CN216054753U

CN216054753U - Carrier plate groove of HWCVD equipment for monocrystalline silicon heterojunction solar cell

Info

Publication number: CN216054753U
Application number: CN202122483484.8U
Authority: CN
Inventors: 刘翠翠
Original assignee: Jiangxi Hankefan Semiconductor Technology Co ltd
Current assignee: Jiangxi Hankefan Semiconductor Technology Co ltd
Priority date: 2021-10-14
Filing date: 2021-10-14
Publication date: 2022-03-15
Anticipated expiration: 2031-10-14

Abstract

The utility model discloses a carrier plate groove of a single crystal silicon heterojunction solar cell HWCVD device, which comprises a trapezoidal placing groove, wherein a first clamping piece and a second clamping piece are respectively arranged on two inner sides of the trapezoidal placing groove; the connecting assembly comprises a first sliding rod, and the first sliding rod is arranged on one side, away from one end of the first clamping piece and one end of the second clamping piece. According to the utility model, the end parts of the first clamping piece and the second clamping piece are used for clamping the silicon wafer through the first sliding rod matched with the first spring, the middle parts of the first clamping piece and the second clamping piece are used for clamping the silicon wafer through the second sliding rod matched with the second spring, so that the silicon wafer is reinforced, the silicon wafer is prevented from falling from the trapezoid placing groove, the silicon wafer is conveniently placed in the groove of the support plate, and the silicon wafer is reinforced after being placed in the groove of the support plate, so that the corners of the silicon wafer are effectively prevented from being crushed, and the processing efficiency of the solar cell is improved.

Description

Carrier plate groove of HWCVD equipment for monocrystalline silicon heterojunction solar cell

Technical Field

The utility model relates to the technical field of solar cell processing, in particular to a carrier plate groove of HWCVD equipment for a monocrystalline silicon heterojunction solar cell.

Background

The monocrystalline silicon heterojunction solar cell has high conversion efficiency, is recognized as one of the next generation of large-scale industrialization key technologies by the photovoltaic industry, and has HWCVD and PECVD (plasma enhanced chemical vapor deposition) key coating equipment, wherein the HWCVD has higher competitiveness due to lower manufacturing cost and higher productivity.

The prior art has the following defects: the groove for placing the silicon wafer on the support plate is square or quasi-square similar to the shape of the silicon wafer, if the silicon wafer is automatically positioned or placed in a deviation mode, the corner area of the silicon wafer is easily immersed into the groove of the support plate, the part can be clamped and broken by the cover plate, the edge breakage and corner breakage of a product are caused, and the yield is influenced.

SUMMERY OF THE UTILITY MODEL

In order to overcome the above drawbacks of the prior art, embodiments of the present invention provide a carrier recess of a HWCVD apparatus for a monocrystalline silicon heterojunction solar cell to solve the above problems in the background art.

In order to achieve the above purpose, the utility model provides a carrier plate groove of a HWCVD device for a monocrystalline silicon heterojunction solar cell, which comprises a trapezoidal placing groove, wherein a first clamping piece and a second clamping piece are respectively arranged on two inner sides of the trapezoidal placing groove, a connecting component is further arranged on two inner sides of the trapezoidal placing groove, and the first clamping piece and the second clamping piece are both connected with the trapezoidal placing groove through the connecting component.

Preferably, coupling assembling includes first slide bar, first slide bar setting is in one side that first clamping piece and second clamping piece one end were kept away from, the outside cover of first slide bar is equipped with first spring, and two the tip of first spring respectively with first clamping piece and second clamping piece one end butt, one side that first clamping piece and second clamping piece middle part were kept away from all is fixed and is equipped with the second slide bar, the outside cover of second slide bar is equipped with the second spring, and two the tip of second spring respectively with the middle part butt of first clamping piece and second clamping piece.

Preferably, two the tip of first slide bar and second slide bar all is fixed and is equipped with the limiting plate, just the limiting plate is with trapezoidal standing groove butt.

Preferably, four bottom corners of the trapezoidal placing groove are provided with mounting plates, and the mounting plates are fixedly connected with the trapezoidal placing groove.

Preferably, a top plate is arranged at the top of the trapezoid placing groove.

Preferably, T-shaped guide strips are fixedly arranged on two sides of the bottom of the top plate, and the top plate is connected with the trapezoidal placing groove in a sliding mode through the T-shaped guide strips.

Preferably, T-shaped grooves are formed in two sides of the top of the trapezoidal placing groove, and the T-shaped guide strips are matched with the T-shaped grooves.

The utility model has the technical effects and advantages that:

according to the utility model, the end parts of the first clamping piece and the second clamping piece are used for clamping the silicon wafer through the first sliding rod matched with the first spring, the middle parts of the first clamping piece and the second clamping piece are used for clamping the silicon wafer through the second sliding rod matched with the second spring, so that the silicon wafer is reinforced, the silicon wafer is prevented from falling from the trapezoid placing groove, the silicon wafer is conveniently placed in the groove of the support plate, and the silicon wafer is reinforced after being placed in the groove of the support plate, so that the corners of the silicon wafer are effectively prevented from being crushed, and the processing efficiency of the solar cell is improved.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention.

FIG. 2 is a usage scenario diagram of the present invention.

FIG. 3 is an enlarged view of portion A of FIG. 2 according to the present invention.

The reference signs are: 1. a trapezoidal placing groove; 2. a first clip piece; 3. a second clip; 4. a first slide bar; 5. a first spring; 6. a second slide bar; 7. a second spring; 8. a limiting plate; 9. mounting a plate; 10. a top plate; 11. a silicon wafer; 12. a T-shaped conducting bar; 13. t-shaped grooves.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-3 in the specification, a carrier groove of HWCVD equipment for a monocrystalline silicon heterojunction solar cell according to an embodiment of the utility model includes a trapezoidal placement groove 1, wherein a first clamping piece 2 and a second clamping piece 3 are respectively disposed on two sides inside the trapezoidal placement groove 1, a first sliding bar 4 is fixedly disposed on one side of each of the first clamping piece 2 and the second clamping piece 3 away from one end, a first spring 5 is sleeved outside the first sliding bar 4, ends of the two first springs 5 are respectively abutted to one ends of the first clamping piece 2 and the second clamping piece 3, a second sliding bar 6 is fixedly disposed on one side of each of the first clamping piece 2 and the second clamping piece 3 away from the middle, a second spring 7 is sleeved outside the second sliding bar 6, and ends of the two second springs 7 are respectively abutted to the middle of the first clamping piece 2 and the second clamping piece 3.

Two the tip of first slide bar 4 and second slide bar 6 is all fixed and is equipped with limiting plate 8, just limiting plate 8 and 1 butt of trapezoidal standing groove, four base angle departments of trapezoidal standing groove 1 all are equipped with mounting panel 9, and four mounting panel 9 all with 1 fixed connection of trapezoidal standing groove, prevent through the limiting plate 8 that sets up that first slide bar 4 and second slide bar 6 break away from trapezoidal standing groove 1, the fixed mounting of trapezoidal standing groove 1 of being convenient for through the mounting panel 9 that sets up.

The top of trapezoidal standing groove 1 is equipped with roof 10, the bottom both sides of roof 10 all are fixed and are equipped with T shape conducting bar 12, just roof 10 and trapezoidal standing groove 1 pass through T shape conducting bar 12 sliding connection, T-slot 13 has all been seted up to the top both sides of trapezoidal standing groove 1, just T shape conducting bar 12 and T-slot 13 looks adaptation, and after silicon chip 11 put into trapezoidal standing groove 1 inside, roof 10 passes through T shape conducting bar 12 sliding connection at the top of trapezoidal standing groove 1.

The working principle is as follows: silicon chip 11 is put into trapezoidal standing groove 1, first slide bar 4 cooperates first spring 5 to make the tip of first clamping piece 2 and second clamping piece 3 press from both sides tight silicon chip 11, second slide bar 6 cooperates second spring 7 to make the middle part of first clamping piece 2 and second clamping piece 3 press from both sides tight silicon chip 11, thereby consolidate silicon chip 11, prevent that silicon chip 11 from dropping from trapezoidal standing groove 1, the putting into of silicon chip is convenient for to this support plate recess, and the silicon chip has the reinforcement after putting into, not only avoid the silicon chip corner to be crushed effectively, and solar cell's machining efficiency has been improved.

The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;

secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the utility model, only the structures related to the disclosed embodiments are referred to, other structures can refer to common designs, and the same embodiment and different embodiments of the utility model can be combined with each other without conflict;

and finally: the above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like that are within the spirit and principle of the present invention are intended to be included in the scope of the present invention.

Claims

1. A support plate groove of a HWCVD device of a monocrystalline silicon heterojunction solar cell is characterized in that: the grooves of the carrier plate are trapezoidal.

2. The carrier plate groove of the HWCVD equipment of the monocrystalline silicon heterojunction solar cell in claim 1, wherein: including trapezoidal standing groove (1), the inside both sides of trapezoidal standing groove (1) are equipped with first clamping piece (2) and second clamping piece (3) respectively, the inside both sides of trapezoidal standing groove (1) still are equipped with coupling assembling, and just first clamping piece (2) and second clamping piece (3) all are connected through coupling assembling with trapezoidal standing groove (1).

3. The carrier plate groove of the HWCVD equipment of the monocrystalline silicon heterojunction solar cell in claim 2, wherein: coupling assembling includes first slide bar (4), first slide bar (4) set up the one side of keeping away from mutually in first clamping piece (2) and second clamping piece (3) one end, the outside cover of first slide bar (4) is equipped with first spring (5), and two the tip of first spring (5) respectively with first clamping piece (2) and second clamping piece (3) one end butt, one side of keeping away from mutually in first clamping piece (2) and second clamping piece (3) middle part is all fixed and is equipped with second slide bar (6), the outside cover of second slide bar (6) is equipped with second spring (7), and two the tip of second spring (7) respectively with the middle part butt of first clamping piece (2) and second clamping piece (3).

4. The carrier plate groove of the HWCVD equipment of the monocrystalline silicon heterojunction solar cell of claim 3, wherein: the end parts of the first sliding rod (4) and the second sliding rod (6) are both fixedly provided with limiting plates (8), and the limiting plates (8) are abutted to the trapezoidal placing grooves (1).

5. The carrier plate groove of the HWCVD equipment of the monocrystalline silicon heterojunction solar cell in claim 2, wherein: four base angles of the trapezoidal placing groove (1) are provided with mounting plates (9), and the mounting plates (9) are fixedly connected with the trapezoidal placing groove (1).

6. The carrier plate groove of the HWCVD equipment of the monocrystalline silicon heterojunction solar cell in claim 2, wherein: the top of the trapezoidal placing groove (1) is provided with a top plate (10).

7. The carrier plate groove of the HWCVD equipment of the monocrystalline silicon heterojunction solar cell of claim 6, wherein: t-shaped guide strips (12) are fixedly arranged on two sides of the bottom of the top plate (10), and the top plate (10) is connected with the trapezoidal placing groove (1) in a sliding mode through the T-shaped guide strips (12).

8. The carrier plate groove of the HWCVD equipment of the monocrystalline silicon heterojunction solar cell of claim 7, wherein: t-shaped grooves (13) are formed in two sides of the top of the trapezoidal placing groove (1), and the T-shaped guide strips (12) are matched with the T-shaped grooves (13).