CN215941844U

CN215941844U - Semiconductor laser packaging equipment

Info

Publication number: CN215941844U
Application number: CN202121747542.7U
Authority: CN
Inventors: 杨经纬
Original assignee: Shenzhen Ziwu Photoelectric Technology Co ltd
Current assignee: Shenzhen Ziwu Photoelectric Technology Co ltd
Priority date: 2021-07-29
Filing date: 2021-07-29
Publication date: 2022-03-04
Anticipated expiration: 2031-07-29

Abstract

The utility model discloses semiconductor laser packaging equipment which comprises a bearing plate, an optical fiber automatic angle-adjusting welding mechanism and a lens clamp, wherein a placing plate is fixedly connected to the upper end of the bearing plate, a clamping mechanism used for automatically clamping a laser is arranged on the bearing plate, the clamping mechanism comprises two moving plates which are connected to the bearing plate in a sliding mode, and a mounting groove is formed in the upper end of the bearing plate. The movable plate is arranged, so that the laser shell is automatically fixed and fixed, the automation degree of laser packaging is improved, the labor intensity of operators is reduced, the telescopic air bag and the top plate are arranged, the situation that the laser shell is too tightly clamped with the placing groove and is difficult to operate when being manually taken out is avoided, the difficulty in taking out the shell is reduced, the detachable baffle is arranged, the possibility that other instruments are collided in the process of taking out the laser shell is avoided, and the service life of the instruments is ensured.

Description

Semiconductor laser packaging equipment

Technical Field

The utility model relates to the technical field of semiconductor laser production equipment, in particular to semiconductor laser packaging equipment.

Background

The semiconductor laser is a device for amplifying long-distance transmission optical signals in the optical fiber communication industry, and is packaged by packaging equipment in the production process, wherein the packaging equipment comprises an optical fiber automatic angle-adjusting welding mechanism and a lens clamp.

The existing laser diode packaging equipment is fixed on a laser shell through manual operation, the concrete mode is that the bolt is screwed up, the two sides of the shell are clamped and fixed, and the shell is still required to be manually released and fixed after being fixedly packaged, so that the labor capacity of an operator is increased in the mode, the practicability of the device is reduced, and therefore, the problem is solved by designing the semiconductor laser diode packaging equipment.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defects in the prior art and provides semiconductor laser packaging equipment.

In order to achieve the purpose, the utility model adopts the following technical scheme:

the utility model provides a semiconductor laser packaging equipment, includes loading board, optic fibre automatic angle modulation welding mechanism and lens anchor clamps, the board is placed to loading board upper end fixedly connected with, be equipped with the fixture who is used for automatic centre gripping laser instrument on the loading board, fixture includes two movable plates of sliding connection at the loading board, the loading board upper end is equipped with the mounting groove, top fixedly connected with driving motor in the mounting groove, driving motor's output shaft fixedly connected with threaded rod, two sliding blocks have been cup jointed to the threaded rod lateral wall, sliding block upper end and adjacent movable plate lower extreme fixed connection, be equipped with the ejection mechanism who is used for ejecting assembly back laser instrument on the loading board.

Preferably, the ejection mechanism comprises a telescopic airbag fixedly connected to the bottom in the mounting groove, a placing groove is formed in the upper end of the placing plate, a through groove is formed in the lower end of the placing plate, the through groove is communicated with the placing groove, a top plate is connected to the inner wall of the through groove in a sliding mode, and the top plate is fixedly connected to the upper end of the telescopic airbag.

Preferably, the bearing plate lateral wall fixedly connected with solid fixed cylinder, be equipped with the piston in the solid fixed cylinder, be equipped with the communicating pipe rather than inside intercommunication on the solid fixed cylinder, the one end and the flexible gasbag intercommunication of solid fixed cylinder are kept away from to communicating pipe.

Preferably, the upper end of the piston is fixedly connected with a pressure rod penetrating through the upper end of the fixed cylinder, and the pressure rod is elastically connected with the upper end of the fixed cylinder through a return spring.

Preferably, the mounting groove inner wall fixedly connected with gag lever post, the gag lever post runs through two sliding block lateral walls, two the equal fixedly connected with of lateral wall that the movable plate is relative supports tight board.

Preferably, a slot is formed in the upper end of the bearing plate, a baffle is arranged in the slot, and a stop block is fixedly connected to the side wall of the baffle.

The utility model has the following beneficial effects:

1. the device is provided with a clamping mechanism, a driving motor is started, an output shaft of the driving motor drives a threaded rod to rotate, two sliding blocks drive a movable plate to move in opposite directions, two abutting plates automatically abut against two sides of a laser shell, and a stop block is matched for limiting the left side of the laser shell, so that the laser shell is firmly fixed;

2. the device is provided with the ejection mechanism, the pressure rod is pressed downwards, the pressure rod drives the piston to move downwards to press air into the telescopic air bag through the communicating pipe, the telescopic air bag extends to drive the top plate to move upwards to eject the laser shell out of the placing groove, the shell does not need to be taken out of the placing groove manually, the situation that the laser shell is too tightly clamped with the placing groove and is difficult to operate when the laser shell is taken out manually is avoided, and therefore the difficulty in taking out the shell is reduced;

3. the device is provided with the detachable baffle, the baffle is upwards extracted after the two movable plates are separated from the laser shell, and the pressing rod is downwards pressed, so that the laser shell can be extracted from the position of the baffle, the possibility that other instruments are collided in the process of taking out the laser shell is avoided, and the service life of the instrument is ensured.

Drawings

Fig. 1 is a schematic structural diagram of a semiconductor laser packaging device according to the present invention;

FIG. 2 is an enlarged view of the structure at A in FIG. 1;

FIG. 3 is an enlarged view of the structure at B in FIG. 1;

fig. 4 is an assembly view of a driving motor and a mounting groove of a semiconductor laser packaging device according to the present invention.

In the figure: the automatic angle-adjusting welding device comprises a bearing plate 1, an optical fiber automatic angle-adjusting welding mechanism 2, a lens clamp 3, a moving plate 4, a placing plate 5, a abutting plate 6, a sliding block 7, a threaded rod 8, a telescopic air bag 9, a communicating pipe 10, a limiting rod 11, a placing groove 12, a baffle 13, a baffle 14, a baffle 15, a slot 15, a piston 16, a fixed cylinder 17, a pressure rod 18 and a driving motor 19.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

Referring to fig. 1-4, a semiconductor laser packaging device comprises a bearing plate 1, an optical fiber automatic angle-adjusting welding mechanism 2 and a lens clamp 3, wherein a placing plate 5 is fixedly connected to the upper end of the bearing plate 1, a clamping mechanism for automatically clamping a laser is arranged on the bearing plate 1, the clamping mechanism comprises two movable plates 4 which are slidably connected to the bearing plate 1, a mounting groove is formed in the upper end of the bearing plate 1, a driving motor 19 is fixedly connected to the top of the mounting groove, a threaded rod 8 is fixedly connected to an output shaft of the driving motor 19, two sliding blocks 7 are sleeved on the side wall of the threaded rod 8, and the upper end of each sliding block 7 is fixedly connected to the lower end of the adjacent movable plate 4.

Be equipped with the ejection mechanism who is used for ejecting post-assembly laser instrument on loading board 1, ejection mechanism includes fixed connection at the flexible gasbag 9 of mounting groove bottom, places 5 upper ends of board and has seted up standing groove 12, places 5 lower extremes of board and has seted up logical groove, leads to groove and 12 intercommunications of standing groove, leads to inslot wall sliding connection and has the roof, roof and flexible gasbag 9 upper end fixed connection.

According to the utility model, a fixed cylinder 17 is fixedly connected to the side wall of the bearing plate 1, a piston 16 is arranged in the fixed cylinder 17, a communicating pipe 10 communicated with the inside of the fixed cylinder 17 is arranged on the fixed cylinder 17, one end, far away from the fixed cylinder 17, of the communicating pipe 10 is communicated with the telescopic airbag 9, a pressure rod 18 penetrating through the upper end of the fixed cylinder 17 is fixedly connected to the upper end of the piston 16, the pressure rod 18 is elastically connected with the upper end of the fixed cylinder 17 through a return spring, the piston 16 can move upwards under the elastic action of the spring due to the arrangement of the return spring, so that the telescopic airbag 9 can be contracted before the next laser housing is placed into the placing groove 12, and the top plate enters the through groove.

According to the utility model, the inner wall of the mounting groove is fixedly connected with the limiting rod 11, the limiting rod 11 penetrates through the side walls of the two sliding blocks 7, the opposite side walls of the two moving plates 4 are fixedly connected with the abutting plates 6, and the limiting rod 11 limits the movement of the sliding blocks 7, so that the sliding blocks 7 cannot rotate when the threaded rod 8 rotates.

According to the utility model, the slot 15 is formed in the upper end of the bearing plate 1, the baffle 13 is arranged in the slot 15, the baffle 14 is fixedly connected to the side wall of the baffle 13, and the baffle 13 is detachably arranged, so that the laser can be taken out more conveniently after the baffle 13 is taken down, and the damage of instruments on the bearing plate 1 in the laser taking-out process is avoided.

When the laser packaging device is used, the laser shell is placed in the placing groove 12, the driving motor 19 is started, the output shaft of the driving motor 19 drives the threaded rod 8 to rotate, the two sliding blocks 7 move oppositely under the limiting of the limiting rod 11, the two sliding blocks 7 drive the moving plate 4 to move oppositely, the two abutting plates 6 automatically abut against the two sides of the laser shell, and the limit of the stop block 14 on the left side of the laser shell is matched, so that the laser shell is firmly fixed, otherwise, the driving motor 19 is started, the output shaft of the driving motor 19 rotates reversely, and the two sliding blocks 7 drive the moving plate 4 to move in opposite directions to be separated from the laser shell, so that the laser shell is automatically fixed and fixed, the laser packaging automation degree is improved, and the labor intensity of operators is reduced;

after the two moving plates 4 are separated from the laser shell, the baffle 13 is upwards extracted, the pressing rod 18 is pressed downwards, the pressing rod 18 drives the piston 16 to move downwards to press air into the telescopic air bag 9 through the communicating pipe 10, the telescopic air bag 9 extends to drive the top plate to move upwards to eject the laser shell out of the placing groove 12, the laser shell can be extracted from the position of the baffle 13, the laser shell is taken out, the shell does not need to be manually taken out of the placing groove 12, the possibility that other instruments collide in the laser shell taking-out process is avoided while the taking-out difficulty is reduced, and the service life of the instruments is guaranteed.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical scope of the present invention and the equivalent alternatives or modifications thereof according to the technical solution and the practical idea of the present invention.

Claims

1. A semiconductor laser packaging device comprises a bearing plate (1), an optical fiber automatic angle-adjusting welding mechanism (2) and a lens clamp (3), it is characterized in that the upper end of the bearing plate (1) is fixedly connected with a placing plate (5), the bearing plate (1) is provided with a clamping mechanism for automatically clamping the laser, the clamping mechanism comprises two moving plates (4) which are connected with the bearing plate (1) in a sliding way, the upper end of the bearing plate (1) is provided with a mounting groove, the top in the mounting groove is fixedly connected with a driving motor (19), the output shaft of the driving motor (19) is fixedly connected with a threaded rod (8), the side wall of the threaded rod (8) is sleeved with two sliding blocks (7), the upper ends of the sliding blocks (7) are fixedly connected with the lower ends of the adjacent moving plates (4), and the bearing plate (1) is provided with an ejection mechanism for ejecting the assembled laser.

2. The semiconductor laser packaging device according to claim 1, wherein the ejection mechanism comprises a telescopic airbag (9) fixedly connected to the bottom of the mounting groove, a mounting groove (12) is formed in the upper end of the mounting plate (5), a through groove is formed in the lower end of the mounting plate (5), the through groove is communicated with the mounting groove (12), a top plate is slidably connected to the inner wall of the through groove, and the top plate is fixedly connected to the upper end of the telescopic airbag (9).

3. The semiconductor laser packaging device according to claim 2, wherein a fixed cylinder (17) is fixedly connected to a side wall of the bearing plate (1), a piston (16) is arranged in the fixed cylinder (17), a communicating pipe (10) communicated with the inside of the fixed cylinder (17) is arranged on the fixed cylinder (17), and one end, far away from the fixed cylinder (17), of the communicating pipe (10) is communicated with the telescopic airbag (9).

4. A semiconductor laser packaging device according to claim 3, wherein a pressure rod (18) penetrating the upper end of the fixed cylinder (17) is fixedly connected to the upper end of the piston (16), and the pressure rod (18) is elastically connected to the upper end of the fixed cylinder (17) through a return spring.

5. The semiconductor laser packaging device according to claim 1, wherein a limiting rod (11) is fixedly connected to an inner wall of the mounting groove, the limiting rod (11) penetrates through side walls of the two sliding blocks (7), and opposite side walls of the two moving plates (4) are fixedly connected with abutting plates (6).

6. The semiconductor laser packaging device according to claim 1, wherein a slot (15) is formed in an upper end of the carrier plate (1), a baffle (13) is disposed in the slot (15), and a stopper (14) is fixedly connected to a side wall of the baffle (13).