CN216014836U

CN216014836U - Waterproof electronic component conducting film

Info

Publication number: CN216014836U
Application number: CN202121341718.9U
Authority: CN
Inventors: 董平; 陈建勇
Original assignee: Shenzhen Shunmanjia Electronics Co ltd
Current assignee: Shenzhen Shunmanjia Electronics Co ltd
Priority date: 2021-06-17
Filing date: 2021-06-17
Publication date: 2022-03-11
Anticipated expiration: 2031-06-17

Abstract

The utility model discloses a waterproof electronic element conductive film which comprises a transparent substrate layer, wherein a first conductive layer is arranged above the transparent substrate layer, an antistatic film layer is arranged above the first conductive layer, a first waterproof layer is arranged above the antistatic film layer, a reinforcing layer is arranged above the first waterproof layer, a toughened film layer is arranged above the reinforcing layer, a second waterproof layer is arranged below the transparent substrate layer, a fluorescent layer is arranged below the second waterproof layer, and a plurality of rectangular grooves are formed in the first waterproof layer. The utility model relates to a waterproof electronic element conductive film, which belongs to the field of conductive films.

Description

Waterproof electronic component conducting film

Technical Field

The utility model relates to the field of conductive films, in particular to a waterproof conductive film for an electronic element.

Background

The conductive film is a film with a conductive function, charged carriers of the conductive film are scattered by the surface and the interface in the transport process, when the thickness of the film is comparable to the free path of electrons, the influence on the surface and the interface becomes remarkable, the phenomenon is called as the size effect of the film, the free path of the carriers is reduced, therefore, compared with a block made of the same material, the conductivity of the film is smaller, the conductive film is frequently used in the production process of electronic components, but the waterproof performance of the traditional conductive film structure is poor.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a waterproof conductive film for electronic components, which can effectively solve the problems of the related art.

In order to achieve the purpose, the utility model adopts the technical scheme that:

the utility model provides a waterproof type electronic component conducting film, includes transparent stratum basale, the top position of transparent stratum basale is provided with the conducting layer No. one, conducting layer top position is provided with antistatic film layer, antistatic film layer's top position is provided with the waterproof layer No. one, the top position of a waterproof layer is provided with the back up coat, back up coat top position is provided with the tempering rete, transparent stratum basale's below position is provided with No. two waterproof layers, the below position of No. two waterproof layers is provided with the fluorescent layer, be provided with a plurality of rectangular channel on the waterproof layer No. one, be provided with a plurality of hexagonal groove on No. two waterproof layers, rectangular channel and hexagonal inslot are provided with waterproof coating, be provided with a plurality of glass fiber bundle on the back up coat.

Preferably, the first conducting layer is made of a nano silver wire material, and the thickness of the first conducting layer is set to be 0.2 microns.

Preferably, the antistatic film layer is made of metal oxide antistatic materials such as titanium oxide and zinc oxide, and the thickness of the antistatic film layer is set to be 0.2 microns.

Preferably, the waterproof coating material is any one of a synthetic resin, a synthetic rubber, a rubber asphalt, and the like.

Preferably, the first waterproof layer and the second waterproof layer are made of hydrophilic polymer resin materials, and the thickness of the first waterproof layer and the second waterproof layer is set to be 0.2-0.5 microns.

Preferably, the reinforcing layer is made of a synthetic resin material, and the thickness of the reinforcing layer is set to be 0.5 to 1 μm.

Preferably, the thickness of the toughened film layer is 1 to 2 micrometers, and the thickness of the transparent substrate layer is set to 1 to 2 micrometers.

Preferably, the thickness of the fluorescent layer is set to 0.2 to 0.5 μm.

Compared with the prior art, the utility model has the following beneficial effects:

according to the utility model, the waterproof performance of the conductive film is better through the structures such as the first waterproof layer and the second waterproof layer, the electric resistance performance of the conductive film is better through the structure of the antistatic film layer, and the fire resistance performance and the toughness of the conductive film are enhanced through the structures such as the reinforcing layer and the glass fiber bundle.

Drawings

FIG. 1 is a schematic structural diagram of a conductive film according to the present invention;

FIG. 2 is a schematic structural diagram of the waterproof layer I of the present invention;

FIG. 3 is a schematic structural view of the waterproof layer II according to the present invention;

fig. 4 is a schematic structural view of the reinforcing layer of the present invention.

In the figure: 101. a transparent substrate layer; 102. a first conductive layer; 103. an antistatic film layer; 104. a first waterproof layer; 105. a reinforcement layer; 106. tempering the film layer; 107. a second waterproof layer; 108. a fluorescent layer; 109. a rectangular groove; 110. waterproof paint; 111. a hexagonal groove; 112. a glass fiber bundle.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further described with the specific embodiments.

As shown in fig. 1-4, a waterproof electronic component conductive film comprises a transparent substrate layer 101, a first conductive layer 102 is arranged above the transparent substrate layer 101, an antistatic film layer 103 is arranged above the first conductive layer 102, a first waterproof layer 104 is arranged above the antistatic film layer 103, a reinforcing layer 105 is arranged above the first waterproof layer 104, a toughened film layer 106 is arranged above the reinforcing layer 105, a second waterproof layer 107 is arranged below the transparent substrate layer 101, a fluorescent layer 108 is arranged below the second waterproof layer 107, a plurality of rectangular grooves 109 are arranged on the first waterproof layer 104, a plurality of hexagonal grooves 111 are arranged on the second waterproof layer 107, waterproof paint 110 is arranged in the rectangular grooves 109 and the hexagonal grooves 111, and a plurality of glass fiber bundles 112 are arranged on the reinforcing layer 105.

In the present embodiment, in order to facilitate the conduction, the first conductive layer 102 is made of a nano silver wire material, and the thickness of the first conductive layer 102 is set to be 0.2 μm.

In this embodiment, in order to enhance the electrical resistance, the antistatic film layer 103 is made of a metal oxide antistatic material such as titanium oxide or zinc oxide, and the thickness of the antistatic film layer 103 is set to 0.2 μm.

In the present embodiment, in order to enhance the waterproof performance, any one of materials such as synthetic resin, synthetic rubber, and rubber asphalt is used as the waterproof coating material 110.

In this embodiment, in order to prevent water in the first waterproof layer 104 and the second waterproof layer 107, the first waterproof layer 104 and the second waterproof layer 107 are made of a hydrophilic polymer resin material, and the thickness of the first waterproof layer 104 and the second waterproof layer 107 is set to be 0.2 to 0.5 μm.

In the present embodiment, the reinforcing layer 105 is made of a synthetic resin material, and the thickness of the reinforcing layer 105 is set to 0.5 to 1 μm.

In the present embodiment, the thickness of the tempered film layer 106 is 1 to 2 micrometers, and the thickness of the transparent substrate layer 101 is set to 1 to 2 micrometers.

Further, the thickness of the fluorescent layer 108 is set to 0.2 to 0.5 μm.

The utility model is a waterproof electronic component conductive film, the first waterproof layer 104 and the second waterproof layer 107 can be waterproof through the hydrophilic polymer resin material structures of the first waterproof layer 104 and the second waterproof layer 107, the waterproof coating 110 is arranged in the rectangular groove 109 and the hexagonal groove 111 arranged on the surfaces of the first waterproof layer 104 and the second waterproof layer 107, the waterproof capability of the first waterproof layer 104 and the second waterproof layer 107 is enhanced, the waterproof performance of the conductive film is enhanced, the antistatic capability of the conductive film is enhanced through the antistatic film layer 103, and the toughness and the fireproof performance of the conductive film are enhanced through the glass fiber bundle 112 arranged in the reinforcing layer 105.

The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. While only the preferred embodiment of the present invention has been illustrated and described in detail, it should be understood that the utility model is not limited thereto, but is capable of numerous changes, modifications, substitutions and alterations all falling within the scope of the appended claims without departing from the spirit and scope of the present invention as set forth herein. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. A waterproof electronic component conductive film is characterized in that: the waterproof coating comprises a transparent substrate layer (101), a first conductive layer (102) is arranged at the top position of the transparent substrate layer (101), an antistatic film layer (103) is arranged at the top position of the first conductive layer (102), a first waterproof layer (104) is arranged at the top position of the antistatic film layer (103), a reinforcing layer (105) is arranged at the top position of the first waterproof layer (104), a toughened film layer (106) is arranged at the top position of the reinforcing layer (105), a second waterproof layer (107) is arranged at the bottom position of the transparent substrate layer (101), a fluorescent layer (108) is arranged at the bottom position of the second waterproof layer (107), a plurality of rectangular grooves (109) are arranged on the first waterproof layer (104), a plurality of hexagonal grooves (111) are arranged on the second waterproof layer (107), and waterproof coatings (110) are arranged in the rectangular grooves (109) and the hexagonal grooves (111), the reinforcing layer (105) is provided with a plurality of glass fiber bundles (112).

2. The waterproof conductive film for electronic components according to claim 1, wherein: the first conducting layer (102) is made of a nano silver wire material, and the thickness of the first conducting layer (102) is set to be 0.2 micrometer.

3. The waterproof conductive film for electronic components according to claim 2, wherein: the antistatic film layer (103) is made of metal oxide antistatic materials such as titanium oxide and zinc oxide, and the thickness of the antistatic film layer (103) is set to be 0.2 micrometer.

4. The waterproof conductive film for electronic components according to claim 3, wherein: the waterproof coating (110) is made of any one of synthetic resin, synthetic rubber, rubber asphalt and the like.

5. The waterproof conductive film for electronic components according to claim 4, wherein: the first waterproof layer (104) and the second waterproof layer (107) are made of hydrophilic polymer resin materials, and the thickness of the first waterproof layer (104) and the second waterproof layer (107) is set to be 0.2-0.5 micrometers.

6. The waterproof conductive film for electronic components according to claim 5, wherein: the reinforcing layer (105) is made of synthetic resin, and the thickness of the reinforcing layer (105) is set to be 0.5-1 micron.

7. The waterproof conductive film for electronic components according to claim 6, wherein: the thickness of the toughening film layer (106) is 1-2 microns, and the thickness of the transparent substrate layer (101) is 1-2 microns.

8. The waterproof conductive film for electronic components according to claim 7, wherein: the thickness of the fluorescent layer (108) is set to 0.2 to 0.5 μm.