CN216064050U

CN216064050U - Gluing device for chip processing

Info

Publication number: CN216064050U
Application number: CN202121936186.3U
Authority: CN
Inventors: 蔡铭宇
Original assignee: Individual
Current assignee: Kunshan Xiumeifeng Electronic Technology Co ltd
Priority date: 2021-08-17
Filing date: 2021-08-17
Publication date: 2022-03-18
Anticipated expiration: 2031-08-17

Abstract

The utility model discloses a gluing device for chip processing, which relates to the technical field of chip processing and comprises a support frame, wherein a gluing device body is fixedly arranged at the top of the support frame, a turnover mechanism is arranged at the bottom of the support frame, a quick drying mechanism is arranged at the bottom of the support frame, the turnover mechanism comprises a fixed base, a stepping motor is fixedly arranged on the left side of the fixed base, and a first transmission gear is fixedly connected with an output shaft of the stepping motor, which extends into an inner cavity of the fixed base. According to the utility model, the chip is arranged on the chip fixing frame, the top surface of the chip is coated with glue, then the stepping motor is controlled to operate, the workpiece seat drives the chip to turn over through the design of the first transmission gear and the second transmission gear, and then the bottom surface of the chip can be coated with glue, so that the problem that the working efficiency is influenced when a worker manually turns over the chip is avoided, the integral processing efficiency of the device on the chip is improved, and the convenience of the device is improved.

Description

Gluing device for chip processing

Technical Field

The utility model relates to a gluing device, relates to the technical field of chip processing, and particularly relates to a gluing device for chip processing.

Background

The gluing device plays an important role in the field of processing of electronic products, gluing is carried out on the gluing device in the processes of packaging of LEDs and processing of touch screens, gluing can be carried out only by using the gluing device, and chip processing gluing plays an important role in a chip packaging process. The following problems exist in the prior art:

1. the existing gluing device does not have the function of turning over chips, and if chips with two sides needing gluing are machined, workers need to manually turn over the chips, so that the working efficiency of the workers is affected;

2. the existing gluing device does not have the function of quickly drying glue, the natural solidification speed of the glue on the chip is lower, the continuity of chip processing is influenced, and the improvement is needed.

SUMMERY OF THE UTILITY MODEL

The utility model provides a gluing device for chip processing, which has the function of automatically turning a chip and solves the problem that the manual turning of a worker on the chip can influence the working efficiency; the other purpose is to solve the problem that the natural solidification speed of glue on the chip is slow and can influence the continuity of chip processing so as to achieve the effect of quickly drying the chip.

In order to solve the technical problems, the technical scheme adopted by the utility model is as follows:

the gluing device for chip processing comprises a support frame, wherein a gluing device body is fixedly mounted at the top of the support frame, a turnover mechanism is arranged at the bottom of the support frame, and a quick drying mechanism is arranged at the bottom of the support frame.

The turnover mechanism comprises a fixed base, a stepping motor is fixedly mounted on the left side of the fixed base, and an output shaft of the stepping motor extends to an inner cavity of the fixed base and is fixedly connected with a first transmission gear.

The quick drying mechanism comprises an air inlet cover, a heating cylinder and a flow distribution plate, an air blower is fixedly mounted in an inner cavity of the heating cylinder, and an electric heating net located below the air blower is fixedly mounted in the inner cavity of the heating cylinder.

The technical scheme of the utility model is further improved as follows: the fixed base is fixedly welded at the bottom of the support frame, the top of the fixed base is rotatably connected with the rotating rod and is positioned on the left side, a second transmission gear is fixedly connected to the left side of the rotating rod, and the bottom of the second transmission gear is meshed with the top of the first transmission gear.

The technical scheme of the utility model is further improved as follows: two the inboard dismantlement formula of dwang is connected with the work piece seat, the draw-in groove has been seted up at the top of work piece seat, fixed mounting has the chip mount in the inner chamber of draw-in groove.

The technical scheme of the utility model is further improved as follows: the air inlet cover is fixedly arranged on the right side of the fixed base, the heating cylinder is fixedly arranged at the bottom of the inner cavity of the fixed base, and the flow distribution plate is fixedly arranged at the bottom of the inner cavity of the fixed base.

The technical scheme of the utility model is further improved as follows: the right side threaded connection of air inlet cover has the fretwork cover, the embedded filter screen that is connected with in the inner chamber of air inlet cover, the left side swing joint of air inlet cover has the tuber pipe, the one end that the air inlet cover was kept away from to the tuber pipe is with the top swing joint of a heating section of thick bamboo.

The technical scheme of the utility model is further improved as follows: pipeline swing joint is passed through with the left side of a section of thick bamboo that heats in the right side of flow distribution plate, the top fixed mounting of flow distribution plate has the exit tube, the top fixedly connected with meso position pipe of flow distribution plate, logical groove has been seted up to the inside of meso position pipe, fixed mounting has the baffle on the inner wall of exit tube.

Due to the adoption of the technical scheme, compared with the prior art, the utility model has the technical progress that:

1. the utility model provides a gluing device for chip processing, which is characterized in that a stepping motor, a first transmission gear, a second transmission gear and a workpiece seat are combined, a chip is installed on a chip fixing frame, the top surface of the chip is glued, then the stepping motor is controlled to operate, the workpiece seat drives the chip to turn over through the design of the first transmission gear and the second transmission gear, and then the bottom surface of the chip can be glued, so that the problem that the working efficiency is influenced when a worker turns over the chip manually is solved, the overall processing efficiency of the device on the chip is improved, and the convenience of the device is improved.

2. The utility model provides a gluing device for chip processing, which is characterized in that an air blower, an electric heating net, a hollowed-out cover and an outlet pipe are combined, the air blower is controlled to operate, air filtered by the hollowed-out cover and a filter screen can be absorbed from an inner cavity of an air inlet cover, then the air is processed into hot air through the electric heating net, and finally the hot air is sprayed out through the top of the outlet pipe, so that the function of quickly drying a chip on a chip fixing frame is realized, the problem that the natural solidification speed of glue on the chip is low is solved, the continuity of the device for chip processing is increased, and the practicability of the device is improved.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the internal structure of the fixing base of the present invention;

FIG. 3 is a schematic view of the interior of the air inlet cover of the present invention;

FIG. 4 is a schematic view of the internal structure of the heating cylinder of the present invention;

fig. 5 is a schematic sectional structure view of an outlet tube according to the present invention.

In the figure: 1. a support frame; 2. a gluing device body;

3. a turnover mechanism; 31. a fixed base; 32. a stepping motor; 33. a first transmission gear; 34. rotating the rod; 35. a second transmission gear; 36. a workpiece seat;

4. a quick drying mechanism; 41. an air inlet cover; 411. a hollow cover; 412. a filter screen; 42. a heating cylinder; 421. a blower; 422. an electric heating net; 43. a flow distribution plate; 431. discharging a pipe; 432. a middle position pipe; 433. a through groove; 434. and a baffle plate.

Detailed Description

The present invention will be described in further detail with reference to the following examples:

example 1

As shown in fig. 1-5, the utility model provides a gluing device for chip processing, which comprises a support frame 1, a gluing device body 2 is fixedly installed at the top of the support frame 1, a turnover mechanism 3 is arranged at the bottom of the support frame 1, a quick drying mechanism 4 is arranged at the bottom of the support frame 1, the turnover mechanism 3 comprises a fixed base 31, a stepping motor 32 is fixedly installed at the left side of the fixed base 31, a first transmission gear 33 is fixedly connected in an inner cavity of the fixed base 31, an output shaft of the stepping motor 32 extends into the inner cavity of the fixed base 31, the quick drying mechanism 4 comprises an air inlet cover 41, a heating cylinder 42 and a flow distribution plate 43, an air blower 421 is fixedly installed in the inner cavity of the heating cylinder 42, an electric heating net 422 positioned below the air blower 421 is fixedly installed in the inner cavity of the heating cylinder 42, the operation of the stepping motor 32 is controlled, a chip on a workpiece seat 36 can be driven to turn over by driving the first transmission gear 33 and the second transmission gear 35, through air-blower 421 and electric heat net 422's work, can follow the top blowout of exit tube 431 hot-blastly, carry out fast drying to the glue on the chip, when drying, steerable step motor 32 work drives the chip and rotates, further promotes the speed of drying.

Example 2

As shown in fig. 1 to 5, on the basis of embodiment 1, the present invention provides a technical solution: preferably, fixed welding is in the bottom of support frame 1 for fixed baseplate 31, fixed baseplate 31's top is rotated and is connected with dwang 34, be located two 35 of left fixedly connected with drive gear of left dwang 34, two 35 of drive gear's bottom and the top meshing of drive gear 33, two 34 inboard dismantlements of dwang are connected with work piece seat 36, the draw-in groove has been seted up at work piece seat 36's top, fixed mounting has the chip mount in the inner chamber of draw-in groove, through being equipped with the chip mount, install the chip on the chip mount in proper order, can cooperate rubber coating device body 2 to carry out the rubber coating processing to a plurality of chips simultaneously, be convenient for the use of this device, through being equipped with two 35 of drive gear and drive gear 33, make step motor 32 during operation, can drive dwang 34 and rotate, and then drive work piece seat 36 and rotate.

Example 3

As shown in fig. 1 to 5, on the basis of embodiment 1, the present invention provides a technical solution: preferably, the air inlet cover 41 is fixedly installed at the right side of the fixed base 31, the heating cylinder 42 is fixedly installed at the bottom of the inner cavity of the fixed base 31, the splitter plate 43 is fixedly installed at the bottom of the inner cavity of the fixed base 31, the right side of the air inlet cover 41 is in threaded connection with the hollow cover 411, the filter screen 412 is embedded in the inner cavity of the air inlet cover 41, the left side of the air inlet cover 41 is movably connected with the air pipe, one end of the air pipe, which is far away from the air inlet cover 41, is movably connected with the top of the heating cylinder 42, the right side of the splitter plate 43 is movably connected with the left side of the heating cylinder 42 through a pipeline, the top of the splitter plate 43 is fixedly installed with an outlet pipe 431, the top of the splitter plate 43 is fixedly connected with a middle position pipe 432, a through groove 433 is formed in the middle position pipe 432, a baffle 434 is fixedly installed on the inner wall of the outlet pipe 431, hot air in the splitter plate 43 can be discharged from the side of the middle position pipe 432 through the through groove 433, and then blown onto the chip through the guide of the baffle 434, avoid the piece on the chip to drop to the problem that leads to the air outlet at flow distribution plate 43 top to block up in the exit tube 431, through the cooperation of fretwork cover 411 and filter screen 412, can carry out abundant filtration to the air, avoid the piece in the air problem that falls to the chip surface along with the air flow.

The working principle of the glue spreading device for chip processing is described in detail below.

As shown in fig. 1-5, when the rapid drying device is used, the chips are sequentially mounted on the chip fixing frame, the gluing device body 2 is controlled to work, so that the top surfaces of the chips can be glued, then the stepping motor 32 is controlled to operate, the chips on the workpiece seat 36 are driven to turn over through the first transmission gear 33 and the second transmission gear 35, then the gluing device body 2 is used for gluing the bottom surfaces of the chips, and then the blower 421 and the electric heating net 422 are controlled to operate, so that the rapid drying function of the glue on the chips is realized.

The present invention has been described in general terms in the foregoing, but it will be apparent to those skilled in the art that modifications and improvements can be made thereto based on the present invention. Therefore, modifications or improvements are within the scope of the utility model without departing from the spirit of the inventive concept.

Claims

1. The utility model provides a rubber coating device is used in chip processing, includes support frame (1), the top fixed mounting of support frame (1) has rubber coating device body (2), its characterized in that: the bottom of the support frame (1) is provided with a turnover mechanism (3), and the bottom of the support frame (1) is provided with a quick drying mechanism (4);

the turnover mechanism (3) comprises a fixed base (31), a stepping motor (32) is fixedly mounted on the left side of the fixed base (31), and a first transmission gear (33) is fixedly connected into an inner cavity of the fixed base (31) and an output shaft of the stepping motor (32) extends into the inner cavity of the fixed base (31);

quick-drying mechanism (4) are including air inlet cover (41), heating cylinder (42) and flow distribution plate (43), fixed mounting has air-blower (421) in the inner chamber of heating cylinder (42), fixed mounting has electric heat net (422) that are located air-blower (421) below in the inner chamber of heating cylinder (42).

2. The gluing device for chip processing according to claim 1, wherein: fixed baseplate (31) fixed welding is in the bottom of support frame (1), the top of fixed baseplate (31) is rotated and is connected with dwang (34), is located the left side fixedly connected with drive gear two (35) of dwang (34), the top meshing of the bottom of drive gear two (35) and drive gear one (33).

3. The gluing device for chip processing according to claim 2, wherein: two the inboard dismantlement formula of dwang (34) is connected with work piece seat (36), the draw-in groove has been seted up at the top of work piece seat (36), fixed mounting has the chip mount in the inner chamber of draw-in groove.

4. The gluing device for chip processing according to claim 1, wherein: the air inlet cover (41) is fixedly arranged on the right side of the fixed base (31), the heating cylinder (42) is fixedly arranged at the bottom of the inner cavity of the fixed base (31), and the flow distribution plate (43) is fixedly arranged at the bottom of the inner cavity of the fixed base (31).

5. The gluing device for chip processing according to claim 4, wherein: the right side threaded connection of air inlet cover (41) has fretwork cover (411), embedded filter screen (412) that is connected with in the inner chamber of air inlet cover (41), the left side swing joint of air inlet cover (41) has the tuber pipe, the top swing joint of one end and the heating cylinder (42) of air inlet cover (41) is kept away from to the tuber pipe.

6. The gluing device for chip processing according to claim 4, wherein: pipeline swing joint is passed through with the left side of heating a section of thick bamboo (42) to the right side of flow distribution plate (43), the top fixed mounting of flow distribution plate (43) has exit tube (431), the top fixedly connected with meso position pipe (432) of flow distribution plate (43), logical groove (433) have been seted up to the inside of meso position pipe (432), fixed mounting has baffle (434) on the inner wall of exit tube (431).