CN215976038U

CN215976038U - Plating solution circulating device for IC (integrated circuit) support plate chemical plating

Info

Publication number: CN215976038U
Application number: CN202121733961.5U
Authority: CN
Inventors: 黄雪理
Original assignee: Shenzhen Zhien Core Electronic Technology Co ltd
Current assignee: Shenzhen Zhien Core Electronic Technology Co ltd
Priority date: 2021-07-28
Filing date: 2021-07-28
Publication date: 2022-03-08
Anticipated expiration: 2031-07-28

Abstract

The utility model relates to the technical field of chemical plating, in particular to a plating solution circulating device for IC (integrated circuit) support plate chemical plating, which comprises a plating solution cylinder, a bottom frame and a support frame, wherein a filtrate plate is fixedly connected at the middle position inside the plating solution cylinder, the inner side of the filtrate plate is hermetically connected with a heating pipe, the lower end of the plating solution cylinder is hermetically connected with a circulating pipe, the upper end of the circulating pipe is hermetically connected with a plating solution pump, the upper side inside the plating solution cylinder is slidably connected with a clamping plate, the left side inside the clamping plate is slidably connected with a movable plate, and the left end of the movable plate is rotatably connected with a threaded shaft. The use cost of the plating solution of the chemical plating is reduced.

Description

Plating solution circulating device for IC (integrated circuit) support plate chemical plating

Technical Field

The utility model relates to the technical field of chemical plating, in particular to a plating solution circulating device for IC carrier plate chemical plating.

Background

With the development of society, the application of chemical plating is increasingly wide, chemical plating is a novel metal surface treatment technology, the technology is increasingly concerned by people with simple and convenient process, energy conservation and environmental protection, the chemical plating has wide application range, the gold plating layer is uniform, the decoration is good, the corrosion resistance and the service life of a product can be improved in the aspect of protection performance, and the special functions of wear resistance, conductivity, lubricating performance and the like of a machined part can be improved in the aspect of functionality.

In the prior art, the plating solution can not be fully recycled in the plating solution process for the chemical plating of the IC carrier plate, so that the waste of the plating solution is easily caused, and the use cost of the plating solution for the chemical plating is increased; in addition, in the process of chemically plating the IC carrier plates, the IC carrier plates of different types cannot be fixed in the process of a large amount of chemical degrees, the IC carrier plates cannot be effectively fixed in the process of experiments or a small amount of chemical plating, and external impurities are easily doped in plating solution in the process of chemical plating to influence the finished product effect of chemical plating.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a plating solution circulating device for IC carrier plate chemical plating, which solves the problems in the background technology.

In order to achieve the purpose, the utility model provides the following technical scheme:

the utility model provides a plating bath circulating device for IC support plate chemical plating, includes plating a liquid section of thick bamboo, chassis and support frame, the fixedly connected with leachate board of inside intermediate position department of plating a liquid section of thick bamboo, the inboard sealing connection of leachate board has the heating pipe, the lower extreme sealing connection of plating a liquid section of thick bamboo has the circulating pipe, the upper end sealing connection of circulating pipe has the liquid pump of plating, the inside upside sliding connection of plating a liquid section of thick bamboo has the grip block, the inside left side sliding connection of grip block has the fly leaf, the left end of fly leaf is rotated and is connected with the screw thread axle, screw connection between screw thread axle and the grip block.

Preferably, the upper end of the plating liquid cylinder is hermetically connected with a cover plate, the inner side of the cover plate is fixedly connected with a plating liquid disc, the upper end of the plating liquid disc is hermetically connected with a plating liquid pipe, and the plating liquid pipe is hermetically connected with a plating liquid pump.

Preferably, the inboard of grip block is equipped with IC support plate main part, the equal sliding connection in the left and right sides of IC support plate main part has the rubber head, is located the left fixed connection between rubber head and the fly leaf, is located the right side fixed connection between rubber head and the grip block, the left side of grip block is equipped with the rotary valve, fixed connection between rotary valve and the threaded shaft.

Preferably, the lower end of the interior of the plating liquid cylinder is fixedly connected with a liquid outlet hopper, and the lower end of the plating liquid cylinder is fixedly connected with an underframe.

Preferably, the upper end of the plating solution tray is fixedly connected with a support frame, and the support frame is fixedly connected with a plating solution pump.

Preferably, the outside fixedly connected with hot plate of heating pipe, fixedly connected between hot plate and the filtrating board, the left end electric connection of hot plate has the power cord.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the utility model, the filter liquid plate, the heating pipe and the plating liquid pump are arranged, and the plating liquid after plating is shunted by the filter liquid plate, so that the heating pipe can fully warm the plating liquid, the plating liquid can be fully circulated, and the plating liquid pump can pump out the warmed plating liquid again, so that the plating liquid can be recycled, and the use cost of the plating liquid in chemical plating is reduced;

2. according to the utility model, through the clamping plate, the movable plate and the threaded shaft, the sealing state can be kept in the chemical plating process by utilizing the installation of the clamping plate, impurities in the external air are prevented from being doped in the plating solution, the IC carrier plate is clamped through the movable plate, the IC carrier plate can be fixed, and meanwhile, the position of the movable plate can be adjusted through the rotation of the threaded shaft, so that the IC carrier plates with different sizes can be used for fixing the plating solution, and the chemical plating effect of the IC carrier plate can be effectively improved.

Drawings

FIG. 1 is a schematic view of the overall mounting structure of the present invention;

FIG. 2 is a cross-sectional view of the mounting structure of FIG. 1 in accordance with the present invention;

FIG. 3 is a perspective view of the mounting structure of the clamping plate, the movable plate and the rubber head according to the present invention;

FIG. 4 is a top view of the mounting structure of the clamping plate, the movable plate and the rubber head of the present invention.

In the figure: 1. a plating solution cylinder; 2. a filtrate plate; 3. heating a tube; 4. a circulation pipe; 5. plating a liquid pump; 6. a clamping plate; 7. a movable plate; 8. a threaded shaft; 9. a cover plate; 10. plating a liquid disc; 11. plating solution pipes; 12. an IC carrier body; 13. a rubber head; 14. a rotary valve; 15. a liquid outlet hopper; 16. a chassis; 17. a support frame; 18. heating plates; 19. a power line.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Embodiment 1 referring to fig. 1 to 4, the present invention provides a technical solution: a plating solution circulating device for IC carrier plate chemical plating comprises a plating solution cylinder 1, a bottom frame 16 and a support frame 17, wherein a filtrate plate 2 is fixedly connected at the middle position inside the plating solution cylinder 1, the inner side of the filtrate plate 2 is hermetically connected with a heating pipe 3, the plating solution can be subjected to warm treatment through the heating pipe 3, so that the plating solution can be circulated faster, the lower end of the plating solution cylinder 1 is hermetically connected with a circulating pipe 4, the upper end of the circulating pipe 4 is hermetically connected with a plating solution pump 5, so that the plating solution can be recycled, the use cost of the plating solution for chemical plating is reduced, the upper end of the plating solution cylinder 1 is hermetically connected with a cover plate 9, the inner side of the cover plate 9 is fixedly connected with a plating solution disk 10, the upper end of the plating solution disk 10 is hermetically connected with a plating solution pipe 11, the plating solution pipe 11 is hermetically connected with the plating solution pump 5, the plating solution flowing out of the plating solution pipe 11 is shunted through the plating solution disk 10, so that the plating solution can more comprehensively perform chemical plating on an IC carrier plate, the inside lower extreme fixedly connected with of a plating liquid section of thick bamboo 1 goes out liquid bucket 15, makes the plating solution can flow out fast, and the lower extreme fixedly connected with chassis 16 of a plating liquid section of thick bamboo 1 is convenient for support the device, and the outside fixedly connected with hot plate 18 of heating pipe 3, fixed connection between hot plate 18 and the filtrating board 2, the left end electric connection of hot plate 18 has power cord 19, is convenient for carry out heat treatment to heating pipe 3.

Example 2: referring to fig. 2-4, the difference between the present embodiment and embodiment 1 is: the upper side of the interior of the plating barrel 1 is slidably connected with a clamping plate 6, the left side of the interior of the clamping plate 6 is slidably connected with a movable plate 7, the left end of the movable plate 7 is rotatably connected with a threaded shaft 8, the movable plate 7 can move left and right through rotation of the threaded shaft 8, so that an IC carrier plate main body 12 can be fixedly clamped by the movable plate 7 and the clamping plate 6, the device can clamp IC carrier plates of different models through movement of the movable plate 7, an IC carrier plate main body 12 is arranged on the inner side of the clamping plate 6, rubber heads 13 are slidably connected to the left side and the right side of the IC carrier plate main body 12, the IC carrier plate main body 12 is clamped through the rubber heads 13, and the IC carrier plate main body 12 can be effectively protected.

The working process is as follows: when the device is used, an indoor rated power supply is adopted for supplying power, when the IC carrier plate is chemically plated, the clamping plate 6 is drawn out from the plating solution cylinder 1, the IC carrier plate is placed between the movable plate 7 and the clamping plate 6, the movable plate 7 can be driven to move by the threaded shaft 8 through the left end of the rotary valve 14, so that the movable plate 7 and the clamping plate 6 can fix the IC carrier plate, IC carrier plates of different models can be fixed and used in the device through the movement of the movable plate 7, after the IC carrier plate is fixed, the clamping plate 6 is pushed into the plating solution cylinder 1, the plating solution pump 5 is started, plating solution in the plating solution cylinder 1 is drawn out through the circulating pipe 4, the plating solution is plated on the surface of the IC carrier plate through the plating solution disk 10, and after the redundant plating solution is used, the plating solution enters the heating pipe 3 through the filtrate plate 2, and the heating plate 18 is heated through the power supply wire 19, the plating solution is subjected to warm treatment, the plating solution can flow more quickly, and meanwhile, the plating solution enters the circulating pipe 4 again through the liquid outlet hopper 15, so that the plating solution can be recycled, the use cost of the plating solution for chemical plating is reduced, and the plating solution can be effectively used conveniently.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a plating solution circulating device for IC support plate chemical plating, includes a plating solution section of thick bamboo (1), chassis (16) and support frame (17), its characterized in that: fixedly connected with leachate plate (2) is located to the inside intermediate position of plating liquid section of thick bamboo (1), the inboard sealing connection of leachate plate (2) has heating pipe (3), the lower extreme sealing connection of plating liquid section of thick bamboo (1) has circulating pipe (4), the upper end sealing connection of circulating pipe (4) has plating liquid pump (5), the inside upside sliding connection of plating liquid section of thick bamboo (1) has grip block (6), the inside left side sliding connection of grip block (6) has fly leaf (7), the left end rotation of fly leaf (7) is connected with threaded spindle (8), threaded spindle (8) and between grip block (6) screwed connection.

2. The plating solution circulating device for IC carrier plate electroless plating according to claim 1, wherein: the upper end sealing connection of a plating liquid section of thick bamboo (1) has apron (9), inboard fixedly connected with plating liquid dish (10) of apron (9), the upper end sealing connection of plating liquid dish (10) has plating solution pipe (11), sealing connection between plating solution pipe (11) and plating solution pump (5).

3. The plating solution circulating device for IC carrier plate electroless plating according to claim 1, wherein: the inboard of grip block (6) is equipped with IC support plate main part (12), the equal sliding connection in the left and right sides of IC support plate main part (12) has rubber head (13), is located the left fixed connection between rubber head (13) and fly leaf (7), is located the right side fixed connection between rubber head (13) and grip block (6), the left side of grip block (6) is equipped with rotation valve (14), fixed connection between rotation valve (14) and threaded shaft (8).

4. The plating solution circulating device for IC carrier plate electroless plating according to claim 1, wherein: the inner lower end of the plating liquid cylinder (1) is fixedly connected with a liquid outlet hopper (15), and the lower end of the plating liquid cylinder (1) is fixedly connected with an underframe (16).

5. The plating solution circulating device for IC carrier plate electroless plating according to claim 2, characterized in that: the upper end fixedly connected with support frame (17) of plating bath dish (10), fixed connection between support frame (17) and plating bath pump (5).

6. The plating solution circulating device for IC carrier plate electroless plating according to claim 1, wherein: the outside fixedly connected with hot plate (18) of heating pipe (3), fixed connection between hot plate (18) and filtrate board (2), the left end electric connection of hot plate (18) has power cord (19).