CN215943505U - Novel die carrier with quick cooling function - Google Patents
Novel die carrier with quick cooling function Download PDFInfo
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- CN215943505U CN215943505U CN202121933708.4U CN202121933708U CN215943505U CN 215943505 U CN215943505 U CN 215943505U CN 202121933708 U CN202121933708 U CN 202121933708U CN 215943505 U CN215943505 U CN 215943505U
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Abstract
The utility model discloses a novel die carrier with a rapid cooling function, and relates to the technical field of die carriers. The novel die set with the rapid cooling function comprises a base, a guide post fixed on the base and a top seat fixed on the guide post, wherein a hydraulic cylinder is installed at the bottom of the top seat, the bottom of the hydraulic cylinder is connected with an upper die base, an upper die is arranged at the bottom of the upper die base, and the upper die base is connected to the guide post in a sliding manner; the upper part of the base is sequentially provided with a lower die holder and a lower die; the inside installation cavity that is equipped with of footstock, be equipped with the air-cooler in the installation cavity, the upper die base bottom is equipped with the air conditioning nozzle, air-cooler and air conditioning nozzle pass through the blast pipe and connect. According to the utility model, the cooling treatment can be carried out on the die by simultaneously matching the cooling liquid and the cold air, the die can be fully cooled during the stamping operation of the die, and the cooling effect of the die is improved.
Description
Technical Field
The utility model relates to the technical field of die carriers, in particular to a novel die carrier with a rapid cooling function.
Background
The die carrier is a device which combines and fixes all parts of the die according to a certain rule and position and enables the die to be shaped.
At present, some die frames can not be cooled down in time to the mould after using in the use, or the effect of cooling down is relatively poor, influences the normal operation of mould. How to solve the technical problem is the technical problem to be solved in the technical field of the current die carrier.
SUMMERY OF THE UTILITY MODEL
In view of the above technical problems, an embodiment of the present invention provides a novel mold frame with a rapid cooling function, so as to solve the problems in the background art.
The utility model provides the following technical scheme: a novel die carrier with a quick cooling function comprises a base, a guide post fixed on the base and a top seat fixed on the guide post, wherein a hydraulic cylinder is installed at the bottom of the top seat, the bottom of the hydraulic cylinder is connected with an upper die base, an upper die is arranged at the bottom of the upper die base, and the upper die base is connected to the guide post in a sliding manner; the upper part of the base is sequentially provided with a lower die holder and a lower die;
an installation cavity is formed in the top seat, an air cooler is arranged in the installation cavity, an air cooling nozzle is arranged at the bottom of the upper die seat, and the air cooler and the air cooling nozzle are connected through an air supply pipe; and a cooling pipe is arranged in the lower die base, and a cooling liquid inlet and a cooling liquid outlet which are connected with the cooling pipe are respectively arranged at two sides of the lower die base.
Preferably, the upper part of the base is provided with a buffer groove, and the lower die holder is arranged in the buffer groove; four corner positions of the lower die holder are provided with guide holes, the buffer groove is provided with guide rods which are matched with the guide holes to slide, and the guide rods are sleeved with buffer springs at positions between the lower die holder and the buffer groove.
Preferably, the cooling tube is S-shaped.
Preferably, the cooling liquid inlet is connected with a cooling liquid storage tank, the cooling liquid outlet is connected with a circulating water pump, and the circulating water pump is connected with the cooling liquid storage tank.
Preferably, the outer surfaces of the upper die base, the upper die, the lower die base and the lower die are coated with polyurethane anticorrosive materials.
Preferably, the side wall of the mounting cavity is provided with heat dissipation holes.
The novel die carrier with the rapid cooling function provided by the embodiment of the utility model has the following beneficial effects:
1. according to the utility model, the cooling treatment can be carried out on the die by simultaneously matching the cooling liquid and the cold air, the die can be fully cooled during the stamping operation of the die, and the cooling effect of the die is improved;
2. through the buffering connection structure who sets up die holder and base, can reduce the impact force of compound die in-process, avoid the impact force to cause the damage to the die carrier, prolonged the life of die carrier.
Drawings
Fig. 1 is a front view of the novel mold frame with a rapid cooling function according to the present invention;
FIG. 2 is a schematic cross-sectional view of the base and the lower die holder of the present invention;
FIG. 3 is a schematic top view of the lower die base of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by a person skilled in the art based on the embodiments of the present invention without any creative work belong to the protection scope of the present invention.
See fig. 1-3.
In view of the above mentioned problems in the background art, an embodiment of the present invention provides a novel mold frame with a rapid cooling function to solve the above mentioned technical problems, and the technical solution is as follows:
a novel die set with a quick cooling function comprises a base 140, a guide post 170 fixed on the base 140 and a top seat 110 fixed on the guide post 170, wherein a hydraulic cylinder 180 is installed at the bottom of the top seat 110, the bottom of the hydraulic cylinder 180 is connected with an upper die holder 120, an upper die 130 is arranged at the bottom of the upper die holder 120, and the upper die holder 120 is connected to the guide post 170 in a sliding manner; the upper part of the base 140 is sequentially provided with a lower die holder 150 and a lower die 160; the hydraulic cylinder 180 is operated to drive the upper die holder 120 and the upper die 130 to move downward close to the lower die 160, thereby completing the stamping operation.
An installation cavity 111 is formed in the top base 110, an air cooler 210 is arranged in the installation cavity 111, a cold air nozzle 230 is arranged at the bottom of the upper die base 120, and the air cooler 210 and the cold air nozzle 230 are connected through an air supply pipe 220; in the punching operation, the air cooler 210 operates, and the cool air prepared by the air cooler 210 is sprayed out from the cool air nozzle 230 through the air supply pipe 220 to cool the periphery of the lower mold 160 and the upper mold 130.
A cooling pipe 153 is arranged in the lower die holder 150, and a cooling liquid inlet 151 and a cooling liquid outlet 152 connected with the cooling pipe 153 are respectively arranged at two sides of the lower die holder 150; by providing the cooling pipe 153, the cooling liquid can be introduced into the cooling pipe 153 and circulated during the actual press work, thereby cooling the press die.
Preferably, a buffer groove 141 is formed in the upper portion of the base 140, and the lower die holder 150 is installed in the buffer groove 141; guide holes 155 are formed in four corner positions of the lower die holder 150, guide rods 156 which are matched with the guide holes 155 to slide are arranged on the buffer grooves 141, and buffer springs 157 are sleeved on the guide rods 156 at positions between the lower die holder 150 and the buffer grooves 141; the matched arrangement of the structures can reduce the impact force in the die closing process when the die closing operation is carried out, avoid the damage of the impact force to the die carrier and prolong the service life of the die carrier.
Preferably, the cooling pipe 153 is S-shaped; the S-shaped cooling pipe 153 is designed to extend the circulation path of the cooling fluid in the cooling pipe 153, thereby improving the cooling effect.
Preferably, the cooling liquid inlet 151 is connected to a cooling liquid storage tank, the cooling liquid outlet 152 is connected to a circulating water pump, and the circulating water pump is connected to the cooling liquid storage tank.
Preferably, the outer surfaces of the upper die holder 120, the upper die 130, the lower die holder 150 and the lower die 160 are coated with a polyurethane anticorrosive material; by coating and smearing the polyurethane anti-corrosion material, the upper die holder 120, the upper die 130, the lower die holder 150 and the lower die 160 can be effectively prevented from being corroded, moistened, rusted and the like under the long-term blowing of cold air.
Preferably, the side wall of the mounting cavity 111 is provided with heat dissipation holes, so that heat dissipation of the air cooler 210 in the mounting cavity 111 of the top seat 110 is facilitated.
The utility model discloses a novel die carrier using method with a quick cooling function, which comprises the following steps: when the cooling device is used, the cooling pipe 153 can be connected with the cooling liquid storage tank and the circulating water pump through the cooling liquid inlet 151 and the cooling liquid outlet 152, so that cooling liquid flows in the cooling pipe 153 inside the lower die holder 150 in a circulating manner to cool the die; meanwhile, the air cooler 210 works, and cold air prepared by the air cooler 210 is sprayed out of the cold air nozzle 230 through the air supply pipe 220 to cool the periphery of the lower die 160 and the upper die 130, so that the cooling effect is enhanced; the cooling liquid is matched with cold air to work, and the temperature of the die can be fully reduced and cooled during the stamping operation of the die.
The novel die carrier with the rapid cooling function provided by the embodiment of the utility model has the following beneficial effects: according to the utility model, the cooling treatment can be carried out on the die by simultaneously matching the cooling liquid and the cold air, the die can be fully cooled during the stamping operation of the die, and the cooling effect of the die is improved; through the buffering connection structure who sets up die holder and base, can reduce the impact force of compound die in-process, avoid the impact force to cause the damage to the die carrier, prolonged the life of die carrier.
The above-described embodiments of the apparatus are merely illustrative, and the units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "disposed," "connected," "secured," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communication between two elements or interaction relationship between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations.
It should be understood that the technical solutions and concepts of the present invention may be equally replaced or changed by those skilled in the art, and all such changes or substitutions should fall within the protection scope of the appended claims.
Claims (6)
1. A novel die carrier with a quick cooling function comprises a base, a guide post fixed on the base and a top seat fixed on the guide post, and is characterized in that a hydraulic cylinder is installed at the bottom of the top seat, the bottom of the hydraulic cylinder is connected with an upper die base, an upper die is arranged at the bottom of the upper die base, and the upper die base is connected to the guide post in a sliding manner; the upper part of the base is sequentially provided with a lower die holder and a lower die;
an installation cavity is formed in the top seat, an air cooler is arranged in the installation cavity, an air cooling nozzle is arranged at the bottom of the upper die seat, and the air cooler and the air cooling nozzle are connected through an air supply pipe; and a cooling pipe is arranged in the lower die base, and a cooling liquid inlet and a cooling liquid outlet which are connected with the cooling pipe are respectively arranged at two sides of the lower die base.
2. The novel die carrier with the rapid cooling function as claimed in claim 1, wherein a buffer groove is formed in the upper part of the base, and the lower die holder is installed in the buffer groove; four corner positions of the lower die holder are provided with guide holes, the buffer groove is provided with guide rods which are matched with the guide holes to slide, and the guide rods are sleeved with buffer springs at positions between the lower die holder and the buffer groove.
3. The novel formwork with rapid cooling function as claimed in claim 1, wherein the cooling pipe is S-shaped.
4. The novel formwork with the rapid cooling function as claimed in claim 1, wherein the cooling liquid inlet is connected with a cooling liquid storage tank, the cooling liquid outlet is connected with a circulating water pump, and the circulating water pump is connected with the cooling liquid storage tank.
5. The novel die frame with the rapid cooling function as claimed in claim 1, wherein the outer surfaces of the upper die base, the upper die, the lower die base and the lower die are coated with polyurethane anticorrosive material.
6. The novel formwork support with rapid cooling function as claimed in claim 1, wherein the side wall of the installation cavity is provided with heat dissipation holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121933708.4U CN215943505U (en) | 2021-08-18 | 2021-08-18 | Novel die carrier with quick cooling function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121933708.4U CN215943505U (en) | 2021-08-18 | 2021-08-18 | Novel die carrier with quick cooling function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215943505U true CN215943505U (en) | 2022-03-04 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121933708.4U Active CN215943505U (en) | 2021-08-18 | 2021-08-18 | Novel die carrier with quick cooling function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215943505U (en) |
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2021
- 2021-08-18 CN CN202121933708.4U patent/CN215943505U/en active Active
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