CN215986615U - Optical module and equipment panel - Google Patents

Abstract

The embodiment of the application discloses optical module and equipment panel includes: a housing assembly; a circuit board disposed within the housing assembly; a laser and electrical interface in electrical connection with the circuit board, the electrical interface configured to supply power to the laser; an optical interface coupled with the laser; and a heat transfer structure through which the laser radiates heat to the housing assembly; the electrical interface and the optical interface are disposed at the same end of the housing assembly. The optical module and the equipment panel have the advantages of high optical interface coupling precision and good heat dissipation.

Description

Optical module and equipment panel

Technical Field

The present application relates to the field of optical communications, and in particular, to an optical module and an apparatus panel.

Background

The optical module is an optical-electrical signal interface device which is very important in optical fiber communication.

One end of the traditional optical module is used as an optical interface to be connected with an external optical fiber, and the other end of the traditional optical module is used as an electrical interface to be connected with external communication equipment. The optical module can convert optical signals and electric signals. The traditional optical module is divided into three parts, namely a front end, a middle end and a rear end. Wherein the front end comprises an optical interface facing the front end; the middle end comprises functional components such as a laser chip, a receiver chip, a wave combining and/or distributing component and the like; the back end includes an electrical interface for interconnecting electrical signals with the device.

In a communication docking system, the requirement of optical signal docking accuracy is far higher than the electrical signal docking accuracy. In the process of plugging and unplugging the traditional optical module, an electrical interface is firstly butted, an optical interface with better precision requirement is arranged in an additional operation for secondary butt joint, and the optical interface is fixed and can not be adjusted, so that the coupling precision of the optical interface and equipment is often too low, the laser generates heat seriously and the like, and the comprehensive performance of the optical module is reduced.

Disclosure of Invention

In view of the above, embodiments of the present application are directed to providing an optical module and a device panel to solve the problems of low coupling precision and heat dissipation of an optical interface and a device.

In order to achieve the above purpose, the technical solution of the embodiment of the present application is implemented as follows:

a light module, comprising: a housing assembly; a circuit board disposed within the housing assembly; a laser and electrical interface in electrical connection with the circuit board, the electrical interface configured to supply power to the laser; an optical interface coupled with the laser; and a heat transfer structure through which the laser radiates heat to the housing assembly; the electrical interface and the optical interface are disposed at the same end of the housing assembly.

Furthermore, the laser is a TO packaging type semiconductor laser, the laser comprises a base, a pin and a tube body arranged on one side of the base, and the pin is arranged on one side of the base, which is far away from the tube body, and is connected with the circuit board; the heat transfer structure comprises a heat dissipation tile, and the heat dissipation tile is arranged on the outer periphery side of the pipe body.

Further, the heat transfer structure comprises heat-conducting glue, and the heat-conducting glue is filled among the heat dissipation tile, the pipe body and the shell assembly.

Further, the shell assembly comprises a lower shell and an upper shell covering the lower shell; the lower shell and the upper shell are surrounded to form an accommodating cavity with an opening at one axial end, and the electrical interface and the optical interface are arranged in the opening; one side of keeping away from on the last casing lower casing is formed with a plurality of rectangle tooth's sockets, the setting of heat dissipation tile is in the body with between the last casing.

Further, a supporting platform for supporting the circuit board is formed on the lower shell; the heat transfer structure comprises a heat conduction silica gel sheet, and the heat conduction silica gel sheet is arranged between the supporting platform and the circuit board.

Further, the optical module comprises a plurality of lasers, and the lasers are arranged in two rows in a staggered mode.

Further, the electric interface is a gold finger integrally formed at one end of the circuit board; or the electric interface is a contact pin, is fixedly arranged in the shell assembly and is electrically connected with the circuit board through a flexible soft belt.

Furthermore, the electrical interface comprises a fixed seat and a floating piece, the fixed seat is fixed relative to the circuit board, the floating piece is movably arranged on the fixed seat, the floating piece is electrically connected with the circuit board through a flexible soft belt, and the floating piece can float relative to the circuit board; the floating piece is used for supplying power to the laser.

Further, the electrical interface includes the elastic component, the floating component inserts and establishes in the fixing base, the elastic component is arranged the floating component with between the fixing base, the terminal surface of floating component is scalable for the fixing base.

An apparatus panel includes a card cage, an optical connector, and an electrical connection portion; the card cage is provided with an accommodating space capable of accommodating the optical module, and a bulge for heat dissipation is formed on the outer wall of the card cage; the optical connector is arranged on the card cage and used for being coupled with the optical interface; the electrical connection is disposed within the card cage for detachable connection with the electrical interface.

An optical module and an equipment panel in the embodiment of the application are provided with a shell component, a circuit board, a laser, an electrical interface, an optical interface and a heat transfer structure; the heat transfer structure is arranged in the shell component, and heat emitted by the laser can be quickly transferred to the heat transfer structure and quickly transferred to the shell component through a large surface area, so that the heat dissipation of the laser is good, and the temperature of a working environment is ensured to be in a proper range; the electrical interface and the optical interface are arranged at the same end of the shell component, so that the optical interface and the electrical interface can be synchronously inserted into the optical connector and the electrical connector of the panel, the connection between the optical module and the panel can be completed quickly, the optical module is prevented from being plugged on the panel for many times, the wiring time and cost are reduced, and the influence of secondary plugging on the coupling precision of the optical interface is avoided. And finally, the optical module has good heat dissipation performance, high coupling precision of the optical interface and good comprehensive performance.

Drawings

Fig. 1 is a schematic structural diagram of an optical module according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of the optical module in fig. 1, in which the upper housing is omitted;

FIG. 3 is one embodiment of the optical and electrical interfaces of FIG. 2;

FIG. 4 is a side view of FIG. 3;

FIG. 5 is another embodiment of the optical and electrical interfaces of FIG. 2;

FIG. 6 is a side view of FIG. 5;

fig. 7 is a schematic structural diagram of an optical module according to another embodiment of the present application, in which a circuit board and an upper housing are omitted;

fig. 8 is a schematic structural diagram of an optical module according to still another embodiment of the present application;

FIG. 9 is an exploded view of the assembly of the optical module and the faceplate of the present application, wherein the upper housing of the shell assembly is omitted;

FIG. 10 is one embodiment of an electrical interface of the present application;

FIG. 11 is a schematic diagram of the electrical interface shown in FIG. 10 from another perspective;

fig. 12 is a sectional view a-a of fig. 11.

Detailed Description

It should be noted that, in the case of conflict, the technical features in the examples and examples of the present application may be combined with each other, and the detailed description in the specific embodiments should be interpreted as an explanation of the present application and should not be construed as an improper limitation of the present application.

In the description of the embodiments of the present application, the "up", "down", "left", "right", "front", "back" orientation or positional relationship is based on the orientation or positional relationship shown in fig. 2, it is to be understood that these orientation terms are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be considered as limiting the present application.

As shown in fig. 1 to 12, a light module includes: a housing assembly 1, a circuit board 5, a laser 4, an electrical interface 3, an optical interface 2, and a heat transfer structure 6.

The shell assembly 1 comprises a lower shell 11 and an upper shell 12 covered on the lower shell 11; the lower housing 11 and the upper housing 12 enclose an accommodating cavity 14 with an opening 13 at one end in the axial direction, and the accommodating cavity 14 is used for accommodating other components. The circuit board 5 is arranged in the housing assembly 1, in particular, the circuit board 5 can be arranged in the receiving chamber 14 after assembly. The outer side of the housing assembly 1 may be inserted into and mated with an external optical fiber, a panel of an optical communication device, and the like, so as to implement the functions of photoelectric conversion of the optical module and transmitting/receiving optical signals.

Wherein the electrical interface 3 is electrically connected with the circuit board 5. It should be understood that the electrical connection here may refer to the electrical interface 3 and the circuit board 5 being interfered by copper foil, wire or metal to realize the electrical energy transmission or the electrical signal transmission between the two.

The laser 4 is typically arranged on a circuit board 5 and the electrical interface 3 is configured to supply electrical power to the laser 4, i.e. the electrical interface 3 supplies electrical power to the laser 4 via the circuit board 5 to excite an optical signal. As known to those skilled in the art, in the field of optical devices, an optical module has an independent package, and the circuit board 5 integrates necessary components for performing optical-electrical signal conversion.

For example, components such as an optical modulator (not shown), a multiplexer (not shown), a demultiplexer (not shown), and the like may be integrated on the circuit board 5. Wherein the optical modulator is configured to apply an electrical signal to the optical energy to output a signal-bearing optical signal. In particular, electrical signals are loaded into optical energy to form a particular form of optical signal, which may change its phase, amplitude, etc. The optical signals with different wavelengths can be combined by the multiplexer to form a path of optical signal. One path of optical signal containing multiple wavelengths is split into multiple optical signals with single wavelength by a demultiplexer.

The optical interface 2 is coupled to a laser 4; the optical interface 2 is used for outputting optical energy or optical signals emitted by the laser 4.

The laser 4 can be a TO packaging type semiconductor laser, and has the advantages of compact structure and strong reliability.

The heat transfer structure 6 is arranged in the shell component 1, and the laser 4 radiates heat to the shell component 1 through the heat transfer structure 6; specifically, the laser 4 includes a base 41, pins 43, and a tube 42 disposed on one side of the base 41, and the pins 43 are disposed on one side of the base 41 away from the tube 42 and connected to the circuit board 5; the bottom end of the tube 42 has a chip (not shown), an optical fiber 45 extends from one end of the tube 42 away from the base 41, the end connection of the optical fiber 45 is coupled with the optical interface 2, the electrical interface 3 provides electrical energy to the laser 4 through the circuit board 5, the chip receives the electrical energy sent by the circuit board 5 to the laser 4 and converts the electrical energy into light, and the optical fiber 45 further transmits the light to the optical interface 2. The heat transfer structure 6 is tightly attached to the laser 4, the heat transfer structure 6 is a good heat conductor and has a large surface area, heat emitted by the laser 4 can be rapidly transferred to the heat transfer structure 6 and is rapidly transferred to the shell assembly 1 through the large surface area, so that the heat dissipation of the laser 4 is good, and the temperature of a working environment is ensured to be within a proper range.

The electrical interface 3 and the optical interface 2 are arranged at the same end of the housing component 1. In particular, the electrical interface 3 as well as the optical interface 2 are arranged in the opening 13. In the opening 13, the electrical interface 3 and the optical interface 2 face in the same direction. It will be appreciated by those skilled in the art that both the optical interface 2 and the electrical interface 3 have an opening direction for interfacing with other devices.

The optical interface 2 and the electrical interface 3 are used for being simultaneously plugged into an optical connector 82 (mentioned below) and an electrical connector 83 (mentioned below) of the panel, or the optical interface 2 and the electrical interface 3 are used for being simultaneously unplugged from the optical connector 82 and the electrical connector 83 of the panel, so that the connection between the optical module and the panel is completed quickly, the optical module is prevented from being plugged and unplugged on the panel for multiple times, and the wiring time and cost are reduced. It is understood that the electrical interface 3 and the optical interface 2 are inserted into the optical connector 82 and the electrical connector 83 of the panel; both are the first plugging, so that the influence of the second plugging on the coupling precision of the optical interface 2 is avoided. Therefore, on one hand, the heat dissipation is controlled, on the other hand, the coupling precision of the optical interface 2 is improved, and the comprehensive performance of the optical module is good.

In one possible embodiment, as shown in fig. 1 and 2, the heat transfer structure 6 includes heat dissipation tiles 61, and the heat dissipation tiles 61 are disposed on the outer peripheral side of the pipe body 42. The heat dissipation tile 61 may be an arc-shaped metal block, and is made of a good heat conductor. The cambered surface size of heat dissipation tile 61 should match with the peripheral size of the body 42 of laser 4 to make heat dissipation tile 61 and body 42 can closely laminate, the heat that body 42 gived off can transmit to heat dissipation tile 61 rapidly on, heat dissipation tile 61 has great surface area, and heat conductivility is good, again with heat transfer to shell subassembly 1 in, realize the heat dissipation.

The heat transfer structure 6 includes a heat conductive adhesive (not shown), which can be filled between the heat dissipation tile 61, the pipe 42 and the housing assembly 1, and the gap is filled with the heat conductive adhesive with better heat transfer performance, so that the heat transfer performance between the heat transfer structure 6 and the laser 4 and between the heat transfer structure and the housing assembly 1 is better. The heat-conducting glue can be selected to be heat-conducting silicone grease or a silicone sheet as required.

In one possible embodiment, as shown in fig. 1 and 2, and fig. 7 and 8, a plurality of rectangular slots 15 are formed on the upper housing 12 on a side away from the lower housing 11, and heat dissipation fins 61 are disposed between the tube 42 and the upper housing 12. The heat conducting glue is filled between the heat dissipation tile 61 and the upper shell 12, between the tube 42 and the heat dissipation tile 61, and between the lower shell 11 and the tube 42. No gap is formed between the tube 42 and the heat dissipation tile 61, so that the heat transfer performance is good, the heat emitted by the laser 4 is preferentially transferred to the upper shell 12 which is relatively close to the upper shell through the heat dissipation tile 61, the rectangular tooth grooves 15 on the upper shell 12 can play a role in increasing the surface area, the heat is dissipated from the upper shell 12 to the environment, and the heat dissipation performance of the optical module is good.

A supporting platform 16 for supporting the circuit board 5 is formed on the lower shell 11; the heat transfer structure 6 includes a heat conductive silicone sheet 63, and the heat conductive silicone sheet 63 is disposed between the supporting platform 16 and the circuit board 5 to realize rapid heat dissipation.

In a possible embodiment, as shown in fig. 1 to 12, the optical module includes one, two or more lasers 4, and the lasers 4 are arranged in two rows and offset. Namely, the plurality of lasers 4 can be staggered in the front-back direction or vertically staggered in the vertical direction; the structure is more compact, and the space of the accommodating cavity 14 is fully utilized. The heat generated by the plurality of lasers 4 is transferred to the housing assembly 1 through the heat transfer structure 6, and the heat dissipation is finally completed.

In the non-limiting embodiment illustrated in FIG. 8, the electrical interface 3 is a gold finger integrally formed on one end of the circuit board 5; the structure is simple and the circuit on the circuit board 5 is convenient to design; the electrical connection portion 83 may be a metal dome jack, and when the optical interface 2 and the optical connector 82 complete coupling and docking, the electrical interface 3 is correspondingly inserted into the electrical connection portion 83 to achieve circuit communication. The golden fingers can be arranged on two sides of the ferrule 25 according to requirements, and can also be arranged above and/or below the ferrule 25, specifically based on design.

In the non-limiting embodiment illustrated in fig. 2 to 6, the electrical interface 3 is a pin, which is simple in structure, and the electrical interface 3 is fixedly disposed in the housing assembly 1 and electrically connected to the circuit board 5 through the flexible tape 51. The electrical connection part 83 may be a female plug corresponding to the electrical interface 3, and the electrical interface 3 is correspondingly inserted into the electrical connection part 83 to realize the communication of the circuit while the optical interface 2 and the optical connector 82 complete the coupling and docking. When the electrical interface 3 and the electrical connection portion 83 are plugged and unplugged to generate mechanical stress, the flexible soft tape 51 can eliminate the mechanical stress of the electrical interface 3 through flexible deformation under the condition of keeping the electrical connection between the electrical interface 3 and the electrical connection portion 83, so that the mechanical stress is prevented from being transmitted to the optical interface 2 through the circuit board 5, and the coupling precision of the optical interface 2 and the optical connector 82 is improved.

The electrical interface 3 is a pin and is fixedly arranged with the shell assembly 1, the electrical interface 3 can be designed into a plurality of or one, the arranged position can be arranged on two sides of the ferrule 25 according to requirements, and can also be arranged above and/or below the ferrule 25, specifically, the design is the standard.

In the non-limiting embodiment illustrated in fig. 2 to 6 and 10 to 12, the electrical interface 3 includes a fixed base 31 and a floating member 32, the fixed base 31 is fixed relative to the circuit board 5, the floating member 32 is movably disposed on the fixed base 31, the floating member 32 is electrically connected to the circuit board 5 through a flexible soft tape 51, and the floating member 32 can float relative to the circuit board 5; the floating here means that the floating member 32 can be extended and contracted back and forth, swung left and right, or horizontally offset within a certain range with respect to the circuit board 5 without departing from the restriction of the fixed base 31.

The optical module is inserted in the panel, the floating piece 32 is used for supplying power to the laser 4, and the floating piece 32 provides electric energy for the laser 4 through the circuit board 5 so as to excite an optical signal. The mechanical stress generated by the insertion and extraction of the electrical connection portion 83 and the floating member 32 is released by the floating of the floating member 32 itself, so that the optical interface 2 can be coupled with the optical connector 82 with the external interference as small as possible, and finally the purpose of improving the coupling accuracy of the optical interface 2 is achieved.

The optical module comprises a flexible soft strip 51. The floating element 32 is electrically connected with the circuit board 5 through the flexible soft belt 51, when the electrical interface 3 and the electrical connection part 83 are plugged and pulled to generate mechanical stress, the flexible soft belt 51 can eliminate the mechanical stress of the electrical interface 3 through flexible deformation under the condition of keeping the electrical connection between the electrical interface 3 and the electrical connection part, so that the mechanical stress is prevented from being transmitted to the optical interface 2 through the circuit board 5, and the coupling precision of the optical interface 2 and the optical connector 82 is improved.

The flexible soft tape 51 may be a flexible circuit board according to design requirements; can also be a multi-core flat cable; or a plurality of flexible wires. The cost is low, the conductivity is stable, and the mechanical stress of the electrical interface 3 can be eliminated through self effective deformation.

One possible embodiment, as shown in fig. 2 and 9 to 12, is that the electrical interface 3 comprises an elastic element 33, the floating element 32 is inserted in the fixed seat 31, the elastic element 33 is arranged between the floating element 32 and the fixed seat 31, and the end surface of the floating element 32 is retractable with respect to the fixed seat 31. That is, the end face of the floating member 32 is retractable with respect to the circuit board 5; therefore, a male plug is formed, the electric connection portion 83 can be set as a female jack according to needs, the floating piece 32 is inserted into the electric connection portion 83 in the form of the male plug and the female plug to complete connection of the two, and the floating piece 32 is subjected to the conditions of front-back stretching, left-right swinging, horizontal offset and the like due to corresponding mechanical stress, so that the mechanical stress is prevented from being transmitted to the optical interface 2, and the coupling precision of the optical interface 2 is finally improved.

Specifically, as shown in fig. 10 to 12, the floating member 32 is a hollow cylinder with an open end, the fixing seat 31 is formed with a positioning hole 311, an inner diameter of the positioning hole 311 is larger than an outer diameter of the floating member 32, the positioning hole 311 and the positioning hole are in clearance fit to form a clearance C, where C is greater than or equal to 0.01mm and less than or equal to 0.5mm, so that the floating member 32 can vertically shift up and down or horizontally shift left and right according to mechanical stress generated when being inserted into the electrical connector 82; the floating piece 32 can also swing left and right and up and down within the range of the angle B by taking one end of the floating piece as a fulcrum, B is more than or equal to 1 degree and less than or equal to 10 degrees, and under the condition of keeping the floating piece 32 to be electrically connected with the circuit board 5, the mechanical stress is prevented from being transmitted to the optical interface 2, and the coupling precision of the optical interface 2 is finally improved.

As shown in fig. 9, an apparatus panel includes a card cage 84, an optical connector 82, and an electrical connection portion 83; the card cage 84 has an accommodating space 85 capable of accommodating the housing assembly 1 of the optical module, and a protrusion 841 is formed on an outer wall of the card cage 84 to increase a surface area of the card cage 84, so that heat emitted by the optical module can be rapidly dissipated to the environment. The optical connector 82 is provided in the card cage 84 for coupling with the optical interface 2; an electrical connection 83 is provided within the card cage 84 for detachable connection with the electrical interface 3.

The equipment panel is typically a panel of an optical communication device. In the specific working process, the optical module is inserted into the card cage 84, the equipment panel supplies power to the optical module through the electric connection part 83, the electric interface 3 transmits the received electric energy to the circuit board 5 and then to the laser 4 so as to excite the laser 4 to emit an optical signal, and the optical signal is transmitted to the optical connector 82 through the optical interface 2 and enters the equipment panel; the optical communication device may use the optical signal as its own signal source according to different application scenarios, or may separate an optical fiber from the device panel to transmit the optical signal to other devices.

The various embodiments/implementations provided herein may be combined with each other without contradiction.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims (10)

1. A light module, comprising:

a shell assembly (1);

a circuit board (5), the circuit board (5) being disposed within the housing assembly (1);

a laser (4) and an electrical interface (3), the electrical interface (3) being electrically connected with the circuit board (5), the electrical interface (3) being configured to supply power to the laser (4);

an optical interface (2), the optical interface (2) being coupled with the laser (4);

and a heat transfer structure (6), through which the laser (4) radiates heat to the housing assembly (1);

the electrical interface (3) and the optical interface (2) are arranged at the same end of the housing assembly (1).

2. An optical module as claimed in claim 1, characterized in that the laser (4) is a semiconductor laser of the TO package type, the laser (4) comprising a base (41), pins (43) and a tube (42) arranged on one side of the base (41), the pins (43) being arranged on the side of the base (41) facing away from the tube (42) and being connected TO the circuit board (5);

the heat transfer structure (6) includes a heat dissipation shoe (61), and the heat dissipation shoe (61) is disposed on the outer peripheral side of the pipe body (42).

3. Optical module according to claim 2, characterized in that the heat transfer structure (6) comprises a thermally conductive glue filled between the heat dissipation tile (61), the tube body (42) and the housing assembly (1).

4. The light module according to claim 2, characterized in that the housing assembly (1) comprises a lower housing (11) and an upper housing (12) covering the lower housing (11); the lower shell (11) and the upper shell (12) are enclosed to form an accommodating cavity (14) with an opening (13) at one end along the axial direction, and the electrical interface (3) and the optical interface (2) are arranged in the opening (13);

a plurality of rectangular tooth grooves (15) are formed in one side, far away from the lower shell (11), of the upper shell (12), and the heat dissipation tile (61) is arranged between the pipe body (42) and the upper shell (12).

5. The light module according to claim 4, characterized in that the lower housing (11) has formed thereon a support platform (16) for supporting the circuit board (5);

the heat transfer structure (6) comprises a heat-conducting silica gel sheet (63), and the heat-conducting silica gel sheet (63) is arranged between the supporting platform (16) and the circuit board (5).

6. The light module according to any of claims 1 to 4, characterized in that it comprises a plurality of said lasers (4), said plurality of lasers (4) being formed in two rows and being arranged offset.

7. The optical module according to any one of claims 1 to 4, characterized in that the electrical interface (3) is a gold finger integrally formed at one end of the circuit board (5); or the like, or, alternatively,

the electric interface (3) is a contact pin, and the electric interface (3) is fixedly arranged in the shell component (1) and is electrically connected with the circuit board (5) through a flexible soft belt (51).

8. The optical module according to any one of claims 1 to 4, wherein the electrical interface (3) comprises a fixed base (31) and a floating member (32), the fixed base (31) is fixed relative to the circuit board (5), the floating member (32) is movably arranged on the fixed base (31), the floating member (32) is electrically connected with the circuit board (5) through a flexible soft tape (51), and the floating member (32) can float relative to the circuit board (5); the float (32) is used for supplying power to the laser (4).

9. Optical module according to claim 8, characterized in that the electrical interface (3) comprises an elastic member (33), the floating member (32) being interposed in the fixed seat (31), the elastic member (33) being arranged between the floating member (32) and the fixed seat (31), the end face of the floating member (32) being retractable with respect to the fixed seat (31).

10. An equipment panel characterized by comprising a card cage (84), an optical connector (82), and an electrical connection section (83); the card cage (84) has an accommodating space (85) capable of accommodating the optical module according to any one of claims 1 to 9, and a protrusion (841) for heat dissipation is formed on an outer wall of the card cage (84);

the optical connector (82) is arranged at the card cage (84) for coupling with the optical interface (2); the electrical connection (83) is arranged in the card cage (84) for detachable connection with the electrical interface (3).

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