and 4, the signal acquisition branch 11 and the target acquisition structure 3 are soldered to the pad in a reflow soldering manner, and a reflow soldering process is only required to be performed once during soldering, so that the operation process is simple.
In some embodiments, as shown in fig. 1, 2 and 3, the signal collection branch 11 includes one or more collection terminals 12; the fuses 22 correspond to the acquisition ends 12 one by one, and each acquisition end 12 is connected with the corresponding fuse 22; wherein a plurality means two or more; when the signal acquisition branch 11 has a plurality of acquisition ends 12, the width of the end of the flexible circuit board 2 connected with the signal acquisition branch 11 can be increased by a proper amount, and meanwhile, fuses 22 with the same number as the acquisition ends 12 are arranged on the flexible circuit board 2, so that the acquisition ends 12 correspond to the fuses 22 one by one, and each acquisition end 12 is connected with the corresponding fuse 22; in other words, the plurality of collecting terminals 12 of each signal collecting branch 11 can be soldered on one flexible circuit board 2, and the respective fuses 22 are connected through one flexible circuit board 2, so that the volume of the signal collecting harness assembly can be reduced.
Illustratively, as shown in fig. 2 and 4, a signal collecting branch 11 includes a collecting terminal 12, where the collecting terminal 12 is used for connecting with the target collecting structure 3 to collect the electrical signal of the battery unit. At this time, a fuse 22 is disposed on the flexible circuit board 2, one end of the fuse 22 is connected to the acquisition end 12 by soldering via the first bonding pad 21, and the other end of the fuse 22 is electrically connected to the target acquisition structure 3 via the second bonding pad 25.
Or, for example, as shown in fig. 3, a signal collecting branch 11 may include two collecting terminals 12, where the two collecting terminals 12 are respectively used for connecting with a positive electrode and a negative electrode of a temperature sensor, and the temperature sensor is disposed on the target collecting structure 3 and is used for collecting temperature information of the battery unit. At this time, two fuses 22 are arranged on the flexible circuit board 2, the collection ends 12 correspond to the fuses 22 one by one, one end of each fuse 22 is welded to the corresponding collection end 12, and the other ends of the two fuses 22 are connected to the positive electrode and the negative electrode of the temperature sensor respectively.
Specifically, as shown in fig. 1, the signal collecting harness assembly provided in the present application may further include a reinforcing plate 4 and a connector 5 at one end of the main body portion of the flexible flat cable device 1.
In addition, the utility model also provides a battery device which comprises the signal acquisition wiring harness assembly, and the information acquisition wiring harness in the battery device has the advantages of better connection strength and stability, simple manufacturing process and smaller volume.
In some embodiments, the battery device may be a battery module or a battery pack.
It will be apparent to those skilled in the art that various changes and modifications may be made in the embodiments of the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.