CN216041845U - High-strength rubber-plastic heat-insulation board - Google Patents
High-strength rubber-plastic heat-insulation board Download PDFInfo
- Publication number
- CN216041845U CN216041845U CN202121207921.7U CN202121207921U CN216041845U CN 216041845 U CN216041845 U CN 216041845U CN 202121207921 U CN202121207921 U CN 202121207921U CN 216041845 U CN216041845 U CN 216041845U
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- rubber
- heat
- plastic
- adhesive linkage
- layer
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- 238000009413 insulation Methods 0.000 title claims abstract description 53
- 239000004033 plastic Substances 0.000 title claims abstract description 48
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 239000000853 adhesive Substances 0.000 claims description 27
- 230000001070 adhesive effect Effects 0.000 claims description 27
- 239000000428 dust Substances 0.000 claims description 6
- 238000004321 preservation Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 28
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- Laminated Bodies (AREA)
Abstract
The utility model discloses a high-strength rubber and plastic heat-insulation board, which comprises a rubber and plastic substrate, wherein one side of the rubber and plastic substrate is provided with a first bonding layer, the other side of the rubber and plastic substrate is provided with a second bonding layer, the first bonding layer and the second bonding layer are fixedly bonded with the rubber and plastic substrate, the heat-insulation board is arranged outside the first bonding layer and is fixedly bonded with the first bonding layer, the heat-insulation board is arranged outside the second bonding layer and is fixedly bonded with the second bonding layer, the outer side surfaces of the first heat-insulation board and the second heat-insulation board are provided with a third bonding layer, the outer surface of the third bonding layer is provided with a dust-proof layer, and the dust-proof layer and the third bonding layer are fixedly bonded with each other. The rubber and plastic heat insulation board can realize the heat insulation performance of the board body through the additionally arranged multilayer heat insulation structure, so that the strength of the board body is improved.
Description
Technical Field
The utility model relates to the technical field of rubber and plastic insulation boards, in particular to a high-strength rubber and plastic insulation board.
Background
The existing rubber and plastic heat insulation board adopts a rubber and plastic board as a base plate, so that the basic heat insulation performance of rubber and plastic is realized by the heat insulation material additionally arranged outside the rubber and plastic base plate, the existing rubber and plastic heat insulation board is single in heat insulation structure additionally arranged, the effect is poor on the heat insulation performance of the board body, and the strength of the board body in the using process is reduced.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a high-strength rubber-plastic heat-insulation board, which solves the problems in the background technology.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a high strength rubber and plastic heated board, includes the rubber and plastic base plate, one side of rubber and plastic base plate is equipped with adhesive linkage one, the opposite side of rubber and plastic base plate is equipped with adhesive linkage two, adhesive linkage one with adhesive linkage two all with the rubber and plastic base plate is fixed through bonding, the outside of adhesive linkage one is equipped with heated board one and is fixed through bonding, the outside of adhesive linkage two is equipped with heated board two and passes through bonding fixedly, heated board one with the lateral surface of heated board two is equipped with adhesive linkage three, the surface of adhesive linkage three is equipped with the dust layer, the dust layer with it is fixed that the adhesive linkage tee is crossed to bond.
As a preferred embodiment of the utility model, a first heat insulation layer is arranged between the first heat insulation plate and the second heat insulation plate and between the third bonding layer, and the first heat insulation layer is bonded and fixed on the surfaces of the first heat insulation plate and the second heat insulation plate through the third bonding layer.
As a preferred embodiment of the present invention, a second insulating layer is disposed inside the rubber-plastic substrate, and the second insulating layer is embedded inside the rubber-plastic substrate and fixed by adhesion.
Compared with the prior art, the utility model has the following beneficial effects:
the rubber and plastic heat insulation board can realize the heat insulation performance of the board body through the additionally arranged multilayer heat insulation structure, so that the strength of the board body is improved.
Drawings
FIG. 1 is a front view of the high-strength rubber-plastic insulation board of the present invention.
In the figure, a rubber-plastic substrate 1, a bonding layer I2, a bonding layer II 3, a heat-insulating plate I4, a heat-insulating plate II 5, a bonding layer III 6, a dust-proof layer 7, a heat-insulating layer I8 and a heat-insulating layer II 9 are arranged.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the present invention provides a technical solution: the utility model provides a high strength rubber and plastic heated board, includes rubber and plastic base plate 1, one side of rubber and plastic base plate 1 is equipped with adhesive linkage one 2, the opposite side of rubber and plastic base plate 1 is equipped with adhesive linkage two 3, adhesive linkage one 2 with adhesive linkage two 3 all with rubber and plastic base plate 1 is fixed through bonding, the outside of adhesive linkage one 2 is equipped with heated board one 4 and fixes through bonding, the outside of adhesive linkage two 3 is equipped with heated board two 5 and fixes through bonding, heated board one 4 with the lateral surface of heated board two 5 is equipped with adhesive linkage three 6, the surface of adhesive linkage three 6 is equipped with dust layer 7, dust layer 7 with adhesive linkage three 6 is fixed through bonding.
Referring to fig. 1, a first heat insulation layer 8 is arranged between the first heat insulation plate 4, the second heat insulation plate 5 and the third adhesive layer 6, the first heat insulation layer 8 is fixedly bonded to the surfaces of the first heat insulation plate 4 and the second heat insulation plate 5 through the third adhesive layer 6, and the first heat insulation layer 8 is additionally arranged to realize an external heat insulation function of the rubber-plastic substrate 1.
Referring to fig. 1, a second insulating layer 9 is arranged inside the rubber-plastic substrate 1, the second insulating layer 9 is embedded inside the rubber-plastic substrate 1 and is fixed by bonding, and the internal insulating function of the rubber-plastic substrate 1 can be realized by the additionally arranged second insulating layer 9.
The rubber-plastic heat-insulation plate comprises a rubber-plastic substrate 1, a bonding layer I2, a bonding layer II 3, a heat-insulation plate I4, a heat-insulation plate II 5, a bonding layer III 6, a dust-proof layer 7, a heat-insulation layer I8 and a heat-insulation layer III 9 which are all universal standard parts or parts known by technicians in the field, and the structure and the principle of the rubber-plastic heat-insulation plate are known by technical manuals or conventional experimental methods. According to the rubber and plastic heat-insulation plate, the heat-insulation performance of the plate body can be realized through the additionally arranged multilayer heat-insulation structure, so that the strength of the plate body is improved.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the utility model. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (3)
1. A high strength rubber and plastic heat preservation board which is characterized in that: including rubber and plastic base plate (1), one side of rubber and plastic base plate (1) is equipped with adhesive linkage one (2), the opposite side of rubber and plastic base plate (1) is equipped with adhesive linkage two (3), adhesive linkage one (2) with adhesive linkage two (3) all with rubber and plastic base plate (1) is fixed through bonding, the outside of adhesive linkage one (2) is equipped with heated board one (4) and fixes through bonding, the outside of adhesive linkage two (3) is equipped with heated board two (5) and fixes through bonding, heated board one (4) with the lateral surface of heated board two (5) is equipped with adhesive linkage three (6), the surface of adhesive linkage three (6) is equipped with dust layer (7), dust layer (7) with adhesive linkage three (6) are fixed through bonding.
2. The high-strength rubber-plastic heat-insulation board as claimed in claim 1, wherein: the heat insulation board I (4) and the heat insulation board II (5) are arranged between the bonding layer III (6) and the heat insulation layer I (8), and the heat insulation layer I (8) is bonded and fixed on the surfaces of the heat insulation board I (4) and the heat insulation board II (5) through the bonding layer III (6).
3. The high-strength rubber-plastic heat-insulation board as claimed in claim 1, wherein: and a second heat-insulating layer (9) is arranged inside the rubber-plastic substrate (1), and the second heat-insulating layer (9) is embedded into the rubber-plastic substrate (1) and fixed through bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121207921.7U CN216041845U (en) | 2021-06-01 | 2021-06-01 | High-strength rubber-plastic heat-insulation board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121207921.7U CN216041845U (en) | 2021-06-01 | 2021-06-01 | High-strength rubber-plastic heat-insulation board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216041845U true CN216041845U (en) | 2022-03-15 |
Family
ID=80614562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121207921.7U Active CN216041845U (en) | 2021-06-01 | 2021-06-01 | High-strength rubber-plastic heat-insulation board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216041845U (en) |
-
2021
- 2021-06-01 CN CN202121207921.7U patent/CN216041845U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240807 Address after: No. 900, Group 3, Residential Area 55, Saheti Community, Red Flag Slope Area Management Committee, Aksu Prefecture, Xinjiang Uygur Autonomous Region, 843000 Patentee after: Luo Feng Country or region after: China Address before: G061, 2nd floor, building 3, high tech entrepreneurship service center, 82 Huayuan West Road, Chuzhou City, Anhui Province 239000 Patentee before: Chuzhou sanjiewai Industrial Design Co.,Ltd. Country or region before: China |
|
| TR01 | Transfer of patent right |