CN215966947U - Laser cutting equipment for ultrathin copper foil - Google Patents

Laser cutting equipment for ultrathin copper foil Download PDF

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Publication number
CN215966947U
CN215966947U CN202122119430.3U CN202122119430U CN215966947U CN 215966947 U CN215966947 U CN 215966947U CN 202122119430 U CN202122119430 U CN 202122119430U CN 215966947 U CN215966947 U CN 215966947U
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China
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ultra
ultrathin
laser cutting
copper foil
motor module
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CN202122119430.3U
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Chinese (zh)
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朱开峰
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Suzhou Jingfeng Machine & Electric Co ltd
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Suzhou Jingfeng Machine & Electric Co ltd
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Abstract

The utility model relates to the technical field of laser cutting, in particular to an ultrathin copper foil laser cutting device, which comprises an ultrathin material adsorption device, a machine table, an ultraviolet laser generating device, a three-axis high-speed linear motor module and an ultrathin raw material, wherein the top of the machine table is fixedly connected with the ultrathin material adsorption device, the top of the ultrathin material adsorption device is fixedly connected with the ultrathin raw material, the top of the machine table is movably connected with the three-axis high-speed linear motor module, and one side of the three-axis high-speed linear motor module is fixedly connected with the ultraviolet laser generating device. The minimum diameter of the processed round hole can reach 0.05 mm.

Description

Laser cutting equipment for ultrathin copper foil
Technical Field
The utility model relates to the technical field of laser cutting, in particular to laser cutting equipment for an ultrathin copper foil.
Background
With the development of science and technology and the progress of technology, various laser cutting devices are more and more applied to various forming processing.
The laser cutting equipment embodies a plurality of advantages in various forming processing, such as good cutting quality, narrow kerf width (generally 0.1-0.5 mm), high precision (generally 0.1-0.4 mm of hole center distance error and 0.1-0.5 mm of outline dimension error), good kerf surface roughness (generally Ra is 12.5-25 mu m), no need of reprocessing of cutting seams, small cutting speed fast heating influence area, extremely small deformation, low noise in the laser cutting process, small vibration, various cutting materials including metal, nonmetal, metal-based and nonmetal-based composite materials, leather, wood, fibers and the like, cleanness, safety and no pollution, and greatly improves the working environment of operators.
With the progress of technology and the miniaturization development of parts to be processed, the common laser cutting equipment cannot meet the advanced process requirements.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide laser cutting equipment for an ultrathin copper foil, which aims to solve the problems in the background technology.
In order to achieve the purpose, the utility model provides the following technical scheme: an ultrathin copper foil laser cutting device comprises an ultrathin material adsorption device, a machine table, an ultraviolet laser generating device, a three-axis high-speed linear motor module and an ultrathin raw material;
the top fixedly connected with ultra-thin material adsorption equipment of board, ultra-thin material adsorption equipment's ultra-thin raw and other materials of top fixedly connected with, the top swing joint of board has the high-speed linear electric motor module of triaxial, one side fixedly connected with ultraviolet laser of the high-speed linear electric motor module of triaxial takes place equipment.
Preferably, the ultrathin material adsorption device is positioned under the ultraviolet laser generation equipment, and the ultrathin raw material is positioned in the irradiation range of the ultraviolet laser generation equipment.
Preferably, the inside of the ultrathin material adsorption device is provided with an air hole, and one end of the ultrathin material adsorption device is detachably connected with a vacuum generator.
Preferably, the top one end fixedly connected with guide rail of board, be connected through the guide rail between triaxial high-speed linear electric motor module and the board.
Preferably, the top of the machine table is fixedly connected with an L-shaped limiting clamping block, and one side of the ultrathin material adsorption device is attached to the L-shaped limiting clamping block.
Preferably, the three-axis high-speed linear motor module is movably connected with the guide rail.
Compared with the prior art, the utility model has the beneficial effects that:
1. by adopting the matching between the ultraviolet laser generating equipment and the triaxial high-speed linear motor module, the ultra-thin material cutting device can be applied to high-speed and high-precision laser cutting processing, the ultra-thin raw material can be cut by the ultraviolet laser generating equipment, the minimum width between two lines can reach 0.03 mm, and the minimum diameter of a processed round hole can reach 0.05 mm;
2. adopt ultra-thin material adsorption equipment to use in high-speed, high-accuracy laser cutting processing to guaranteed to fix the position of ultra-thin raw and other materials, guaranteed that offset can not appear in ultra-thin raw and other materials in the course of working, thereby guaranteed the cutting accuracy to ultra-thin raw and other materials.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic side view of the present invention.
In the figure: 1. ultra-thin raw materials; 2. an ultra-thin material adsorption device; 3. a machine platform; 4. an ultraviolet laser generating device; 5. triaxial high-speed linear electric motor module.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples
Referring to fig. 1-2, there are shown: the embodiment is a preferred embodiment in the technical scheme, and the ultra-thin copper foil laser cutting equipment comprises an ultra-thin material adsorption device 2, a machine table 3, an ultraviolet laser generating device 4, a three-axis high-speed linear motor module 5 and ultra-thin raw materials 1;
the top of the machine table 3 is fixedly connected with an ultrathin material adsorption device 2, the top of the ultrathin material adsorption device 2 is fixedly connected with an ultrathin raw material 1, the top of the machine table 3 is movably connected with a three-axis high-speed linear motor module 5, and one side of the three-axis high-speed linear motor module 5 is fixedly connected with an ultraviolet laser generation device 4;
as shown in fig. 1 and 2, the ultra-thin material adsorption device 2 is located right below the ultraviolet laser generation device 4, and the ultra-thin raw material 1 is located within the irradiation range of the ultraviolet laser generation device 4, so that the ultraviolet laser generation device 4 can perform laser cutting on the ultra-thin raw material 1, and the use is convenient;
as shown in fig. 1 and 2, an air hole is formed inside the ultra-thin material adsorption device 2, and one end of the ultra-thin material adsorption device 2 is detachably connected with a vacuum generator, so that the ultra-thin material adsorption device 2 is acted by the vacuum generator, and the position of the ultra-thin raw material 1 is fixed, and the use is convenient;
as shown in fig. 1 and 2, a guide rail is fixedly connected to one end of the top of the machine table 3, and the three-axis high-speed linear motor module 5 is connected with the machine table 3 through the guide rail, so that the three-axis high-speed linear motor module 5 can drive the ultraviolet laser generating device 4 to move on the top of the machine table 3, and the ultrathin raw material 1 is cut, and the use is convenient;
as shown in fig. 1 and 2, an L-shaped limiting clamping block is fixedly connected to the top of the machine table 3, and one side of the ultra-thin material adsorption device 2 is attached to the L-shaped limiting clamping block, so that the position of the ultra-thin material adsorption device 2 is conveniently limited by the L-shaped limiting clamping block, and therefore, the position of the ultra-thin raw material 1 is ensured to be located below the ultraviolet laser generation device 4, the ultraviolet laser generation device 4 is convenient to cut the ultra-thin raw material 1, and the use is convenient;
as shown in fig. 1 and 2, the three-axis high-speed linear motor module 5 is movably connected with the guide rail, so that the three-axis high-speed linear motor module 5 can move on the guide rail conveniently, and the use is convenient;
in the embodiment, in the using process, an ultrathin raw material 1 is placed at the top of an ultrathin material adsorption device 2, a vacuum generator is opened, the ultrathin raw material 1 can be adsorbed at the top of the ultrathin material adsorption device 2 under the action of the ultrathin material adsorption device 2, an ultraviolet laser generating device 4 and a triaxial high-speed linear motor module 5 are respectively started, the ultraviolet laser generating device 4 is driven to move under the action of the triaxial high-speed linear motor module 5, the surface of the ultrathin raw material 1 is irradiated by the ultraviolet laser generating device 4, so that precise laser cutting is performed, after the cutting is completed, the ultraviolet laser generating device 4 and the triaxial high-speed linear motor module 5 are closed, the vacuum generator is closed, so that a finished product can be taken down from the top of the ultrathin material adsorption device 2, and the device is formed by applying the ultraviolet laser generating device 4, through the effect of the high-speed mirror that shakes, field lens, beam expanding lens of high-end, adopt ultra-thin material adsorption equipment 2, the adoption of the high-speed linear electric motor module of triaxial 5: the speed can reach 1500mm/s, and the method is applied to ultra-precise high-speed cutting of cutting ultrathin materials, and ultra-fine cuts: minimum width of 0.02mm, ultra-high precision: the error of the center distance of the holes is 0.01-0.04 mm, the error of the contour dimension is 0.01-0.05 mm, and the surface roughness of the cut is good: the Ra is 12.5-25 mu m generally, the joint cutting does not need to be processed again generally, the cutting speed is high, the heat influence area is small, the deformation is extremely small, the noise in the laser cutting process is low, the vibration is small, the types of cutting materials are various, including metal, nonmetal, metal-based and nonmetal-based composite materials and the like, and the cutting device is clean, safe, pollution-free and convenient to use.
While the utility model has been described in further detail in connection with specific embodiments thereof, it will be understood that the utility model is not limited thereto, and that various other modifications and substitutions may be made by those skilled in the art without departing from the spirit of the utility model, which should be considered to be within the scope of the utility model as defined by the appended claims.

Claims (6)

1. An ultrathin copper foil laser cutting device comprises an ultrathin material adsorption device (2), a machine table (3), an ultraviolet laser generating device (4), a three-axis high-speed linear motor module (5) and an ultrathin raw material (1);
the method is characterized in that:
the top fixedly connected with ultra-thin material adsorption equipment (2) of board (3), the ultra-thin raw and other materials (1) of top fixedly connected with of ultra-thin material adsorption equipment (2), the top swing joint of board (3) has high-speed linear electric motor module of triaxial (5), one side fixedly connected with ultraviolet laser of high-speed linear electric motor module of triaxial (5) takes place equipment (4).
2. The laser cutting apparatus of ultra-thin copper foil according to claim 1, wherein: the ultrathin material adsorption device (2) is located under the ultraviolet laser generation equipment (4), and the ultrathin raw material (1) is located in the irradiation range of the ultraviolet laser generation equipment (4).
3. The laser cutting apparatus of ultra-thin copper foil according to claim 1, wherein: an air hole is formed in the ultrathin material adsorption device (2), and one end of the ultrathin material adsorption device (2) is detachably connected with a vacuum generator.
4. The laser cutting apparatus of ultra-thin copper foil according to claim 1, wherein: the top one end fixedly connected with guide rail of board (3), be connected through the guide rail between triaxial high-speed linear electric motor module (5) and the board (3).
5. The laser cutting apparatus of ultra-thin copper foil according to claim 1, wherein: the top fixedly connected with L shape spacing fixture block of board (3), one side and the laminating each other of L shape spacing fixture block of ultra-thin material adsorption equipment (2).
6. The laser cutting apparatus of ultra-thin copper foil according to claim 4, wherein: the three-axis high-speed linear motor module (5) is movably connected with the guide rail.
CN202122119430.3U 2021-09-03 2021-09-03 Laser cutting equipment for ultrathin copper foil Active CN215966947U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122119430.3U CN215966947U (en) 2021-09-03 2021-09-03 Laser cutting equipment for ultrathin copper foil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122119430.3U CN215966947U (en) 2021-09-03 2021-09-03 Laser cutting equipment for ultrathin copper foil

Publications (1)

Publication Number Publication Date
CN215966947U true CN215966947U (en) 2022-03-08

Family

ID=80521659

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122119430.3U Active CN215966947U (en) 2021-09-03 2021-09-03 Laser cutting equipment for ultrathin copper foil

Country Status (1)

Country Link
CN (1) CN215966947U (en)

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