CN215991348U - Multilayer flexible circuit board with mistake proofing layer - Google Patents
Multilayer flexible circuit board with mistake proofing layer Download PDFInfo
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- CN215991348U CN215991348U CN202122618334.3U CN202122618334U CN215991348U CN 215991348 U CN215991348 U CN 215991348U CN 202122618334 U CN202122618334 U CN 202122618334U CN 215991348 U CN215991348 U CN 215991348U
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Abstract
The utility model discloses a multilayer flexible circuit board with an anti-fault layer, which comprises circuit board parts: the circuit board comprises insulating layer, first circuit layer, second circuit layer and the substrate that stacks gradually, be provided with first mistake proofing subassembly between insulating layer and the first circuit layer, be provided with the mistake proofing subassembly of second between first circuit layer and the second circuit layer, be provided with the wrong subassembly of third mistake proofing between second circuit layer and the substrate. According to the flexible circuit board, the staggered components distributed in the independent structure are arranged, so that the mutual restraining effect can be formed between the two adjacent layers of the flexible circuit board, the two adjacent layers can be in a matched and stable stacked state, the phenomenon that the two non-adjacent layers are staggered and stacked is prevented, the flexible circuit board can be accurately and completely stacked and mounted, and the quality of the multi-layer flexible circuit board is improved.
Description
Technical Field
The utility model relates to the technical field of electronic elements, in particular to a multilayer flexible circuit board with an anti-fault layer.
Background
The flexible printed circuit board is a flexible printed circuit board which is made of polyimide or polyester film serving as a base material and has high reliability and excellent flexibility, and has the characteristics of high wiring density, light weight, thin thickness and good bending property.
Chinese patent publication No.: CN211090108U discloses "a multilayer PCB with anti-fault layer", which is formed by sequentially laminating and laminating multiple layers of substrate units, each substrate unit includes a working area and a non-working area, the non-working area is located at the edge of the substrate unit, the non-working area is provided with an inspection area, the positions of the inspection areas of multiple substrate units in the same PCB are the same, each inspection area is provided with multiple label areas, and the number of the label areas is the same as the number of the substrate units of the PCB; each substrate unit is provided with a copper bar in a label area with the same number of stacked layers as the substrate unit, and after the plurality of substrate units are stacked, the positions of the copper bars form a distribution sequence.
However, the existing multilayer flexible circuit board is not enough in a visual observation mode, and the phenomenon of eye fatigue is easy to occur after long-time observation, so that the phenomenon of lamination error cannot be accurately found at the first time, and further the lamination quality of the multilayer flexible circuit board is poor.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a multilayer flexible circuit board with error-proof layers, which adopts an independent error-proof structure between adjacent layers and ensures accurate stacked installation between the adjacent layers.
In order to achieve the above purpose, the utility model provides the following technical scheme: a multilayer flexible circuit board having a fault-tolerant layer, comprising a circuit board member:
the circuit board part consists of an insulating layer, a first circuit layer, a second circuit layer and a base material which are sequentially stacked;
a first error-proofing component is arranged between the insulating layer and the first circuit layer;
a second error-proofing component is arranged between the first circuit layer and the second circuit layer;
and a third error prevention assembly is arranged between the second circuit layer and the substrate.
As a further description of the above technical solution:
the first mistake proofing assembly comprises an upper clamping block arranged on the lower surface of the insulating layer and a first clamping groove arranged on the upper surface of the first circuit layer and matched with the upper clamping block.
As a further description of the above technical solution:
the second error-proofing component comprises a first clamping block arranged on the lower surface of the first circuit layer and a second clamping groove arranged on the upper surface of the second circuit layer.
As a further description of the above technical solution:
the third error-proofing component comprises a second clamping block arranged on the lower surface of the second circuit layer and a lower clamping groove arranged on the upper surface of the substrate.
As a further description of the above technical solution:
the first error-proofing component, the second error-proofing component and the third error-proofing component are distributed along the horizontal plane in an offset structure.
As a further description of the above technical solution:
and flexible reinforcing strips are arranged on two sides of the upper surface of the circuit board along the length direction of the circuit board.
As a further description of the above technical solution:
and sealing edges are arranged at two ends of the circuit board along the width direction of the circuit board.
As a further description of the above technical solution:
the inner wall of the seal edge is provided with a hollow layer, and the seal edge is provided with glue injection holes communicated with the hollow layer.
In the technical scheme, the multilayer flexible circuit board with the fault-tolerant layer provided by the utility model has the following beneficial effects:
this flexible circuit board can form the effect of holding back each other between flexible circuit board's adjacent two-layer through the mistake subassembly of putting that the independent structure that sets up distributes for adjacent two-layer can be in looks adaptation and stable range upon range of state, prevents that non-adjacent two-layer from taking place the range upon range of phenomenon of dislocation, thereby ensures that flexible circuit board can be by accurate and complete range upon range of installation, has improved multilayer flexible circuit board's quality.
Drawings
In order to more clearly illustrate the embodiments of the present application or technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present invention, and other drawings can be obtained by those skilled in the art according to the drawings.
Fig. 1 is a schematic structural diagram of a multilayer flexible circuit board having an anti-fault layer according to an embodiment of the present invention;
fig. 2 is an exploded schematic view of a circuit board according to an embodiment of the present invention;
fig. 3 is a schematic side view of the edge seal according to the embodiment of the present invention.
Description of reference numerals:
1. a circuit board member; 11. an insulating layer; 111. an upper clamping block; 12. a first circuit layer; 121. a first card slot; 122. a first clamping block; 13. a second circuit layer; 131. a second card slot; 132. a second fixture block; 14. a substrate; 141. a lower clamping groove; 2. reinforcing the strips; 3. sealing edges; 31. a hollowed-out layer; 32. and (6) injecting glue holes.
Detailed Description
In order to make the technical solutions of the present invention better understood, those skilled in the art will now describe the present invention in further detail with reference to the accompanying drawings.
As shown in fig. 1 and 2, a multilayer flexible circuit board having an anti-fault layer includes a circuit board member 1:
the circuit board member 1 is composed of an insulating layer 11, a first circuit layer 12, a second circuit layer 13 and a base material 14 which are laminated in this order;
a first error-proofing component is arranged between the insulating layer 11 and the first circuit layer 12;
a second error-proofing component is arranged between the first circuit layer 12 and the second circuit layer 13;
a third error prevention component is arranged between the second circuit layer 13 and the base material 14;
the first error-proofing component, the second error-proofing component and the third error-proofing component are distributed along the horizontal plane in an offset structure.
In this embodiment, the substrate 14 is placed on the bottommost layer, the second circuit layer 13 is placed on the substrate 14, the stacking position and state of the two layers are fixed by the third error-proofing assembly, the first circuit layer 12 is placed on the second circuit layer 13, the stacking position and state of the two layers are fixed by the second error-proofing assembly, the insulating layer 11 is finally placed on the first circuit layer 12, the stacking position and state of the two layers are fixed by the first error-proofing assembly, and the three error-proofing assemblies distributed in the staggered structure along the horizontal plane can avoid the phenomenon of staggered installation between the two non-adjacent layers, prevent the circuit layer from stacking errors, ensure that the flexible circuit board can be accurately and completely stacked and installed, and improve the quality of the multilayer flexible circuit board.
As shown in fig. 2, the first error-proofing assembly includes an upper fixture block 111 disposed on the lower surface of the insulating layer 11, and a first clamping groove 121 disposed on the upper surface of the first circuit layer 12 and adapted to the upper fixture block 111, and by the embedded clamping of the upper fixture block 111 and the first clamping groove 121, the insulating layer 11 and the first circuit layer 12 can be positioned and stacked, so as to ensure the accuracy and stability of the stacked state of the two.
As shown in fig. 2, the second error-proofing assembly includes a first latch 122 disposed on the lower surface of the first circuit layer 12 and a second latch 131 disposed on the upper surface of the second circuit layer 13, and the first latch 122 and the second latch 131 are engaged with each other in an embedded manner, so that the first circuit layer 12 and the second circuit layer 13 can be positioned and stacked, and the stacking state of the first circuit layer 12 and the second circuit layer 13 can be ensured to be accurate and stable.
As shown in fig. 2, the third error-proofing component includes a second latch 132 disposed on the lower surface of the second circuit layer 13 and a lower latch 141 disposed on the upper surface of the substrate 14, and the second latch 132 and the lower latch 141 are clamped in an embedded manner, so that the second circuit layer 13 and the substrate 14 can be positioned and stacked, and the accuracy and stability of the stacked state of the two layers are ensured.
As shown in fig. 1, the flexible reinforcing strips 2 are arranged on two sides of the upper surface of the circuit board 1 along the length direction thereof, so that the flexible circuit board after being mounted in a stacked manner can be reinforced and supported, the flexible circuit board can keep a relatively complete state after being bent and deformed, and the phenomenon that the flexible circuit board is excessively deformed after being bent is prevented.
As shown in fig. 1, the sealing edges 3 are arranged at two ends of the circuit board 1 along the width direction, so that the two ends of the flexible circuit board after being stacked can be sealed and wrapped, the overall tightness of the flexible circuit board is improved, and the stable state of the flexible circuit board is improved.
As shown in fig. 3, the inner wall of the edge sealing 3 is provided with a hollow-out layer 31, the edge sealing 3 is provided with a glue injection hole 32 communicated with the hollow-out layer 31, when the edge sealing 3 is wrapped at the outer sides of the two ends of the flexible circuit board, a sealing medium is injected into the edge sealing 3 through the glue injection hole 32, so that the sealing medium enters the hollow-out layer 31 and is seeped outwards, a gap between the edge sealing 3 and the end portion of the flexible circuit board can be sealed and filled, and the sealing effect of the wrapping between the edge sealing 3 and the flexible circuit board is ensured.
While certain exemplary embodiments of the present invention have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that the described embodiments may be modified in various different ways without departing from the spirit and scope of the utility model. Accordingly, the drawings and description are illustrative in nature and should not be construed as limiting the scope of the utility model.
Claims (8)
1. Multilayer flexible circuit board with error protection layer, comprising a circuit board element (1), characterized in that:
the circuit board piece (1) is composed of an insulating layer (11), a first circuit layer (12), a second circuit layer (13) and a base material (14) which are sequentially stacked;
a first error-proofing component is arranged between the insulating layer (11) and the first circuit layer (12);
a second error-proofing component is arranged between the first circuit layer (12) and the second circuit layer (13);
and a third error prevention component is arranged between the second circuit layer (13) and the base material (14).
2. A multilayer flexible circuit board having an anti-fault layer according to claim 1, wherein: the first mistake proofing assembly comprises an upper clamping block (111) arranged on the lower surface of the insulating layer (11) and a first clamping groove (121) arranged on the upper surface of the first circuit layer (12) and matched with the upper clamping block (111).
3. A multilayer flexible circuit board having an anti-fault layer according to claim 1, wherein: the second error-proofing assembly comprises a first clamping block (122) arranged on the lower surface of the first circuit layer (12) and a second clamping groove (131) arranged on the upper surface of the second circuit layer (13).
4. A multilayer flexible circuit board having an anti-fault layer according to claim 1, wherein: the third error-proofing component comprises a second clamping block (132) arranged on the lower surface of the second circuit layer (13) and a lower clamping groove (141) arranged on the upper surface of the base material (14).
5. A multilayer flexible circuit board having an anti-fault layer according to claim 1, wherein: the first error-proofing component, the second error-proofing component and the third error-proofing component are distributed along the horizontal plane in an offset structure.
6. A multilayer flexible circuit board having an anti-fault layer according to claim 1, wherein: and flexible reinforcing strips (2) are arranged on two sides of the upper surface of the circuit board piece (1) along the length direction of the circuit board piece.
7. A multilayer flexible circuit board having an anti-fault layer according to claim 1, wherein: and sealing edges (3) are arranged at two ends of the circuit board component (1) along the width direction of the circuit board component.
8. A multilayer flexible circuit board having an error-proofing layer according to claim 7, wherein: the inner wall of banding (3) is provided with fretwork layer (31), be equipped with on banding (3) annotate gluey hole (32) with fretwork layer (31) intercommunication.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202122618334.3U CN215991348U (en) | 2021-10-29 | 2021-10-29 | Multilayer flexible circuit board with mistake proofing layer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202122618334.3U CN215991348U (en) | 2021-10-29 | 2021-10-29 | Multilayer flexible circuit board with mistake proofing layer |
Publications (1)
Publication Number | Publication Date |
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CN215991348U true CN215991348U (en) | 2022-03-08 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202122618334.3U Active CN215991348U (en) | 2021-10-29 | 2021-10-29 | Multilayer flexible circuit board with mistake proofing layer |
Country Status (1)
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CN (1) | CN215991348U (en) |
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2021
- 2021-10-29 CN CN202122618334.3U patent/CN215991348U/en active Active
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