CN215988701U

CN215988701U - Film coating platform for packaging wafer-level chip

Info

Publication number: CN215988701U
Application number: CN202122681246.8U
Authority: CN
Inventors: 潘潘; 李宝
Original assignee: Suzhou Weibang Electronics Co ltd
Current assignee: Suzhou Weibang Electronics Co ltd
Priority date: 2021-11-04
Filing date: 2021-11-04
Publication date: 2022-03-08
Anticipated expiration: 2031-11-04

Abstract

The utility model relates to a film coating table for packaging a wafer-level chip, which belongs to the technical field of wafer-level chips and comprises a coating table main body, wherein support columns penetrate through four corners of the upper surface of the coating table main body, cushion blocks are fixedly connected to the bottom ends of the support columns, an installation groove is formed in one side of each support column, a rack is arranged in the installation groove and fixedly installed on the support columns, a gear is meshed and connected to the front surface of each rack, and a connecting shaft is fixedly connected to one side of each gear. Install the support column in folded sheet four corners department, the rack, the gear, connecting axle and turning block through the design and be convenient for adjust the device's height, support the device through the cushion of design, when needs are adjusted, rotatable turning block drives the support column and reciprocates to drive the cushion and reciprocate, then utilize stop gear to fix the support column, then can realize the regulation to the device height, its easy operation, use step is few, has better development prospect.

Description

Film coating platform for packaging wafer-level chip

Technical Field

The utility model relates to the technical field of wafer-level chips, in particular to a film coating platform for packaging a wafer-level chip.

Background

Chips are a way to miniaturize circuits in electronics and are often manufactured on the surface of a semiconductor wafer, and chip packaging film coating is a continuous solid film formed by firmly attaching a colloid material and the chips, in the process, the operation is required to be carried out on a coating table, but the existing coating table has many defects.

For example, although the application of the epoxy resin film coating platform for wafer level chip packaging under the publication number CN101837335A solves the problems that the wafer can be conveniently rotated from the side surface or the back surface of the wafer and the chip can be conveniently taken down from the back surface of the wafer, the work efficiency of the gluing process is improved, and the wafer is prevented from contacting the glued front surface of the wafer due to the rotation of the wafer and the taking down of the wafer, so that the gluing quality is effectively improved, the problem that the height of the existing film coating platform for wafer level chip packaging cannot be adjusted in the using process, so that the operation of workers or equipment is inconvenient during coating, and the workers need to bend down or the coating equipment needs to adjust the height is still solved.

Disclosure of Invention

In order to solve the problems, the utility model provides a film coating table for wafer-level chip packaging, and provides a problem that the height of the existing film coating table for wafer-level chip packaging cannot be adjusted in the using process, so that the operation of workers or equipment is inconvenient in coating, and the workers need to bend down to operate or the height of the coating equipment needs to be adjusted.

The technical scheme of the utility model is as follows:

the utility model provides a wafer level is film coating platform for chip package, includes the coating platform main part, the upper surface four corners of coating platform main part all runs through there is the support column, the bottom fixedly connected with cushion of support column, the mounting groove has been seted up to one side of support column, the inside of mounting groove is provided with the rack, rack fixed mounting is on the support column, the meshing of the front surface of rack is connected with the gear, one side fixedly connected with connecting axle of gear, the other end fixedly connected with turning block of connecting axle, one side of support column still is provided with stop gear, stop gear is in the bottom of connecting axle.

In a further technical scheme, the limiting mechanism comprises a limiting column, a reset spring and a moving block are arranged on the outer surface of the limiting column, the other end of the limiting column is fixedly connected with a poking block, one end of the reset spring is fixedly connected to the moving block, the other end of the reset spring is fixedly connected to the coating table main body, and a plurality of limiting holes are formed in one side of the supporting column.

In a further technical scheme, one side fixedly connected with spacing slider of support column, the spout has been seted up to the inside of coating platform main part and the one side that is located the support column, spacing slider can slide from top to bottom in the spout.

In a further technical scheme, the front surface top and the rear surface top of coating platform main part all are provided with the folded sheet, the lower surface both sides fixedly connected with hinge of folded sheet, the folded sheet is through two hinges and coating platform main part swing joint, fixed establishment is installed to the both sides of folded sheet.

In a further technical scheme, the fixing mechanism comprises a fixing block, the inner side of the fixing block is fixedly connected to the coating table main body, a threaded rod penetrates through the middle position of the fixing block, and a driving block is fixedly connected to the other end of the threaded rod.

In a further technical scheme, thread grooves are formed in the two sides of the folding plate, threads on the inner wall of each thread groove are matched with threads on the outer surface of the corresponding threaded rod, and one end of each threaded rod extends into the corresponding thread groove.

The utility model has the beneficial effects that:

1. the height of the device can be conveniently adjusted through the designed support columns, racks, gears, connecting shafts and rotating blocks which are arranged at the four corners of the folding plate, the device is supported through the designed cushion blocks, when the height needs to be adjusted, the rotating blocks can be rotated to drive the support columns to move up and down, so that the cushion blocks are driven to move up and down, and then the support columns are fixed through the limiting mechanisms, so that the height of the device can be adjusted, the operation is simple, the use steps are few, and the device has a good development prospect;

2. install folding plate, hinge, threaded rod, drive block and the fixed block at coating platform main part front surface and rear surface through the design and be convenient for expand the mesa that the device can place article, improved the device's parking space greatly, can fold when not using simultaneously, prevent to occupy more space, its flexibility is high, and is folding convenient, and it is comparatively firm to expand the after-fixing, can place heavier article.

Drawings

FIG. 1 is a schematic diagram of the overall structure of an embodiment of the present invention;

FIG. 2 is a schematic diagram of a side view of a support column according to an embodiment of the present invention;

FIG. 3 is an enlarged schematic view of the structure at A in FIG. 1 according to an embodiment of the present invention;

fig. 4 is an enlarged schematic structural diagram at B in fig. 1 according to an embodiment of the present invention.

Description of reference numerals:

1. a coating table main body; 2. folding the board; 3. a support pillar; 4. a limiting slide block; 5. rotating the block; 6. cushion blocks; 7. a hinge; 8. a rack; 9. a gear; 10. a connecting shaft; 11. a limiting column; 12. a return spring; 13. a moving block; 14. a shifting block; 15. a drive block; 16. a fixed block; 17. a threaded rod; 18. a thread groove.

Detailed Description

The embodiments of the present invention will be further described with reference to the accompanying drawings.

Example (b):

as shown in fig. 1-4, a film coating platform for wafer level chip packaging comprises a coating platform main body 1, wherein support columns 3 penetrate four corners of the upper surface of the coating platform main body 1, a cushion block 6 is fixedly connected to the bottom ends of the support columns 3, a mounting groove is formed in one side of each support column 3, a rack 8 is arranged inside the mounting groove, the rack 8 is fixedly mounted on each support column 3, a gear 9 is meshed and connected to the front surface of the rack 8, a connecting shaft 10 is fixedly connected to one side of the gear 9, a rotating block 5 is fixedly connected to the other end of the connecting shaft 10, a limiting mechanism is further arranged at one side of each support column 3 and is located at the bottom end of the connecting shaft 10, the limiting mechanism comprises a limiting column 11, a reset spring 12 and a moving block 13 are arranged on the outer surface of the limiting column 11, a poking block 14 is fixedly connected to the other end of the limiting column 11, one end of the reset spring 12 is fixedly connected to the moving block 13, the other end of the reset spring 12 is fixedly connected to the coating table main body 1, and one side of the support column 3 is provided with a plurality of limiting holes.

The working principle of the technical scheme is as follows:

when the height of the device needs to be adjusted, the dial block 14 can be pulled, the dial block 14 drives the limit post 11 to move, meanwhile, the limit post 11 can drive the moving block 13 to move and compress the reset spring 12, so that the reset spring 12 has certain elastic potential energy until the limit post 11 moves to a position where the limit hole does not penetrate through, then the rotating block 5 is rotated, the rotating block 5 drives the gear 9 to rotate through the connecting shaft 10, because the rear surface of the gear 9 is meshed and connected with the rack 8, the gear 9 drives the rack 8 to move upwards or downwards when rotating, the rack 8 drives the support post 3 to move downwards or upwards, when the support post 3 moves to a specified position, the rotating block 5 stops rotating, then the dial block 14 is released, the limit post 11 can move under the action of the elastic potential energy of the reset spring 12 and penetrate through the corresponding limit hole, and the support post 3 cannot move upwards or downwards, the device can now be supported by means of the spacer 6.

In another embodiment, as shown in fig. 1, a limiting slide block 4 is fixedly connected to one side of the supporting column 3, a sliding groove is formed in the coating table main body 1 and located at one side of the supporting column 3, and the limiting slide block 4 can slide up and down in the sliding groove.

The spout of seting up is convenient for spacing slider 4's removal, can drive spacing slider 4 when support column 3 removes and remove, and spacing slider 4 plays stabilizing effect to the removal of support column 3.

In another embodiment, as shown in fig. 1 and 4, the front surface top end and the rear surface top end of the coating table main body 1 are both provided with a folding plate 2, two hinges 7 are fixedly connected to two sides of the lower surface of the folding plate 2, the folding plate 2 is movably connected to the coating table main body 1 through the two hinges 7, fixing mechanisms are installed on two sides of the folding plate 2, each fixing mechanism comprises a fixing block 16, the inner side of each fixing block 16 is fixedly connected to the coating table main body 1, a threaded rod 17 penetrates through the middle position of each fixing block 16, a driving block 15 is fixedly connected to the other end of each threaded rod 17, thread grooves 18 are formed in two sides of the folding plate 2, threads on the inner wall of each thread groove 18 are matched with outer surface threads of the corresponding threaded rod 17, and one end of each threaded rod 17 extends into the corresponding thread groove 18.

Two folded sheet 2 of design can increase the mesa that the device placed article, shelter from when accomodating as needs to folded sheet 2, can rotate drive block 15 earlier, drive block 15 drives threaded rod 17 and rotates, because the screw thread of the 18 inner walls of thread groove and the surface screw thread looks adaptation of threaded rod 17, then threaded rod 17 can move to the outside simultaneously when rotating, make the one end of threaded rod 17 not be in the inside of thread groove 18, then rotate another drive block 15 and make the one end of another threaded rod 17 not be in the inside of thread groove 18, can fold folded sheet 2 under the effect of two hinges 7 next.

The above examples only express the specific embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention.

Claims

1. A wafer level chip package is with film coating platform, includes coating platform main part (1), its characterized in that: support column (3) have all been run through in the upper surface four corners of coating platform main part (1), bottom fixedly connected with cushion (6) of support column (3), the mounting groove has been seted up to one side of support column (3), the inside of mounting groove is provided with rack (8), rack (8) fixed mounting is on support column (3), the meshing of the front surface of rack (8) is connected with gear (9), one side fixedly connected with connecting axle (10) of gear (9), the other end fixedly connected with turning block (5) of connecting axle (10), one side of support column (3) still is provided with stop gear, stop gear is in the bottom of connecting axle (10).

2. The film coating station for wafer level chip packaging according to claim 1, wherein: the limiting mechanism comprises a limiting column (11), a reset spring (12) and a moving block (13) are arranged on the outer surface of the limiting column (11), the other end of the limiting column (11) is fixedly connected with a shifting block (14), one end of the reset spring (12) is fixedly connected to the moving block (13), the other end of the reset spring (12) is fixedly connected to the coating table main body (1), and a plurality of limiting holes are formed in one side of the supporting column (3).

3. The film coating station for wafer level chip packaging according to claim 1, wherein: one side fixedly connected with spacing slider (4) of support column (3), the spout has been seted up to the inside of coating platform main part (1) and the one side that is located support column (3), spacing slider (4) can slide from top to bottom in the spout.

4. The film coating station for wafer level chip packaging according to claim 1, wherein: coating platform main part (1)'s front surface top and rear surface top all are provided with folded sheet (2), the lower surface both sides fixedly connected with hinge (7) of folded sheet (2), folded sheet (2) are through two hinge (7) and coating platform main part (1) swing joint, fixed establishment is installed to the both sides of folded sheet (2).

5. The film coating station for wafer level chip packaging according to claim 4, wherein: the fixing mechanism comprises a fixing block (16), the inner side of the fixing block (16) is fixedly connected to the coating table main body (1), a threaded rod (17) penetrates through the middle position of the fixing block (16), and the other end of the threaded rod (17) is fixedly connected with a driving block (15).

6. The film coating station for wafer level chip packaging according to claim 5, wherein: thread groove (18) have all been seted up to the both sides of folded sheet (2), the screw thread of thread groove (18) inner wall and the surface screw thread looks adaptation of threaded rod (17), the one end of threaded rod (17) extends to in the thread groove (18).