CN215955306U

CN215955306U - Light Emitting Diode (LED) chip

Info

Publication number: CN215955306U
Application number: CN202121540494.4U
Authority: CN
Inventors: 王永彪
Original assignee: Nanjing Canjing Photoelectric Technology Co ltd
Current assignee: Nanjing Canjing Photoelectric Technology Co ltd
Priority date: 2021-07-07
Filing date: 2021-07-07
Publication date: 2022-03-04
Anticipated expiration: 2031-07-07

Abstract

The utility model discloses a light-emitting diode (LED) chip, which relates to the field of electronic devices and comprises a diode wafer and a substrate, wherein the top surface of the substrate is provided with a placing groove matched with the diode wafer in shape, the diode wafer is positioned in the placing groove, and two opposite vertical groove walls of the placing groove are provided with fixing devices for fixing the diode wafer; the electrode grooves are formed in the vertical side walls, adjacent to the fixing device, of the placing groove, electrode pins extend from the two side walls of the diode wafer, the electrode pins are located in the electrode grooves, the diode wafer and the substrate in the device are detachably connected, when damage occurs, only the damaged part can be replaced, and resources are saved.

Description

Light Emitting Diode (LED) chip

Technical Field

The utility model relates to the field of electronic devices, in particular to a light-emitting diode (LED) chip.

Background

With the rapid development of LED technology and the gradual improvement of LED lighting effect, the application of LED will be more and more extensive, with the increasing severity of the problem of global energy shortage, people will pay more and more attention to the development prospect of LED in the lighting market, LED will be a solid semiconductor device which replaces the potential light source of incandescent lamp, tungsten lamp and fluorescent lamp, it is a semiconductor wafer, the wafer is attached on a substrate, one end is the negative pole, the other end connects the positive pole of the power, make the whole wafer encapsulated by epoxy resin; however, due to the technology of the LED lamp, the cost of the LED lamp is higher than that of the conventional lamp, the cost is collectively increased by a light source, a radiator, a power supply, a high-transmittance lampshade and the like, the heart of the LED lamp is located in an LED chip, the improvement and the price reduction of the chip technology are the key for promoting the reduction of the application cost of LED illumination, the size of the chip is very small, problems are easy to occur during production and installation, and if any small part of the chip is in a problem, the whole chip is scrapped.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects in the prior art, the utility model provides the light-emitting diode LED chip, which can enable the diode wafer to be detachably connected with the substrate, only the problem part needs to be replaced when the problem occurs, and the resource is saved.

In order to achieve the purpose, the utility model provides the following technical scheme:

a Light Emitting Diode (LED) chip comprises a diode wafer and a substrate, wherein the top surface of the substrate is provided with a placing groove matched with the diode wafer in shape, the diode wafer is positioned in the placing groove, and two opposite vertical groove walls of the placing groove are provided with fixing devices for fixing the diode wafer; the electrode groove is formed in the vertical side wall, adjacent to the fixing device, of the placing groove, electrode pins extend from the two side walls of the diode wafer, and the electrode pins are located in the electrode groove.

By adopting the technical scheme, the convenience of the use of the diagnosis tester is ensured.

Preferably, the fixing device comprises a telescopic groove formed in the substrate, the telescopic groove is communicated with the placing groove and the outside, the telescopic groove is close to the vertical side wall of the placing groove, springs are fixedly connected to the vertical side wall of the placing groove in a symmetrical mode, the other ends of the springs are fixedly connected with pull blocks, and the surfaces of the pull blocks, close to the placing groove, of the pull blocks are fixedly connected with fixing blocks extending to the fixing blocks in the placing groove.

Preferably, the part of the diode wafer contacting the fixed block is recessed with an interference groove.

Preferably, the surface of the pull block far away from the placing groove is flush with the outer wall of the substrate, and a pull groove is formed in the pull block.

Preferably, the two vertical side walls of the electrode tank are fixedly connected with inverted V-shaped metal sheets.

Preferably, the bottom surface of the placing groove is provided with an uneven arc curved surface, and a plurality of leakage holes are formed in the bottom surface of the placing groove.

Compared with the prior art, the utility model has the following beneficial effects: the diode wafer is detachably connected in the placing groove, and is stably connected through the fixing device for use; when producing the damage, only need open fixing device, with both separation, separately detect the part, change the part that goes wrong, the problem-free still continues to use, can save the resource of preparation part, reduce cost simultaneously.

Drawings

The utility model is preferably described below with reference to the accompanying drawings:

FIG. 1 is a top view of the present invention;

fig. 2 is a right side view of the present invention.

Labeled as: 1. a diode wafer; 2. a substrate; 3. a placement groove; 4. an electrode tank; 5. an electrode pin; 6. a telescopic groove; 7. a spring; 8. pulling the block; 9. a fixed block; 10. a contact groove; 11. groove drawing; 12. a metal sheet; 13. and (4) a leak hole.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

A Light Emitting Diode (LED) chip comprises a diode wafer 1 and a substrate 2, wherein the top surface of the substrate 2 is provided with a placing groove 3 matched with the diode wafer 1 in shape, the diode wafer 1 is positioned in the placing groove 3, and two opposite vertical groove walls of the placing groove 3 are provided with fixing devices for fixing the diode wafer 1; electrode grooves 4 are formed in the vertical side walls, adjacent to the fixing device, of the placing groove 3, electrode pins 5 extend from the two side walls of the diode wafer 1, and the electrode pins 5 are located in the electrode grooves 4.

As shown in fig. 1-2, an external power source is connected to the positive and negative electrodes on the substrate 2, a connection circuit is provided in the substrate 2 to electrically connect the positive and negative electrodes on the substrate 2 with the electrode grooves 4, and when the diode chip 1 is mounted in the placement groove 3, the diode chip can be electrically connected with the electrode pins 5 on the two side walls of the diode; when the diode wafer 1 is installed in the placing groove 3, the fixing device is started to fix the two together, so that the two are prevented from falling off in use and influencing the use of equipment.

As shown in fig. 1-2, the fixing device includes a telescopic slot 6 formed inside the substrate 2, the telescopic slot 6 is communicated with the placing slot 3 and the outside, springs 7 symmetrically arranged relative to each other are fixedly connected to the vertical side wall of the telescopic slot 6 close to the placing slot 3, pull blocks 8 are fixedly connected to the other ends of the two springs 7, and fixing blocks 9 extending into the placing slot 3 are fixedly connected to the surfaces of the pull blocks 8 close to the placing slot 3.

As shown in fig. 1-2, when the diode chip 1 is to be mounted in the placing slot 3, the pulling block 8 is first applied with force, so that the spring 7 is elongated, the pulling block 8 is pulled out of the telescopic slot 6, and the fixing block 9 fixedly connected with the pulling block is driven to move towards the direction far away from the placing slot 3, until the fixing block 9 is completely moved out of the placing slot 3, the diode chip 1 is placed in the placing slot 3, at this time, the pulling block 8 is released, the pulling block 8 returns to the original position due to the restoring force of the spring 7, and moves towards the placing slot 3, so that the fixing block 9 also moves towards the placing slot 3, and applies force to the diode chip 1 when contacting with the diode chip 1, and because the fixing devices are arranged at the two opposite sides of the placing slot 3, the diode chip 1 can be fixed in the placing slot 3 by applying opposite force.

As shown in fig. 1, the contact portion of the diode chip 1 with the fixing block 9 is recessed with an interference groove 10.

As shown in fig. 1, in order to make the fixed block 9 hold the diode chip 1 more stably, an interference groove 10 is formed, and when the fixed block 9 moves toward the placing groove 3 under the action of the spring 7, the part of the fixed block 9 located in the placing groove 3 is located right in the interference groove 10, so that the fixed block 9 is abutted not only in the horizontal direction, but also in a state that the whole chip is turned upside down, so that stable holding can be performed.

As shown in fig. 2, in order to facilitate pulling the pulling block 8 out of the telescopic slot 6 by applying force, a pulling slot 11 is formed in a surface of the pulling block 8 away from the placing slot 3, flush with the outer wall of the substrate 2, and recessed therein.

As shown in fig. 1-2, the two vertical side walls of the electrode tank 4 are fixedly connected with inverted V-shaped metal sheets 12.

As shown in fig. 1-2, the metal sheet 12 has a V-shape, which is elastically compressible, so that the metal sheet 12 can clamp the electrode pin 5 in the electrode groove 4 and make electrical connection.

As shown in fig. 2, the bottom surface of the placing groove 3 is provided with an uneven arc curved surface, and a plurality of weep holes 13 are formed in the bottom surface of the placing groove 3.

As shown in fig. 2, when the current flows through the diode wafer 1, heat is generated, the bottom of the placing groove 3 is uneven, a certain gap exists, air is circulated, the heat can be easily dissipated from the leakage hole 13 through the air, the heat accumulation at the bottom of the diode wafer 1 is reduced, the damage caused by overhigh temperature during use is avoided, and the possibility of chip damage is reduced.

The present invention is not limited to the above embodiments, and any alternative or modification to solve the above problems is also within the scope of the present invention.

Claims

1. A light emitting diode, LED, chip comprising a diode wafer (1) and a substrate (2), characterized in that: the top surface of the substrate (2) is provided with a placing groove (3) matched with the diode wafer (1) in shape, the diode wafer (1) is positioned in the placing groove (3), and two opposite vertical groove walls of the placing groove (3) are provided with fixing devices for fixing the diode wafer (1); the electrode groove (4) is formed in the vertical side wall, adjacent to the fixing device, of the placing groove (3), electrode pins (5) extend from the two side walls of the diode wafer (1), and the electrode pins (5) are located in the electrode groove (4).

2. The LED chip of claim 1, wherein: fixing device is including seting up in inside flexible groove (6) of substrate (2), flexible groove (6) with standing groove (3) and outside intercommunication, flexible groove (6) are close to spring (7) that fixedly connected with relative symmetry set up on the vertical lateral wall of standing groove (3), two the other end fixedly connected with of spring (7) draws piece (8), draw piece (8) to be close to fixedly connected with extends to fixed block (9) in standing groove (3) on the face of standing groove (3).

3. The LED chip of claim 2, wherein: and the part of the diode wafer (1) contacted with the fixed block (9) is recessed with an interference groove (10).

4. The LED chip of claim 2, wherein: the surface of the pull block (8) far away from the placing groove (3) is flush with the outer wall of the substrate (2), and a pull groove (11) is formed in the surface of the pull block.

5. The LED chip of claim 1, wherein: and the two vertical side walls of the electrode tank (4) are fixedly connected with inverted V-shaped metal sheets (12).

6. The LED chip of claim 1, wherein: the bottom surface of the placing groove (3) is set to be an uneven arc curved surface, and a plurality of leakage holes (13) are formed in the bottom surface of the placing groove (3).