CN216017562U - Cooling and dehumidifying equipment for limited space - Google Patents

Abstract

The utility model discloses a finite space cooling dehumidification equipment, including the cooling die cavity and the dehydration die cavity that can dismantle the connection, be provided with first wind channel on the cooling die cavity, be provided with inlet port and venthole on the lateral wall of cooling die cavity one side, inlet port and venthole all communicate with first wind channel, the setting of dehydration die cavity is in cooling die cavity below, be provided with the second wind channel on the dehydration die cavity, second wind channel and first wind channel intercommunication, dehydration die cavity bottom is provided with pagoda joint, pagoda joint and second wind channel intercommunication, cooling die cavity opposite side is provided with the fin, the laminating is provided with semiconductor refrigeration piece and temperature detect switch between cooling die cavity and the fin. The beneficial effects of the utility model are that the in-process through cooling die cavity and dehydration die cavity confined space inner loop has accomplished cooling and dehumidification to the air current, does not receive external environment's influence, connects simultaneously through the pagoda and can thoroughly discharge moisture, realizes just really dehydrating, prevents that electrical components from puncturing or being damaged by the corrosion.

Description

Cooling and dehumidifying equipment for limited space

Technical Field

The utility model belongs to traditional industrial control field especially relates to a finite space cooling dehumidification equipment.

Background

In the field of traditional industrial control, the relative humidity in a small space is controlled by arranging a heater or enhancing the ventilation mode of a control cabinet aiming at the humidity control in the control cabinet (limited closed space), so that the moisture in the air is prevented from forming condensation on electrical components, and the insulation grade is reduced or insulation breakdown accidents are caused.

The heater is arranged in the limited space in a mode of substantially increasing the air temperature in the space, so that the capacity of carrying moisture by the air is enhanced, and the condensation phenomenon is avoided; the ventilation of the confined space essentially introduces more air into the confined space, thereby diluting the moisture content of the air inside the confined space, but both of these approaches have drawbacks:

1. condensation is avoided by means of heated air: after the air temperature rises, the capacity of carrying moisture is enhanced, the possibility of condensation can be reduced, but for a limited closed space such as a control cabinet, the total water content in the space is not reduced, and the air carrying a large amount of water vapor can bring the moisture into the tiny gaps of humidity-sensitive electric parts more easily, so that insulation breakdown accidents are caused; on the other hand, many electrical components generate heat in the operation process, if the space is heated for removing the condensation to avoid the condensation at the moment, the temperature in the limited space (the closed small space) is increased rapidly, so that the electrical components operate at a higher environmental temperature, the aging of the electrical components is accelerated, and the service life of the electrical components is shortened.

2. Dilution of air relative humidity by ventilation: the premise that this mode works is that the relative humidity of the environment outside the control cabinet (limited small space) is lower than that inside the control cabinet, and when summer or plum rainy season, the environment humidity must be far higher than that of the control cabinet (limited small space), and at the moment, the starting ventilation can not dilute the water content of the air in the control cabinet (limited small space), but can introduce the air with higher water content and more humidity into the control cabinet (limited small space).

Therefore, a limited space cooling and dehumidifying device is needed to solve these problems.

SUMMERY OF THE UTILITY MODEL

The to-be-solved problem of the utility model is to provide a limited space cooling dehumidification equipment, especially be fit for using in the comparatively moist area of external environment.

In order to solve the technical problem, the utility model discloses a technical scheme is:

the utility model provides a finite space cooling dehumidification equipment, is including the cooling die cavity and the dehydration die cavity that can dismantle the connection, be provided with first wind channel on the cooling die cavity, be provided with inlet port and venthole on the lateral wall of cooling die cavity one side, the inlet port with the venthole all with first wind channel intercommunication, the setting of dehydration die cavity is in cooling die cavity below, be provided with the second wind channel on the dehydration die cavity, the second wind channel with first wind channel intercommunication, dehydration die cavity bottom is provided with pagoda joint, pagoda joint with second wind channel intercommunication, cooling die cavity opposite side is provided with the fin, the cooling die cavity with the laminating is provided with semiconductor refrigeration piece and temperature detect switch between the fin.

Preferably, the first air ducts are arranged vertically, the air inlet is communicated with one of the first air ducts, the air outlet is communicated with the other first air duct, the cooling cavity is provided with an end cover at one end of the first air duct, the second air duct is U-shaped, two ends of the second air duct are respectively communicated with the other end of the first air duct, the dehydration cavity is further provided with a sewage discharge hole, the sewage discharge hole is communicated with the second air duct, and a plug is arranged in the sewage discharge hole in a threaded fit manner.

So set up, the air current of being convenient for carries out sharp turn when quick through U type passageway for the air current is detained in dehydration die cavity bottom under centrifugal force effect at the small water droplet that appears under low temperature environment, and end cover and end cap convenient to detach clear up inside.

Preferably, the cooling die cavity with the fin junction is provided with the heat insulating mattress, the fretwork is provided with the mounting groove on the heat insulating mattress, the semiconductor refrigeration piece with temperature detect switch all is located in the mounting groove, just the semiconductor refrigeration piece with the cooling die cavity with heat conduction silicone grease is evenly paintd to fin cooperation department.

So set up, the heat-insulating pad can prevent effectively that the heat on the fin from passing back to the cooling die cavity, installs the semiconductor refrigeration piece of fretwork department and can effectively transfer the heat in the cooling die cavity to the fin, and heat conduction silicone grease has further improved heat transfer efficiency.

Preferably, the radiating fins are made of aluminum alloy, and radiating fans are fixedly arranged on the radiating fins through bolts.

So set up, aluminum alloy heat conduction effect is good, and radiator fan has accelerated the giving off of fin heat.

Preferably, sealing gaskets are arranged at the joints of the cooling cavity, the dehydration cavity and the end covers.

So set up for guarantee the gas tightness of U type passageway, prevent that the comdenstion water from revealing.

Preferably, the pagoda joint and the dehydration cavity are detachably connected through threads, and a sealing ring is arranged at the joint.

So set up, be used for the connecting hose to the comdenstion water of dehydration die cavity is discharged.

Preferably, the end cover is fixedly provided with a wiring terminal, and the semiconductor refrigeration piece, the temperature control switch and the cooling fan are all connected with the wiring terminal through wires.

So set up, be convenient for connect electrical components fast.

Preferably, the number of the temperature control switches is at least two, one of the temperature control switches is electrically connected with the cooling fan and is used for controlling the cooling fan to cool the semiconductor chilling plate, and the other temperature control switch is electrically connected with the main circuit contactor and is used for overload protection.

So set up, can protect the semiconductor refrigeration piece when overheated again, can cut off the power when equipment transships operation simultaneously, protect equipment.

The utility model has the advantages and positive effects that:

1. the utility model discloses an air introduction cooling die cavity and the interior flow of dehydration die cavity in with finite space (closed little space), realized the inside cooling circulation of finite space (closed little space), can also dewater simultaneously, do not receive the external environment influence.

2. The semiconductor refrigeration piece is used for establishing a low-temperature environment in the cooling cavity, water in the air is analyzed through the physical principle, the water is accumulated in the dehydration cavity at the bottom and is discharged through the pagoda joint on the dehydration cavity, the real dehydration is realized, and the service life and the safety of electrical components are improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is an exploded view of a temperature-reducing and dehumidifying apparatus for a limited space according to the present invention;

FIG. 2 is an assembled perspective view of a limited space temperature reduction and dehumidification apparatus according to the present invention;

FIG. 3 is a connecting structure diagram of the internal air duct of the cooling and dehumidifying apparatus for a limited space according to the present invention;

FIG. 4 is a wiring diagram of a power supply circuit of the temperature reduction and dehumidification equipment for a limited space according to the present invention;

fig. 5 is a wiring diagram of an interlock protection circuit of the temperature reduction and dehumidification equipment in a limited space.

The reference numerals are explained below:

1. cooling the cavity; 2. a dehydration cavity; 3. a heat sink; 4. a first air duct; 5. a second air duct; 6. an air outlet; 7. an air inlet; 8. a gasket; 9. a heat insulating pad; 10. mounting grooves; 11. a semiconductor refrigeration sheet; 12. a temperature control switch; 13. an end cap; 14. a wiring terminal; 15. a pagoda joint; 16. a plug; 17. and a sewage draining hole.

Detailed Description

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.

The present invention will be further explained with reference to the accompanying drawings:

example 1

As shown in figure 1, the limited space cooling and dehumidifying equipment comprises a cooling cavity 1 and a dehydration cavity 2 which are detachably connected, wherein a first air duct 4 is arranged on the cooling cavity 1, an air inlet 7 and an air outlet 6 are arranged on the side wall of one side of the cooling cavity 1, the air inlet 7 and the air outlet 6 are both communicated with the first air duct 4, the dehydration cavity 2 is arranged below the cooling cavity 1, a second air duct 5 is arranged on the dehydration cavity 2, the second air duct 5 is communicated with the first air duct 4, a pagoda joint 15 is arranged at the bottom of the dehydration cavity 2, the pagoda joint 15 is communicated with the second air duct 5, a cooling fin 3 is arranged on the other side of the cooling cavity 1, a semiconductor refrigerating fin 11 and a temperature control switch 12 are arranged between the cooling cavity 1 and the cooling fin 3 in a laminating manner, and the model of the temperature control switch 12 is KSD-01F type.

As shown in fig. 3, the first air ducts 4 are two and vertical, the air inlet 7 is communicated with one of the first air ducts 4, the air outlet 6 is communicated with the other first air duct 4, the end cover 13 is arranged at one end of each of the two first air ducts 4 on the cooling cavity 1, the second air duct 5 is in a U shape, two ends of the second air duct 5 are respectively communicated with the other ends of the two first air ducts 4, a sewage discharge hole 17 is further formed in the dehydration cavity 2, the sewage discharge hole 17 is communicated with the second air duct 5, and the plug 16 is arranged in the sewage discharge hole 17 through thread fit, so that the air flow can enter the air flow and the moisture in the air can be separated and discharged conveniently, and the end cover and the plug can be detached conveniently to clean the inside of the air flow.

As shown in fig. 2, cooling die cavity 1 and fin 3 junction are provided with heat insulating mattress 9, the fretwork is provided with mounting groove 10 on the heat insulating mattress 9, semiconductor refrigeration piece 11 and temperature detect switch 12 all are located mounting groove 10, and semiconductor refrigeration piece 11 evenly paints heat conduction silicone grease with cooling die cavity 1 and fin 3 cooperation department, so set up the heat insulating mattress and can effectively prevent heat on the fin from retracing to the cooling die cavity, install the semiconductor refrigeration piece of fretwork department can effectively with the heat transfer to the fin in the cooling die cavity, heat conduction silicone grease has further improved heat transfer efficiency.

The material of fin 3 is the aluminum alloy, is provided with radiator fan through the bolt fastening on the fin 3, so set up the aluminum alloy heat conduction effectual, radiator fan has accelerated giving off of fin heat.

The joints of the cooling cavity 1, the dehydration cavity 2 and the end cover 13 are all provided with sealing gaskets 8, so that the sealing gaskets are arranged to ensure the air tightness of the U-shaped channel and prevent condensed water from leaking.

The pagoda joint 15 and the dehydration cavity 2 are detachably connected through threads, a sealing ring is arranged at the joint, and the connection part is used for discharging condensed water of the dehydration cavity through a connecting hose.

The end cover 13 is fixedly provided with a wiring terminal 14, the semiconductor refrigeration sheet 11, the temperature control switch 12 and the cooling fan are all connected with the wiring terminal 14 through wires, and the arrangement is convenient for rapidly connecting electrical elements.

As shown in fig. 4-5, the number of the temperature controlled switches 12 is at least two, one of the temperature controlled switches 12 is electrically connected to the cooling fan for controlling the cooling fan to cool the semiconductor cooling plate 11, and the other temperature controlled switch 12 is electrically connected to the main circuit contactor for overload protection, so that the semiconductor cooling plate can be protected when overheated again, and the power supply can be cut off to protect the equipment when the equipment is overloaded.

The working process of the embodiment: when the temperature control type semiconductor refrigeration device is used, a worker firstly switches on a power supply of the device, when the air temperature inside the cabinet body is too high or the humidity is high, a temperature and humidity controller in the control cabinet controls the contactor K1.2 to be attracted, power is supplied to the temperature reduction and dehumidification device, the temperature reduction and dehumidification device is enabled to be put into operation, after the temperature reduction and dehumidification device is started, the semiconductor refrigeration piece 11 firstly starts to operate, and as the semiconductor refrigeration piece 11 and the contact surfaces of the temperature reduction cavity and the radiating fins 3 are coated with heat-conducting silicone grease with good heat-conducting property, the semiconductor refrigeration piece 11 can transfer the heat of the temperature reduction cavity to the radiating fins 3 when in operation and radiate the heat through the radiating fins 3 to reduce the temperature of the cooling cavity 1, one temperature control switch 12 is used for detecting the temperature of the semiconductor refrigeration piece 11, when the temperature of the semiconductor refrigeration piece 11 exceeds the set temperature of 35 ℃, the radiating fan can be started to radiate the semiconductor refrigeration piece 11 to prevent the semiconductor refrigeration piece from being overheated and burnt out, when the temperature of the cooling cavity 1 reaches the normal working temperature, the small vortex fans on the air inlet 7 and the air outlet 6 start to work, air is blown into the cooling cavity 1 from the air inlet 7, then the air flow can pass through the U-shaped channel formed by the first air channel 4 and the second air channel 5, because the temperature of the cooling cavity 1 is reduced by the semiconductor chilling plate 11, moisture contained in the air entering the cooling cavity 1 can be separated out, meanwhile, the air flow can rapidly flow in the U-shaped channel along with the driving of the vortex fans, the separated small water drops can flow together with the high-speed flowing air flow, when the high-speed air flow flows in the U-shaped channel, the small water drops can be thrown out under the action of centrifugal force to realize the separation from the air, the water drops separated from the air flow can flow downwards under the influence of gravity, and then enter the dewatering cavity 2, when the moisture in the dewatering cavity 2 is accumulated to a certain degree, the water can be discharged out of the dewatering cavity 2 through the tower joint 15, meanwhile, the temperature of the dehydrated air flow can be reduced, the air flow is continuously input into the cooling cavity 1 along with the small-sized vortex fan, the cooled and dehydrated air flow can flow out of the cooling cavity 1 from the air outlet 6 and then is merged into the surrounding environment to cool the surrounding environment, and the moisture content of the dehydrated air is reduced, so that the conditions of insulation breakdown and corrosion to electrical elements are reduced, the service life of equipment is prolonged, and the safety is improved.

Meanwhile, a direct current UPS (uninterrupted power supply) without an inverter is also arranged, so that the temperature reduction and dehumidification system can be ensured to continuously operate under the condition of external power failure, electrical elements in a limited space are dehumidified, and the operation is stopped until the humidity meets the requirement or the standby power supply is dead.

Set up the temperature detect switch 12 in semiconductor refrigeration piece 11 both sides simultaneously and can monitor the temperature of cooling die cavity, when the temperature of cooling die cavity exceeded 65 ℃, prove that the cooling die cavity at this moment not only can not dewater the air, and can't be effectively for cooling down in the finite space, then temperature detect switch 12 can trigger high temperature protection, cut off contactor K1.2 coil's power, make contactor K1.2 main contact disconnection, thereby make whole refrigerating system stop work, in order to avoid adverse environmental condition to cause newly-increased equipment hardware to damage.

While one embodiment of the present invention has been described in detail, the present invention is only a preferred embodiment of the present invention, and should not be construed as limiting the scope of the present invention. All the equivalent changes and improvements made according to the application scope of the present invention should still fall within the patent coverage of the present invention.

Claims (8)

1. The utility model provides a finite space cooling dehumidification equipment which characterized in that: comprises a cooling cavity (1) and a dehydration cavity (2) which are detachably connected, a first air duct (4) is arranged on the cooling cavity (1), an air inlet hole (7) and an air outlet hole (6) are arranged on the side wall of one side of the cooling cavity (1), the air inlet hole (7) and the air outlet hole (6) are communicated with the first air duct (4), the dehydration cavity (2) is arranged below the cooling cavity (1), a second air duct (5) is arranged on the dehydration cavity (2), the second air duct (5) is communicated with the first air duct (4), the bottom of the dehydration cavity (2) is provided with a pagoda joint (15), the pagoda joint (15) is communicated with the second air duct (5), the other side of the cooling cavity (1) is provided with a radiating fin (3), and a semiconductor refrigerating sheet (11) and a temperature control switch (12) are attached between the cooling cavity (1) and the radiating sheet (3).

2. The limited space temperature and humidity reducing and removing device as claimed in claim 1, wherein: the air conditioner is characterized in that the first air ducts (4) are arranged vertically, the air inlet holes (7) are communicated with one of the first air ducts (4), the air outlet holes (6) are communicated with the other one of the first air ducts (4), the cooling cavity (1) is provided with two ends, one end of each first air duct (4) is provided with an end cover (13), the second air duct (5) is U-shaped, two ends of each second air duct (5) correspond to the other end of each first air duct (4) respectively, a sewage discharge hole (17) is further formed in the dewatering cavity (2), the sewage discharge hole (17) is communicated with the second air duct (5), and a plug (16) is arranged in each sewage discharge hole (17) in a threaded fit mode.

3. The limited space temperature and humidity reducing and removing device as claimed in claim 1, wherein: cooling die cavity (1) with fin (3) junction is provided with heat insulating mattress (9), the fretwork is provided with mounting groove (10) on heat insulating mattress (9), semiconductor refrigeration piece (11) with temperature detect switch (12) all are located in mounting groove (10), just semiconductor refrigeration piece (11) with cooling die cavity (1) with heat fin (3) cooperation department evenly paints heat conduction silicone grease.

4. The limited space temperature and humidity reducing and removing device as claimed in claim 2, wherein: the radiating fin (3) is made of aluminum alloy, and a radiating fan is fixedly arranged on the radiating fin (3) through bolts.

5. The limited space temperature and humidity reducing and removing device as claimed in claim 4, wherein: and sealing gaskets (8) are arranged at the joints of the cooling cavity (1), the dehydration cavity (2) and the end covers (13).

6. The limited space temperature and humidity reducing and removing device as claimed in claim 1, wherein: the pagoda joint (15) and the dehydration cavity (2) are detachably connected through threads, and a sealing ring is arranged at the joint.

7. The limited space temperature and humidity reducing and removing device as claimed in claim 5, wherein: the end cover (13) is fixedly provided with a wiring terminal (14), and the semiconductor refrigeration piece (11), the temperature control switch (12) and the cooling fan are connected with the wiring terminal (14) through wires.

8. The limited space temperature and humidity reducing and removing device as claimed in claim 7, wherein: the number of the temperature control switches (12) is at least two, one of the temperature control switches (12) is electrically connected with the cooling fan and used for controlling the cooling fan to cool the semiconductor chilling plate (11), and the other temperature control switch (12) is electrically connected with the main circuit contactor and used for overload protection.

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