CN216039879U - Production line for electroplating conductive film - Google Patents
Production line for electroplating conductive film Download PDFInfo
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- CN216039879U CN216039879U CN202122385468.5U CN202122385468U CN216039879U CN 216039879 U CN216039879 U CN 216039879U CN 202122385468 U CN202122385468 U CN 202122385468U CN 216039879 U CN216039879 U CN 216039879U
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Abstract
The embodiment of the utility model provides a production line for electroplating a conductive film, which comprises: the conductive film is electroplated for multiple times through each electroplating unit in sequence; each electroplating unit comprises an electroplating bath, a metal ion removing tank and a conductive tank which are arranged in sequence; the conductive groove of the former electroplating unit in the two adjacent electroplating units is adjacent to the electroplating groove of the latter electroplating unit; in the electroplating process, the metal ions brought into the plating solution when the conductive film is carried are removed through the metal ion removing groove, so that the condition that the plating solution in the electroplating groove is brought into the conductive groove by the conductive film to cause the plating of a layer of metal film on the conductive roller in the conductive groove is avoided, and the electroplating efficiency is improved.
Description
Technical Field
The utility model relates to the technical field of conductive film electroplating, in particular to a production line for conductive film electroplating.
Background
The current process for preparing the ultrathin metal film mainly comprises an electroplating process, namely, an electrolyte passes through the upper surface of the metal film with a certain metal layer, copper ions in the electrolyte are plated on the metal film under the action of current, a conductive roller is mainly used as a cathode in the current process, titanium blue is used as an anode, copper balls are placed in the titanium blue, and the copper ions leave the copper balls and are laminated on the metal film under the action of current.
In the process, the conductive roller is positioned above the liquid level, the metal film penetrates out of the electroplating bath and then reaches the conductive roller, and the electroplating solution is carried on the metal film, so that the electroplating solution carried on the metal film after reaching the conductive roller forms a micro electroplating loop with the conductive roller, so that copper ions in the electroplating solution are plated on the conductive roller, and a thin copper layer is formed on the conductive roller after a long time, and the thin copper layer has insufficient bonding force with the conductive roller. Therefore, the copper layer with poor bonding force is attached to the surface of the metal film, and after the metal film enters the electroplating bath again, copper ions in the electroplating solution can be laminated on the thin copper layer under the action of current.
On the other hand, because the current is conducted on the conductive roller and the electroplating solution has a certain temperature, the electroplating solution reaching the conductive roller along with the conduction of the metal film can be evaporated on the conductive roller, so that copper crystals are formed, the surfaces of the copper crystals are sharp, and the passing metal film can be punctured.
Based on the above, the utility model designs a production line for electroplating a conductive film to solve the above problems.
SUMMERY OF THE UTILITY MODEL
In view of the above, an embodiment of the present invention provides a production line for electroplating a conductive film, so as to solve the technical problems that in the prior art, a metal film is plated on a conductive roller, so that the thicknesses and colors of metal layers on the conductive film are different, which results in poor appearance and different surface resistances of a product, and affects the quality of the product.
In order to achieve the above object, in a first aspect, an embodiment of the present invention provides a production line for electroplating a conductive film, including: the conductive film is electroplated through each electroplating unit in sequence; the electroplating unit comprises an electroplating bath, a metal ion removing bath and a conductive bath which are arranged in sequence; the conductive groove of the former electroplating unit in the two adjacent electroplating units is adjacent to the electroplating groove of the latter electroplating unit; wherein the demetallization ion bath comprises:
a metal ion removal tank body;
the conductive solution is placed in the metal ion removal tank body;
an upper insoluble anode plate and a lower insoluble anode plate which are symmetrically arranged in the conductive solution from top to bottom and are fixedly connected with the metal ion removal tank body, wherein a gap for the conductive film to pass through is arranged between the upper insoluble anode plate and the lower insoluble anode plate;
wherein the conductive solution, the upper insoluble anode plate, the lower insoluble anode plate and the conductive film form a metal ion removal circulation loop.
In some possible embodiments, the plating unit further comprises:
a plating solution isolation portion provided between the plating tank and the demetallization ion tank, for preventing the plating solution in the plating tank from overflowing to the demetallization ion tank.
In some possible embodiments, the plating solution separator includes: the bottom of the plating solution isolation tank is provided with a reflux port;
the liquid storage tank is arranged below the backflow port and used for receiving the plating solution flowing back to the liquid storage tank from the backflow port;
and the filter pump is provided with a liquid inlet pipe and a liquid outlet pipe, the liquid inlet pipe is connected with the liquid storage tank, and the liquid outlet pipe is connected with the electroplating bath and used for pumping the plating solution in the liquid storage tank back to the electroplating bath through the liquid inlet pipe and the liquid outlet pipe.
In some possible embodiments, the plating bath includes:
the electroplating bath body is used for containing a plating solution;
the first upper liquid inlet liquid interception roller and the first lower liquid inlet liquid interception roller are arranged at the liquid inlet end of the electroplating bath body and are rotationally connected with the electroplating bath body;
the first upper liquid-discharging liquid-stopping roller and the first lower liquid-discharging liquid-stopping roller are arranged at the liquid-discharging end of the electroplating bath body and are rotationally connected with the electroplating bath body;
the upper anode titanium blue and the lower anode titanium blue are arranged between the liquid inlet end and the liquid outlet end of the electroplating bath body and are fixedly connected with the electroplating bath body;
the surface of the first upper liquid inlet liquid interception roller is in rolling contact with the surface of the first lower liquid inlet liquid interception roller, the upper anode titanium blue and the lower anode titanium blue are symmetrically arranged at the upper position and the lower position, and the surface of the first upper liquid outlet liquid interception roller is in rolling contact with the surface of the first lower liquid outlet liquid interception roller;
the conductive film penetrates through the space between the first upper liquid inlet liquid interception roller and the first lower liquid inlet liquid interception roller, passes through the gap between the upper anode titanium blue and the lower anode titanium blue, and penetrates out of the space between the first upper liquid outlet liquid interception roller and the first lower liquid outlet liquid interception roller.
In some possible embodiments, a portion of the first upper liquid-inlet cutoff roller and the first upper liquid-outlet cutoff roller are located inside the plating solution in the plating tank, and a portion of the first upper liquid-inlet cutoff roller is located outside the plating solution in the plating tank, so as to prevent the plating solution in the plating tank from overflowing.
In some possible embodiments, the demetallization ion bath includes:
the second upper liquid inlet liquid interception roller and the second lower liquid inlet liquid interception roller are arranged at the liquid inlet end of the metal ion removal groove body and are rotationally connected with the metal ion removal groove body;
the second upper liquid-discharging liquid-intercepting roller and the second lower liquid-discharging liquid-intercepting roller are arranged at the liquid-discharging end of the metal ion removing groove body and are rotationally connected with the metal ion removing groove body;
the upper insoluble anode plate and the lower insoluble anode plate are arranged between the liquid inlet end and the liquid outlet end of the metal ion removing tank;
the surface of the second upper liquid inlet liquid interception roller is in rolling contact with the surface of the second lower liquid inlet liquid interception roller, the upper insoluble anode plate and the lower insoluble anode plate are symmetrically arranged at the upper and lower positions, and the surface of the second upper liquid outlet liquid interception roller is in rolling contact with the surface of the second lower liquid outlet liquid interception roller;
and the conductive film penetrates through the space between the second upper liquid inlet liquid interception roller and the second lower liquid inlet liquid interception roller, passes through the gap between the upper insoluble anode plate and the lower insoluble anode plate, and penetrates out of the space between the second upper liquid outlet liquid interception roller and the second lower liquid outlet liquid interception roller.
In some possible embodiments, a part of the second upper liquid-inlet liquid-interception roller and the second upper liquid-outlet liquid-interception roller are positioned inside the conductive solution, and a part of the second upper liquid-inlet liquid-interception roller and the second upper liquid-outlet liquid-interception roller are positioned outside the conductive solution, so as to prevent the conductive solution from overflowing.
In some possible embodiments, the conductive slot comprises:
a conductive slot body;
the conductive rollers are arranged in the conductive groove body from top to bottom and are rotationally connected with the conductive groove body, and the conductive film penetrates through the conductive rollers from top to bottom.
And the plurality of spray pipes are arranged at the bottom of the conductive groove, positioned between every two conductive rollers and used for spraying cooling liquid to reduce the temperature of the conductive rollers.
In a second aspect, the present invention provides another production line for electroplating a conductive film, comprising: the electroplating unit comprises an electroplating bath, a metal ion removing bath and a conductive bath which are arranged in sequence; wherein the demetallization ion bath comprises:
a metal ion removal tank body;
the conductive solution is placed in the metal ion removal tank body;
the upper insoluble anode plate and the lower insoluble anode plate are arranged in the conductive solution in an up-down symmetrical mode and are fixedly connected with the metal ion removal tank body, and a gap for a conductive film to penetrate is formed between the upper insoluble anode plate and the lower insoluble anode plate;
the metal ion removing tank is used for removing metal ions from the conductive solution.
The technical scheme has the following beneficial effects:
because the metal ion removing groove is additionally arranged between the electroplating groove and the conductive groove in the embodiment of the utility model, and the liquid in the metal ion removing groove is different from the electroplating solution in the electroplating groove, the liquid in the metal ion removing groove is a conductive solution with good conductive performance, because the conductive film can bring a part of the electroplating solution in the electroplating groove into the conductive groove in the process of belt walking, and the metal ion in the electroplating solution can not exist when the liquid attached to the conductive film enters the conductive groove by arranging the metal ion removing groove, a layer of metal film is prevented from being plated on the conductive roller in the conductive groove, and the electroplating quality of the conductive film is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a production line for electroplating a conductive film according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of an overall structure of a production line for electroplating a conductive film according to an embodiment of the present invention;
FIG. 3A is a schematic diagram of an overall structure of another production line for electroplating a conductive film according to an embodiment of the present invention;
FIG. 3B is a schematic diagram of a structure of a plated isolation portion according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of an electroplating unit according to an embodiment of the present invention;
FIG. 5 is a schematic view of a plating cell according to an embodiment of the utility model;
FIG. 6 is a schematic structural diagram of a metal ion removal tank according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a conductive slot according to an embodiment of the present invention.
The reference numbers illustrate:
1. the electroplating bath comprises an electroplating bath body 10, an electroplating bath body 11, a first upper liquid-inlet liquid-interception roller 12, a first lower liquid-inlet liquid-interception roller 13, upper anode titanium blue 14, lower anode titanium blue 15, a first upper liquid-outlet liquid-interception roller 16 and a first lower liquid-outlet liquid-interception roller;
2. a plating solution isolation part 21, a plating solution isolation groove 211, a reflux port 22, a liquid storage groove 23 and a filter pump;
3. a metal ion removing groove 30, a metal ion removing groove body 31, a second upper liquid inlet liquid interception roller 32, a second lower liquid inlet liquid interception roller 33, an upper insoluble anode plate 34, a lower insoluble anode plate 35, a second upper liquid outlet liquid interception roller 36, a second lower liquid outlet liquid interception roller 37 and a conductive solution;
4. the device comprises a conductive groove 40, a conductive groove body 41, a conductive roller 42 and a spray pipe;
5. a conductive film.
Detailed Description
Features and exemplary embodiments of various aspects of the present invention will be described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the present invention. In the drawings and the following description, at least some well-known structures and techniques have not been shown in detail in order to avoid unnecessarily obscuring the present invention; also, the dimensions of some of the structures may be exaggerated for clarity. Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
Example one
As shown in fig. 1, an embodiment of the present invention provides a production line for conductive film plating, including: the number of the electroplating units arranged in sequence, such as the first electroplating unit, the second electroplating unit … …, the nth electroplating unit, can be set according to the requirement in the actual production, and is not specifically limited here, and the conductive film 5 is electroplated sequentially and respectively by each electroplating unit.
As shown in fig. 2, each of the plating units includes a plating tank 1, a demetallization ion tank 3 and a conductive tank 4; the electroplating bath 1, the metal ion removing bath 3 and the conductive bath 4 are sequentially arranged, the conductive bath 4 of the former electroplating unit in the two adjacent electroplating units is adjacent to the electroplating bath 1 of the latter electroplating unit, for example, the conductive bath 4 in the first electroplating unit is adjacent to the electroplating bath 1 in the second electroplating unit, the conductive bath 4 in the second electroplating unit is adjacent to the electroplating bath 1 in the third electroplating unit, and so on until the last electroplating unit. During electroplating, the conductive film 5 is electroplated through the electroplating bath 1, the metal ion removing bath 3 and the conductive bath 4 of each electroplating unit in sequence.
As shown in fig. 4, the metal ion removing tank 3 may include a metal ion removing tank body 30, a conductive solution 37 disposed in the metal ion removing tank body 30, an upper insoluble anode plate 33 and a lower insoluble anode plate 34, the upper insoluble anode plate 33 and the lower insoluble anode plate 34 disposed inside the conductive solution 37 and fixedly connected to the metal ion removing tank body 30, and metal ions brought into the plating tank 1 when the conductive film 3 is carried are removed through a metal ion removing circulation loop formed by the upper insoluble anode plate 33, the lower insoluble anode plate 34, the conductive solution 37 and the conductive film 5. Specifically, the upper insoluble anode plate 33 and the lower insoluble anode plate 34 are respectively connected with the anode of a power supply, anode electrodes are provided in a metal ion removing circulation loop, cathode electrodes are provided for the conductive film 5 through the conductive tank 4, so that the conductive solution 37, the upper insoluble anode plate 33, the lower insoluble anode plate 34 and the conductive film 5 form a metal ion removing circulation loop, metal ions brought into the electroplating tank 1 when the conductive film 5 is taken away can be electroplated on the conductive film 5 through the metal ion removing circulation loop, the metal ions in the conductive solution 37 are removed, and the metal ions are prevented from being introduced into the conductive tank 4 when the conductive film 5 is taken away.
In the embodiment of the utility model, the metal ion removing groove 3 is additionally arranged between the electroplating groove 1 and the conductive groove 4, the liquid in the metal ion removing groove 3 is different from the plating solution in the electroplating groove 1, the liquid in the metal ion removing groove 3 is the conductive solution 37 with good conductive performance, because the conductive film 3 can bring a part of the plating solution in the electroplating groove 1 into the conductive groove 4 in the tape moving process, and the metal ion removing groove 3 is arranged, so that metal ions cannot exist in the plating solution when the liquid attached to the conductive film 5 enters the conductive groove 4, a metal film is prevented from being plated on the conductive roller 41 in the conductive groove 4, and the electroplating quality of the conductive film 5 is improved.
In some embodiments, as shown in fig. 3A and 3B, a plating solution isolation portion 2 is provided between the plating tank 1 and the demetallization ion tank 3, and the plating solution isolation portion 2 can prevent the plating solution in the plating tank 1 from overflowing into the demetallization ion tank 3.
In some embodiments, as shown in fig. 3B, the plating solution isolation part 2 includes a plating solution isolation tank 21, a liquid storage tank 22 and a filter pump 23, the plating solution isolation tank 21 is disposed between the plating tank body 10 and the metal ion removal tank body 30, a backflow port 211 is disposed at the bottom of the plating solution isolation tank 21, the liquid storage tank 22 is disposed below the backflow port 211, and after the plating solution in the plating solution isolation tank 21 flows back to the liquid storage tank 22 from the backflow port 211, the plating solution can flow back to the plating tank 1 through the filter pump 23 or other pump body pumps, so as to prevent the plating solution in the plating solution isolation tank 21 from overflowing to the metal ion removal tank 3, and simultaneously avoid waste of the plating solution.
In some embodiments, as shown in fig. 4 and 5, the plating tank 1 includes a plating tank body 10, and a first upper liquid-inlet cutoff roller 11, a first lower liquid-inlet cutoff roller 12, an upper anode titanium blue 13, a lower anode titanium blue 14, a first upper liquid-outlet cutoff roller 15, and a first lower liquid-outlet cutoff roller 16 are disposed in the plating tank body 10; wherein, the first upper liquid-inlet liquid-interception roller 11 and the first lower liquid-inlet liquid-interception roller 12 are arranged at the liquid-inlet end of the electroplating bath 1 and are rotationally connected with the electroplating bath body 10; the first upper liquid-discharging liquid-intercepting roller 15 and the first lower liquid-discharging liquid-intercepting roller 16 are arranged at the liquid-discharging end of the electroplating bath body 10 and are rotationally connected with the electroplating bath body 10, the upper anode titanium blue 13 and the lower anode titanium blue 14 are symmetrically arranged between the liquid-inlet end and the liquid-discharging end of the electroplating bath 1 up and down and are fixed on the electroplating bath body 10, the surface of the first upper liquid-inlet liquid-intercepting roller 11 is in rolling contact with the surface of the first lower liquid-inlet liquid-intercepting roller 12, and the surface of the first upper liquid-discharging liquid-intercepting roller 15 is in rolling contact with the surface of the first lower liquid-discharging liquid-intercepting roller 16; a certain gap is formed between the upper anode titanium blue 13 and the lower anode titanium blue 14, and the conductive film 5 passes through the gap between the first upper liquid inlet liquid interception roller 11 and the first lower liquid inlet liquid interception roller 12, passes through the gap between the upper anode titanium blue 13 and the lower anode titanium blue 14, and penetrates out from the gap between the first upper liquid outlet liquid interception roller 11 and the first lower liquid outlet liquid interception roller 12. The first upper liquid inlet liquid interception roller 11, the first lower liquid inlet liquid interception roller 12, the first upper liquid outlet liquid interception roller 15 and the first lower liquid outlet liquid interception roller 16 are arranged, so that the plating solution in the plating tank 1 can be prevented from being taken out when the conductive film 5 is carried, and the plating quality is improved.
Wherein, the first lower liquid-entering liquid-intercepting roller 12 and the first lower liquid-intercepting roller 16 are arranged inside the plating solution in the plating bath 1, a part of the first upper liquid-entering liquid-intercepting roller 11 and the first upper liquid-intercepting roller 15 are arranged inside the plating bath 1, and a part of the first upper liquid-intercepting roller is arranged outside the plating solution in the plating bath 1, thereby being capable of preventing the plating solution in the plating bath 1 from overflowing into the adjacent bath bodies. During electroplating, the upper anode titanium blue 13 and the lower anode titanium blue 14 are respectively connected with the anode of a power supply and are used for providing anode electricity in an electroplating circulation loop.
In some embodiments, metal balls are respectively disposed in the upper anode titanium blue 13 and the lower anode titanium blue 14, so as to supplement metal ions in the plating solution, ensure the concentration of the metal ions in the plating solution, and improve the plating quality.
In some embodiments, as shown in fig. 4, the metal ion removing tank 3 comprises a metal ion removing tank body 30, and a conductive solution 37, a second upper liquid-cut roller 31, a second lower liquid-cut roller 32, an upper insoluble anode plate 33, a lower insoluble anode plate 34, a second upper liquid-cut roller 35 and a second lower liquid-cut roller 36 are arranged in the metal ion removing tank body 30; a second upper liquid inlet cut-off roller 31 and a second lower liquid inlet cut-off roller 32 are arranged at the liquid inlet end of the metal ion removing groove 3 and are rotationally connected with the metal ion removing groove body 30, a second upper liquid outlet cut-off roller 35 and a second lower liquid outlet cut-off roller 36 are arranged at the liquid outlet end of the metal ion removing groove body 30 and are rotationally connected with the metal ion removing groove body 30, an upper insoluble anode plate 33 and a lower insoluble anode plate 34 are vertically and symmetrically arranged between the liquid inlet end and the liquid outlet end of the metal ion groove body 30 and are fixed on the metal ion removing groove body 30, the surface of the second upper liquid inlet cut-off roller 31 is in rolling contact with the surface of the second lower liquid inlet cut-off roller 32, and the surface of the second upper liquid outlet cut-off roller 35 is in rolling contact with the surface of the second lower liquid outlet cut-off roller 36; a certain gap is left between the upper insoluble anode plate 33 and the lower insoluble anode plate 34, and the conductive film 5 passes through the gap between the second upper liquid-inlet liquid-interception roller 31 and the second lower liquid-inlet liquid-interception roller 32, passes through the gap between the upper insoluble anode plate 33 and the lower insoluble anode plate 34, and passes through the gap between the second upper liquid-outlet liquid-interception roller 35 and the second lower liquid-outlet liquid-interception roller 36.
By arranging the second upper liquid-inlet liquid-intercepting roller 31, the second lower liquid-inlet liquid-intercepting roller 32, the second upper liquid-outlet liquid-intercepting roller 35 and the second lower liquid-outlet liquid-intercepting roller 36, the situation that the plating solution in the conductive groove 1 is brought into the metal-removing ion groove 2 when the conductive film 5 is in a running state can be further reduced, and meanwhile, the situation that the conductive solution in the metal-removing ion groove 2 is brought into the conductive groove 4 when the conductive film 5 is in a running state can be further reduced.
The second upper liquid inlet and outlet liquid interception rollers 31 and 35 are partially arranged inside the conductive solution 37 in the metal ion removing tank 3, and partially arranged outside the conductive solution 37, so that the liquid in the metal ion removing tank 3 can be prevented from overflowing into the adjacent tank bodies.
In the embodiment of the utility model, a conductive solution 37, an upper insoluble anode plate 33 and a lower insoluble anode plate 34 are contained in a demetallization ion tank body 30 of a demetallization ion tank 3, the upper insoluble anode plate 33 and the lower insoluble anode plate 34 are connected with an anode of a power supply, a cathode of the power supply is connected with a conductive roller 41 in a conductive tank 4, a conductive film 5 enters the demetallization ion tank 3 through an electroplating tank 1, as the conductive film 5 can bring a part of the electroplating solution in the electroplating tank 1 into the demetallization ion tank 3 in the process of moving, the conductive roller 41 in the conductive tank 4 provides an anode electrode for the upper insoluble anode plate 33 and the lower insoluble anode plate 34, and a cathode electrode for the conductive film 5, so that a demetallization ion circulation loop is formed among the conductive solution 37, the upper insoluble anode plate 33, the lower insoluble anode plate 34 and the conductive film 5, the metal ions in the plating solution are electroplated on the conductive film 5 through the metal ion removing circulation loop, so that no metal ions exist in the plating solution when the liquid attached to the conductive film 5 enters the conductive groove 4, a metal film is prevented from being plated on the conductive roller 41, and the electroplating quality of the conductive film is improved.
In some embodiments, as shown in fig. 4 and fig. 6, the conductive groove 4 includes a conductive groove body 40, a plurality of conductive rollers 41 are disposed in the conductive groove body 40 in the horizontal direction, the plurality of conductive rollers 41 are rotatably connected to the conductive groove body 40, the axes of the plurality of conductive rollers 41 are parallel to each other, and the conductive film 5 passes through between the plurality of conductive rollers 41 disposed above and below; wherein the conductive roller 41 in the conductive tank 4 is connected with the cathode of the power supply to provide the cathode for the conductive film 5 during electroplating.
In some embodiments, as shown in fig. 4 and 7, a plurality of shower pipes 42 are further disposed at the bottom of the conductive tank body 40, and each shower pipe 42 is disposed between every two conductive rollers 41 and is used for spraying the cooling liquid to reduce the temperature of the conductive rollers 41, and it should be noted that the number and the position of the specific arrangement of the shower pipes 42 and the type of the cooling liquid are not specifically limited in the present invention, and may be arbitrarily set according to the actual needs during electroplating.
In the embodiment of the utility model, the temperature of the conductive roller 41 is reduced by the cooling liquid sprayed by the spray pipe 42, and the plating liquid brought by the conductive film 5 from the plating bath 1 can be prevented from evaporating on the conductive roller 41, so that the formation of metal crystals is avoided, on one hand, the metal crystals can puncture the conductive film 5 to cause unqualified products, and on the other hand, the tips of the metal crystals can discharge as usual when more current is gathered, so that the conductive film 5 is burnt off.
According to the production line for conductive film electroplating provided by the embodiment of the utility model, the conductive solution 37 is contained in the metal-removing ion tank body 30 of the metal-removing ion tank 3, the upper insoluble anode plate 33 and the lower insoluble anode plate 34 are arranged in the conductive solution 37, the upper insoluble anode plate 33 and the lower insoluble anode plate 34 are connected with the anode of the power supply, the cathode of the power supply is connected with the conductive roller 41 in the conductive tank 4, the conductive film 5 enters the metal-removing ion tank 3 through the electroplating tank 1, as the conductive film 5 can bring part of the electroplating solution in the electroplating tank 1 into the metal-removing ion tank 3 in the moving process, the upper insoluble anode plate 33 and the lower insoluble anode plate 34 provide anode electrodes in the metal-removing ion tank 3, and the conductive roller 41 in the conductive tank 4 provides cathode electrodes for the conductive film 5, so that the conductive solution 37, the upper insoluble anode plate 33, the lower insoluble anode plate 33 and the conductive roller 34, A metal ion removing circulation loop is formed between the lower insoluble anode plate 34 and the conductive film 5, and metal ions in the plating solution are plated on the conductive film 5 through the metal ion removing circulation loop, so that the liquid attached to the conductive film 5 does not have metal ions in the plating solution when entering the conductive groove 4, a metal film is prevented from being plated on the conductive roller 41, and the plating quality of the conductive film is improved.
By disposing a part of the second upper liquid-inlet liquid-interception roller 31 and the second upper liquid-outlet liquid-interception roller 35 inside the conductive solution 30 in the metal ion removal tank 3 and a part of the rollers outside the conductive solution 30, the liquid in the metal ion removal tank 3 can be prevented from overflowing into the adjacent tank bodies.
In the embodiment of the present invention, the plating solution isolating part 2 is provided between the plating tank 1 and the metal ion removal tank 3, and the plating solution isolating part 2 can prevent the plating solution in the plating tank 1 from overflowing into the metal ion removal tank 3. The plating solution isolation part 2 comprises a plating solution isolation groove 21, a liquid storage groove 22 and a filter pump 23, the plating solution isolation groove 21 is arranged between the plating bath body 10 and the metal ion removal bath body 30, a backflow port 211 is arranged at the bottom of the plating solution isolation groove 21, the liquid storage groove 22 is arranged below the backflow port 211, and after the plating solution in the plating solution isolation groove 21 flows back to the liquid storage groove 22 from the backflow port 211, the plating solution can return to the plating bath 1 through the filter pump 23 or other pump body pumps, so that the plating solution in the plating solution isolation groove 2 is prevented from overflowing to the metal ion removal bath 3, and meanwhile, the waste of the plating solution can be avoided.
In addition, in the prior art, because the temperature of the conductive roller 41 rises in the electroplating process of the conductive roller 41, the plating solution brought by the conductive film 5 from the electroplating bath 1 evaporates on the conductive roller 41, and the metal crystals formed by copper plating on the conductive roller 41, on one hand, the metal crystals can pierce the conductive film 5 to cause unqualified products, and on the other hand, more current gathered at the tips of the metal crystals can also discharge at the tips as usual.
Example two
The utility model provides another production line for electroplating a conductive film, which comprises an electroplating unit, a metal ion removing unit and a conductive unit, wherein the electroplating unit comprises an electroplating bath 1, a metal ion removing tank 3 and a conductive tank 4 which are sequentially arranged; wherein, demetallization ion groove 3 includes: a demetallized ion bath body 30; a conductive solution 37 contained in the demetallization bath body 30; an upper insoluble anode plate 32 and a lower insoluble anode plate 33 which are vertically and symmetrically arranged in the conductive solution 37 and are fixedly connected with the metal ion removing tank body 30, and a gap for the conductive film 5 to pass through is arranged between the upper insoluble anode plate and the lower insoluble anode plate; the metal ions in the conductive solution can be plated on the conductive film 5 by removing the metal ions from the conductive solution by the metal ion removal tank 3. The electroplating unit in the embodiment of the utility model is basically the same as the electroplating unit in the first embodiment, and the specific structure and the working principle are not described herein again.
The production device for electroplating the conductive film provided by the utility model has the following working principle:
the conductive film 5 is sequentially electroplated through a plurality of electroplating units, the conductive film 5 is controlled to pass through a gap between an upper anode titanium blue 13 and a lower anode titanium blue 14 in an electroplating bath 1, and the upper anode titanium blue 13 and the lower anode titanium blue 14 which are symmetrically arranged up and down in the electroplating bath 1 provide anode electricity for the conductive film 5, so that the electroplating solution in the electroplating bath 1, the upper anode titanium blue 13, the lower anode titanium blue 14 and the conductive film 5 form an electroplating circulation loop to realize electroplating of the conductive film 5; removing metal ions in the plating tank 1 brought by the running of the conductive film 5 by a metal ion removal circulation circuit formed in the metal ion removal tank 3; the cathode electrode is provided to the conductive film 5 by a plurality of conductive rollers 41 provided in the conductive bath 4.
In some embodiments, a plating solution isolation part 2 is further included, and the plating solution in the plating tank 1 is prevented from overflowing into the demetallization ion tank 3 by the plating solution isolation part 2, so that the plating quality of the conductive thin film 5 is further improved.
The utility model contains conductive solution 37 in the body 30 of the metal ion removing tank 3, and an upper insoluble anode plate 33 and a lower insoluble anode plate 34 are arranged in the conductive solution 37, the upper insoluble anode plate 33 and the lower insoluble anode plate 34 are connected with the anode of a power supply, the cathode of the power supply is connected with a conductive roller 41 in a conductive tank 4, a conductive film 5 enters the metal ion removing tank 3 through the electroplating tank 1, because the conductive film 5 can bring part of the electroplating solution in the electroplating tank 1 into the metal ion removing tank 3 in the process of moving, in the metal ion removing tank 3, the upper insoluble anode plate 33 and the lower insoluble anode plate 34 provide anode electricity, the conductive roller 41 in the conductive tank 4 provides cathode electricity for the conductive film 5, thus a metal ion removing circulation loop is formed among the conductive solution 37, the upper insoluble anode plate 33, the lower insoluble anode plate 34 and the conductive film 5, the metal ions in the plating solution are electroplated on the conductive film 5 through the metal ion removing circulation loop, so that the metal ions in the plating solution can not exist when the liquid attached to the conductive film 5 enters the conductive groove 4, a layer of metal film is prevented from being plated on the conductive roller 41, and the plating quality of the conductive film is improved.
In the embodiment of the present invention, the plating solution isolating part 2 is provided between the plating tank 1 and the metal ion removal tank 3, and the plating solution isolating part 2 can prevent the plating solution in the plating tank 1 from overflowing into the metal ion removal tank 3. The plating solution isolation part 2 comprises a plating solution isolation groove 21, a liquid storage groove 22 and a filter pump 23, the plating solution isolation groove 21 is arranged between the plating bath body 10 and the metal ion removal groove body 30, a backflow port 211 is arranged at the bottom of the plating solution isolation groove 21, the liquid storage groove 22 is arranged below the backflow port 211, and after the plating solution in the plating solution isolation groove 21 flows back to the liquid storage groove 22 from the backflow port 211, the plating solution can flow back to the plating bath 1 through the filter pump 23 in the liquid storage groove 22 or other pump bodies through a pipeline pump, so that the plating solution in the plating solution isolation groove 2 is prevented from overflowing to the metal ion removal groove 3, and meanwhile, the waste of the plating solution can be avoided.
In the description of the embodiments of the present invention, it should be noted that the terms "upper, lower, inner and outer" and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus should not be construed as limiting the present invention. Furthermore, the terms first, second, or third are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted, connected" and the like are to be understood broadly, for example: can be fixedly connected, detachably connected or integrally connected; they may be mechanically, electrically, or directly connected, or indirectly connected through intervening media, or may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
While the utility model has been described with reference to a preferred embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the utility model. In particular, the technical features mentioned in the embodiments can be combined in any way as long as there is no structural conflict. It is intended that the utility model not be limited to the particular embodiments disclosed, but that the utility model will include all embodiments falling within the scope of the appended claims.
Claims (10)
1. A production line for electroplating of conductive films, comprising: the electroplating device comprises a plurality of electroplating units which are arranged in sequence, wherein a conductive film (5) is electroplated through each electroplating unit in sequence; wherein the electroplating unit comprises an electroplating bath (1), a metal ion removing bath (3) and a conductive bath (4) which are arranged in sequence; the conductive groove (4) of the previous electroplating unit in the two adjacent electroplating units is adjacent to the electroplating groove (1) of the next electroplating unit; wherein the demetallization ion bath (3) comprises:
a demetallization tank body (30);
a conductive solution (37) contained in the metal ion removal tank body (30);
and the upper insoluble anode plate (33) and the lower insoluble anode plate (34) are symmetrically arranged in the conductive solution (37) up and down and are fixedly connected with the metal ion removal tank body (30), and a gap for the conductive film (5) to pass through is formed between the upper insoluble anode plate (33) and the lower insoluble anode plate (34).
2. A production line for conductive film plating according to claim 1, characterized in that: the plating unit further includes:
a plating solution isolation section (2) provided between the plating tank (1) and the metal ion removal tank (3) for preventing the plating solution in the plating tank (1) from overflowing to the metal ion removal tank (3).
3. A production line for conductive thin film electroplating according to claim 2, characterized in that the bath separator (2) comprises:
a plating solution isolation tank (21) provided with a reflux port (211) at the bottom;
a liquid storage tank (22) which is arranged below the reflow opening (211) and is used for receiving the plating solution which flows back into the liquid storage tank (22) from the reflow opening (211);
and the filter pump (23) is provided with a liquid inlet pipe and a liquid outlet pipe, the liquid inlet pipe is connected with the liquid storage tank (22), and the liquid outlet pipe is connected with the electroplating bath (1) and used for pumping the plating solution in the liquid storage tank (22) back to the electroplating bath (1) through the liquid inlet pipe and the liquid outlet pipe.
4. A production line for conductive film plating according to any one of claims 1 to 3, characterized in that: the plating tank (1) comprises:
an electroplating bath body (10) for containing a plating solution;
the first upper liquid inlet liquid interception roller (11) and the first lower liquid inlet liquid interception roller (12) are arranged at the liquid inlet end of the electroplating bath body (10) and are rotationally connected with the electroplating bath body (10);
the first upper liquid-discharging liquid-stopping roller (15) and the first lower liquid-discharging liquid-stopping roller (16) are arranged at the liquid-discharging end of the electroplating bath body (10) and are rotationally connected with the electroplating bath body (10);
the upper anode titanium blue (13) and the lower anode titanium blue (14) are arranged between the liquid inlet end and the liquid outlet end of the electroplating bath body (10) and are fixedly connected with the electroplating bath body (10);
the surface of the first upper liquid inlet liquid interception roller (11) is in rolling contact with the surface of the first lower liquid inlet liquid interception roller (12), the upper anode titanium blue (13) and the lower anode titanium blue (14) are symmetrically arranged at the upper and lower positions, and the surface of the first upper liquid outlet liquid interception roller (15) is in rolling contact with the surface of the first lower liquid outlet liquid interception roller (16);
the conductive film (5) penetrates through the space between the first upper liquid inlet liquid interception roller (11) and the first lower liquid inlet liquid interception roller (12), passes through the gap between the upper anode titanium blue (13) and the lower anode titanium blue (14), and penetrates out of the space between the first upper liquid outlet liquid interception roller (15) and the first lower liquid outlet liquid interception roller (16).
5. A production line for conductive film plating according to claim 4, characterized in that: the first upper liquid inlet intercepting roller (11) and the first upper liquid outlet intercepting roller (15) are partially positioned inside the plating solution in the plating tank (1) and partially positioned outside the plating solution in the plating tank (1) and are used for preventing the plating solution in the plating tank (1) from overflowing.
6. A production line for conductive film plating according to claim 1, characterized in that: the demetallization ion tank (3) further comprises:
the second upper liquid inlet liquid interception roller (31) and the second lower liquid inlet liquid interception roller (32) are arranged at the liquid inlet end of the metal ion removal groove body (30) and are rotationally connected with the metal ion removal groove body (30);
the second upper liquid-discharging liquid-stopping roller (35) and the second lower liquid-discharging liquid-stopping roller (36) are arranged at the liquid-discharging end of the metal ion removing groove body (30) and are rotationally connected with the metal ion removing groove body (30);
the upper insoluble anode plate (33) and the lower insoluble anode plate (34) are arranged between the liquid inlet end and the liquid outlet end of the metal ion removing tank (3).
7. A production line for conductive film plating according to claim 6, characterized in that: the surface of the second upper liquid inlet interception roller (31) is in rolling contact with the surface of the second lower liquid inlet interception roller (32), the upper insoluble anode plate (33) and the lower insoluble anode plate (34) are symmetrically arranged at the upper and lower positions, and the surface of the second upper liquid outlet interception roller (35) is in rolling contact with the surface of the second lower liquid outlet interception roller (36);
the conductive film (5) penetrates through the space between the second upper liquid inlet liquid interception roller (31) and the second lower liquid inlet liquid interception roller (32), passes through the gap between the upper insoluble anode plate (33) and the lower insoluble anode plate (34), and penetrates out of the space between the second upper liquid outlet liquid interception roller (35) and the second lower liquid outlet liquid interception roller (36).
8. A production line for conductive film plating according to claim 7, characterized in that: and one part of the second upper liquid inlet intercepting roller (31) and one part of the second upper liquid outlet intercepting roller (35) are positioned inside the conductive solution (37), and the other part of the second upper liquid inlet intercepting roller and the other part of the second upper liquid outlet intercepting roller are positioned outside the conductive solution (37) and are used for preventing the conductive solution (37) from overflowing.
9. A production line for the electroplating of conductive films according to claim 1, characterized in that said conductive bath (4) comprises:
a conductive slot body (40);
the conductive rollers (41) are arranged in the conductive groove body (40) from top to bottom and are rotationally connected with the conductive groove body (40), and the conductive film (5) penetrates through the conductive rollers (41) arranged from top to bottom;
and the spraying pipes (42) are arranged at the bottom of the conductive groove body (40) and positioned between every two conductive rollers (41) and are used for spraying cooling liquid to reduce the temperature of the conductive rollers (41).
10. A production line for electroplating of conductive films, comprising: the electroplating device comprises an electroplating bath (1), a metal ion removing bath (3) and a conductive bath (4) which are arranged in sequence; wherein the demetallization ion bath (3) comprises:
a demetallization tank body (30);
a conductive solution (37) contained in the metal ion removal tank body (30);
an upper insoluble anode plate (33) and a lower insoluble anode plate (34) which are symmetrically arranged in the conductive solution (37) up and down and are fixedly connected with the metal ion removal tank body (30), wherein a gap for the conductive film (5) to pass through is arranged between the upper insoluble anode plate (33) and the lower insoluble anode plate (34);
the metal ion removing tank (3) is used for removing metal ions from the conductive solution (37).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122385468.5U CN216039879U (en) | 2021-09-29 | 2021-09-29 | Production line for electroplating conductive film |
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| CN202122385468.5U CN216039879U (en) | 2021-09-29 | 2021-09-29 | Production line for electroplating conductive film |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113930820A (en) * | 2021-09-29 | 2022-01-14 | 重庆金美新材料科技有限公司 | Production line and production method for electroplating conductive film |
| WO2024051152A1 (en) * | 2022-09-07 | 2024-03-14 | 重庆金美新材料科技有限公司 | Flexible foil production system |
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2021
- 2021-09-29 CN CN202122385468.5U patent/CN216039879U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113930820A (en) * | 2021-09-29 | 2022-01-14 | 重庆金美新材料科技有限公司 | Production line and production method for electroplating conductive film |
| CN113930820B (en) * | 2021-09-29 | 2023-04-28 | 重庆金美新材料科技有限公司 | Production line and production method for electroplating conductive film |
| WO2024051152A1 (en) * | 2022-09-07 | 2024-03-14 | 重庆金美新材料科技有限公司 | Flexible foil production system |
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