CN215991783U

CN215991783U - Improved reflow soldering tin-filling hole structure of radiator

Info

Publication number: CN215991783U
Application number: CN202122526604.8U
Authority: CN
Inventors: 陈杭彬
Original assignee: Jieyang Fengying Technology Co ltd
Current assignee: Jieyang Fengying Technology Co ltd
Priority date: 2021-08-26
Filing date: 2021-10-20
Publication date: 2022-03-08
Anticipated expiration: 2031-10-20

Abstract

The utility model relates to the technical field of heat dissipation products, in particular to an improved radiator reflow soldering tin injection hole structure which comprises a heat dissipation sheet, wherein a plurality of heat dissipation holes used for assembling heat dissipation pipes are formed in the heat dissipation sheet, each heat dissipation hole comprises a tin injection hole and a heat pipe hole, the tin injection holes are formed in the upper side of the heat pipe hole and are intersected with the heat pipe hole, and a first expansion part is arranged at the connecting part of the tin injection holes and the heat pipe hole.

Description

Improved reflow soldering tin-filling hole structure of radiator

Technical Field

The utility model relates to the technical field of heat dissipation products, in particular to an improved reflow soldering tin-filling hole structure of a heat radiator.

Background

The radiator is an indispensable part for normal operation of the electronic product at present, and in the processing and assembly between the radiating fin and the radiating pipe in the radiator, medium filling is required to be carried out on a gap between the radiating fin and the radiating pipe so as to enable the gap between the radiating fin and the radiating pipe to be relatively stable, but the conventional tin injection hole and the conventional heat pipe hole are flatly arranged, when tin is injected into the tin injection hole so as to enable the tin injection hole to flow through the heat pipe hole, the gap between the tin injection hole and the heat pipe hole is limited so that the medium cannot fill the gap between the heat pipe hole and the radiating pipe, the mounting stability of the radiating pipe is reduced, and the radiator is damaged.

Disclosure of Invention

The utility model aims to provide an improved reflow soldering tin filling hole structure of a radiator, which is designed for solving at least one technical problem in the background technology.

In order to achieve the purpose, the utility model adopts the following scheme: the utility model provides a radiator reflow soldering annotates tin pore structure of improvement type, includes the fin, a plurality of louvres that are used for assembling the cooling tube have on the fin, the louvre is including annotating tin hole, heat pipe hole, annotate the tin hole setting and be in the upside of heat pipe hole just annotate the tin hole with crossing the setting between the heat pipe hole annotate the tin hole with one of them junction of heat pipe hole is provided with first extension portion.

And a second expansion part is arranged at the connecting part of the tin injection hole and the heat pipe hole and on the side opposite to the first expansion part.

The first expanding part and the second expanding part extend outwards from the inner wall of the tin injection hole gradually.

Wherein the first expansion part and/or the second expansion part are arranged in an oblique angle or arc shape.

Wherein, a notch is arranged on one side of the inner wall of the tin injection hole close to the heat pipe hole.

The first extension part and the second extension part are symmetrically arranged relative to a central connecting line of the tin injection hole and the heat pipe hole.

Wherein, the top of the first expansion part is contacted with the lower edge of the notch.

Wherein an expansion space is formed between the first expansion part and the second expansion part.

Wherein, the lateral distance of the expansion space is gradually increased from top to bottom.

Wherein, the distance between the top end of the first expansion part and the center of the tin injection hole is larger than or equal to the distance between the top end of the second expansion part and the center of the tin injection hole.

The radiator has the advantages that the covering area of a medium flowing into the heat pipe hole from the tin injection hole is increased by arranging the first expansion part and the second expansion part, so that the assembling stability between the radiating pipe assembled in the heat pipe hole and the radiating fin is improved, the integral stability of the radiator is improved, and the service life of the radiator is prolonged.

Drawings

FIG. 1 is a schematic structural diagram of an improved reflow soldering tin filling hole structure of a heat sink;

FIG. 2 is a schematic structural diagram of a modified reflow soldering tin filling hole structure of a heat sink;

fig. 3 is an enlarged view of a portion a in fig. 2.

Detailed Description

Reference will now be made in detail to the present preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein the purpose of the drawings is to graphically supplement the description of the text portion of the specification, so that each feature and the whole technical solution of the present invention can be visually and vividly understood, but the scope of the present invention should not be construed as being limited thereto.

In the description of the present invention, if an orientation description is referred to, for example, the orientations or positional relationships indicated by "upper", "lower", "front", "rear", "left", "right", etc. are based on the orientations or positional relationships shown in the drawings, only for convenience of describing the present invention and simplifying the description, but not for indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. When a feature is referred to as being "disposed," "secured," or "connected" to another feature, it can be directly disposed, secured, or connected to the other feature or be indirectly disposed, secured, or connected to the other feature.

In the description of the present invention, if "a number" is referred to, it means one or more, if "a number" is referred to, it means two or more, if "more than", "less than" or "more than" is referred to, it is understood that the number is not included, and if "more than", "less than" or "within" is referred to, it is understood that the number is included. If reference is made to "first" or "second", this should be understood to distinguish between features and not to indicate or imply relative importance or to implicitly indicate the number of indicated features or to implicitly indicate the precedence of the indicated features.

In addition, unless defined otherwise, technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

Example (b): as shown in fig. 1, an improved heat sink reflow soldering tin-filling hole structure includes a heat sink 1, the heat sink 1 has a plurality of heat dissipation holes for assembling heat dissipation pipes, the heat dissipation holes include tin-filling holes 101 and heat pipe holes 102, the tin-filling holes 101 are disposed on the upper side of the heat pipe holes 102, the tin-filling holes 101 intersect with the heat pipe holes 102, and a first extension portion 103 is disposed at a connection portion between the tin-filling holes 101 and the heat pipe holes 102, so that a medium entering from the tin-filling holes can flow into an outer pipe wall of the heat dissipation pipe located in the heat dissipation holes from the first extension portion, thereby improving a capacity of the medium flowing into the heat dissipation holes, and improving a stability between the heat dissipation pipe and the heat dissipation holes and prolonging a service life.

Wherein, the connection part of the tin injection hole 101 and the heat pipe hole 102 and the side opposite to the first expansion part 103 are provided with a second expansion part 104, so that the medium entering from the tin injection hole can flow into the outer pipe wall of the heat dissipation pipe positioned in the heat dissipation hole from the second expansion part, the capacity of the medium flowing into the heat dissipation hole is improved, and the stability degree and the service life between the heat dissipation pipe and the heat dissipation hole are improved.

The first expanding portion 103 and the second expanding portion 104 extend outward from the inner wall of the tin injection hole 101, so that the area and the inflow speed of the medium flowing into the heat pipe hole are increased, and the area of the medium covering the heat pipe before cooling is increased.

The first expansion part 103 and/or the second expansion part 104 are arranged in an oblique angle or arc shape, so that the medium can flow into the heat dissipation hole along the outer surface of the oblique angle or the round angle, and the medium flowing speed is increased.

A notch 105 is formed on the inner wall of the tin injection hole 101 near the heat pipe hole 102.

The first extension part 103 and the second extension part 104 are symmetrically arranged relative to a central connecting line of the tin injection hole 101 and the heat pipe hole 102, so that the tin injection hole and the heat pipe hole are easy to process and produce, and the production efficiency is improved.

Wherein, the top end of the first expansion part 103 is arranged in contact with the lower edge of the notch 105.

Wherein an expansion space 106 is formed between the first expansion part 103 and the second expansion part 104.

The transverse distance of the expansion space 106 is gradually increased from top to bottom, so that the coverage area of the medium is increased, and the stability of product assembly is improved.

Wherein, the distance between the top end of the first expansion part 103 and the center of the tin injection hole 101 is greater than or equal to the distance between the top end of the second expansion part 104 and the center of the tin injection hole 101.

Through setting up first extension portion and second extension portion, improve the area of coverage that the medium flowed into the heat pipe hole from annotating the tin hole to make the assembly at the cooling tube in heat pipe hole can improve with the firm degree of assembly between the fin, improve the whole firm and life of radiator.

While the utility model has been described with reference to specific embodiments, the utility model is not limited thereto, and various equivalent modifications and substitutions can be easily made by those skilled in the art within the technical scope of the utility model. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. The utility model provides a radiator reflow soldering notes tin pore structure of improvement type, includes the fin, its characterized in that: the radiating fin is provided with a plurality of radiating holes for assembling the radiating pipe, each radiating hole comprises a tin injection hole and a heat pipe hole, the tin injection holes are arranged on the upper sides of the heat pipe holes and are intersected with the heat pipe holes, and a first expansion part is arranged at the connecting position of the tin injection holes and one of the heat pipe holes.

2. An improved reflow soldering tin-filling hole structure of a heat radiator as claimed in claim 1, wherein: and a second expansion part is arranged at the joint of the tin injection hole and the heat pipe hole and on the opposite side of the first expansion part.

3. An improved reflow soldering tin-filling hole structure of a heat radiator as claimed in claim 2, wherein: the first expansion part and the second expansion part extend outwards gradually from the inner wall of the tin injection hole.

4. An improved reflow soldering tin-filling hole structure of a heat radiator as claimed in claim 3, wherein: the first expansion part and/or the second expansion part are arranged in an oblique angle or arc shape.

5. An improved reflow soldering tin-filling hole structure of a heat radiator as claimed in claim 4, wherein: and a notch is arranged on one side of the inner wall of the tin injection hole, which is close to the heat pipe hole.

6. An improved reflow tin hole structure of a heat sink as claimed in claim 2 or 4, wherein: the first extension part and the second extension part are symmetrically arranged relative to a central connecting line of the tin injection hole and the heat pipe hole.

7. An improved reflow soldering tin-filling hole structure of a heat radiator as claimed in claim 5, wherein: the top end of the first expansion part is in contact with the lower edge of the notch.

8. An improved reflow soldering tin-filling hole structure of a heat radiator as claimed in claim 2, wherein: an expansion space is formed between the first expansion part and the second expansion part.

9. An improved reflow soldering tin-filling hole structure of a heat sink as claimed in claim 8, wherein: the lateral distance of the expansion space is gradually increased from top to bottom.

10. An improved reflow tin hole structure of a heat sink as claimed in claim 2 or 9, wherein: the distance between the top end of the first expansion part and the center of the tin injection hole is larger than or equal to the distance between the top end of the second expansion part and the center of the tin injection hole.