CN215966957U

CN215966957U - Laser concealed cutting device for wafer processing

Info

Publication number: CN215966957U
Application number: CN202122434230.7U
Authority: CN
Inventors: 锁珍
Original assignee: Suzhou Bazhu Laser Technology Co ltd
Current assignee: Suzhou Bazhu Laser Technology Co ltd
Priority date: 2021-10-09
Filing date: 2021-10-09
Publication date: 2022-03-08
Anticipated expiration: 2031-10-09

Abstract

The utility model discloses a laser recessive cutting device for wafer processing, which comprises a box body, wherein a protective cover is fixedly arranged at the top of the box body, a hydraulic rod is fixedly arranged at the top of an inner cavity of the protective cover, one side of the hydraulic rod is fixedly connected with a laser cutting device through an adjusting assembly, a buffer assembly is fixedly arranged at the bottom end of the hydraulic rod, the bottom of the buffer assembly is connected with a pressing plate through a rotating shaft, a rotating mechanism is arranged, the rotating mechanism can drive a cutting table to rotate so as to drive a silicon wafer placed at the top of the cutting table to rotate, the laser cutting device can cut the periphery of the silicon wafer while the silicon wafer rotates, the hydraulic rod can control the pressing plate to lift through the arrangement of the hydraulic rod, the pressing plate can clamp and fix the silicon wafer to be cut while the rotation of the silicon wafer is not influenced, the swinging in the cutting process of the silicon wafer can be avoided, the cutting process is simple, the processing efficiency is high.

Description

Laser concealed cutting device for wafer processing

Technical Field

The utility model relates to a laser concealed cutting device for wafer processing, and belongs to the technical field of laser cutting.

Background

The traditional processing technology adopted in the silicon wafer processing and preparation operation is that a crystal bar is firstly cut through a laser or a diamond cutter wheel, and then the periphery of a cut wafer blank is ground through the diamond cutter wheel, so that a finished silicon wafer product is obtained.

SUMMERY OF THE UTILITY MODEL

The utility model aims to overcome the technical problems of the prior art, provides a laser concealed cutting device for wafer processing, which has simple cutting process and high processing efficiency, can drive a cutting table to rotate by arranging a rotating mechanism, further can drive a silicon wafer placed on the top of the cutting table to rotate, can cut the periphery of the silicon wafer by the laser cutting device while the silicon wafer rotates, can control a press plate to lift by arranging a hydraulic rod, can clamp and fix the silicon wafer to be cut while not influencing the rotation of the silicon wafer, can avoid the swinging in the silicon wafer cutting process, can avoid the damage of the press plate on the surface of the silicon wafer in the clamping process by arranging a buffer assembly, can adjust the position of the laser cutting device by arranging an adjusting assembly, and can adjust the radius of the cut silicon wafer by adjusting the position of the laser cutting device, can meet different cutting requirements and effectively solve the problems in the background technology.

In order to solve the technical problems, the utility model provides the following technical scheme:

the utility model provides a wafer processing is with stealthy device of cutting of laser, includes the box, the fixed protection casing that is equipped with in box top, the fixed hydraulic stem that is equipped with in protection casing inner chamber top, hydraulic stem one side is through adjusting part fixedly connected with laser cutting device, the fixed buffering subassembly that is equipped with in hydraulic stem bottom, buffering subassembly bottom is connected with the clamp plate through the pivot, the box inner chamber is equipped with rotary mechanism, the fixed cutting bed that is equipped with in rotary mechanism top.

As further description of the technical scheme, the front side surface of the protective cover is connected with a protective door through a hinge shaft, and a transparent window is arranged in the middle of the protective door.

As the further description of the technical scheme, the adjusting assembly comprises a sliding rod, a sliding sleeve and a locking bolt, the sliding sleeve is sleeved outside the sliding rod, and the locking bolt is arranged at the top of the sliding sleeve in an inserting mode.

As a further description of the above technical solution, the buffering assembly includes a guide hole, a guide rod is inserted into an inner cavity of the guide hole, a gasket is fixedly arranged at the bottom of the guide rod, and a buffering spring is fixedly connected between the top of the gasket and the bottom of the hydraulic rod.

As a further description of the above technical solution, the rotating mechanism includes a driving motor and a rotating column, the rotating column is inserted and arranged at the top of the box body through a bearing, the top of the driving motor and the bottom of the rotating column are respectively and fixedly provided with a driving gear and a driven gear, and the driving gear and the driven gear are meshed and connected.

As a further description of the above technical solution, the bottom surface of the pressing plate and the top surface of the cutting table are both fixedly provided with rubber non-slip pads.

The utility model has the beneficial effects that: 1. by arranging the rotating mechanism, the rotating mechanism can drive the cutting table to rotate, so that the silicon wafer placed at the top of the cutting table can be driven to rotate, the laser cutting device can cut the periphery of the silicon wafer while the silicon wafer rotates, the hydraulic rod can control the lifting of the pressing plate, the pressing plate can clamp and fix the silicon wafer to be cut while the rotation of the silicon wafer is not influenced, and the silicon wafer can be prevented from shaking in the cutting process;

2. can avoid the clamp plate to cause the damage to the silicon wafer surface among the centre gripping process through setting up buffer unit, can adjust laser cutting device's position through setting up adjusting part, adjust laser cutting device's position and can adjust the radius of the circle of cutting, can satisfy different cutting demands.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model and not to limit the utility model.

FIG. 1 is a schematic diagram of a laser stealth cutting apparatus for wafer processing according to the present invention.

FIG. 2 is a cross-sectional view of a laser stealth cutting apparatus for wafer processing according to the present invention.

FIG. 3 is a cross-sectional view of a housing of a laser stealth cutting apparatus for wafer processing according to the present invention.

FIG. 4 is a front view of a buffer assembly of the laser stealth cutting apparatus for wafer processing according to the present invention.

Reference numbers in the figures: 1. a box body; 2. a protective cover; 3. a hydraulic lever; 4. an adjustment assembly; 5. a laser cutting device; 6. a buffer assembly; 7. pressing a plate; 8. a rotation mechanism; 9. cutting table; 10. a protective door; 11. a transparent window; 12. a slide bar; 13. a sliding sleeve; 14. locking the bolt; 15. a guide hole; 16. a guide bar; 17. a gasket; 18. a buffer spring; 19. a drive motor; 20. rotating the column; 21. a driving gear; 22. a driven gear.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.

Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a wafer processing is with latent device of cutting of laser, includes

box

1, 1 fixed protection casing 2 that is equipped with in top of box, 2 fixed hydraulic stem 3 that are equipped with in inner chamber tops of protection casing, can control the lift of clamp plate 7 through hydraulic stem 3, clamp plate 7 can carry out the centre gripping fixed to the silicon wafer that needs the cutting when not influencing the silicon wafer rotation, 3 one side of hydraulic stem is through 4 fixedly connected with laser cutting device 5 of adjusting part, 3 bottom fixings of hydraulic stem are equipped with

buffering subassembly

6, 6 bottoms of buffering subassembly are connected with clamp plate 7 through the pivot, 1 inner chamber of box is equipped with rotary mechanism 8, the fixed cutting bed 9 that is equipped with in rotary mechanism 8 top.

Specifically, as shown in fig. 1 to 3, a guard door 10 is coupled to a front side surface of the guard 2 by a hinge shaft, the middle part of the protective door 10 is provided with a transparent window 11, the rotating mechanism 8 comprises a driving motor 19 and a rotating column 20, the rotating column 20 is inserted and arranged on the top of the box body 1 through a bearing, a driving gear 21 and a driven gear 22 are respectively and fixedly arranged on the top of the driving motor 19 and the bottom of the rotating column 20, and the driving gear 21 is engaged with the driven gear 22, the driving motor 19 can drive the driving gear 21 to rotate, the driving gear 21 can drive the rotating column 20 to rotate through the driven gear 22, and then can drive cutting table 9 rotatory, laser cutting device 5 can cut around the silicon wafer that 9 tops of cutting table placed when cutting table 9 is rotatory, 7 bottom surfaces of clamp plate and 9 top surfaces of cutting table all are fixed and are equipped with the rubber slipmat.

Specifically, as shown in fig. 4, the adjusting assembly 4 is composed of a sliding rod 12, a sliding sleeve 13 and a locking bolt 14, the sliding sleeve 13 is sleeved outside the sliding rod 12, the locking bolt 14 is inserted into the top of the sliding sleeve 13, the locking bolt 14 can lock and fix the sliding sleeve 13, the locking bolt 14 is loosened, the sliding sleeve 13 is adjusted to move left and right to adjust the position of the laser cutting device 5, the radius of a cut circle can be adjusted by adjusting the position of the laser cutting device 5, silicon wafers of different sizes can be cut, the buffering assembly 6 includes a guide hole 15, a guide rod 16 is inserted into an inner cavity of the guide hole 15, a gasket 17 is fixedly arranged at the bottom of the guide rod 16, a buffering spring 18 is fixedly connected between the top of the gasket 17 and the bottom end of the hydraulic rod 3, and the buffering assembly 6 enables the pressing plate 7 to have a certain buffering performance, damage to the surface of the silicon wafer by the pressure plate 7 during clamping can be avoided.

The working principle of the utility model is as follows: can control clamp plate 7 through hydraulic stem 3 and go up and down, clamp plate 7 can carry out the centre gripping to the silicon wafer that needs the cutting when not influencing the silicon wafer rotation fixed, driving motor 19 can drive driving gear 21 rotatory, driving gear 21 can drive the rotation post 20 rotation through driven gear 22, and then can drive cutting table 9 rotatory, laser cutting device 5 can cut around the silicon wafer that the cutting table 9 top was placed when cutting table 9 was rotatory, locking bolt 14 can lock sliding sleeve 13 fixedly, it can adjust laser cutting device 5's position to remove about adjusting sliding sleeve 13 about locking bolt 14 to become flexible, the position through adjusting laser cutting device 5 can be adjusted the radius of the circle of cutting, can cut the silicon wafer of equidimension not.

The above embodiments are preferred embodiments of the present invention, and those skilled in the art can make variations and modifications to the above embodiments, therefore, the present invention is not limited to the above embodiments, and any obvious improvements, substitutions or modifications made by those skilled in the art based on the present invention are within the protection scope of the present invention.

Claims

1. The utility model provides a wafer processing is with latent device of cutting of laser, includes box (1), its characterized in that: the fixed protection casing (2) that is equipped with in box (1) top, the fixed hydraulic stem (3) that is equipped with in protection casing (2) inner chamber top, hydraulic stem (3) one side is through adjusting part (4) fixedly connected with laser cutting device (5), hydraulic stem (3) bottom mounting is equipped with buffering subassembly (6), buffering subassembly (6) bottom is connected with clamp plate (7) through the pivot, box (1) inner chamber is equipped with rotary mechanism (8), rotary mechanism (8) top is fixed and is equipped with cutting bed (9).

2. The laser stealth-cutting device for wafer processing according to claim 1, wherein: the front side surface of the protective cover (2) is connected with a protective door (10) through a hinge shaft, and the middle part of the protective door (10) is provided with a transparent window (11).

3. The laser stealth-cutting device for wafer processing according to claim 2, wherein: adjusting part (4) comprise slide bar (12), sliding sleeve (13), locking bolt (14), sliding sleeve (13) cover is established in the slide bar (12) outside, locking bolt (14) alternate the setting at sliding sleeve (13) top.

4. The laser stealth-cutting device for wafer processing according to claim 3, wherein: buffer unit (6) include guiding hole (15), guiding rod (16) are equipped with in guiding hole (15) inner chamber interlude, guiding rod (16) bottom is fixed and is equipped with gasket (17), fixedly connected with buffer spring (18) between gasket (17) top and hydraulic stem (3) bottom.

5. The laser stealth-cutting device for wafer processing according to claim 4, wherein: the rotating mechanism (8) comprises a driving motor (19) and a rotating column (20), the rotating column (20) is arranged at the top of the box body (1) in a penetrating mode through a bearing, a driving gear (21) and a driven gear (22) are fixedly arranged at the top of the driving motor (19) and the bottom of the rotating column (20) respectively, and the driving gear (21) and the driven gear (22) are connected in a meshed mode.

6. The laser stealth-cutting device for wafer processing according to claim 5, wherein: and rubber non-slip pads are fixedly arranged on the bottom surface of the pressing plate (7) and the top surface of the cutting table (9).