CN216046413U

CN216046413U - High-stability film coating machine for chip production

Info

Publication number: CN216046413U
Application number: CN202122318447.1U
Authority: CN
Inventors: 夏英洪
Original assignee: Maanshan Sipaikechuang Technology Co ltd
Current assignee: Maanshan Sipaikechuang Technology Co ltd
Priority date: 2021-09-24
Filing date: 2021-09-24
Publication date: 2022-03-15
Anticipated expiration: 2031-09-24

Abstract

The utility model discloses a film plating machine with high stability for chip production, which comprises a film plating machine body and a buffer box, wherein the bottom of an inner cavity of the buffer box is provided with a buffer groove, the inner cavity of the buffer groove is fixedly connected with a buffer slide rod, the surface of the buffer slide rod is slidably connected with a buffer slide block, the surface of the buffer slide rod is slidably connected with a first spring, the top of the buffer slide block is fixedly connected with a buffer block, the top of the inner cavity of the buffer box is provided with a buffer plate, and the bottom of the buffer plate is fixedly connected with a buffer pulley. According to the film coating machine, the film coating machine body, the buffer box, the buffer groove, the buffer slide rod, the buffer slide block, the first spring, the buffer block, the buffer plate, the buffer pulley, the spring piece, the limiting box, the second spring, the limiting plate, the limiting column, the limiting block, the damper and the third spring are matched for use, so that the buffer performance of the film coating machine body during use can be effectively improved, the stability is improved, and the film coating effect is improved.

Description

High-stability film coating machine for chip production

Technical Field

The utility model relates to the technical field of film coating machines, in particular to a film coating machine with high stability for chip production.

Background

The chip is also called integrated circuit, the integrated circuit of the circuit on the surface of semiconductor chip is also called thin film integrated circuit, another thick film integrated circuit is a miniaturized circuit formed by independent semiconductor equipment and passive component, integrated to the substrate or circuit board, the chip needs to use the film coating machine while producing, but the existing film coating machine has poorer buffer performance, and the production efficiency is easy to be reduced because of poor stability when using.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a coating machine with high stability for chip production, which has the advantage of high stability and solves the problems that the existing coating machine is poor in buffering performance and is easy to reduce the production efficiency due to poor stability during use.

In order to achieve the purpose, the utility model provides the following technical scheme: a film plating machine with high stability for chip production comprises a film plating machine body and a buffer tank, wherein a buffer groove is formed in the bottom of an inner cavity of the buffer tank, a buffer slide rod is fixedly connected to the inner cavity of the buffer groove, a buffer slide block is slidably connected to the surface of the buffer slide rod, a first spring is slidably connected to the surface of the buffer slide rod, a buffer block is fixedly connected to the top of the buffer slide block, a buffer plate is arranged at the top of the inner cavity of the buffer tank, a buffer pulley is fixedly connected to the bottom of the buffer plate, spring pieces are fixedly connected to the bottoms of two sides of the buffer tank, a limiting tank is fixedly connected to one side of the buffer block, a second spring is fixedly connected to the inner cavity of the limiting tank, a limiting plate is fixedly connected to one end of the second spring, a limiting column is fixedly connected to one side of the limiting plate, and a limiting block is fixedly connected to one end, away from the limiting column, of the limiting plate, the center department fixedly connected with attenuator of baffle-box inner chamber bottom, the surface cover of attenuator is equipped with the third spring.

Preferably, the top of baffle-box is for opening the design, the bottom of coating machine body and the top fixed connection of buffer board.

Preferably, the number of the buffer grooves and the number of the buffer blocks are four, the cross section of each buffer block is trapezoidal, and the bottom of each buffer pulley is in contact with the surface of each buffer block.

Preferably, the two sides of the buffer box are provided with limiting sliding grooves, the inner cavity of each limiting sliding groove is fixedly connected with a limiting sliding rod, the surface of each limiting sliding rod is connected with a limiting sliding block, and one side of each limiting sliding block is fixedly connected with the buffer plate.

Preferably, the top of the two sides of the inner cavity of the buffer box is fixedly connected with a fixing plate, the inner cavity of the fixing plate is provided with a limiting pulley, and one side of the limiting pulley is in contact with the surface of the coating machine body.

Preferably, the shape of the limiting blocks is matched with the spring sheet, and the number of the limiting blocks is eight.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the film coating machine, the film coating machine body, the buffer box, the buffer groove, the buffer slide rod, the buffer slide block, the first spring, the buffer block, the buffer plate, the buffer pulley, the spring piece, the limiting box, the second spring, the limiting plate, the limiting column, the limiting block, the damper and the third spring are matched for use, so that the buffer performance of the film coating machine body during use can be effectively improved, the stability is improved, the film coating effect is improved, and the problems that the existing film coating machine is poor in buffer performance and the production efficiency is easily reduced due to poor stability during use are solved.

2. According to the utility model, the limiting sliding chute, the limiting sliding rod and the limiting sliding block are arranged, so that the buffer plate can better slide up and down, the fixed plate and the limiting pulley are arranged, the coating machine body can be prevented from shaking left and right during movement, and the limiting block and the spring piece are arranged, so that the buffering effect can be better improved.

Drawings

FIG. 1 is a schematic view of the interior of the structure of the present invention;

FIG. 2 is a schematic view of the internal structure of the spacing box of the present invention;

fig. 3 is an enlarged view of the utility model at a in fig. 1.

In the figure: 1. a film plating machine body; 2. a buffer tank; 3. a buffer groove; 4. buffering the sliding rod; 5. a buffer slide block; 6. a first spring; 7. a buffer block; 8. a buffer plate; 9. a buffer pulley; 10. a spring plate; 11. a limiting box; 12. a second spring; 13. a limiting plate; 14. a limiting column; 15. a limiting block; 16. a damper; 17. a third spring; 18. a limiting chute; 19. a limiting slide bar; 20. a limiting slide block; 21. a fixing plate; 22. and limiting the pulley.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "connected", and the like are to be construed broadly, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The components used in the present invention are all standard components or components known to those skilled in the art, and the structure and principle thereof can be known to those skilled in the art through technical manuals or through routine experiments.

Referring to fig. 1-3, a film plating machine with high stability for chip production comprises a film plating machine body 1 and a buffer tank 2, the top of the buffer tank 2 is open, the bottom of the film plating machine body 1 is fixedly connected with the top of a buffer plate 8, both sides of the buffer tank 2 are provided with limit chutes 18, the inner cavity of each limit chute 18 is fixedly connected with a limit slide bar 19, the surface of each limit slide bar 19 is slidably connected with a limit slider 20, one side of each limit slider 20 is fixedly connected with the buffer plate 8, the tops of both sides of the inner cavity of the buffer tank 2 are fixedly connected with a fixing plate 21, the inner cavity of each fixing plate 21 is provided with a limit pulley 22, one side of each limit pulley 22 is in contact with the surface of the film plating machine body 1, the buffer plate 8 can better slide up and down by arranging the limit chutes 18, the limit slide bars 19 and the limit sliders 20, and by arranging the fixing plates 21 and the limit pulleys 22, can prevent the film coating machine body 1 from shaking leftwards and rightwards when moving, can better improve the buffering effect by arranging the limiting blocks 15 and the spring pieces 10, the bottom of the inner cavity of the buffer box 2 is provided with the buffering groove 3, the number of the buffering groove 3 and the buffering blocks 7 is four, the cross section of each buffering block 7 is trapezoidal, the bottom of each buffering pulley 9 is contacted with the surface of the corresponding buffering block 7, the inner cavity of the buffering groove 3 is fixedly connected with the buffering slide rod 4, the surface of each buffering slide rod 4 is slidably connected with the buffering slide block 5, the shape of each limiting block 15 is matched with the spring pieces 10, the number of the limiting blocks 15 is eight, the surface of each buffering slide rod 4 is slidably connected with the first spring 6, the top of each buffering slide block 5 is fixedly connected with the corresponding buffering block 7, the top of the inner cavity of the buffer box 2 is provided with the buffering plate 8, the bottom of each buffering pulley 9 is fixedly connected with the bottom of each buffering plate 8, the bottoms of two sides of the buffer box 2 are fixedly connected with the spring pieces 10, one side of the buffer block 7 is fixedly connected with a limit box 11, the inner cavity of the limit box 11 is fixedly connected with a second spring 12, one end of the second spring 12 is fixedly connected with a limit plate 13, one side of the limit plate 13 is fixedly connected with a limit post 14, one end of the limit post 14 far away from the limit plate 13 is fixedly connected with a limit block 15, the center of the bottom of the inner cavity of the buffer box 2 is fixedly connected with a damper 16, the surface of the damper 16 is sleeved with a third spring 17, and the buffer box 2, the buffer groove 3, the buffer slide bar 4, the buffer slide block 5, the first spring 6, the buffer block 7, the buffer plate 8, the buffer pulley 9, the spring piece 10, the limit box 11, the second spring 12, the limit plate 13, the limit post 14, the limit block 15, the damper 16 and the third spring 17 are matched for use, so that the buffer performance of the coating machine body 1 during use can be effectively improved, and the stability is improved, thereby improving the film coating effect and solving the problems that the prior film coating machine has poor buffer performance and is easy to cause the reduction of the production efficiency due to poor stability when in use.

During the use, coating machine body 1 produces pressure to buffer board 8, buffer board 8 is to buffering pulley 9, attenuator 16 and third spring 17 produce pressure, buffering pulley 9 produces pressure to buffer block 7, make buffer block 7 to one side removal, buffer block 7 produces pressure to snubber block 5 and first spring 6, make spacing case 11 when buffer block 7 removes, second spring 12, limiting plate 13, spacing post 14 and limiting block 15 move to one side, limiting block 15 and spring leaf 10 contact, through first spring 6, second spring 12, attenuator 16 and third spring 17's cooperation is used, can effectual absorption rocking that produces, make coating machine body 1 inside remain stable.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a chip production is with coating machine that stability is high, includes coating machine body (1) and baffle-box (2), its characterized in that: the buffer box is characterized in that a buffer groove (3) is formed in the bottom of an inner cavity of the buffer box (2), a buffer slide rod (4) is fixedly connected to an inner cavity of the buffer groove (3), a buffer slide block (5) is connected to the surface of the buffer slide rod (4), a first spring (6) is connected to the surface of the buffer slide rod (4), a buffer block (7) is fixedly connected to the top of the buffer slide block (5), a buffer plate (8) is arranged at the top of the inner cavity of the buffer box (2), a buffer pulley (9) is fixedly connected to the bottom of the buffer plate (8), spring pieces (10) are fixedly connected to the bottoms of two sides of the buffer box (2), a limit box (11) is fixedly connected to one side of the buffer block (7), a second spring (12) is fixedly connected to the inner cavity of the limit box (11), and a limit plate (13) is fixedly connected to one end of the second spring (12), spacing post (14) of one side fixedly connected with of limiting plate (13), one end fixedly connected with stopper (15) of limiting plate (13) are kept away from in spacing post (14), fixedly connected with attenuator (16) is located at the center of baffle-box (2) inner chamber bottom, the surface cover of attenuator (16) is equipped with third spring (17).

2. The coating machine of claim 1 for chip production with high stability, characterized in that: the top of buffer box (2) is for opening the design, the bottom of coating machine body (1) and the top fixed connection of buffer board (8).

3. The coating machine of claim 1 for chip production with high stability, characterized in that: the number of the buffer grooves (3) and the number of the buffer blocks (7) are four, the cross section of each buffer block (7) is trapezoidal, and the bottom of each buffer pulley (9) is in contact with the surface of each buffer block (7).

4. The coating machine of claim 1 for chip production with high stability, characterized in that: spacing spout (18) have all been seted up to the both sides of baffle-box (2), the inner chamber fixedly connected with spacing slide bar (19) of spacing spout (18), the surperficial sliding connection of spacing slide bar (19) has spacing slider (20), one side and buffer board (8) fixed connection of spacing slider (20).

5. The coating machine of claim 1 for chip production with high stability, characterized in that: the top of buffer tank (2) inner chamber both sides all fixedly connected with fixed plate (21), the inner chamber of fixed plate (21) is provided with spacing pulley (22), one side of spacing pulley (22) contacts with the surface of coating machine body (1).

6. The coating machine of claim 1 for chip production with high stability, characterized in that: the shape of the limiting blocks (15) is matched with the spring pieces (10), and the number of the limiting blocks (15) is eight.