CN216017262U - Multi-layer flexible combined circuit board structure - Google Patents

Multi-layer flexible combined circuit board structure Download PDF

Info

Publication number
CN216017262U
CN216017262U CN202121332870.0U CN202121332870U CN216017262U CN 216017262 U CN216017262 U CN 216017262U CN 202121332870 U CN202121332870 U CN 202121332870U CN 216017262 U CN216017262 U CN 216017262U
Authority
CN
China
Prior art keywords
circuit board
circuit
board main
layer
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202121332870.0U
Other languages
Chinese (zh)
Inventor
董平
陈建勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Shunmanjia Electronics Co ltd
Original Assignee
Shenzhen Shunmanjia Electronics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Shunmanjia Electronics Co ltd filed Critical Shenzhen Shunmanjia Electronics Co ltd
Priority to CN202121332870.0U priority Critical patent/CN216017262U/en
Application granted granted Critical
Publication of CN216017262U publication Critical patent/CN216017262U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The utility model discloses a multi-layer flexible combined circuit board structure which comprises a circuit board main body, wherein the circuit board main body comprises a polyimide film, a wire support adhesive layer, a circuit copper layer, a low-melting-point insulating adhesive and a sealing protective film, connecting structures are fixedly embedded and installed at two ends of the circuit board main body, each connecting structure comprises a connecting golden finger, a connecting ring, a fixing groove and a spring limiting block, the circuit board main body is provided with a circuit installing structure, each circuit installing structure comprises a circuit board installing groove, a connecting lead and a connecting magnetic sheet, a circuit board module is installed on the circuit installing structure in an attached mode, and each circuit board module comprises a circuit board main board, an adhesion coating and a channel magnetic sheet. Compared with the traditional connection mode, the multi-layer flexible combined circuit board structure provided by the utility model has the advantages that the connection is more stable, the installation is more convenient, certain protection is provided for a circuit copper layer, and different effects can be realized by replacing a circuit board module.

Description

Multi-layer flexible combined circuit board structure
Technical Field
The utility model relates to the field of flexible circuit boards, in particular to a multi-layer flexible combined circuit board structure.
Background
The flexible circuit board is called as a flexible circuit board for short, is a flexible circuit board, has the advantages of space saving, weight reduction, high flexibility and the like, has extremely wide application in production and life, and has expanded market; the existing flexible circuit board has certain defects when in use, the circuit is generally directly exposed outside and is easy to be damaged, meanwhile, the transmission mounting mode is not stable enough, needs adhesive for fastening connection, and is inconvenient to mount.
SUMMERY OF THE UTILITY MODEL
The main objective of the present invention is to provide a multi-layer flexible combined circuit board structure, which can effectively solve the problems in the background art.
In order to achieve the purpose, the utility model adopts the technical scheme that:
the utility model provides a soft combination formula circuit board structure of multilayer, includes the circuit board main part, the circuit board main part includes that polyimide film, line hold in the palm the glue film, circuit copper layer, low-melting point insulation viscose and sealing protection film, circuit board main part both ends are fixed to be buried underground and are installed connection structure, connection structure includes connecting golden finger, go-between, fixed slot and spring stopper, circuit mounting structure has been seted up to the circuit board main part, circuit mounting structure includes line board mounting groove, connecting wire and connection magnetic sheet, circuit mounting structure goes out the attached line board module of installing, the line board module includes line board mainboard, adhesion coating and passageway magnetic sheet.
Preferably, the polyimide film upside fixed surface installs the line and holds in the palm the glue film, the line holds in the palm glue film upside fixed surface and installs the circuit copper layer, the insulating viscose of low melting point of circuit copper layer upside surface coating has, the sealing protection film is installed to the insulating viscose of low melting point upside surface adhesion.
Preferably, the two ends of the upper surface and the lower surface of the connecting golden finger are fixedly welded with connecting rings, the upper surface of each connecting ring is provided with a fixing groove, and the surface of one end of the connecting golden finger is provided with a spring limiting block.
Preferably, the bottom edge of the wire board mounting groove is fixedly provided with a connecting wire, and one end of the connecting wire is fixedly connected with a connecting magnetic sheet.
Preferably, the bottom side of the line board main board is coated with an adhesion coating, and channel magnetic sheets are fixedly mounted on two sides of the adhesion coating.
Preferably, the circuit board main part is held in the palm the glue film by polyimide film, line, circuit copper layer, low melting point insulating bonding glue and sealed protection film and is superposed layer upon layer and constitute, connect the golden finger fixed bury underground with circuit board main part both ends, circuit board mounting groove is seted up in circuit board main part upper surface middle part, the adhesion coating adhesion is at circuit board mounting groove middle part, the passageway magnetic sheet passes through magnetic force and connects magnetic sheet interconnect.
Compared with the prior art, the utility model has the following beneficial effects:
in the utility model, when the flexible circuit board is used as a lead circuit and a connector, a wire board module with a common channel type circuit copper layer embedded inside is installed in a wire board installation groove, when the flexible circuit board is used as a main circuit board, the wire board module with a high-density thin three-dimensional circuit and a precise electronic element type circuit copper layer embedded inside is installed in the wire board installation groove, the flexible circuit board directly serves as the main circuit board to be used in a special device, the flexible circuit board is adhered and installed through an adhesive coating, simultaneously, the channel magnetic sheets and the connecting magnetic sheets are connected with the circuit channels in the circuit board main body, the auxiliary circuit board is installed, the functions are diversified, different functions can be endowed to the circuit board main body through replacing different wire board modules, a sealing protective film is additionally arranged on the traditional flexible circuit board, the flexible circuit board is adhered to the upper side surface of the circuit copper layer through low-melting-point insulating adhesive, the circuit copper layer is protected, and meanwhile, the low-point insulating adhesive can be taken down through low-temperature heating for maintenance when the circuit is damaged, the connection structure can be mutually matched with a specially-made interface, the connecting golden finger is inserted into the mounting groove, the convex block arranged in the mounting groove is inserted into the fixing groove, the spring limiting block is in contact with the wall of the mounting groove to provide a reaction force, the connection is reinforced, and the installation is more convenient compared with the traditional connection mode.
Drawings
FIG. 1 is a schematic view of an overall structure of a multi-layer flexible combined circuit board structure according to the present invention;
FIG. 2 is a schematic diagram of a main body of a multi-layer flexible combined circuit board structure according to the present invention;
FIG. 3 is an enlarged view of the portion A of the multi-layer flexible composite circuit board structure of the present invention shown in FIG. 1;
fig. 4 is a schematic diagram of a wire board module of a multi-layer flexible combined circuit board structure according to the present invention.
In the figure: 1. a circuit board main body; 101. a polyimide film; 102. the wire support adhesive layer; 103. a circuit copper layer; 104. a low melting point insulating adhesive; 105. sealing the protective film; 2. a connecting structure; 201. connecting a golden finger; 202. a connecting ring; 203. fixing grooves; 204. a spring stopper; 3. a circuit mounting structure; 301. a wire board mounting groove; 302. connecting a lead; 303. connecting magnetic sheets; 4. a line board module; 401. a line board main board; 402. adhering the coating; 403. channel magnetic sheets.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further described with the specific embodiments.
As shown in fig. 1-4, a multi-layer flexible combined circuit board structure comprises a circuit board main body 1, wherein the circuit board main body 1 comprises a polyimide film 101, a wire support adhesive layer 102, a circuit copper layer 103, a low-melting-point insulating adhesive 104 and a sealing protective film 105, connecting structures 2 are fixedly embedded and installed at two ends of the circuit board main body 1, each connecting structure 2 comprises a connecting golden finger 201, a connecting ring 202, a fixing groove 203 and a spring limiting block 204, the circuit board main body 1 is provided with a circuit installation structure 3, each circuit installation structure 3 comprises a circuit board installation groove 301, a connecting lead 302 and a connecting magnetic sheet 303, a circuit board module 4 is installed at the circuit installation structure 3 in an attached manner, and each circuit board module 4 comprises a circuit board main board 401, an adhesive coating 402 and a magnetic sheet channel 403;
the upper side surface of the polyimide film 101 is fixedly provided with a wire support adhesive layer 102, the upper side surface of the wire support adhesive layer 102 is fixedly provided with a circuit copper layer 103, the upper side surface of the circuit copper layer 103 is coated with a low-melting-point insulating adhesive 104, and the upper side surface of the low-melting-point insulating adhesive 104 is provided with a sealing protective film 105 in an adhering manner; the two ends of the upper surface and the lower surface of the connecting golden finger 201 are fixedly welded with connecting rings 202, the upper surface of each connecting ring 202 is provided with a fixing groove 203, and the surface of one end of the connecting golden finger 201 is provided with a spring limiting block 204; a connecting lead 302 is fixedly installed at the bottom edge of the wire board installation groove 301, and one end of the connecting lead 302 is fixedly connected with a connecting magnetic sheet 303; the bottom side of the line board main board 401 is coated with an adhesion coating 402, and both sides of the adhesion coating 402 are fixedly provided with channel magnetic sheets 403; the circuit board main body 1 is formed by overlapping a polyimide film 101, a wire support adhesive layer 102, a circuit copper layer 103, a low-melting-point insulating adhesive 104 and a sealing protective film 105 layer by layer, connecting golden fingers 201 are fixedly embedded at two ends of the circuit board main body 1, a circuit board mounting groove 301 is arranged in the middle of the upper surface of the circuit board main body 1, an adhesion coating 402 is adhered to the middle of the circuit board mounting groove 301, and channel magnetic sheets 403 are connected with connecting magnetic sheets 303 through magnetic force.
It should be noted that the present invention is a multi-layer flexible combined circuit board structure, when used as a lead wire and a connector, a circuit board module 4 with a common channel type circuit copper layer 103 embedded inside is installed in a circuit board installation groove 301, when used as a main circuit board, the circuit board module 4 with a high-density thin three-dimensional circuit and a precise electronic component type circuit copper layer 103 embedded inside is installed in the circuit board installation groove 301, the main circuit board is directly used as a special device, the adhesion installation is performed through an adhesion coating 402, simultaneously the channel magnetic sheet 403 and the connecting magnetic sheet 303 are connected with a circuit channel inside the circuit board main body 1, the installation of the auxiliary circuit board main board 401 is diversified, different functions can be given to the circuit board main body 1 by replacing different circuit board modules 4, a sealing protection film 105 is added on the conventional flexible circuit board, through the insulating viscose 104 adhesion of low melting point on circuit copper layer 103 upside surface, provide the protection with circuit copper layer 103, accessible low-temperature heating takes off low melting point insulating viscose 104 and maintains when the circuit harm simultaneously, connection structure 2 can mutually support with purpose-made interface, connect golden finger 201 and insert in the mounting groove, the lug of seting up in the mounting groove inserts in the fixed slot 203, spring stopper 204 and the contact of mounting groove cell wall provide a reaction force, the reinforced connection, more traditional connected mode, it is more convenient to install.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims (6)

1. A multi-layer flexible combined circuit board structure is characterized in that: comprises a circuit board main body (1), wherein the circuit board main body (1) comprises a polyimide film (101), a wire support glue layer (102), a circuit copper layer (103), a low-melting-point insulating glue (104) and a sealing protective film (105), the two ends of the circuit board main body (1) are fixedly embedded with connecting structures (2), the connecting structure (2) comprises a connecting golden finger (201), a connecting ring (202), a fixing groove (203) and a spring limiting block (204), the circuit board main body (1) is provided with a circuit mounting structure (3), the circuit mounting structure (3) comprises a circuit board mounting groove (301), a connecting lead (302) and a connecting magnetic sheet (303), the line mounting structure (3) is provided with a line board module (4) in an attaching way, the line board module (4) comprises a line board main board (401), an adhesion coating (402) and a channel magnetic sheet (403).
2. A multi-layer flexible combined circuit board structure according to claim 1, wherein: the surface fixing installs line support glue film (102) on polyimide film (101) upside, line support glue film (102) upside surface fixing installs circuit copper layer (103), circuit copper layer (103) upside surface coating has low melting point insulating viscose (104), sealing protection film (105) are installed to low melting point insulating viscose (104) upside surface adhesion.
3. A multi-layer flexible combined circuit board structure according to claim 2, wherein: the connecting device is characterized in that connecting rings (202) are fixedly welded to the two ends of the upper surface and the lower surface of each connecting golden finger (201), fixing grooves (203) are formed in the upper surface of each connecting ring (202), and spring limiting blocks (204) are arranged on the surface of one end of each connecting golden finger (201).
4. A multi-layer flexible combined circuit board structure according to claim 3, wherein: line board mounting groove (301) tank bottom edge fixed mounting has connecting wire (302), connecting wire (302) one end fixed connection installs connection magnetic sheet (303).
5. The structure of claim 4, wherein: the bottom side of the line board main board (401) is coated with an adhesion coating (402), and channel magnetic sheets (403) are fixedly mounted on two sides of the adhesion coating (402).
6. The structure of claim 5, wherein: circuit board main part (1) is held in the palm glue film (102), circuit copper layer (103), low-melting point insulation viscose (104) and sealing protection film (105) by polyimide film (101), line and is superposed layer upon layer and constitute, connect golden finger (201) fixed bury underground with circuit board main part (1) both ends, circuit board main part (1) upper surface middle part is seted up in line board mounting groove (301), adhesion coating (402) adhesion is at line board mounting groove (301) middle part, passageway magnetic sheet (403) are through magnetic force and connection magnetic sheet (303) interconnect.
CN202121332870.0U 2021-06-16 2021-06-16 Multi-layer flexible combined circuit board structure Active CN216017262U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121332870.0U CN216017262U (en) 2021-06-16 2021-06-16 Multi-layer flexible combined circuit board structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121332870.0U CN216017262U (en) 2021-06-16 2021-06-16 Multi-layer flexible combined circuit board structure

Publications (1)

Publication Number Publication Date
CN216017262U true CN216017262U (en) 2022-03-11

Family

ID=80524221

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202121332870.0U Active CN216017262U (en) 2021-06-16 2021-06-16 Multi-layer flexible combined circuit board structure

Country Status (1)

Country Link
CN (1) CN216017262U (en)

Similar Documents

Publication Publication Date Title
CN115666158A (en) Display module and display device
CN113362724B (en) Display module and display device
US9490383B2 (en) Solar module
CN216017262U (en) Multi-layer flexible combined circuit board structure
CN210839659U (en) Electronic device
CN218768575U (en) Display panel and display device
CN216795367U (en) Flexible circuit board with polyester film type protective layer
CN209882227U (en) Insulating film assembly for flexible circuit board
CN205902196U (en) Flexible printed -circuit board
CN210579421U (en) Flexible circuit board
CN113134997A (en) Flame-retardant conductive foam and preparation process thereof
CN210579474U (en) Rigid-flex printed circuit board structure
CN216980812U (en) Battery module for preventing PCB deformation
CN209374615U (en) The signal acquiring board of power battery module
CN211128396U (en) Flexible circuit board
CN220172320U (en) Power battery coupling mechanism
CN215499758U (en) Battery protection board and mobile phone battery assembly
CN211738788U (en) LED lamp bank for corridor lighting
CN209914293U (en) FPC flexible circuit board
CN214361145U (en) Composite double-sided adhesive tape for touch screen of mobile phone
CN217332769U (en) Voltage and temperature acquisition board assembly of battery module
CN216218256U (en) Corrosion-resistant protection circuit board
CN209017358U (en) A kind of multi-layer flexible circuit board for automation equipment
CN220983867U (en) Capacitive touch component and capacitive screen
CN212869697U (en) Flexible circuit board with backlight structure

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant