CN215965766U - High-precision stamping die for high-frequency microwave radio-frequency board - Google Patents
High-precision stamping die for high-frequency microwave radio-frequency board Download PDFInfo
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- CN215965766U CN215965766U CN202122267777.2U CN202122267777U CN215965766U CN 215965766 U CN215965766 U CN 215965766U CN 202122267777 U CN202122267777 U CN 202122267777U CN 215965766 U CN215965766 U CN 215965766U
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Abstract
The utility model belongs to the field of mobile phone element processing jigs, and particularly discloses a high-precision stamping die for a high-frequency microwave radio-frequency board, which comprises a semi-open frame body (100), a lifting motor (110), an upper die mounting frame (120), an upper die (130), a laser positioner (140), a camera (150), a base (200), a slide rail (210), a lower die mounting frame (220), a lower die (230), a double-shaft motor (240), a transmission shaft (250) and a collection box (260); the high-precision stamping die disclosed by the utility model has the advantages of high precision, high automation degree and high production efficiency, and can be widely used for producing high-frequency microwave radio frequency boards of mobile phones.
Description
Technical Field
The utility model belongs to the field of mobile phone element processing jigs, and particularly discloses a high-precision stamping die for a high-frequency microwave radio-frequency plate.
Background
Wireless communication (english: Wireless communication) refers to long-distance transmission communication between a plurality of nodes without propagation via conductors or cables, and Wireless communication can be performed by radio, and the like. Wireless communication includes a variety of stationary, mobile, and portable applications such as two-way radios, cell phones, personal digital assistants, and wireless networks. Other examples of wireless radio communication are GPS, garage door remote control, wireless mouse, etc. Most wireless communication technologies use radio, including Wi-fi, which is only a few meters away, and also include deep space networks, which communicate with the seaman number 1, and which are more than a few million kilometers away. However, some wireless communication technologies do not use radio, but use other electromagnetic wave wireless technologies, such as light, magnetic field, electric field, etc.
The microwave radio frequency chip is a component of a microwave radio frequency integrated circuit and is a core technology in the field of wireless communication. The high-frequency microwave radio-frequency board is a carrier of a microwave radio-frequency chip and is also a core component in the mobile phone. In the process of producing the radio frequency board, in order to improve the working efficiency, a radio frequency mother board with a large area needs to be prepared first, and then the radio frequency mother board is cut into a corresponding size. In the existing preparation process of the radio frequency board, the manual cutting process is often troublesome, and the cutting precision is not high. Therefore, a high precision cutting and pressing tool for the high frequency microwave radio frequency board is urgently needed.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects, the utility model discloses a high-precision stamping die for a high-frequency microwave radio-frequency plate.
The technical scheme of the utility model is as follows:
a high-precision stamping die for a high-frequency microwave radio-frequency board comprises a semi-open frame body, a lifting motor, an upper die mounting frame, an upper die, a laser positioner, a camera, a base, a slide rail, a lower die mounting frame, a lower die, a double-shaft motor, a transmission shaft and a collecting box; the semi-open frame body is rectangular; the lifting motor is arranged at the top of the semi-open frame body; the lifting motor is connected with the upper die mounting frame; the upper die mounting frame is detachably provided with the upper die; the laser positioner is arranged on one side of the upper die; the camera is further arranged at the top of the semi-open frame body; the base is arranged under the upper die and is a rectangular metal base; the base is provided with the slide rail; the lower die mounting rack is slidably mounted on the slide rail; the lower die is arranged on the slide rail; the double-shaft motor is arranged on one side of the base and is connected with one side of the lower die mounting frame through the transmission shaft; the collecting box is arranged on the other side of the base; the double-shaft motor can control the transmission shaft to move left and right and rotate.
Furthermore, according to the high-precision stamping die for the high-frequency microwave radio-frequency board, the lower end of the upper die is provided with the protrusions forming the array.
Furthermore, according to the high-precision stamping die for the high-frequency microwave radio-frequency plate, the lower die is provided with the concave pits with the shapes corresponding to the bulges.
Furthermore, the high-precision stamping die for the high-frequency microwave radio-frequency plate is characterized in that a blocking rod is arranged on the base.
Furthermore, according to the high-precision stamping die for the high-frequency microwave radio-frequency board, a cushion pad is arranged on the upper die mounting frame right above the blocking rod.
Furthermore, according to the high-precision stamping die for the high-frequency microwave radio-frequency board, the semi-open frame body is further provided with the control panel.
Furthermore, according to the high-precision stamping die for the high-frequency microwave radio-frequency plate, the control panel is electrically connected with the lifting motor, the laser positioner, the camera and the double-shaft motor respectively.
Furthermore, the high-precision stamping die for the high-frequency microwave radio-frequency board is used in a mobile phone.
Furthermore, the high-precision stamping die of the high-frequency microwave radio-frequency plate is used for the apple mobile phone.
According to the technical scheme, the utility model has the following beneficial effects:
the utility model discloses a high-precision stamping die for a high-frequency microwave radio-frequency board, which has high integration level, can conveniently replace the die at any time according to production requirements by using an array type upper die and a lower die which can be conveniently replaced, changes the production specification, can obtain a large number of high-frequency microwave radio-frequency boards meeting the requirements by stamping once, and can greatly improve the production efficiency; furthermore, the lower die mounting frame is controlled by the double-shaft motor, after stamping is completed, the lower die mounting frame can be controlled to move to the position above the collecting box, and at the moment, rotation is performed, so that a product after stamping in the lower die can automatically fall into the collecting box, and manual collection is avoided; furthermore, the laser positioner can accurately position the left position and the right position of the lower die, so that the stamping precision is improved, and accidents are prevented. The stamping die can be widely applied to the production of high-frequency microwave radio frequency boards of mobile phones, particularly apple mobile phones.
Drawings
Fig. 1 is a schematic view of a high-precision stamping die for a high-frequency microwave rf board in embodiment 1;
fig. 2 is a schematic view of a high-precision stamping die of a high-frequency microwave rf board in embodiment 2;
wherein: the semi-open frame body 100, the lifting motor 110, the upper die mounting frame 120, the cushion pad 121, the upper die 130, the protrusion 131, the laser positioner 140, the camera 150, the control panel 160, the base 200, the slide rail 210, the lower die mounting frame 220, the lower die 230, the double-shaft motor 240, the transmission shaft 250, the collection box 260 and the blocking rod 270.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the utility model and are not to be construed as limiting the utility model.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be considered as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, unless otherwise specified, "a plurality" means two or more unless explicitly defined otherwise.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
Example 1
The high-precision stamping die for the high-frequency microwave radio-frequency plate shown in fig. 1 comprises a semi-open frame body 100, a lifting motor 110, an upper die mounting frame 120, an upper die 130, a laser positioner 140, a camera 150, a base 200, a slide rail 210, a lower die mounting frame 220, a lower die 230, a double-shaft motor 240, a transmission shaft 250 and a collection box 260; the semi-open frame 100 is rectangular; the lifting motor 110 is disposed at the top of the semi-open frame 100; the lifting motor 110 is connected with the upper die mounting frame 120; the upper die 130 is detachably mounted on the upper die mounting bracket 120; the laser positioner 140 is arranged on one side of the upper die 130; the camera 150 is further disposed at the top of the semi-open frame 100; the base 200 is arranged under the upper die 130, and the base 200 is a rectangular metal base; the base 200 is provided with the slide rail 210; the lower mold mounting bracket 220 is slidably mounted on the slide rail 210; the lower mold 230 is mounted on the slide rail 210; the double-shaft motor 240 is disposed at one side of the base 200 and connected to one side of the lower die mounting bracket 220 through the transmission shaft 250; the collecting box 260 is arranged at the other side of the base 200; the dual-shaft motor 240 may control the driving shaft 250 to perform a left-right movement and a rotational movement.
Example 2
As shown in fig. 2, the high-precision stamping die for the high-frequency microwave radio-frequency board comprises a semi-open frame 100, a lifting motor 110, an upper die mounting frame 120, an upper die 130, a laser positioner 140, a camera 150, a base 200, a slide rail 210, a lower die mounting frame 220, a lower die 230, a double-shaft motor 240, a transmission shaft 250 and a collection box 260; the semi-open frame 100 is rectangular; the lifting motor 110 is disposed at the top of the semi-open frame 100; the lifting motor 110 is connected with the upper die mounting frame 120; the upper die 130 is detachably mounted on the upper die mounting bracket 120; the laser positioner 140 is arranged on one side of the upper die 130; the camera 150 is further disposed at the top of the semi-open frame 100; the base 200 is arranged under the upper die 130, and the base 200 is a rectangular metal base; the base 200 is provided with the slide rail 210; the lower mold mounting bracket 220 is slidably mounted on the slide rail 210; the lower mold 230 is mounted on the slide rail 210; the double-shaft motor 240 is disposed at one side of the base 200 and connected to one side of the lower die mounting bracket 220 through the transmission shaft 250; the collecting box 260 is arranged at the other side of the base 200; the dual-shaft motor 240 can control the transmission shaft 250 to move left and right and rotate; preferably, the lower end of the upper die 130 is provided with protrusions 131 forming an array; specifically, the lower mold 230 has a concave recess corresponding to the shape of the protrusion 131; further, a blocking rod 270 is arranged on the base 200; in particular, a buffer pad 121 is arranged on the upper die mounting frame 120 right above the blocking rod 270; preferably, the semi-open frame 100 is further provided with a control panel 160; further, the control panel 160 is electrically connected to the lifting motor 110, the laser positioner 140, the camera 150, and the dual-axis motor 240, respectively; preferably, the high-frequency microwave radio-frequency board is used in a mobile phone; more preferably, the high-frequency microwave radio-frequency plate is used for an apple mobile phone.
The above is only a preferred embodiment of the present invention, and the scope of the present invention should not be limited thereby, and all the simple equivalent changes and modifications made by the claims and the disclosure of the present invention should be included in the scope of the present invention.
Claims (8)
1. A high-precision stamping die for a high-frequency microwave radio-frequency board is characterized by comprising a semi-open frame body (100), a lifting motor (110), an upper die mounting frame (120), an upper die (130), a laser positioner (140), a camera (150), a base (200), a slide rail (210), a lower die mounting frame (220), a lower die (230), a double-shaft motor (240), a transmission shaft (250) and a collection box (260); the semi-open frame body (100) is rectangular; the lifting motor (110) is arranged at the top of the semi-open frame body (100); the lifting motor (110) is connected with the upper die mounting rack (120); the upper die (130) is detachably mounted on the upper die mounting frame (120); the laser positioner (140) is arranged on one side of the upper die (130); the camera (150) is further arranged at the top of the semi-open frame body (100); the base (200) is arranged under the upper die (130), and the base (200) is a rectangular metal base; the base (200) is provided with the sliding rail (210); the lower die mounting rack (220) is slidably mounted on the slide rail (210); the lower die (230) is mounted on the slide rail (210); the double-shaft motor (240) is arranged on one side of the base (200) and is connected with one side of the lower die mounting rack (220) through the transmission shaft (250); the collecting box (260) is arranged at the other side of the base (200); the double-shaft motor (240) can control the transmission shaft (250) to move left and right and rotate.
2. A high precision stamping die for high frequency microwave radio frequency boards as claimed in claim 1, wherein the lower end of the upper die (130) is provided with protrusions (131) forming an array.
3. A high precision stamping die for high frequency microwave radio frequency boards as claimed in claim 2, wherein the lower die (230) is provided with a concave pit with a shape corresponding to the protrusion (131).
4. The high precision stamping die for high frequency microwave radio frequency boards as claimed in claim 1, wherein the base (200) is provided with a blocking rod (270).
5. The high precision stamping die for high frequency microwave radio frequency boards as claimed in claim 4, wherein the upper die mounting rack (120) right above the blocking rod (270) is provided with a cushion pad (121).
6. The high precision stamping die for high frequency microwave radio frequency boards as claimed in claim 1, wherein the semi-open frame body (100) is further provided with a control panel (160).
7. The high-precision stamping die for the high-frequency microwave radio-frequency plate as claimed in claim 6, wherein the control panel (160) is electrically connected with the lifting motor (110), the laser positioner (140), the camera (150) and the double-shaft motor (240), respectively.
8. The high precision stamping die for the high frequency microwave radio frequency board as claimed in claim 1, wherein the high frequency microwave radio frequency board is used in a mobile phone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122267777.2U CN215965766U (en) | 2021-09-18 | 2021-09-18 | High-precision stamping die for high-frequency microwave radio-frequency board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122267777.2U CN215965766U (en) | 2021-09-18 | 2021-09-18 | High-precision stamping die for high-frequency microwave radio-frequency board |
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| Publication Number | Publication Date |
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| CN215965766U true CN215965766U (en) | 2022-03-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202122267777.2U Active CN215965766U (en) | 2021-09-18 | 2021-09-18 | High-precision stamping die for high-frequency microwave radio-frequency board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114618945A (en) * | 2022-03-17 | 2022-06-14 | 苏州海强机械有限公司 | Mold for machining thin-wall curved surface part and working method thereof |
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2021
- 2021-09-18 CN CN202122267777.2U patent/CN215965766U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114618945A (en) * | 2022-03-17 | 2022-06-14 | 苏州海强机械有限公司 | Mold for machining thin-wall curved surface part and working method thereof |
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