CN215956719U - Double-sided PCB circuit board structure of multilayer high density - Google Patents
Double-sided PCB circuit board structure of multilayer high density Download PDFInfo
- Publication number
- CN215956719U CN215956719U CN202122410879.5U CN202122410879U CN215956719U CN 215956719 U CN215956719 U CN 215956719U CN 202122410879 U CN202122410879 U CN 202122410879U CN 215956719 U CN215956719 U CN 215956719U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- board body
- cover plate
- sided pcb
- pcb circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 13
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 239000000428 dust Substances 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a multilayer high-density double-sided PCB circuit board structure, relates to the technical field of circuit boards, and solves the problems that the existing circuit board is insufficient in heat dissipation capacity and electronic parts on the circuit board are easily damaged in a long-time use process. A multilayer high density double sided PCB circuit board structure comprising: a circuit board body; the top of the circuit board body is provided with a cover plate; the circuit board body is still including: the radiating fins are of rectangular plate structures and fixedly arranged on the outer sides of the periphery of the circuit board body in a rectangular array shape; through being provided with circuit board body, locating lever, cover plate and key position groove, simultaneously through seting up of fin and louvre, can carry out timely discharge with the heat that produces in the circuit board body working process, can avoid the dust to fall into the top of circuit board body through the filter screen simultaneously, only need clear up the filter screen simultaneously alright, the quick clearance of being convenient for.
Description
Technical Field
The utility model belongs to the technical field of circuit boards, and particularly relates to a multi-layer high-density double-sided PCB structure.
Background
The double-sided PCB is an important PCB in circuit boards, is suitable for wide high and new technology industries, and is mainly used for communication electronic equipment, advanced instruments and meters, electronic computers and the like with higher performance requirements.
The existing PCB circuit board has the following defects:
1. the existing circuit board has insufficient heat dissipation capability, and electronic parts on the circuit board are easily damaged in the long-time use process;
2. when the circuit board is used, dust is easily accumulated above the circuit board, so that electronic elements on the circuit board are in poor contact, the use is affected, and the circuit board needs to be cleaned regularly.
SUMMERY OF THE UTILITY MODEL
In order to solve the above technical problems, the present invention provides a multilayer high-density double-sided PCB circuit board structure, so as to solve the problems that the existing circuit board proposed in the above background art has insufficient heat dissipation capability, and is easy to damage electronic components on the circuit board in a long-time use process.
The utility model relates to a multilayer high-density double-sided PCB circuit board structure, which is achieved by the following specific technical means:
a multilayer high density double sided PCB circuit board structure comprising: a circuit board body; the circuit board body adopts a rectangular plate structure, and the top of the circuit board body is provided with a rectangular frame groove structure; a positioning rod is arranged at the top of the circuit board body; the top of the circuit board body is provided with a cover plate; the circuit board body is still including: the radiating fins are of rectangular plate structures and are fixedly arranged on the outer sides of the periphery of the circuit board body in a rectangular array shape.
Furthermore, the positioning rods are of a cylindrical structure, four groups of positioning rods are arranged, and the four groups of positioning rods are fixedly arranged at the top of the circuit board body in a rectangular array shape; the locating lever is still including: the fixed rod is of a cylindrical structure and is fixedly arranged at the top of the fixed rod, and a spring is sleeved outside the fixed rod; the sliding block is of a rectangular block structure, a penetrating circular groove hole is formed in the top of the sliding block, and the sliding block is arranged on the outer side of the fixed rod in a sliding mode; the baffle, the baffle adopt both ends to be the rectangular plate structure of U-shaped, and the baffle passes through the hinge rotation to be set up in the both sides of sliding block.
Furthermore, the cover plate is of a hollow rectangular block structure, is fixedly arranged at the top of the circuit board body, is clamped with the rectangular frame groove at the top of the circuit board body at the bottom, and is provided with four groups of penetrating circular slots in a rectangular array shape at the periphery of the top; the top of the cover plate is provided with a key position groove; the cover plate also includes: the heat dissipation holes are in a round hole structure and penetrate through the top of the cover plate in a rectangular array shape; the filter screen, the filter screen is fixed to be set up in the bottom inboard of cover plate.
Furthermore, the key position grooves are fixedly arranged on the top of the cover plate in a rectangular array shape; the key position groove still includes: the piece that resets, the piece that resets adopts the spring structure, and the piece that resets is fixed to be set up in the top in key position groove.
Compared with the prior art, the utility model has the following beneficial effects:
through being provided with the circuit board body, the locating lever, cover plate and key position groove, realize quick installation and the dismantlement to the cover plate through the cooperation of baffle and sliding block, simultaneously through seting up of fin and louvre, can carry out timely discharge with the heat that produces in the circuit board body working process, avoid too high heat to cause the damage to the circuit board body, can avoid the dust to fall into the top of circuit board body through the filter screen simultaneously, reduce the probability that the circuit board body breaks down, need not to carry out periodic cleaning to the circuit board body simultaneously, only need clear up alright to the filter screen, be convenient for clear up fast.
Drawings
Fig. 1 is a schematic axial perspective view of the present invention.
Fig. 2 is a schematic axial view of the present invention in a disassembled state.
Fig. 3 is a front perspective view of the present invention in a disassembled state.
Fig. 4 is a schematic diagram of the structural circuit board body and the positioning rod of the present invention.
In the drawings, the corresponding relationship between the component names and the reference numbers is as follows:
1. a circuit board body; 101. a heat sink; 2. positioning a rod; 201. fixing the rod; 202. a slider; 203. a baffle plate; 3. a cover plate; 301. heat dissipation holes; 302. a filter screen; 4. a key position slot; 401. a reset member.
Detailed Description
The embodiments of the present invention will be described in further detail with reference to the drawings and examples. The following examples are intended to illustrate the utility model but are not intended to limit the scope of the utility model.
In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the utility model. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, e.g., as being fixed or detachable or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example (b):
as shown in figures 1 to 4:
the utility model provides a multilayer high-density double-sided PCB circuit board structure, comprising: a circuit board body 1; the circuit board body 1 is of a rectangular plate structure, and a rectangular frame groove structure is formed in the top of the circuit board body 1; a positioning rod 2 is arranged at the top of the circuit board body 1; the top of the circuit board body 1 is provided with a cover plate 3; circuit board body 1 is still including: the heat sink 101, the heat sink 101 adopts the rectangular plate structure, and the heat sink 101 is fixed and arranged outside the periphery of the circuit board body 1 in the rectangular array shape.
The positioning rods 2 are of a cylindrical structure, four groups of the positioning rods 2 are arranged, and the four groups of the positioning rods 2 are fixedly arranged at the top of the circuit board body 1 in a rectangular array shape; the locating lever 2 is also included: the fixing rod 201 is of a cylindrical structure, the fixing rod 201 is fixedly arranged at the top of the fixing rod 2, and a spring is sleeved outside the fixing rod 201; the sliding block 202 is of a rectangular block structure, a through circular slot is formed in the top of the sliding block 202, and the sliding block 202 is arranged on the outer side of the fixed rod 201 in a sliding mode; the baffle 203 is of a rectangular plate structure with two U-shaped ends, and the baffle 203 is rotatably arranged on two sides of the sliding block 202 through hinged connection; the cover plate 3 is of a hollow rectangular block structure, the cover plate 3 is fixedly arranged at the top of the circuit board body 1, the bottom of the cover plate 3 is clamped with a rectangular frame groove at the top of the circuit board body 1, and four groups of penetrating circular slots are formed in the periphery of the top of the cover plate 3 in a rectangular array shape; the top of the cover plate 3 is provided with a key position groove 4; the cover plate 3 further comprises: the heat dissipation holes 301, the heat dissipation holes 301 adopt a round hole structure, and the heat dissipation holes 301 penetrate through the top of the cover plate 3 in a rectangular array shape; the filter screen 302, the filter screen 302 is fixed and set up in the inboard bottom of cover plate 3.
By adopting the technical scheme, the baffle 203 is vertically arranged, then the slotted holes on the periphery of the top of the cover plate 3 are aligned with the positioning rods 2, then the cover plate 3 is clamped into the rectangular frame slot on the top of the circuit board body 1, then the baffle plate 203 is transversely placed, under the action of the spring outside the fixed rod 201, the top slide block 202 moves downward along the fixed rod 201, thereby the cover plate 3 is clamped by the transverse baffle plate 203, the cover plate 3 is fixed on the top of the circuit board body 1, the heat generated by the circuit board body 1 is dissipated by the heat dissipation hole 301 and the heat dissipation fin 101, thereby being beneficial to reducing the heat of the circuit board body 1 and avoiding the damage of electronic elements, meanwhile, the dust entering from the heat dissipation holes 301 can be shielded and adsorbed by the filter screen 302, thereby avoid the direct top that falls to circuit board body 1 of dust, provide better operational environment for circuit board body 1.
Wherein, the key position slots 4 are fixedly arranged on the top of the cover plate 3 in a rectangular array; the key position slot 4 further comprises: the reset piece 401, the reset piece 401 adopts a spring structure, and the reset piece 401 is fixedly arranged on the top of the key position groove 4.
Through adopting above-mentioned technical scheme, the circuit accessible louvre 301 of the electronic component at 1 top of circuit board body is provided with key position groove 4 with the cover plate 3 top and is connected, resets to the control button through the piece 401 that resets that 4 tops in key position groove set up.
The specific use mode and function of the embodiment are as follows:
in the utility model, the circuit of the electronic element on the top of the circuit board body 1 can be connected with the key position groove 4 arranged on the top of the cover plate 3 through the heat radiation hole 301, the control key is reset through the reset piece 401 arranged on the top of the key position groove 4, firstly, the baffle plate 203 is vertically placed, then, the slotted holes on the periphery of the top of the cover plate 3 are aligned with the positioning rods 2, then, the cover plate 3 is clamped into the rectangular frame groove on the top of the circuit board body 1, then, the baffle plate 203 is horizontally placed, under the action of the spring on the outer side of the fixing rod 201, the jacking sliding block 202 moves downwards along the fixing rod 201, thereby, the cover plate 3 is clamped through the horizontal baffle plate 203, the cover plate 3 is fixed on the top of the circuit board body 1, in the using process of the circuit board body 1, the heat generated by the circuit board body 1 is radiated through the heat radiation hole 301 and the heat radiation fin 101, thereby being beneficial to the reduction of the heat of the circuit board body 1, avoid electronic component's damage, the dust that gets into from louvre 301 department simultaneously can be sheltered from by filter screen 302 and adsorb to avoid the direct top that falls circuit board body 1 of dust, provide better operational environment for circuit board body 1.
The embodiments of the present invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the utility model in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiment was chosen and described in order to best explain the principles of the utility model and the practical application, and to enable others of ordinary skill in the art to understand the utility model for various embodiments with various modifications as are suited to the particular use contemplated.
Claims (6)
1. A two-sided PCB circuit board structure of multilayer high density which characterized in that includes: a circuit board body (1); the top of the circuit board body (1) is provided with a rectangular frame groove structure; a positioning rod (2) is arranged at the top of the circuit board body (1); the top of the circuit board body (1) is provided with a cover plate (3); circuit board body (1) still including:
the radiating fin (101), radiating fin (101) adopt the rectangular plate structure, and radiating fin (101) are fixed in the outside all around of circuit board body (1) in the form of rectangular array.
2. A multi-layer high-density double-sided PCB circuit board structure as claimed in claim 1, wherein: the positioning rods (2) adopt a cylindrical structure, four groups of the positioning rods (2) are arranged, and the four groups of the positioning rods (2) are fixedly arranged at the top of the circuit board body (1) in a rectangular array shape; the locating rod (2) also comprises:
dead lever (201), dead lever (201) adopt cylindrical structure, and dead lever (201) are fixed to be set up in the top of locating lever (2), and the outside cover of dead lever (201) is equipped with the spring.
3. A multi-layer high-density double-sided PCB circuit board structure as claimed in claim 2, wherein: the locating rod (2) further comprises:
the top of the sliding block (202) is provided with a through circular groove hole, and the sliding block (202) is arranged outside the fixed rod (201) in a sliding manner;
and the baffle plates (203) are rotatably arranged on two sides of the sliding block (202) through hinged connection.
4. A multi-layer high-density double-sided PCB circuit board structure as claimed in claim 1, wherein: the cover plate (3) is fixedly arranged at the top of the circuit board body (1), the bottom of the cover plate (3) is clamped with the rectangular frame groove at the top of the circuit board body (1), and four groups of penetrating circular grooves are formed in the periphery of the top of the cover plate (3) in a rectangular array shape; the top of the cover plate (3) is provided with a key position groove (4).
5. A multi-layer high-density double-sided PCB circuit board structure as claimed in claim 4, wherein: the cover plate (3) further comprises:
the heat dissipation holes (301), the heat dissipation holes (301) penetrate through the top of the cover plate (3) in a rectangular array shape;
the filter screen (302), filter screen (302) fixed set up in the bottom inboard of cover plate (3).
6. A multi-layer high-density double-sided PCB circuit board structure as claimed in claim 4, wherein: the key position grooves (4) are fixedly arranged on the top of the cover plate (3) in a rectangular array shape; the key position groove (4) also comprises:
the reset piece (401) adopts a spring structure, and the reset piece (401) is fixedly arranged at the top of the key position groove (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122410879.5U CN215956719U (en) | 2021-10-08 | 2021-10-08 | Double-sided PCB circuit board structure of multilayer high density |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122410879.5U CN215956719U (en) | 2021-10-08 | 2021-10-08 | Double-sided PCB circuit board structure of multilayer high density |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215956719U true CN215956719U (en) | 2022-03-04 |
Family
ID=80425262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122410879.5U Active CN215956719U (en) | 2021-10-08 | 2021-10-08 | Double-sided PCB circuit board structure of multilayer high density |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215956719U (en) |
-
2021
- 2021-10-08 CN CN202122410879.5U patent/CN215956719U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN215956719U (en) | Double-sided PCB circuit board structure of multilayer high density | |
| CN210534253U (en) | Signal fault alarm device | |
| CN219802360U (en) | Dustproof router | |
| CN115243498A (en) | Multi-functional mobile internet rack structure | |
| CN219872261U (en) | Mainboard fixer | |
| CN207969080U (en) | One kind is anti-to stick up heat radiation type PCB heat board | |
| CN210895199U (en) | Computer mainboard mounting structure | |
| CN212208168U (en) | Changeable server machine case of volume | |
| CN220368365U (en) | Novel switch board case | |
| CN214481054U (en) | Wireless communication module based on CAT4 | |
| CN216218383U (en) | High-precision equipment positioning system based on NBIOT/Lora communication | |
| CN217333840U (en) | High-temperature-resistant tubular motor capacitor | |
| CN214849707U (en) | Server room switch board | |
| CN214177875U (en) | Box convenient to heat dissipation and information acquisition terminal using same | |
| CN216212889U (en) | Anti-interference capacitor | |
| CN213990772U (en) | Camera module and terminal equipment | |
| CN219960611U (en) | POE switch with electric assembly protection function | |
| CN215500056U (en) | Dustproof circuit board | |
| CN220493211U (en) | HDI high density PCB board | |
| CN216649842U (en) | Television mainboard integrated by multiple modules | |
| CN216532152U (en) | High-power blade power supply realized by adopting series resonance topology | |
| CN218352801U (en) | Circuit board that crushing resistance is high | |
| CN217603737U (en) | Folding heat dissipation support of portable computer | |
| CN204028759U (en) | A kind of terminal server | |
| CN219304853U (en) | Computer network router mount |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231218 Address after: 528306, 4th Floor, Building 1, No. 16 Xinfa Road, Rongli Community, Ronggui Street, Shunde District, Foshan City, Guangdong Province (Residence Declaration) Patentee after: Foshan Pushcheng Electronics Co.,Ltd. Address before: 528000 5 / F, No. 8, Zone 8, Rongshan Industrial Zone, Ronggang Road, Ronggui Desheng neighborhood committee, Shunde District, Foshan City, Guangdong Province Patentee before: Foshan Guixin electronic appliance manufacturing Co.,Ltd. |
|
| TR01 | Transfer of patent right |