CN215989238U - Novel bluetooth ceramic bipolar antenna structure - Google Patents

Novel bluetooth ceramic bipolar antenna structure Download PDF

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Publication number
CN215989238U
CN215989238U CN202122567909.3U CN202122567909U CN215989238U CN 215989238 U CN215989238 U CN 215989238U CN 202122567909 U CN202122567909 U CN 202122567909U CN 215989238 U CN215989238 U CN 215989238U
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metal
grounding
patch
feed
patches
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黄祖波
张力明
陈维扬
李月明
宋勇
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Dongguan Taisheng Sound Technology Co ltd
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Dongguan Taisheng Sound Technology Co ltd
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Abstract

The utility model discloses a novel Bluetooth ceramic bipolar antenna structure which comprises a ceramic substrate, transverse metal patches and longitudinal metal patches, wherein each transverse metal patch and each longitudinal metal patch are connected to form a continuous positive and negative inverted-V-shaped patch structure; the left end and the right end of the ceramic substrate are respectively provided with a feed piece and a grounding piece, one end of the patch structure is connected with the feed piece, and the other end of the patch structure is connected with the grounding piece; the feed element is connected with the impedance matching circuit through a feed transmission line, and the grounding element is connected with the metal grounding plate through a grounding transmission line; the bottom surface of the ceramic substrate is also provided with two bottom surface metal patches, one ends of the two bottom surface metal patches are connected with the grounding piece, and the other ends of the two bottom surface metal patches extend to the position close to the feed piece but are not connected with the feed piece. Therefore, the antenna can work in the frequency band of the Bluetooth ISM within the limited space size, and has wider working bandwidth, better radiation omni-directionality, higher radiation efficiency and larger antenna gain.

Description

Novel bluetooth ceramic bipolar antenna structure
Technical Field
The utility model relates to the technical field of wireless communication, in particular to a patch type Bluetooth antenna which is mainly applied to various miniaturized wearable devices and has strict requirements on circuit size.
Background
With the development of wireless communication technology and the maturity of 5G technology, bluetooth and wifi technology are also increasingly widely used, have promoted people to have proposed higher operation requirement to miniaturized, intelligent, portable electronic product to also promoted the market rapid development of wearable equipment. Miniaturization is one of the most concerned factors for wearable devices, and how to reduce the size of the device as much as possible and achieve miniaturization becomes one of the main problems that limit the development of wearable devices at present on the premise of ensuring the basic performance of the wearable devices.
With the continuous reduction of the physical size of the chip, the rapid development of the integrated circuit provides a solid technical foundation for the popularization and application of the wearable device. The size of the whole product is continuously reduced by integrating the circuit into the chip, and the requirement of people on the miniaturized electronic product is met. Especially, in bluetooth wireless communication direction, all have good market application like bluetooth headset, bluetooth stereo set, intelligent bracelet etc.. In order to meet the requirement of circuit miniaturization in wireless communication, how to reduce the physical size of an antenna becomes the most critical problem, the physical size of the antenna as a bridge for realizing communication with the outside in wireless communication is generally in direct proportion to the operating frequency, and the physical size of the antenna required by a lower bluetooth frequency band is relatively larger, so that how to realize the miniaturization of the bluetooth antenna as much as possible and improve the working performance of the antenna becomes the problem which needs to be solved urgently.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem of providing a novel Bluetooth ceramic bipolar antenna structure which can solve the problems of large size of a Bluetooth antenna, poor antenna radiation omni-directionality, low antenna radiation efficiency, narrow antenna resonance bandwidth and the like in the conventional wearable equipment.
In order to solve the technical problems, the utility model adopts the following technical scheme: a novel Bluetooth ceramic bipolar antenna structure comprises a ceramic substrate and a metal patch, wherein the metal patch is arranged on the ceramic substrate to form a main body part of a Bluetooth antenna and is connected to a peripheral matching circuit; the peripheral matching circuit comprises a metal grounding plate and an impedance matching circuit, wherein the impedance matching circuit is connected with the metal grounding plate, and the peripheral matching circuit is characterized in that: the metal patches comprise a plurality of transverse metal patches transversely arranged along the ceramic substrate and a plurality of longitudinal metal patches longitudinally arranged along the ceramic substrate, and each transverse metal patch and each longitudinal metal patch are sequentially and vertically connected end to form a continuous positive and negative inverted 'n' -shaped patch structure or a snake-shaped wiring structure; a feed element and a grounding element are respectively arranged at the left end and the right end of the ceramic substrate, one end of the patch structure is connected with the feed element, and the other end of the patch structure is connected with the grounding element; the feed element is connected with the impedance matching circuit through a feed transmission line, and the grounding element is connected with the metal grounding plate through a grounding transmission line; each horizontal metal patch and each vertical metal patch are arranged inside the ceramic substrate, two bottom surface metal patches are further arranged on the bottom surface of the ceramic substrate, one ends of the two bottom surface metal patches are connected with the grounding piece, and the other ends of the two bottom surface metal patches extend to the position close to the feed piece but are not connected with the feed piece. The ceramic substrate has high dielectric constant and low tangent loss, and is realized by stacking and sintering by a low-temperature co-firing technology, so that electromagnetic waves are transmitted in the ceramic substrate and have short working wavelength.
Furthermore, the two bottom metal patches are parallel to each transverse metal patch and each longitudinal metal patch, and are respectively positioned below the longitudinal metal patches on the front side and the rear side.
Furthermore, the feed part is a square feed copper column, and the grounding part is a square grounding copper column; two ends of the inverted V-shaped patch structure are respectively connected with the middle positions of the feed copper column and the grounding copper column through longitudinal metal patches.
Furthermore, the transverse metal patches are rectangular metal patches, the number of the transverse metal patches is 9, each transverse metal patch has the same width, the length of each transverse metal patch at two ends is half of that of the transverse metal patch in the middle, the adjacent transverse metal patches have the same interval, and the transverse metal patches are located on the same plane and are parallel to each other.
Furthermore, each longitudinal metal patch is a rectangular metal patch, the number of the metal patches is 10, and each longitudinal metal patch has the same width and length; the longitudinal metal patches are arranged into two parallel rows along the head and the tail of the transverse metal patches, and the longitudinal metal patches and the transverse metal patches are positioned on the same plane.
Furthermore, the impedance matching circuit comprises an FR4 dielectric plate and a pi-type impedance matching circuit, the main body part of the whole Bluetooth antenna, the feed transmission line and the grounding transmission line are arranged on the FR4 dielectric plate, and the FR4 dielectric plate is butted with the metal ground plate; the feed transmission line connects the feed copper column with the pi-type impedance matching circuit, and the ground transmission line connects the ground copper column with the metal ground plate. The width of the feed transmission line is calculated according to the working frequency of the antenna and the specification parameters of the FR4 dielectric plate, and the line length should be shortened as much as possible on the premise of meeting the space required by the pi-type impedance matching circuit so as to reduce the energy loss on the feed transmission line.
Furthermore, the pi-type impedance matching circuit comprises a first gap intercepted at the middle position of the feed transmission line, and a second gap and a third gap which are close to the left side and the right side of the first gap and are positioned on an FR4 dielectric board, wherein the three gaps form a pi-type structure; RLC electronic elements are arranged in the three gaps respectively to achieve electrical connection between the Bluetooth antenna main body portion and the metal grounding plate, and therefore the impedance matching function of the antenna is achieved.
Further, a fourth gap is arranged between the tail end of the grounding transmission line and the metal grounding plate, and a 0201 inductor is welded in the fourth gap and used for adjusting the resonant frequency of the Bluetooth ceramic bipolar antenna.
Preferably, the size of the ceramic substrate does not exceed 5.2mm (length) x 2mm (width) x 1.12mm (height).
Preferably, the width of the four gaps used by the pi-type impedance matching circuit for welding the RLC electronic element and the 0201 inductor does not exceed the length of the RLC electronic element or the 0201 inductor inside the gap, such as 2 mm.
According to the utility model, the Bluetooth antenna adopts a bent curve structure, the coupling parasitic branches are added, and the LTCC low-temperature co-fired ceramic technology is matched, a snake-shaped wiring rectangular metal patch with a certain thickness is arranged in the middle of the ceramic substrate, and a straight-line wiring coupling parasitic rectangular metal patch with a certain thickness is arranged on the bottom surface of the ceramic substrate. The S-shaped wiring rectangular metal patch is simultaneously connected with the metal copper columns at the left end and the right end, the coupling parasitic rectangular metal patch of the linear wiring is only connected with the grounding metal copper column, and is not connected with the feeding metal copper column at the other side, and the input end of the other antenna is matched with the pi-shaped matching circuit and is connected with the tuning inductor to the grounding end to realize the main electromagnetic characteristic. Therefore, the utility model can realize that the antenna works in the frequency band of the Bluetooth ISM in the limited space size, has wider working bandwidth, better radiation omni-directionality, higher radiation efficiency and larger antenna gain, and avoids the requirements of the traditional Bluetooth antenna on large-size circuits and clearance design.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic perspective view of a single antenna part with a ceramic substrate removed according to the present invention;
FIG. 3 is a schematic top view of a single antenna portion with a ceramic substrate removed according to the present invention;
FIG. 4 is a diagram showing simulation results of standing wave ratio coefficient and frequency variation of the antenna of the present invention;
FIG. 5 is an EH plane radiation pattern of the antenna of the present invention;
FIG. 6 is a graph of the radiation efficiency of the antenna of the present invention;
fig. 7 is a 3D radiation pattern of the antenna of the present invention;
fig. 8 shows the overall structure of the antenna and its 3D radiation pattern.
In the figure, 1 is a ceramic substrate, 2 is a transverse metal patch, 3 is a longitudinal metal patch, 4 is a bottom metal patch, 5 is a feed copper pillar, 6 is a grounding copper pillar, 7 is a feed transmission line, 8 is a grounding transmission line, 9 is a first gap, 10 is a second gap, 11 is a third gap, 12 is a fourth gap, 13 is an FR4 dielectric plate, and 14 is a metal grounding plate.
Detailed Description
In this embodiment, referring to fig. 1 to 3, the novel bluetooth ceramic bipolar antenna structure includes a ceramic substrate 1 and a metal patch, where the metal patch is disposed on the ceramic substrate 1 to form a main body portion of a bluetooth antenna and is connected to a peripheral matching circuit; the peripheral matching circuit comprises a metal grounding plate 14 and an impedance matching circuit, and the impedance matching circuit is connected with the metal grounding plate 14; the metal patches comprise a plurality of transverse metal patches 2 transversely arranged along the ceramic substrate 1 and a plurality of longitudinal metal patches 3 longitudinally arranged along the ceramic substrate 1, and each transverse metal patch 2 and each longitudinal metal patch 3 are sequentially and vertically connected end to form a continuous positive and negative inverted 'V' -shaped patch structure, or a snake-shaped wiring structure; a feed element and a grounding element are respectively arranged at the left end and the right end of the ceramic substrate 1, one end of the patch structure is connected with the feed element, and the other end of the patch structure is connected with the grounding element; the feed element is connected with the impedance matching circuit through a feed transmission line 7, and the grounding element is connected with a metal grounding plate 14 through a grounding transmission line 8; each horizontal metal paster 2 and each vertical metal paster 3 set up in ceramic substrate 1's inside, and still be provided with two bottom surface metal pasters 4 of walking the line in the bottom surface of ceramic substrate 1 directly, and two bottom surface metal pasters 4's one end all is connected with the ground connection piece, and the other end extends to the position that is close to the feed piece but not is connected with the feed piece. The ceramic substrate 1 has a high dielectric constant and a low tangent loss, and is formed by stacking and sintering through a low-temperature co-firing technique, so that electromagnetic waves are transmitted inside the ceramic substrate with a short operating wavelength.
The two bottom metal patches 4 are parallel to the transverse metal patches 2 and the longitudinal metal patches 3, and are respectively positioned below the longitudinal metal patches 3 on the front side and the rear side.
The feed part is a square feed copper column 5, and the grounding part is a square grounding copper column 6; two ends of the inverted V-shaped patch structure are respectively connected with the middle positions of the feed copper column 5 and the grounding copper column 6 through the longitudinal metal patches 3.
The transverse metal patches 2 are rectangular metal patches, the number of the transverse metal patches is 9, each transverse metal patch 2 has the same width, the length of each transverse metal patch 2 at two ends is half of that of the transverse metal patch 2 in the middle, the adjacent transverse metal patches 2 have the same interval, and the transverse metal patches 2 are located on the same plane and are parallel to each other.
Each longitudinal metal patch 3 is a rectangular metal patch, the number of the metal patches is 10, and each longitudinal metal patch 3 has the same width and length; the longitudinal metal patches 3 are arranged in two parallel rows along the head and the tail of the transverse metal patches, and the longitudinal metal patches 3 and the transverse metal patches 2 are in the same plane.
The impedance matching circuit comprises an FR4 dielectric plate 13 and a pi-type impedance matching circuit, the main body part of the whole Bluetooth antenna, a feed transmission line 7 and a grounding transmission line 8 are arranged on the FR4 dielectric plate 13, and the FR4 dielectric plate 13 is butted with a metal grounding plate 14; the feed transmission line 7 connects the feed copper pillar 5 with the pi-type impedance matching circuit, and the ground transmission line 8 connects the ground copper pillar 6 with the metal ground plate 14. The width of the feed transmission line 7 is calculated according to the operating frequency of the antenna and the specification parameters of the FR4 dielectric plate 14, and the line length should be shortened as much as possible on the premise of meeting the space required by the pi-type impedance matching circuit, so as to reduce the energy loss on the feed transmission line 7.
The pi-type impedance matching circuit comprises a first gap 9 intercepted at the middle position of the feed transmission line 7, and a second gap 10 and a third gap 11 which are close to the left side and the right side of the first gap 9 and are positioned on an FR4 dielectric board 13, wherein the three gaps form a pi-type structure; RLC electronic elements are respectively arranged in the three gaps to realize the electrical connection between the Bluetooth antenna main body part and the metal grounding plate 14, so that the impedance matching function of the antenna is achieved.
A fourth gap 12 is arranged between the end of the grounding transmission line 8 and the metal grounding plate 14, and a 0201 inductor is welded in the fourth gap 12 and is used for adjusting the resonant frequency of the Bluetooth ceramic bipolar antenna.
The size of the ceramic substrate 1 is not more than 5.2mm (length) × 2mm (width) × 1.12mm (height).
The width of the four gaps of the pi-shaped impedance matching circuit for welding the RLC electronic element and the 0201 inductor does not exceed the length of the RLC electronic element or the 0201 inductor in the pi-shaped impedance matching circuit, such as 2 mm.
As shown in fig. 4, the 3D structure of the antenna model proposed by the present invention is simulated by using ANSYS high frequency electromagnetic simulation software HFSS, and a curve graph of the standing wave ratio coefficient corresponding to the bluetooth antenna of the present invention changing with frequency is obtained. The antenna has the working bandwidth of 150MHz in total from 2360MHz to 2510MHz, and can obviously meet the basic engineering requirements of the Bluetooth antenna.
Fig. 5 shows two cross-sectional views of the electric field E and the magnetic field H perpendicular to the maximum radiation direction, which mainly show the gain of the antenna in the radiation direction and the information of the energy radiation direction, and the views show the approximate basic omnidirectional radiation in the radiation direction corresponding to the bluetooth antenna of the present invention, so as to meet the requirements of the basic parameters of the engineering.
As shown in fig. 6, the radiation efficiency of the antenna is shown, and the average radiation efficiency can reach over 73% in the working frequency band of bluetooth, so as to meet the requirements of basic engineering parameters.
As shown in fig. 7 and 8, which are schematic diagrams of the 3D radiation direction of the antenna on the three-dimensional structure thereof, it can be clearly found that the bluetooth antenna related to the present invention has good radiation characteristics, the maximum gain value is 1.4dB, and the requirements of engineering basic parameters are met.
The present invention has been described in detail, and it should be understood that the detailed description and specific examples, while indicating the preferred embodiment of the utility model, are intended for purposes of illustration only and are not intended to limit the scope of the utility model.

Claims (10)

1. A novel Bluetooth ceramic bipolar antenna structure comprises a ceramic substrate and a metal patch, wherein the metal patch is arranged on the ceramic substrate to form a main body part of a Bluetooth antenna and is connected to a peripheral matching circuit; the peripheral matching circuit comprises a metal grounding plate and an impedance matching circuit, wherein the impedance matching circuit is connected with the metal grounding plate, and the peripheral matching circuit is characterized in that: the metal patches comprise a plurality of transverse metal patches transversely arranged along the ceramic substrate and a plurality of longitudinal metal patches longitudinally arranged along the ceramic substrate, and each transverse metal patch and each longitudinal metal patch are sequentially and vertically connected end to form a continuous positive and negative inverted V-shaped patch structure connected end to end; a feed element and a grounding element are respectively arranged at the left end and the right end of the ceramic substrate, one end of the patch structure is connected with the feed element, and the other end of the patch structure is connected with the grounding element; the feed element is connected with the impedance matching circuit through a feed transmission line, and the grounding element is connected with the metal grounding plate through a grounding transmission line; each horizontal metal patch and each vertical metal patch are arranged inside the ceramic substrate, two bottom surface metal patches are further arranged on the bottom surface of the ceramic substrate, one ends of the two bottom surface metal patches are connected with the grounding piece, and the other ends of the two bottom surface metal patches extend to the position close to the feed piece but are not connected with the feed piece.
2. The novel bluetooth ceramic dipole antenna structure of claim 1, wherein: the two bottom metal patches are parallel to each transverse metal patch and each longitudinal metal patch and are respectively positioned below the longitudinal metal patches on the front side and the rear side.
3. The novel bluetooth ceramic dipole antenna structure of claim 1, wherein: the feed part is a square feed copper column, and the grounding part is a square grounding copper column; two ends of the inverted V-shaped patch structure are respectively connected with the middle positions of the feed copper column and the grounding copper column through longitudinal metal patches.
4. The novel bluetooth ceramic dipole antenna structure of claim 1, wherein: the transverse metal patches are rectangular metal patches, the number of the transverse metal patches is 9, each transverse metal patch has the same width, the length of the transverse metal patches at two ends is half of that of the transverse metal patch in the middle, the adjacent transverse metal patches have the same interval, and the transverse metal patches are located on the same plane and are parallel to each other.
5. The novel bluetooth ceramic dipole antenna structure of claim 4, wherein: each longitudinal metal patch is a rectangular metal patch, the number of the metal patches is 10, and each longitudinal metal patch has the same width and length; the longitudinal metal patches are arranged into two parallel rows along the head and the tail of the transverse metal patches, and the longitudinal metal patches and the transverse metal patches are positioned on the same plane.
6. The novel bluetooth ceramic dipole antenna structure of claim 3, wherein: the impedance matching circuit comprises an FR4 dielectric plate and a pi-type impedance matching circuit, the main body part of the whole Bluetooth antenna, a feed transmission line and a grounding transmission line are arranged on the FR4 dielectric plate, and the FR4 dielectric plate is butted with the metal grounding plate; the feed transmission line connects the feed copper column with the pi-type impedance matching circuit, and the ground transmission line connects the ground copper column with the metal ground plate.
7. The novel bluetooth ceramic dipole antenna structure of claim 6, wherein: the pi-type impedance matching circuit comprises a first gap intercepted at the middle position of the feed transmission line, and a second gap and a third gap which are close to the left side and the right side of the first gap and are positioned on an FR4 dielectric slab, wherein the three gaps form a pi-type structure; RLC electronic elements are arranged in the three gaps respectively to achieve electrical connection between the Bluetooth antenna main body portion and the metal grounding plate, and therefore the impedance matching function of the antenna is achieved.
8. The novel bluetooth ceramic dipole antenna structure of claim 7, wherein: and a fourth gap is arranged between the tail end of the grounding transmission line and the metal grounding plate, and a 0201 inductor is welded in the fourth gap and is used for adjusting the resonant frequency of the Bluetooth ceramic bipolar antenna.
9. The novel bluetooth ceramic dipole antenna structure of claim 1, wherein: the size of the ceramic substrate is not more than 5.2mm multiplied by 2mm multiplied by 1.12 mm.
10. The novel bluetooth ceramic dipole antenna structure of claim 8, wherein: the width of the four gaps of the pi-shaped impedance matching circuit for welding the RLC electronic element and the 0201 inductor does not exceed the length of the RLC electronic element or the 0201 inductor in the pi-shaped impedance matching circuit.
CN202122567909.3U 2021-10-25 2021-10-25 Novel bluetooth ceramic bipolar antenna structure Active CN215989238U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122567909.3U CN215989238U (en) 2021-10-25 2021-10-25 Novel bluetooth ceramic bipolar antenna structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122567909.3U CN215989238U (en) 2021-10-25 2021-10-25 Novel bluetooth ceramic bipolar antenna structure

Publications (1)

Publication Number Publication Date
CN215989238U true CN215989238U (en) 2022-03-08

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Application Number Title Priority Date Filing Date
CN202122567909.3U Active CN215989238U (en) 2021-10-25 2021-10-25 Novel bluetooth ceramic bipolar antenna structure

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CN (1) CN215989238U (en)

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