CN216054611U - Chip arranging tool - Google Patents

Abstract

The invention provides a chip arranging tool, which comprises: the left side and the right side of the arranging disc are respectively provided with a side baffle; the front baffle is arranged at the front end of the arranging disc, and the left end and the right end of the front baffle are detachably connected with the front ends of the side baffles respectively; carry the thing piece, carry the thing piece setting in the arrangement dish, its left and right sides both ends respectively with the side shield forms and to dismantle the connection, the top surface of carrying the thing piece is provided with a plurality of accepting grooves that only can hold a chip, carry the height of thing piece all to be less than the height of side shield and preceding baffle. According to the invention, the chips are accommodated one by the carrier block, so that the chips accommodated in the accommodating grooves are arranged in order, and the chips which are not accommodated in the accommodating grooves can be removed by other modes, thereby providing convenience for subsequent welding operation.

Description

Chip arranging tool

Technical Field

The invention belongs to the technical field of electric element production, and particularly relates to a chip arranging tool.

Background

Chips are common electrical components, often having different sizes depending on the function. The chip needs to be welded with pins before leaving the factory and then can be welded on the circuit board. For small-sized chips, such as chips below 2mm, the soldering of the leads becomes a difficult task.

At present, before welding pins, chips need to be arranged one by one and aligned with the pins one by one, and because the size of the chips is too small, picking and arranging the chips by hands becomes more difficult.

Disclosure of Invention

The technical problem to be solved by the invention is as follows: the chip arranging tool can arrange chips orderly rapidly, improves the earlier-stage arrangement efficiency and accuracy of the chips, and brings great convenience to welding work.

The invention is realized by the following steps: a chip arrangement frock includes:

the left side and the right side of the arranging disc are respectively provided with a side baffle;

the front baffle is arranged at the front end of the arranging disc, and the left end and the right end of the front baffle are detachably connected with the front ends of the side baffles respectively;

carry the thing piece, carry the thing piece setting in the arrangement dish, its left and right sides both ends respectively with the side shield forms and to dismantle the connection, the top surface of carrying the thing piece is provided with a plurality of accepting grooves that only can hold a chip, carry the height of thing piece all to be less than the height of side shield and preceding baffle.

Furthermore, the carrying block is a strip-shaped structural body.

Furthermore, a limiting sliding groove extending from front to back is formed in the inner side of the side baffle, and a vertical slot is formed in the position, close to the front end, of the inner side of the side baffle; the left end and the right end of the front baffle are respectively provided with an inserting part corresponding to the vertical slot; and the left end and the right end of the carrying block are respectively provided with a limiting part corresponding to the limiting sliding groove.

Furthermore, the left end and the right end of the front baffle are respectively provided with a mounting groove, an elastic clamping piece is arranged in each mounting groove, the inner side of each side baffle is provided with a clamping groove, and the outer side of each side baffle is provided with a jack communicated with the clamping groove; after the front baffle is connected in place, the outer end of the elastic clamping piece is abutted against the upper groove wall of the clamping groove so as to form limiting; the outer end of the elastic clamping piece can leave the clamping groove and enter the mounting groove after being extruded by external force, so that the limiting is relieved.

Further, after the front baffle and the object carrying block are connected in place, gaps among the object carrying block, the arranging disc and the front baffle are smaller than the minimum size of the chip.

Further, the accommodating grooves are formed in the top surface of the carrying block at equal intervals along the linear direction.

Further, the depth of the accommodating groove is the same as the thickness of the chip.

The invention has the following beneficial effects:

1. according to the invention, the chips are accommodated one by the carrier block, so that the chips accommodated in the accommodating grooves are arranged in order, and the chips which are not accommodated in the accommodating grooves can be removed by other modes, thereby providing convenience for subsequent welding operation.

2. The front baffle plates can be easily detached, so that the carrying blocks are sequentially ejected from back to front, and subsequent processing operation is facilitated.

3. The front baffle and the side baffles are limited by the elastic clamping pieces, so that the front baffle can be stably locked after being installed in place, and the condition that chips are leaked due to separation in the chip arranging process is avoided.

Drawings

FIG. 1 is a perspective view of a preferred embodiment of the present invention;

FIG. 2 is an enlarged view of a portion of FIG. 1 at I;

FIG. 3 is an exploded view of the embodiment of FIG. 1;

FIG. 4 is an enlarged view of a portion of FIG. 3 at II;

FIG. 5 is a left side view of the structure of the embodiment shown in FIG. 1;

FIG. 6 is a sectional view of the structure taken along line A-A in FIG. 5;

fig. 7 is a partial enlarged view at III in fig. 6.

Detailed Description

The invention is further described below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.

As shown in fig. 1 to 7, a chip arranging tool comprises an arranging disc 1, a front baffle 2 and an object carrying block 3.

The left and right sides of arrangement dish 1, arrangement dish 1 are provided with side shield 1.1 respectively. Preceding baffle 2, preceding baffle 2 set up the front end at arrangement dish 1, and both ends form detachable connection with the front end of side shield 1.1 respectively about it. After the front baffle 2 is installed in place, the front baffle and the two side baffles 1.1 form an enclosure for preventing the chip 100 from overflowing.

Carry thing piece 3, carry thing piece 3 setting in arrangement dish 1, both ends form respectively with side shield 1.1 about it and can dismantle the connection, carry the top surface of thing piece 3 and be provided with a plurality of accepting grooves 3.1 that only can hold a chip 100, carry the height that the height of thing piece 3 all is less than side shield 1.1 and preceding baffle 2. The plurality of carrier blocks 3 are arranged in the tidying plate 1 and closely arranged in front and back.

In an alternative embodiment, the carrier block 3 is a strip-shaped structure. In an alternative embodiment, the receiving grooves 3.1 are arranged on the top surface of the carrier block 3 at equal intervals along the straight line direction, and the interval size is matched with the width of the pins.

As shown in fig. 1 and 3, the detachable mounting of the front apron 2 and the carrier block 3 is achieved by: the inboard of side shield 1.1 is provided with by preceding spacing spout 1.2 backward extension, and the inboard position that is close to the front end of side shield 1.1 is provided with vertical slot 1.3. The left end and the right end of the front baffle 2 are respectively provided with an inserting part 2.2 corresponding to the vertical slot 1.3. The left end and the right end of the carrying block 3 are respectively provided with a limiting part 3.2 corresponding to the limiting sliding chute 1.2. When the object carrying blocks 3 are installed, the limiting parts 3.2 are pushed onto the arranging disc 1 after being aligned with the limiting sliding grooves 1.2, all the object carrying blocks 3 are installed in place in sequence, and no obvious gap is formed among the object carrying blocks 3.

As shown in fig. 4 and 7, in order to prevent the front baffle 2 from being separated from the tidying plate 1 during the screening process, it is necessary to lock the front baffle 2 after it is installed in place, and the locking is realized by the following method: the left end and the right end of the front baffle 2 are respectively provided with a mounting groove 2.1, an elastic clamping piece 4 is arranged in the mounting groove 2.1, the inner side of the side baffle 1.1 is provided with a clamping groove 1.5, and the outer side of the side baffle is provided with a jack 1.4 communicated with the clamping groove 1.5; preceding baffle 2 is connected the back that targets in place, thereby the last cell wall of the outer end 4.1 butt draw-in groove 1.5 of elasticity card 4 forms spacingly, and its inner end 4.2 is fixed in preceding baffle 2. The outer end 4.1 of elasticity card 4 receives can leave draw-in groove 1.5 and enter into mounting groove 2.1 after the external force extrusion and thereby relieve spacing.

In an alternative embodiment, after the front baffle 2 and the carrier block 3 are connected in place, the gap between the carrier block 3, the tidying disc 1 and the front baffle 2 is smaller than the minimum size of the chip 100, so as to prevent the chip 100 from being jammed in the gap and affecting subsequent operations.

In an alternative embodiment, the depth of the receiving cavity 3.1 is the same as the thickness of the chip 100, so that the distance between the lead and the chip 100 is at an optimal distance when the lead is soldered.

Before arrangement chip 100, with the front end of baffle 2 installation in order set 1 before, after draw-in groove 1.5 on the outer end 4.1 process side shield 1.1 of elasticity card 4, this end pops out and supports the last cell wall of draw-in groove 1.5 to draw-in groove 1.5, locks baffle 2 before with, can't pull down baffle 2 before this moment, guarantees its fastness. Then the carrying blocks 3 are pushed to the tidying disc 1 one by one, and the carrying block 3 at the forefront clings to the front baffle 2. After the object carrying blocks 3 are mounted, the chips 100 are poured on a large plane formed by the top surfaces of the object carrying blocks 3, then the chips 100 are accommodated in each accommodating groove 3.1 as much as possible by shaking the arranging tray 1 or flatly spreading the chips 100 by hand, the chips 100 which are not accommodated in the accommodating grooves 3.1 are left on the top surfaces of the object carrying blocks 3, at the moment, the front ends of the arranging tray 1 are lifted to be higher than the rear ends, and the chips 100 slide off from the top surfaces of the object carrying blocks 3 under the action of gravity and are uniformly collected. Or the extra chip 100 can be cleaned directly by a brush or the like. The chips 100 remaining in the pockets 3.1 can be aligned with the leads one by one when the leads are soldered.

When the front baffle 2 needs to be detached, the front baffle 2 can be lifted down only by inserting a hard object into the jack 1.4 and pushing the outer end 4.1 of the elastic clamping piece 4 into the mounting groove 2.1 again to remove the limit of the upper groove wall of the clamping groove 1.5.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "left", "right", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation and a specific orientation configuration and operation, and thus, should not be construed as limiting the present invention. Furthermore, "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

In the description of the present invention, "a plurality" means two or more unless otherwise specified. In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate member, or they may be connected through two or more elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The above is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.

Claims (7)

1. The utility model provides a chip arrangement frock which characterized in that includes:

the device comprises a sorting disc (1), wherein side baffles (1.1) are respectively arranged on the left side and the right side of the sorting disc (1);

the front baffle (2) is arranged at the front end of the arranging disc (1), and the left end and the right end of the front baffle (2) are detachably connected with the front end of the side baffle (1.1) respectively;

carry thing piece (3), carry thing piece (3) to set up in arrangement dish (1), about it both ends respectively with side shield (1.1) form can dismantle the connection, the top surface of carrying thing piece (3) is provided with a plurality of accepting grooves (3.1) that only can hold a chip (100), the height of carrying thing piece (3) all is less than the height of side shield (1.1) and preceding baffle (2).

2. A chip arranging tool according to claim 1, characterized in that the carrier block (3) is an elongated structure.

3. The chip arranging tool according to claim 1, characterized in that a limiting sliding groove (1.2) extending from front to back is formed in the inner side of the side baffle (1.1), and a vertical slot (1.3) is formed in the position, close to the front end, of the inner side of the side baffle (1.1); the left end and the right end of the front baffle (2) are respectively provided with an inserting part (2.2) corresponding to the vertical slot (1.3); the left end and the right end of the object carrying block (3) are respectively provided with a limiting part (3.2) corresponding to the limiting sliding groove (1.2).

4. The chip arranging tool according to claim 1, wherein mounting grooves (2.1) are respectively formed in the left end and the right end of the front baffle (2), elastic clamping pieces (4) are arranged in the mounting grooves (2.1), clamping grooves (1.5) are formed in the inner sides of the side baffles (1.1), and inserting holes (1.4) communicated with the clamping grooves (1.5) are formed in the outer sides of the side baffles; after the front baffle (2) is connected in place, the outer end (4.1) of the elastic clamping piece (4) is abutted against the upper groove wall of the clamping groove (1.5) so as to form limiting; the outer end (4.1) of elasticity card (4) receive external force extrusion back can leave draw-in groove (1.5) and enter into thereby relieve spacing in mounting groove (2.1).

5. The chip arranging tool according to claim 1, wherein after the front baffle (2) and the carrying block (3) are connected in place, gaps among the carrying block (3), the arranging disc (1) and the front baffle (2) are smaller than the minimum size of the chip (100).

6. A chip arranging tool according to claim 1, characterized in that the accommodating grooves (3.1) are arranged on the top surface of the carrying block (3) at equal intervals along the linear direction.

7. A chip collating tool according to claim 1, wherein the depth of the accommodating groove (3.1) is the same as the thickness of the chip (100).

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