CN215991332U

CN215991332U - 5G communication high frequency multilayer PCB board

Info

Publication number: CN215991332U
Application number: CN202122015666.2U
Authority: CN
Inventors: 刘飞
Original assignee: Shenzhen Shenbo Intelligent Manufacturing Co ltd
Current assignee: Shenzhen Shenbo Intelligent Manufacturing Co ltd
Priority date: 2021-08-25
Filing date: 2021-08-25
Publication date: 2022-03-08
Anticipated expiration: 2031-08-25

Abstract

The utility model discloses a 5G communication high-frequency multilayer PCB, which comprises a PCB, wherein two groups of fixing plates are arranged on the PCB, two groups of rotating shafts are fixedly connected between the two groups of fixing plates, a connecting plate is fixedly connected between the two groups of rotating shafts, one end of the connecting plate is arc-shaped, the upper ends of the two groups of fixing plates are fixedly connected with a top plate, a limiting shaft is arranged below the top plate and is rotatably connected between the two groups of fixing plates, a torsion spring is sleeved on the limiting shaft, the connecting plate can be arranged on the PCB through bolts, the rubber layer can increase the friction between the connecting plate and the PCB and further prevent the connecting plate from falling off, then a pull ring is pulled, the torsion spring is extruded by the connecting plate and the top plate to shrink, so that a fixing frame is tilted, a chip is placed between the four groups of clamping plates during installation, and is fixed through the elastic expansion and contraction of the spring, and can fix chips of different sizes.

Description

5G communication high frequency multilayer PCB board

Technical Field

The utility model relates to the technical field of PCBs (printed circuit boards), in particular to a 5G communication high-frequency multilayer PCB.

Background

The PCB, which is called a printed circuit board in chinese, is an important electronic component, a support for electronic components, a carrier for electrical connection of electronic components, and is called a "printed" circuit board because it is manufactured by electronic printing.

However, in 5G communication equipment, the chip is installed on the PCB, and the chip installation position does not have a structure for protecting the chip and stabilizing the chip, so that the chip is not loosened and dropped under normal conditions after being installed, but the chip may be dropped and damaged under severe vibration conditions, the service life of the chip is shortened, and even the chip is scrapped, so that the maintenance cost is increased.

Therefore, the present invention provides a 5G communication high frequency multilayer PCB to solve the above-mentioned problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a 5G communication high-frequency multilayer PCB to solve the problems in the background technology.

In order to achieve the purpose, the utility model provides the following technical scheme:

a high-frequency multilayer PCB for 5G communication comprises a PCB, wherein two groups of fixing plates are arranged on the PCB, two groups of rotating shafts are fixedly connected between the two groups of fixing plates, a connecting plate is fixedly connected between the two groups of rotating shafts, one end of the connecting plate is arc-shaped, a top plate is fixedly connected to the upper ends of the two groups of fixing plates, a limiting shaft is arranged below the top plate and is rotatably connected between the two groups of fixing plates, and a torsion spring is sleeved on the limiting shaft;

the upper end and the lower end of the torsion spring are respectively abutted against the top plate and the connecting plate, the other end of the connecting plate is fixedly connected with a fixing frame which is cross-shaped, four groups of sliding grooves are formed in the lower end of the fixing frame, sliding blocks and springs are arranged in the sliding grooves, one ends of the four groups of springs are fixedly connected in the sliding grooves, the other ends of the four groups of springs are fixedly connected with the sliding blocks, and clamping plates are fixedly connected to the lower ends of the four groups of sliding blocks.

As a further scheme of the utility model, the slider is T-shaped and is matched with the chute, the clamping plate is connected with the fixed frame in a sliding manner through the slider, when chips with different sizes are fixed, the chips are positioned between the clamping plates, and the matched slider and chute can reduce resistance and prevent falling off during sliding.

As a further scheme of the utility model, the middle position of the upper end of the connecting plate is fixedly connected with a pull ring, and when a chip needs to be installed or disassembled, the pull ring is pulled to incline the connecting plate, so that the chip is convenient to install and replace.

As a further scheme of the utility model, the lower ends of the two groups of fixing plates are fixedly connected with two groups of connecting sheets, each connecting sheet is in threaded connection with a bolt, the PCB is positioned between the two groups of connecting sheets, and the two groups of connecting sheets are fixed on the PCB through the bolts, so that the fixing firmness is ensured, and the chips are prevented from falling off.

As a further scheme of the utility model, a sponge layer is cemented on the inner surface of the clamping plate, and when the clamping plate clamps and fixes the chip, the chip can be protected by the sponge layer, so that the chip is prevented from being damaged.

As a further scheme of the utility model, the rubber layers are glued on the inner surfaces of the four groups of connecting sheets, and the PCB can be protected after the connecting sheets are fixed through the rubber layers, so that the PCB is prevented from being damaged by extrusion force of the connecting sheets, friction with the PCB can be increased, and falling off is prevented.

As a further scheme of the utility model, the four groups of clamping plates are provided with mounting grooves, the chips can be prevented from falling off in the clamping plates through the mounting grooves, and the chips are tightly attached to the PCB after mounting.

Compared with the prior art, the utility model has the beneficial effects that:

1. can make the connection piece on the PCB board through the bolt, the rubber layer can increase the friction of connection piece and PCB board, further prevent that the connection piece from droing, then the pulling ring, torque spring receives the extrusion of connecting plate and roof and contracts, thereby the mount perk, place the chip between four group's grip blocks during the installation, elastic expansion through the spring fixes the chip, and can fix the chip of equidimension not, can protect the chip through the sponge layer, prevent that the chip edge is impaired, after fixed, the pull ring loosens, torque spring extrusion connecting plate, prevent that the chip from droing.

2. Can place the chip edge among the mounting groove when the chip is installed through the mounting groove, then the spring is fixed chip and connecting plate respectively with torsion spring, ensures that the chip can closely laminate on the PCB board.

Drawings

Fig. 1 is a schematic structural diagram of embodiment 1 of the present invention.

Fig. 2 is a schematic structural view of a torsion spring in embodiment 1 of the present invention.

Fig. 3 is a schematic structural view of a clamping plate in embodiment 1 of the present invention.

Fig. 4 is a schematic structural view of a spring in embodiment 1 of the present invention.

Fig. 5 is a schematic structural diagram of embodiment 2 of the present invention.

In the figure:

1. a PCB board; 2. a fixing plate; 3. a rotating shaft; 4. a connecting plate; 5. a top plate; 6. a limiting shaft; 7. a torsion spring; 8. a fixed mount; 9. a chute; 10. a slider;

11. a spring; 12. a clamping plate; 13. a pull ring; 14. connecting sheets; 15. a bolt; 16. and (4) mounting the groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example 1

Referring to fig. 1 to 4, in the embodiment of the utility model, a 5G communication high-frequency multilayer PCB comprises a PCB 1, two groups of fixing plates 2 are arranged on the PCB 1, two groups of rotating shafts 3 are fixedly connected between the two groups of fixing plates 2, a connecting plate 4 is fixedly connected between the two groups of rotating shafts 3, one end of the connecting plate 4 is arc-shaped, the upper ends of the two groups of fixing plates 2 are fixedly connected with a top plate 5, a limiting shaft 6 is arranged below the top plate 5, the limiting shaft 6 is rotatably connected between the two groups of fixing plates 2, and a torsion spring 7 is sleeved on the limiting shaft 6;

the upper end and the lower end of the torsion spring 7 are respectively resisted with the top plate 5 and the connecting plate 4, the other end of the connecting plate 4 is fixedly connected with a fixing frame 8, the fixing frame 8 is in a cross shape, four groups of sliding grooves 9 are formed in the lower end of the fixing frame 8, sliding blocks 10 and springs 11 are arranged inside the sliding grooves 9, one ends of the four groups of springs 11 are fixedly connected inside the sliding grooves 9, the other ends of the four groups of springs are fixedly connected with the sliding blocks 10, and the lower ends of the four groups of sliding blocks 10 are fixedly connected with clamping plates 12.

As a further scheme of the utility model, the slider 10 is T-shaped and is matched with the sliding groove 9, the clamping plate 12 is connected with the fixed frame 8 in a sliding mode through the slider 10, when chips with different sizes are fixed, the chips are located between the clamping plates 12, and the matched slider 10 and the sliding groove 9 can reduce resistance and prevent falling off when sliding.

Furthermore, the middle position of the upper end of the connecting plate 4 is fixedly connected with a pull ring 13, and when the chip needs to be installed or disassembled, the pull ring 13 is pulled to incline the connecting plate 4, so that the chip is conveniently installed and replaced.

Further, two sets of connection pieces 14 of 2 lower extremes of two sets of fixed plates all fixedly connected with, equal threaded connection has bolt 15 on every connection piece 14, and PCB board 1 is located between two sets of connection pieces 14, fixes two sets of connection pieces 14 on PCB board 1 through bolt 15, ensures fixed fastness, prevents droing of chip.

Further, the internal surface of the clamping plate 12 is glued with a sponge layer, and when the clamping plate 12 clamps and fixes the chip, the chip can be protected through the sponge layer, so that the chip is prevented from being damaged.

Further, the rubber layer is glued to the inner surfaces of the four groups of connecting pieces 14, the PCB board 1 can be protected after the connecting pieces 14 are fixed through the rubber layer, the PCB board 1 is prevented from being damaged by extrusion force of the connecting pieces 14, friction between the connecting pieces and the PCB board can be increased, and falling off is prevented.

When the chip fixing device is used, the connecting sheet 14 is fixed on the PCB 1 through the bolt 15, the rubber layer can increase friction between the connecting sheet 14 and the PCB 1 and further prevent the connecting sheet 14 from falling off, then the pull ring 13 is pulled, and the torsion spring 7 is extruded by the connecting sheet 4 and the top plate 5 and contracts, so that the fixing frame 8 tilts up, the chip is placed between the four groups of clamping plates 12 during installation, the chip is fixed through elastic expansion of the springs 11 and can be fixed on chips with different sizes, the chip can be protected through the sponge layer to prevent the edge of the chip from being damaged, after the chip is fixed, the pull ring 13 is loosened, and the torsion spring 7 extrudes the connecting sheet 4 to prevent the chip from falling off.

Example 2

Referring to fig. 5, the embodiment is different from embodiment 1 in that: mounting grooves 16 are formed in the four groups of clamping plates 12, the edges of the chips can be placed in the mounting grooves 16 when the chips are mounted through the mounting grooves 16, and then the springs 11 and the torsion springs 7 are used for fixing the chips and the connecting plate 4 respectively, so that the chips can be tightly attached to the PCB 1.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.

Claims

1. A5G communication high-frequency multilayer PCB comprises a PCB (1) and is characterized in that two groups of fixing plates (2) are arranged on the PCB (1), two groups of rotating shafts (3) are fixedly connected between the two groups of fixing plates (2), a connecting plate (4) is fixedly connected between the two groups of rotating shafts (3), one end of the connecting plate (4) is arc-shaped, the upper ends of the two groups of fixing plates (2) are fixedly connected with a top plate (5), a limiting shaft (6) is arranged below the top plate (5), the limiting shaft (6) is rotatably connected between the two groups of fixing plates (2), and a torsion spring (7) is sleeved on the limiting shaft (6);

the upper end and the lower end of the torsion spring (7) are respectively abutted against the top plate (5) and the connecting plate (4), the other end of the connecting plate (4) is fixedly connected with a fixing frame (8), the fixing frame (8) is cross-shaped, four groups of sliding grooves (9) are formed in the lower end of the fixing frame (8), sliding blocks (10) and springs (11) are arranged inside the sliding grooves (9), one ends of the four groups of springs (11) are fixedly connected inside the sliding grooves (9), the other ends of the four groups of springs are fixedly connected with the sliding blocks (10), and the lower ends of the four groups of sliding blocks (10) are fixedly connected with clamping plates (12).

2. The 5G communication high-frequency multilayer PCB board as claimed in claim 1, wherein the slider (10) is T-shaped and matched with the sliding groove (9), and the clamping plate (12) is connected with the fixed frame (8) in a sliding way through the slider (10).

3. The high-frequency multilayer PCB board for 5G communication according to claim 1, characterized in that a pull ring (13) is fixedly connected to the middle position of the upper end of the connecting board (4).

4. The 5G communication high-frequency multilayer PCB board as claimed in claim 1, wherein two groups of connecting pieces (14) are fixedly connected to the lower ends of two groups of fixing plates (2), a bolt (15) is screwed on each connecting piece (14), and the PCB board (1) is positioned between the two groups of connecting pieces (14).

5. The 5G communication high-frequency multilayer PCB board as claimed in claim 1, wherein a sponge layer is glued on the inner surface of the clamping board (12).

6. The 5G communication high-frequency multilayer PCB board as claimed in claim 4, wherein the inner surfaces of the four groups of connecting sheets (14) are glued with rubber layers.

7. The 5G communication high-frequency multilayer PCB board as claimed in claim 1, wherein four sets of the clamping plates (12) are provided with mounting grooves (16).