CN216052866U - Raspberry group DAC expansion board with good heat dissipation performance - Google Patents
Raspberry group DAC expansion board with good heat dissipation performance Download PDFInfo
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- CN216052866U CN216052866U CN202121588852.9U CN202121588852U CN216052866U CN 216052866 U CN216052866 U CN 216052866U CN 202121588852 U CN202121588852 U CN 202121588852U CN 216052866 U CN216052866 U CN 216052866U
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Abstract
The utility model relates to the technical field of raspberry groups, in particular to a raspberry group DAC expansion board with good heat dissipation performance, which comprises a circuit board main body, wherein a first limiting column is fixedly installed inside the circuit board main body, an electric slide rail is fixedly installed inside the circuit board main body, a fan base is movably installed inside the electric slide rail, a shell base is movably installed at the bottom of the circuit board main body, a shell top cover is movably installed on the upper surface of the shell base, a sliding groove is formed in one side of the outer surface of the shell top cover, and a fixing mechanism is movably installed inside the sliding groove. The utility model has the advantages that: the problems that the internal heat dissipation effect is not good and the heat dissipation effect is not uniform are solved through the matched arrangement of the electric slide rail, the first magnet, the second magnet, the fan base and the heat dissipation fan; through the cooperation setting of fixed establishment, third magnet and fourth magnet, solved and dismantled inconvenient problem.
Description
Technical Field
The utility model relates to the technical field of raspberry groups, in particular to a raspberry group DAC expansion board with good heat dissipation performance.
Background
The raspberry pie is designed for learning computer programming education, and is a microcomputer with the size of a credit card, and the system of the raspberry pie is based on Linux.
The defects of the existing raspberry pi DAC expansion board are as follows:
1. the traditional raspberry-type DAC expansion board has poor and uniform internal heat dissipation effect, and is not convenient to assemble and disassemble a heat dissipation fan;
2. the DAC expansion board is sent to current raspberry, and wherein the installation shell is not convenient for dismantle for follow-up very inconvenient when needing the maintenance.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the defects of the prior art, improve the heat dissipation effect of the device, prevent the problems that the heat dissipation effect is not good enough and the heat dissipation effect is not uniform enough and the subsequent disassembly and assembly of the heat dissipation fan are not convenient enough, improve the structure of the device and prevent the problem that the subsequent maintenance is inconvenient because the shell is not convenient to disassemble.
The purpose of the utility model is realized by the following technical scheme: the utility model provides a raspberry group DAC expansion board that heat dispersion is good, includes the circuit board main part, the inside fixed mounting of circuit board main part has first spacing post, the inside fixed mounting of circuit board main part has electronic slide rail, the inside movable mounting of electronic slide rail has fan base, the bottom movable mounting of circuit board main part has outer shell base, the last surface movable mounting of outer shell base has the shell top cap, the spout has been seted up to one side of shell top cap surface, the inside movable mounting of spout has fixed establishment.
Optionally, the electric slide rails are communicated with two sides inside the circuit board main body, one side of the outer surface of the fan base is fixedly provided with the electric slide block, the electric slide block is driven to move subsequently through the arrangement of the electric slide rails, and the electric slide rails are communicated with the inside of the circuit board main body, so that the movement range of the electric slide block is larger, and the subsequent heat dissipation effect is improved;
the electric sliding block is movably arranged inside the electric sliding rail, the bottom of the fan base is provided with the heat dissipation port, the bottom of the fan base is fixedly provided with the first magnet, the electric sliding block is controlled to move inside the electric sliding rail, so that the heat dissipation fan is driven to move, and the subsequent heat dissipation fan can be fixed inside the fan base through the arrangement of the first magnet.
Optionally, a cooling fan is movably mounted on the upper surface of the fan base, a second magnet is arranged on the outer surface of the bottom of the cooling fan, and the cooling fan is controlled through the matching arrangement of the second magnet and the first magnet;
the first magnet and the second magnet are matched, a gap exists between the fan base and the upper surface of the circuit board main body, and through the arrangement of the gap, the air in the device can be well circulated in the working process of the cooling fan.
Optionally, a limiting rod is fixedly mounted on the upper surface inside the housing base, the limiting rod penetrates through the inside of the first limiting column, and the housing base is limited through the limiting rod and the first limiting column;
the number of the first limiting columns is four, the first limiting columns are distributed around the inner portion of the circuit board main body, the number of the limiting rods is four, and the limiting rods are arranged according to the positions of the first limiting columns.
Optionally, the upper surface of the inside of the top cover of the housing is fixedly provided with four second limiting posts, the second limiting posts are arranged according to the positions of the first limiting posts, and the limiting posts are inserted into the inside of the second limiting posts through limiting rods, so that the top cover of the housing is limited;
the quantity of spout is two sets of, and symmetric distribution in the both sides of shell top cap, one side of fixed establishment is provided with the stopper, the surface of stopper and the inside swing joint of spout are through removing fixed establishment along the spout to make fixed establishment insert the inside of spout.
Optionally, a third magnet is fixedly mounted on one side of the housing base, a fourth magnet is fixedly mounted on one side of the fixing mechanism, and the fixing mechanism is inserted into the chute, so that the fourth magnet and the third magnet are attracted to fix the fixing mechanism;
the third magnet and the fourth magnet are arranged in a matched mode, the upper surface of the top cover of the shell is provided with heat dissipation holes, and the heat dissipation effect inside the device is improved through the heat dissipation holes.
The utility model has the following advantages:
1. this DAC expansion plate is sent to raspberry that heat dispersion is good, there is electronic slide rail through the inside fixed mounting of circuit board main part, the inside movable mounting of electronic slide rail has fan base, fan base bottom fixed mounting has first magnet, the surface of radiator fan bottom is provided with the second magnet, cooperation setting through first magnet and second magnet, install radiator fan in fan base's inside, thereby fix radiator fan, move in the inside of electronic slide rail through control fan base, thereby it removes to drive radiator fan, work through control radiator fan, and then carry out the heat dissipation treatment to device inside, current DAC expansion plate is sent to raspberry has been solved, its inside radiating effect is not very good, the radiating effect is not enough even simultaneously, follow-up not convenient problem to radiator fan's dismouting simultaneously.
2. This DAC expansion board is sent to raspberry that heat dispersion is good, there is the shell top cap through the last surface movable mounting of shell base, the spout has been seted up to one side of shell top cap surface, the inside movable mounting of spout has fixed establishment, thereby it is spacing to shell top cap and shell base through the inside that inserts fixed establishment the spout, one side fixed mounting through the shell base has the third magnet, one side fixed mounting of fixed establishment has the fourth magnet, through the cooperation of third magnet with fourth magnet, make to fix fixed establishment, thereby be convenient for carry out the dismouting to the device, current DAC expansion board is sent to raspberry has been solved, wherein install the shell and be not convenient for dismantle, make follow-up very inconvenient problem when needs maintenance.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural diagram of a housing base according to the present invention;
FIG. 3 is a schematic structural diagram of a circuit board body according to the present invention;
FIG. 4 is a cross-sectional view of a structural heat dissipation fan of the present invention;
FIG. 5 is a cross-sectional view of the present invention at the structural power slide;
FIG. 6 is an enlarged schematic view of the present invention at configuration A of FIG. 4;
FIG. 7 is an enlarged schematic view of the present invention at configuration B of FIG. 4;
FIG. 8 is a circuit diagram of the present invention using MCU and digital power amplifier to realize digital dac function;
FIG. 9 is a circuit diagram of the Hdmi male-female interface conversion of the present invention.
In the figure: 1-circuit board body, 2-first limiting column, 3-electric sliding rail, 4-fan base, 5-shell base, 6-shell top cover, 7-sliding chute, 8-fixing mechanism, 9-electric sliding block, 10-first magnet, 11-heat dissipation fan, 12-second magnet, 13-limiting rod, 14-second limiting column, 15-third magnet, 16-fourth magnet and 17-heat dissipation hole.
Detailed Description
The utility model will be further described with reference to the accompanying drawings, but the scope of the utility model is not limited to the following.
As shown in fig. 1-9, a raspberry pi DAC expansion board with good heat dissipation performance includes a circuit board main body 1, a first limit column 2 is fixedly mounted inside the circuit board main body 1, an electric slide rail 3 is fixedly mounted inside the circuit board main body 1, a fan base 4 is movably mounted inside the electric slide rail 3, a housing base 5 is movably mounted at the bottom of the circuit board main body 1, a housing top cover 6 is movably mounted on the upper surface of the housing base 5, a chute 7 is formed in one side of the outer surface of the housing top cover 6, and a fixing mechanism 8 is movably mounted inside the chute 7.
As a preferred technical scheme of the utility model:
the electric slide rails 3 are communicated with two sides of the interior of the circuit board main body 1, the electric slide block 9 is driven to move subsequently through the arrangement of the electric slide rails 3, and the electric slide rails 3 are communicated with the interior of the circuit board main body 1, so that the movement range of the electric slide block 9 is large, and the subsequent heat dissipation effect is increased;
one side fixed mounting of fan base 4 surface has electronic slider 9, and the thermovent has been seted up to fan base 4's bottom, and fan base 4 bottom fixed mounting has first magnet 10, moves in electronic slide rail 3's inside through controlling electronic slider 9 to drive radiator fan 11 and remove, through the setting of first magnet 10, thereby make follow-up radiator fan 11 can be fixed in fan base 4's inside.
The outer surface of the bottom of the cooling fan 11 is provided with a second magnet 12, the cooling fan 11 is controlled through the matching arrangement of the second magnet 12 and the first magnet 10, the first magnet 10 and the second magnet 12 are arranged in a matching manner, a gap exists between the fan base 4 and the upper surface of the circuit board main body 1, and through the arrangement of the gap, air in the cooling fan 11 can be circulated well in the working process;
the limiting rod 13 penetrates through the inside of the first limiting column 2, and the limiting rod 13 and the first limiting column 2 are arranged, so that limiting processing is carried out on the housing base 5.
The number of the first limiting columns 2 is four, the first limiting columns are distributed on the periphery of the inner part of the circuit board main body 1, and the number of the limiting rods 13 is four, and the limiting rods are arranged according to the positions of the first limiting columns 2;
the quantity of the second limit column 14 is four, and is set according to the position of the first limit column 2, and is inserted into the inside of the second limit column 14 through the limit rod 13, so that the shell top cover 6 is limited.
The quantity of spout 7 is two sets of, and symmetric distribution is in the both sides of shell top cap 6, and one side of fixed establishment 8 is provided with the stopper, and the surface of stopper and the inside swing joint of spout 7 are through removing fixed establishment 8 along spout 7 to make fixed establishment 8 insert the inside of spout 7.
A third magnet 15 is fixedly mounted on one side of the housing base 5, a fourth magnet 16 is fixedly mounted on one side of the fixing mechanism 8, and the fixing mechanism 8 is inserted into the sliding groove 7, so that the fourth magnet 16 and the third magnet 15 attract each other, and the fixing mechanism 8 is fixed.
The working process of the utility model is as follows:
s1: the fan base 4 is controlled to move in the electric slide rail 3, so that the heat dissipation fan 11 is driven to move, and the heat dissipation fan 11 is controlled to work, so that the heat dissipation treatment is performed on the interior of the device;
s2: thereby insert the inside of spout 7 through with fixed establishment 8 and carry on spacingly to shell top cap 6 and shell base 5, through the cooperation of third magnet 15 with fourth magnet 16 for fix fixed establishment 8, make the installation of device very convenient, subsequent dismantlement and the installation of being convenient for.
In conclusion, when the raspberry group DAC expansion board with good heat dissipation performance is used, the electric slide rail 3 is fixedly installed inside the circuit board main body 1, the fan base 4 is movably installed inside the electric slide rail 3, the first magnet 10 is fixedly installed at the bottom of the fan base 4, the second magnet 12 is arranged on the outer surface of the bottom of the heat dissipation fan 11, the heat dissipation fan 11 is installed inside the fan base 4 through the matching arrangement of the first magnet 10 and the second magnet 12, so that the heat dissipation fan 11 is fixed, the heat dissipation fan 11 is driven to move by controlling the fan base 4 to move inside the electric slide rail 3, the heat dissipation treatment is further performed inside the device by controlling the heat dissipation fan 11 to work, the problem that the existing raspberry group DAC expansion board is poor in heat dissipation effect and not uniform in heat dissipation effect is solved, meanwhile, the subsequent disassembly and assembly of the cooling fan is not convenient enough; there is shell top cap 6 through the last surface movable mounting of shell base 5, spout 7 has been seted up to one side of shell top cap 6 surface, the inside movable mounting of spout 7 has fixed establishment 8, thereby it is spacing to shell top cap 6 and shell base 5 through the inside with fixed establishment 8 insert spout 7, one side fixed mounting through shell base 5 has third magnet 15, one side fixed mounting of fixed establishment 8 has fourth magnet 16, through the cooperation of third magnet 15 with fourth magnet 16, make to fix fixed establishment 8, thereby be convenient for carry out the dismouting to the device, current raspberry group DAC expansion board has been solved, wherein the installation shell is not convenient for dismantle, make follow-up very inconvenient problem when needs maintenance.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a raspberry group DAC expansion board that heat dispersion is good which characterized in that: including circuit board main part (1), the inside fixed mounting of circuit board main part (1) has first spacing post (2), the inside fixed mounting of circuit board main part (1) has electronic slide rail (3), the inside movable mounting of electronic slide rail (3) has fan base (4), the bottom movable mounting of circuit board main part (1) has outer shell base (5), the last movable surface mounting of outer shell base (5) has shell top cap (6), spout (7) have been seted up to one side of shell top cap (6) surface, the inside movable mounting of spout (7) has fixed establishment (8).
2. The raspberry pi DAC expansion board of claim 1, wherein: the electric slide rails (3) are communicated with two sides inside the circuit board main body (1), and one side of the outer surface of the fan base (4) is fixedly provided with an electric slide block (9);
the electric sliding block (9) is movably mounted inside the electric sliding rail (3), a heat dissipation opening is formed in the bottom of the fan base (4), and a first magnet (10) is fixedly mounted at the bottom of the fan base (4).
3. The raspberry pi DAC expansion board of claim 2, wherein: a heat radiation fan (11) is movably mounted on the upper surface of the fan base (4), and a second magnet (12) is arranged on the outer surface of the bottom of the heat radiation fan (11);
the first magnet (10) and the second magnet (12) are arranged in a matched mode, and a gap exists between the fan base (4) and the upper surface of the circuit board main body (1).
4. The raspberry pi DAC expansion board of claim 1, wherein: a limiting rod (13) is fixedly arranged on the upper surface inside the shell base (5), and the limiting rod (13) penetrates through the inside of the first limiting column (2);
the number of the first limiting columns (2) is four, the first limiting columns are distributed around the inner portion of the circuit board main body (1), the number of the limiting rods (13) is four, and the limiting rods are arranged according to the positions of the first limiting columns (2).
5. The raspberry pi DAC expansion board of claim 1, wherein: the upper surface of the inside of the shell top cover (6) is fixedly provided with four second limiting columns (14), and the number of the second limiting columns (14) is four, and the second limiting columns are arranged according to the positions of the first limiting columns (2);
the quantity of spout (7) is two sets of, and symmetric distribution in the both sides of shell top cap (6), one side of fixed establishment (8) is provided with the stopper, the surface of stopper and the inside swing joint of spout (7).
6. The raspberry pi DAC expansion board of claim 1, wherein: a third magnet (15) is fixedly arranged on one side of the shell base (5), and a fourth magnet (16) is fixedly arranged on one side of the fixing mechanism (8);
the third magnet (15) and the fourth magnet (16) are arranged in a matched mode, and heat dissipation holes (17) are formed in the upper surface of the shell top cover (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121588852.9U CN216052866U (en) | 2021-07-13 | 2021-07-13 | Raspberry group DAC expansion board with good heat dissipation performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121588852.9U CN216052866U (en) | 2021-07-13 | 2021-07-13 | Raspberry group DAC expansion board with good heat dissipation performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216052866U true CN216052866U (en) | 2022-03-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121588852.9U Active CN216052866U (en) | 2021-07-13 | 2021-07-13 | Raspberry group DAC expansion board with good heat dissipation performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216052866U (en) |
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2021
- 2021-07-13 CN CN202121588852.9U patent/CN216052866U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 518000 Room 301, building 2, Xiechang Industrial Park, No. 109, Jinbi Road, Liulian community, Pingshan street, Pingshan District, Shenzhen City, Guangdong Province Patentee after: Santa Technology (Shenzhen) Co.,Ltd. Address before: 518000 No. 12, Xinda Road, biling community, Pingshan new area, Shenzhen, Guangdong Patentee before: SUN SCALE (SZ) MANUFACTURING LTD. |
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| CP03 | Change of name, title or address |