CN215933827U

CN215933827U - Coupling structure based on multilayer coupling, radio frequency circuit and electronic equipment

Info

Publication number: CN215933827U
Application number: CN202121594966.4U
Authority: CN
Inventors: 张子炎; 李旭东
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2021-07-12
Filing date: 2021-07-12
Publication date: 2022-03-01
Anticipated expiration: 2031-07-12

Abstract

The embodiment of the application discloses a coupling structure based on multilayer coupling, a radio frequency circuit and electronic equipment, and relates to the technical field of wireless communication. The coupling structure of an embodiment of the present application includes a first radiator, a second radiator, a first coupler, and a ground reference. The first coupling body is arranged between the first radiating body and the second radiating body. The second radiator is arranged between the first coupling body and the reference ground. The first radiator and the first coupling body form a first coupling channel. The second radiator and the first coupling body form a second coupling channel. The embodiment of the application can reduce the layout area of the coupler, and does not need to additionally increase a combiner, thereby optimizing the design of the coupler and reducing the layout area and the design cost of a radio frequency circuit in electronic equipment.

Description

Coupling structure based on multilayer coupling, radio frequency circuit and electronic equipment

Technical Field

The embodiment of the application relates to the technical field of wireless communication, in particular to a coupling structure based on multilayer coupling, a radio frequency circuit and electronic equipment.

Background

With the widespread application of multi-frequency multi-mode products, the multi-band-Input multi-Output (MIMO) specification brought by the fifth Generation Mobile Communication Technology (5G) standard and the Dual Connectivity (endec) requirement of the 4G radio access network and the 5G NR have resulted in hardware design of multi-frequency multi-mode multi-antenna for electronic devices. As the appearance of electronic devices becomes more and more delicate, the number of antennas becomes more and more, resulting in the occurrence of a plurality of main transmitting antennas corresponding to different frequency bands in radio frequency transmission. When the electronic device has a main transmitting antenna with multiple frequency bands, multiple coupling channels and couplers are needed, which causes the problems of excessive coupling channels and large occupied layout.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application discloses a coupling structure based on multilayer coupling, a radio frequency circuit and electronic equipment, so as to optimize the design of the radio frequency circuit.

The application discloses a coupling structure based on multilayer coupling in a first aspect, which comprises a first radiator, a second radiator, a first coupling body and a reference ground. The first coupling body is arranged between the first radiating body and the second radiating body. The second radiator is disposed between the first coupling body and the reference ground. The first radiator and the first coupling body form a first coupling channel. The second radiator and the first coupling body form a second coupling channel.

In this embodiment, the first coupling body is shared by the first coupling channel and the second coupling channel, so that the layout area of the coupler can be reduced, and an additional combiner is not required, thereby optimizing the design of the coupler, and reducing the layout area and the design cost of a radio frequency circuit in electronic equipment.

In one embodiment, the minimum intersection angle of the projection of the first radiator and the first coupling body on a plane is a, and a is greater than or equal to 0 and less than or equal to 90. The plane is a plane parallel to the reference ground.

In another embodiment, the minimum intersection angle of the projection of the second radiator and the first coupling body on the plane is b, and b is greater than or equal to 0 and less than or equal to 90.

In another embodiment, the magnitude of a is inversely related to the magnitude of the coupling degree of the first coupling channel.

In this embodiment, by rotating the first radiator or the first coupler, the size of a may be adjusted to adjust the overlapping area of the first radiator and the first coupler on the plane, so as to adjust the coupling parameter of the first coupling channel.

In another embodiment, the magnitude of b is inversely related to the magnitude of the coupling of the second coupling channel.

In this embodiment, by rotating the second radiator or the first coupler, the size of b can be adjusted to adjust the overlapping area of the second radiator and the first coupler on the plane, so as to adjust the coupling parameter of the second coupling channel.

In another embodiment, a cross angle of a projection of the first radiator and the second radiator on the plane is 90 degrees.

In this embodiment, projections of the first radiator and the second radiator on the plane are perpendicular to each other, so that mutual influence of the first radiator and the second radiator can be reduced.

In another embodiment, the first radiator is a microstrip line, and the second radiator and the first coupler are striplines.

In another embodiment, the coupling structure is a four-layer circuit board structure. The first radiator is arranged on a first layer of the four-layer circuit board, the first coupling body is arranged on a second layer of the four-layer circuit board, the second radiator is arranged on a third layer of the four-layer circuit board, and the second radiator is arranged on a fourth layer of the four-layer circuit board in a reference mode.

In another embodiment, the coupling structure further includes a third radiator and a second coupling body. The second coupling body is arranged between the second radiation body and the third radiation body. The third radiator is disposed between the second coupling body and the reference ground. And the second radiator and the second coupling body form a third coupling channel. And the third radiator and the second coupling body form a fourth coupling channel.

In this embodiment, the third coupling channel and the fourth coupling channel share the second coupling body, which can reduce the layout area of the coupler, thereby optimizing the design of the coupler and reducing the layout area and the design cost of the radio frequency circuit in the electronic device.

In another embodiment, the coupling directions of the second coupling channel and the third coupling channel are opposite.

In this embodiment, the second coupling channel and the third coupling channel adopt opposite coupling directions, so that the detection of the forward and reverse coupling power can be realized.

In another embodiment, the coupling structure is a six-layer circuit board structure. The first radiator set up in the first layer of six layers of circuit boards, the first coupling body set up in the second floor of six layers of circuit boards, the second radiator set up in the third layer of six layers of circuit boards, the second coupling body set up in the fourth layer of six layers of circuit boards, the third radiator set up in the fifth layer of six layers of circuit boards, set up with reference in the sixth layer of six layers of circuit boards.

The second aspect of the present application discloses another coupling structure based on multilayer coupling, which includes a first coupling body, a second coupling body, a radiator and a reference ground. The radiator is arranged between the first coupling body and the second coupling body, and the second coupling body is arranged between the radiator and the reference ground. The radiator and the first coupler form a first coupling channel, and the radiator and the second coupler form a second coupling channel.

In this embodiment, the first coupling channel and the second coupling channel share the radiator, so that the layout area of the coupler can be reduced, and an additional combiner is not required, thereby optimizing the design of the coupler, and reducing the layout area and the design cost of a radio frequency circuit in the electronic device.

In one embodiment, the coupling directions of the first coupling channel and the second coupling channel are opposite.

In this embodiment, the first coupling channel and the second coupling channel adopt opposite coupling directions, so that the detection of the forward and reverse coupling power can be realized.

In another embodiment, the minimum crossing angle of the projection of the radiator and the first coupling body on a plane is c, and the magnitude of c is in a negative correlation with the magnitude of the coupling degree of the first coupling channel. The plane is a plane parallel to the reference ground.

In this embodiment, by rotating a radiator or a first coupling body, a value of a minimum intersection angle c of projections of the radiator and the first coupling body on the plane may be adjusted to adjust an overlapping area of the radiator and the first coupling body on the plane, so as to adjust a coupling parameter of a first coupling channel.

In another embodiment, the minimum crossing angle of the projection of the radiator and the second coupling body on the plane is d, and the magnitude of d is in a negative correlation with the magnitude of the coupling degree of the second coupling channel.

In this embodiment, by rotating a radiator or a second coupling body, a value of a minimum intersection angle d of projections of the radiator and the second coupling body on the plane may be adjusted to adjust an overlapping area of the radiator and the second coupling body on the plane, so as to adjust a coupling parameter of a second coupling channel.

In another embodiment, the coupling structure is a four-layer circuit board structure. The first coupling body is arranged on a first layer of the four-layer circuit board, the radiator is arranged on a second layer of the four-layer circuit board, the second coupling body is arranged on a third layer of the four-layer circuit board, and the second coupling body is arranged on a fourth layer of the four-layer circuit board in a reference mode.

In a third aspect of the present application, a radio frequency circuit is disclosed, comprising any one of the coupling structures described above.

A fourth aspect of the present application discloses an electronic device comprising a radio frequency circuit, the radio frequency circuit comprising any one of the coupling structures described above.

For technical effects brought by the third aspect to the fourth aspect of the present application, reference may be made to the description of the coupling structures of the first aspect and the second aspect, and details are not repeated here.

Drawings

Fig. 1 is a circuit diagram of a radio frequency circuit according to an embodiment of the present application.

Fig. 2 is a circuit diagram of a radio frequency circuit according to another embodiment of the present application.

Fig. 3 is a diagram of an application scenario of a coupler according to an embodiment of the present application.

Fig. 4 is a diagram of an application scenario of a coupler according to another embodiment of the present application.

Fig. 5 is a diagram of an application scenario of a coupler according to another embodiment of the present application.

Fig. 6 is a schematic structural diagram of a coupling structure according to an embodiment of the present application.

Fig. 7 is a schematic projection diagram of a coupling structure according to an embodiment of the present application.

Fig. 8 is a simulation diagram of a coupling structure according to an embodiment of the present application.

Fig. 9 is a simulation diagram of a coupling structure according to another embodiment of the present application.

Fig. 10 is a schematic structural diagram of a coupling structure according to another embodiment of the present application.

Fig. 11 is a schematic structural diagram of a coupling structure according to another embodiment of the present application.

Detailed Description

In order that the above objects, features and advantages of the present application can be more clearly understood, a detailed description of the present application will be given below with reference to the accompanying drawings and specific embodiments. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict. In the following description, numerous specific details are set forth to provide a thorough understanding of the present application, and the described embodiments are merely a subset of the embodiments of the present application and are not intended to be a complete embodiment.

In the embodiments of the present application, "at least one" means one or more, "and" a plurality "means two or more. "and/or" describes an association relationship of associated objects, meaning that three relationships may exist, e.g., A and/or B may represent: a exists alone, A and B exist simultaneously, and B exists alone, wherein A and B can be singular or plural. The terms "first," "second," "third," "fourth," and the like in the description and in the claims and drawings of the present application, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.

Fig. 1 is a circuit diagram of an rf circuit 100 according to an embodiment of the present application.

Referring to fig. 1, the rf circuit 100 includes a modem 110, an amplifier 120, a filter 130, a coupler 140, and an antenna 150. The modem 110 is electrically connected to the amplifier 120 and the coupler 140. The amplifier 120 is electrically connected to the modem 110 and the filter 130. The coupler 140 is electrically connected to the modem 110, the filter 130, and the antenna 150.

The modem 110, the amplifier 120, the filter 130, the coupler 140, and the antenna 150 are connected to form a transmission channel. The coupler 140 and the modem 110 are connected to form a coupling channel.

The signal output from the modem 110 is transmitted to the coupler 140 via the amplifier 120 and the filter 130. The coupler 140 outputs two signals. The first signal output by the coupler 140 is transmitted to the antenna 150, and is radiated by the antenna 150. The second signal output by the coupler 140 is coupled to the modem 110 to implement feedback control of the transmission power.

Wherein the coupler 140 can couple a portion of the power on the transmit channel back to the modem 110. The modem 110 can determine the transmit power of the electronic device based on the change in the feedback power.

In a linear system, in order to improve the capacity and communication quality of a base station, a high requirement is imposed on the power control accuracy of an electronic device. Therefore, the electronic device may couple the transmission power on the transmission channel using the coupler 140, and feed back the coupled power to the modem 110, so that the feedback control of the transmission power may be implemented because the coupled power obtained by the coupling channel has a positive correlation with the transmission power of the antenna 150.

Fig. 2 is a circuit diagram of an rf circuit 200 according to another embodiment of the present application.

Referring to fig. 2, the rf circuit 200 includes a modem 210, a first amplifier 221, a second amplifier 222, a first filter 231, a second filter 232, a third filter 233, a first coupler 241, a second coupler 242, a third coupler 243, a first antenna 251, a second antenna 252, a third antenna 253, and a combiner 260. The modem 210 is electrically connected to the first amplifier 221, the second amplifier 222, and the combiner 260. The first amplifier 221 is electrically connected to the modem 210, the first filter 231, and the second filter 232. The second amplifier 222 is electrically connected to the modem 210 and the third filter 233. The first coupler 241 is electrically connected to the first filter 231, the combiner 260, and the first antenna 251. The second coupler 242 is electrically connected to the second filter 232, the combiner 260 and the second antenna 252. The third coupler 243 is electrically connected to the third filter 233, the combiner 260, and the third antenna 253.

The modem 210, the first amplifier 221, the first filter 231, the first coupler 241, and the first antenna 251 are connected to form a first transmission channel. The modem 210, the first amplifier 221, the second filter 232, the second coupler 242, and the second antenna 252 are connected to form a second transmission channel. The modem 210, the second amplifier 222, the third filter 233, the third coupler 243, and the third antenna 253 are connected to form a third transmission channel. The first coupler 241, the combiner 260 and the modem 210 are connected to form a first coupling channel. The second coupler 242, the combiner 260 and the modem 210 are connected to form a second coupling channel. The third coupler 243, the combiner 260 and the modem 210 are connected to form a third coupling channel.

The combiner 260 includes a multi-way selection switch, and the multi-way selection switch can be connected to any one of the first coupling channel, the second coupling channel, and the third coupling channel to access the coupling signal.

The modem 210 outputs two signals. The first path of signals output by the modem 210 is transmitted to the first amplifier 221, and the second path of signals output by the modem 210 is transmitted to the second amplifier 222. The first amplifier 221 outputs two signals. The first path of signal output by the first amplifier 221 is transmitted to the first coupler 241 through the first filter 231. The second path of signal output by the first amplifier 221 is transmitted to the second coupler 242 via the second filter 232. The signal output from the second amplifier 222 is transmitted to the third coupler 243 via the third filter 233. The first coupler 241 outputs two signals. The first path of signal output by the first coupler 241 is transmitted to the first antenna 251, and is radiated by the first antenna 251. The second path of signals output by the first coupler 241 is coupled to the combiner 260. The second coupler 242 outputs two signals. The first path of signal output by the second coupler 242 is transmitted to the second antenna 252, and is radiated by the second antenna 252. The second path of signals output by the second coupler 242 is coupled to the combiner 260. The third coupler 243 outputs two signals. The first path of signal output by the third coupler 243 is transmitted to the third antenna 253, and is radiated by the third antenna 253. The second path of signals output by the third coupler 243 is coupled to the combiner 260. The signal output from the combiner 260 is transmitted to the modem 210 to implement feedback control of the transmission power.

When the electronic device has a plurality of frequency band transmitting antennas, a plurality of coupling channels and couplers are needed, which results in excessive coupling channels, large occupied layout and additional combiner between the coupler and the modem.

For example, referring to fig. 3, the first coupler 341 and the second coupler 342 are connected in series, and a signal output from the first coupler 341 is coupled to the second coupler 342. The design of two couplers connected in series results in large layout area and affects the coupling degree and insertion loss of the couplers.

Referring to fig. 4, the first coupler 441 and the second coupler 442 are connected in parallel, and the frequency divider 410 is electrically connected to the first coupler 441 and the second coupler 442. The first signal output by the first coupler 441 and the second signal output by the second coupler 442 are both coupled to the frequency divider 410. The two couplers are in parallel connection, the frequency divider is adopted at the combining end, the requirement on the frequency of a coupling channel is met, the layout area is large, and the device cost is high.

Referring to fig. 5, the first coupler 541 and the second coupler 542 are connected in parallel, and the combiner 510 is electrically connected to the first coupler 541 and the second coupler 542. The first signal output by the first coupler 541 and the second signal output by the second coupler 542 are both coupled to the combiner 510. The design of two couplers connected in parallel, the combiner is adopted at the combining end, resulting in large layout area and high device cost.

Based on this, the application provides a coupling structure, radio frequency circuit and electronic equipment based on multilayer coupling, can reduce the coupling channel, reduces the layout area of coupler, does not need additionally to increase the path device to optimize the design of coupler, reduce the layout area and the design cost of radio frequency circuit in the electronic equipment.

Fig. 6 is a schematic structural diagram of a coupling structure 600 according to an embodiment of the present application.

Referring to fig. 6, the coupling structure 600 is a four-layer circuit board structure, and includes a first radiator 610, a second radiator 620, a coupling body 630 and a ground reference 640. The first radiator 610 is disposed on a first layer (i.e., a surface layer) of the four-layer circuit board, and the second radiator 620 is disposed on a third layer (i.e., an inner layer) of the four-layer circuit board. The coupling body 630 is disposed between the first radiator 610 and the second radiator 620, that is, the coupling body 630 is disposed on the second layer of the four-layer circuit board. The second radiator 620 is disposed between the coupling body 630 and the ground reference 640, i.e., the ground reference 640 is disposed on the fourth layer of the four-layer circuit board.

The coupling structure 600 is a 6-port element that can be equivalent to two parallel-connected directional couplers. Specifically, the coupling structure 600 includes a first input Port1 and a first output Port2, a coupled Port3 and an isolated Port4, and a second input Port5 and a second output Port 6. The first input Port1 and the first output Port2 are disposed at two opposite ends of the first radiator 610. Coupled Port3 and isolated Port4 are disposed at opposite ends of coupling body 230. The second input Port5 and the second output Port6 are disposed at opposite ends of the second radiator 620. The first radiator 610 and the coupling body 630 constitute a first coupling channel, which corresponds to a first directional coupler. The first radiator 610 corresponds to a main line of the first directional coupler, and the coupling body 630 corresponds to a sub line of the first directional coupler. The second radiator 620 and the coupling body 630 constitute a second coupling channel, which is equivalent to a second directional coupler. The second radiator 620 corresponds to a main line of the second directional coupler, and the coupling body 630 corresponds to a sub line of the second directional coupler. The first coupling channel and the second coupling channel share the coupling body 630, so that the layout area of the coupler can be reduced.

The directional coupler is a 4-port element which comprises an input port, an output port, a coupling port and an isolation port. The directional coupler includes a through line (main line) and a coupled line (sub line). A part (or all) of the power of the straight line is coupled into the coupling line through a certain coupling mechanism (such as a gap, a hole, a coupling line section and the like) between the straight line and the coupling line, and the power is required to be transmitted to a certain output port only in the coupling line, and no power is output from the other port, so that the input signal is distributed according to a certain power proportional relation.

In one embodiment, the first radiator 610 may be a microstrip line, and the second radiator 620 and the coupling body 630 may be striplines. In the microstrip line, the transmission speed of signals is high and the loss is small. In the strip line, the transmission reliability of the signal is high.

In one embodiment, the shapes of the first radiator 610, the second radiator 620 and the coupler 630 may be hexahedrons, cylinders, prisms or other regular shapes.

The reference ground 640 may be a portion of the electronic device that may be a virtual ground. For example, a Printed Circuit Board (PCB) in an electronic device or a metal back plate, a center frame, a display screen, etc. of an electronic device.

In one embodiment, the coupling parameters of the coupling structure 600 may be adjusted by rotating one or more of the first radiator 610, the second radiator 620 and the coupling body 630 to adjust the overlapping areas of the first radiator 610, the second radiator 620 and the coupling body 630 on the same projection plane. Wherein the projection plane is a plane parallel to the reference ground 640. The coupling parameters include coupling, insertion loss, isolation and directivity.

The coupling degree comprises a surface structure coupling degree and an inner structure coupling degree. The skin structure coupling degree is the ratio of the power of the coupled Port3 to the first input Port1, and can be expressed as S13 as shown in formula (1).

C₁＝10*lg(P_C/P_in1) (1)

Wherein, C₁Indicating the degree of coupling of the surface structure, P_CIndicating the power, P, of the coupled Port Port3_in1Representing the power of the first input Port 1.

The degree of inner-layer structural coupling refers to the ratio of the power of the coupled Port3 to the power of the second input Port5, and can be expressed as S53 as shown in equation (2).

C₂＝10*lg(P_C/P_in2) (2)

Wherein, C₂Indicates the degree of coupling of the inner layer structure, P_in2Indicating the power of the second input Port 5.

The insertion loss comprises surface layer line insertion loss and inner layer line insertion loss. The skin line loss is the ratio of the power of the first output Port2 to the power of the first input Port1, and can be expressed as S12 as shown in equation (3).

L₁＝10*lg(P_out1/P_in1) (3)

Wherein L is₁Indicating the insertion loss of surface layer wire, P_out1Indicating the power of the first output Port 2.

The inner line loss refers to the ratio of the power of the second output Port6 and the second input Port5, and can be expressed as S56 as shown in equation (4).

L₂＝10*lg(P_out2/P_in2) (4)

Wherein L is₂Denotes inner layer line insertion loss, P_out2Indicating the power of the second output Port 6.

The isolation includes input isolation, output isolation, input/output isolation and output/input isolation. The input isolation refers to the ratio of the power of the second input Port5 to the power of the first input Port1, and can be expressed as S15 as shown in equation (5).

I₁＝10*lg(P_in2/P_in1) (5)

Wherein, I₁Indicating input isolation.

The output Port isolation is the ratio of the power of the second output Port6 to the power of the first output Port2, and can be expressed as S26 as shown in equation (6).

I₂＝10*lg(P_out2/P_out1) (6)

Wherein, I₂Indicating the output isolation.

The input/output isolation refers to the ratio of the power of the second output Port6 to the first input Port1, and can be expressed as S16 as shown in equation (7).

I₃＝10*lg(P_out2/P_in1) (7)

Wherein, I₃Indicating input-output isolation.

The output-to-input isolation refers to the ratio of the power of the second input Port5 to the first output Port2, and can be expressed as S25 as shown in equation (8).

I₄＝10*lg(P_in2/P_out1) (8)

Wherein, I₄Indicating the degree of output-input isolation.

The directionality includes surface structure directionality and inner structure directionality. Skin structure directivity refers to the ratio of the power of the coupled Port3 to the first input Port1 minus the ratio of the power of the isolated Port4 to the first input Port1, as shown in equation (9), which can be expressed as S13-S14.

D₁＝10*lg(P_C/P_in1)-10*lg(P_D/P_in1)＝10*lg(P_C/P_D) (9)

Wherein D is₁Indicating the directionality of the surface structure, P_DIndicating the power of the isolated Port 4.

The inter-layer fabric directivity is the ratio of the power of the coupled Port3 and the second input Port5 minus the ratio of the power of the isolated Port4 and the second input Port5, as shown in equation (10), which can be expressed as S53-S54.

D₂＝10*lg(P_C/P_in2)-10*lg(P_D/P_in2)＝10*lg(P_C/P_D)(10)

Wherein D is₂Indicating the directionality of the inner layer structure.

Fig. 7 is a schematic projection diagram of a coupling structure 600 according to an embodiment of the present application.

Referring to fig. 7, the first radiator 610, the second radiator 620, and the coupling body 630 are projected on the same plane. The

projection areas

611 and 621 of the first radiator 610 and the second radiator 620 on the plane are both rectangular. The projection area 631 of the coupling body 630 on the plane is a central symmetrical shape, and the projection area 631 is approximately in the shape of letter "N", and two ends of the projection area are bent in two opposite directions respectively relative to the middle part. The minimum intersection angle between the projection area 611 of the first radiator 610 on the plane and the projection area 631 of the coupling body 630 on the plane is a, and a is greater than or equal to 0 and less than or equal to 90. The minimum crossing angle between the projection area 621 of the second radiator 620 on the plane and the projection area 631 of the coupling body 630 on the plane is b, and b is greater than or equal to 0 and less than or equal to 90.

In one embodiment, the size of a may be adjusted by rotating the first radiator 610 or the coupling body 630 to adjust the overlapping area of the first radiator 610 and the coupling body 630 on the plane, so as to adjust the coupling parameter of the first coupling channel.

Wherein, the value of a and the coupling degree of the first coupling channel are in a negative correlation relationship. That is, by decreasing the value of a, the degree of coupling of the first coupling channel can be increased.

For example, the relationship between the magnitude of the coupling degree and the magnitude of a can be verified through the following two sets of simulation experiments. In the two sets of simulation experiments, the power values of the ports of the coupling structure 600 may be detected, and then the coupling parameters of the coupling structure 600 may be obtained by calculation according to the above formulas (1) to (10).

Referring to fig. 8, fig. 8 shows a simulation diagram of a first set of simulation experiments. The T1 curve is a fitting curve of surface layer line insertion loss, the T2 curve is a fitting curve of inner layer line insertion loss, the T3 curve is a fitting curve of surface layer structure directivity, the T4 curve is a fitting curve of surface layer structure coupling degree, the T5 curve is a fitting curve of inner layer structure coupling degree, the T6 curve is a fitting curve of inner layer structure directivity, the T7 curve is a fitting curve of output end isolation degree, the T8 curve is a fitting curve of input end isolation degree, the T9 curve is a fitting curve of output input isolation degree, and the T10 curve is a fitting curve of input and output isolation degree. Wherein, the T2 curve is superposed with the T1 curve, the T8 curve is superposed with the T7 curve, and the T10 curve is superposed with the T9 curve. Table 1 shows the results of a first simulation experiment, which measured the coupling parameters of the coupling structure 600 at different operating frequencies. As can be seen from fig. 8 and table 1, the insertion loss of the surface layer line and the insertion loss of the inner layer line of the coupling structure 600 are equal, and the values are small and can be ignored. The input and output isolation of the coupling structure 600 is equal, and the input and output isolation is equal.

TABLE 1 results of the first set of simulation experiments

Coupling parameter (dB)	Port representation	700MHz	1700MHz	2700MHz
					Surface layer line insertion loss	S12	0.01	0.04	0.07
Inner layer line insertion loss	S56	0.01	0.04	0.07
					Degree of coupling of surface structure	S13	-33	-26	-22
Degree of coupling of inner layer structure	S53	-36.5	-29	-25.1
					Directionality of surface structure	S13-S14	-32	-24	-29
Directionality of inner layer structure	S53-S54	-37	-29.5	-25.6
					Degree of isolation of input terminal	S15	-45	-38	-34
Degree of isolation of output terminal	S26	-45	-38	-34
					Degree of input/output isolation	S16	-49	-41	-37
Degree of isolation between input and output	S25	-49	-41	-37

Referring to fig. 9, fig. 9 shows a simulation diagram of a second set of simulation experiments. The first simulation experiment and the second simulation experiment are different in that the second simulation experiment rotates the first radiator 610 clockwise by 5 degrees. The T11 curve is a fitting curve of surface layer line insertion loss, the T12 curve is a fitting curve of inner layer line insertion loss, the T13 curve is a fitting curve of surface layer structure directivity, the T14 curve is a fitting curve of surface layer structure coupling degree, the T15 curve is a fitting curve of inner layer structure coupling degree, the T16 curve is a fitting curve of inner layer structure directivity, the T17 curve is a fitting curve of input end isolation degree, the T18 curve is a fitting curve of output end isolation degree, the T19 curve is a fitting curve of input and output isolation degree, and the T20 curve is a fitting curve of output and input isolation degree. Wherein, the T12 curve is superposed with the T11 curve, the T18 curve is superposed with the T17 curve, and the T20 curve is superposed with the T19 curve. Table 2 shows the results of a second simulation experiment, which measured the coupling parameters of the coupling structure 600 at different operating frequencies. As can be seen from fig. 9 and table 2, the insertion loss of the surface layer line and the insertion loss of the inner layer line of the coupling structure 600 are equal, and the values are small and can be ignored. The input and output isolation of the coupling structure 600 is equal, and the input and output isolation is equal. The values of input isolation, output isolation, input output isolation and output input isolation are not shown in table 2.

TABLE 2 results of the second set of simulation experiments

Comparing fig. 8 and 9, it can be seen from table 1 and table 2 that, when the first radiator 610 is rotated clockwise by 5 degrees, the skin structure coupling degree of the coupling structure 600 is increased by 1.5dB, and other coupling parameters are substantially unchanged. Obviously, the above two sets of simulation experiments can verify that the coupling degree of the coupling structure 600 can be increased by reducing the value of a.

In another embodiment, the size of b may be adjusted by rotating the second radiator 620 or the coupling body 630 to adjust the overlapping area of the second radiator 620 and the coupling body 630 on the plane, thereby adjusting the coupling parameter of the second coupling channel.

Wherein, the value of b is in negative correlation with the coupling degree of the second coupling channel. That is, by reducing the value of b, the degree of coupling of the second coupling path can be increased.

In another embodiment, the sizes of a and b can be simultaneously changed by rotating the coupling body 630, thereby synchronously adjusting the coupling parameters of the first coupling channel and the second coupling channel.

In one embodiment, projections of the first radiator 610 and the second radiator 620 on the same plane are perpendicular to each other, so that mutual influence of the first radiator 610 and the second radiator 620 can be reduced.

Fig. 10 is a schematic structural diagram of a coupling structure 700 according to another embodiment of the present application. Coupling structure 700 is similar to coupling structure 600, except that coupling structure 700 adds a 1-layer coupler and a 1-layer radiator.

Referring to fig. 10, the coupling structure 700 is a six-layer circuit board structure, which includes a first radiator 710, a second radiator 720, a third radiator 730, a first coupler 740, a second coupler 750, and a ground reference 760. The first radiator 710 is disposed on a first layer (i.e., a surface layer) of the six-layer circuit board, the second radiator 720 is disposed on a third layer (i.e., a middle layer) of the six-layer circuit board, and the third radiator 730 is disposed on a fifth layer (i.e., a bottom layer) of the six-layer circuit board. The first coupler 740 is disposed between the first radiator 710 and the second radiator 720, that is, the first coupler 740 is disposed on the second layer of the six-layer circuit board. The second coupler 750 is disposed between the second radiator 720 and the third radiator 730, i.e., the second coupler 750 is disposed on the fourth layer of the six-layer circuit board. The third radiator 730 is disposed between the second coupling body 750 and the ground reference 760, i.e., the ground reference 760 is disposed on the sixth layer of the six-layer circuit board.

The coupling structure 700 is a 10-port element, which may be equivalent to four directional couplers. The coupling structure 700 includes a first input Port1 and a first output Port2, a first coupled Port3 and a first isolated Port4, a second input Port5 and a second output Port6, a second coupled Port7 and a second isolated Port8, and a third input Port9 and a third output Port 10. The first input Port1 and the first output Port2 are disposed at two opposite ends of the first radiator 710. The first coupling Port3 and the first isolation Port4 are disposed at opposite ends of the first coupling body 740. The second input Port5 and the second output Port6 are disposed at opposite ends of the second radiator 720. The second coupling Port7 and the second isolation Port8 are disposed at opposite ends of the second coupling body 750. The third input Port9 and the third output Port10 are disposed at opposite ends of the third radiator 730.

The first radiator 710 and the first coupler 740 form a first coupling channel, which is equivalent to a first directional coupler. The first radiator 710 corresponds to a main line of the first directional coupler, and the first coupling body 740 corresponds to a sub line of the first directional coupler. The second radiator 720 and the first coupler 740 form a second coupling channel, which is equivalent to a second directional coupler. The second radiator 720 corresponds to a main line of the second directional coupler, and the first coupling body 740 corresponds to a sub line of the second directional coupler. The second radiator 720 and the second coupling body 750 form a third coupling channel, which is equivalent to a third directional coupler. The second radiator 720 corresponds to a main line of the third directional coupler, and the second coupling body 750 corresponds to a sub line of the third directional coupler. The third radiator 730 and the second coupler 750 form a fourth coupling channel, which is equivalent to a fourth directional coupler. The third radiator 730 corresponds to a main line of the fourth directional coupler, and the second coupling body 750 corresponds to a sub line of the fourth directional coupler.

The second coupling channel and the third coupling channel are cascaded and are equivalent to a double-directional coupler. The double directional coupler comprises two cascaded directional couplers, and forward and reverse coupling power detection can be realized by adopting opposite coupling directions.

The first coupling channel and the second coupling channel share the first coupling body 740, and the third coupling channel and the fourth coupling channel share the second coupling body 750, so that the layout area of the coupler can be reduced.

In one embodiment, the first radiator 710 may be a microstrip line, and the second radiator 720, the third radiator 730, the first coupler 740, and the second coupler 750 may be striplines.

In one embodiment, the shapes of the first radiator 710, the second radiator 720, the third radiator 730, the first coupler 740, and the second coupler 750 may be hexahedrons, cylinders, prisms, or other regular shapes.

The reference ground 760 may be a portion of the electronic device that may be a virtual ground.

In one embodiment, the coupling parameters of the coupling structure 700 may be adjusted by rotating one or more of the first radiator 710, the second radiator 720, the third radiator 730, the first coupling body 740, and the second coupling body 750 to adjust the overlapping areas of the first radiator 710, the second radiator 720, the third radiator 730, the first coupling body 740, and the second coupling body 750 on the same projection plane. The projection plane is a plane parallel to the reference ground 760.

For a specific implementation of adjusting the coupling parameters of the coupling structure 700, reference may be made to the above description of the coupling structure 600, which is not described herein again.

Fig. 11 is a schematic structural diagram of a coupling structure 800 according to another embodiment of the present application. The coupling structure 800 is similar to the coupling structure 600 in structure, except that the coupling structure 800 replaces the radiator and the coupler with each other.

Referring to fig. 11, the coupling structure 800 is a four-layer circuit board structure, which includes a first coupling body 810, a second coupling body 820, a radiator 830 and a ground reference 840. The first coupling body 810 is disposed on a first layer (i.e., a surface layer) of the four-layer circuit board, and the second coupling body 820 is disposed on a third layer (i.e., an inner layer) of the four-layer circuit board. The radiator 830 is disposed between the first coupling body 810 and the second coupling body 820, that is, the radiator 830 is disposed on the second layer of the four-layer circuit board. The second coupling body 820 is disposed between the radiator 830 and the reference ground 840, i.e., the reference ground 840 is disposed on the fourth layer of the four-layer circuit board.

The coupling structure 800 is a 6-port element that can be equivalently a dual directional coupler. The coupling structure 800 includes a first coupled Port1 and a first isolated Port2, an input Port3 and an output Port4, and a second coupled Port5 and a second isolated Port 6. The first coupling Port1 and the first isolation Port2 are disposed at two opposite ends of the first coupling body 810. The input Port3 and the output Port4 are disposed at opposite ends of the radiator 830. A second coupling Port5 and a second isolation Port6 are disposed at opposite ends of the second coupling body 820. The radiator 830 and the first coupler 810 constitute a first coupling channel, which corresponds to a first directional coupler. The radiator 830 corresponds to a main line of the first directional coupler, and the first coupling body 810 corresponds to a sub line of the first directional coupler. The radiator 830 and the second coupling body 820 constitute a second coupling channel, which is equivalent to a second directional coupler. The radiator 830 corresponds to a main line of the second directional coupler, and the second coupling body 820 corresponds to a sub line of the second directional coupler.

The first coupling channel and the second coupling channel are cascaded, and are equivalent to a bidirectional coupler, and can perform forward coupling and reverse coupling on the radiator 830 at the same time. Moreover, the radiator 830 is shared by the first coupling channel and the second coupling channel, so that the layout area of the coupler can be reduced.

In one embodiment, the first coupling body 810 may be a microstrip line, and the second coupling body 820 and the radiator 830 may be striplines.

In one embodiment, the shapes of the first coupler 810, the second coupler 820 and the radiator 830 may be hexahedrons, cylinders, prisms or other regular shapes.

The reference ground 840 may be a portion of the electronic device that may be a virtual ground.

In one embodiment, the coupling parameters of the coupling structure 800 can be adjusted by rotating one or more of the first coupling body 810, the second coupling body 820 and the radiator 830 to adjust the overlapping areas of the first coupling body 810, the second coupling body 820 and the radiator 830 on the same projection plane. The projection plane is a plane parallel to the reference ground 840.

For example, the minimum intersection angle of the radiator 830 and the projection of the first coupling body 810 on the projection plane is c. And the value of c is in a negative correlation with the coupling degree of the first coupling channel. By rotating the radiator 830 and/or the first coupling body 810, the value of c can be adjusted, so as to adjust the coupling degree of the first coupling channel.

The minimum intersection angle of the radiator 830 and the projection of the second coupling body 820 on the projection plane is d. And the value of d and the coupling degree of the second coupling channel are in a negative correlation relationship. The value of d can be adjusted by rotating the radiator 830 and/or the second coupling body 820, so as to adjust the coupling degree of the second coupling channel.

For a specific implementation of adjusting the coupling parameters of the coupling structure 800, reference may be made to the above description of the coupling structure 600, which is not described herein again.

It will be appreciated that in other embodiments, the coupling structure may include more layers of radiators and couplers. Wherein, the multilayer radiator and the multilayer coupling body are arranged at intervals in a crossing way. That is, the coupling structure can be equivalent to N directional couplers, N is not less than 2 and N is a positive integer.

When the coupling structure includes more layers of radiators and couplers, attention needs to be paid to impedance transformation of each layer of the circuit board and the influence of the impedance transformation on the coupling degree because the distance between the reference ground and the surface layer of the circuit board is further.

The embodiment of the application also provides a radio frequency circuit, and the radio frequency circuit comprises the coupling structure of the embodiment of the application. For example, the radio frequency circuit may include any of the

coupling structures

600, 700, 800 described above.

For example, referring to fig. 3 again, the first coupler 341 and the second coupler 342 may be replaced with the coupling structure 600 or the coupling structure 800 of the embodiment of the present application, so as to reduce the layout area of the couplers to optimize the design of the rf circuit.

Referring again to fig. 4, the first coupler 441, the second coupler 442 and the frequency divider 410 may be replaced with the coupling structure 600 or the coupling structure 800 according to the embodiment of the present application, so as to reduce the layout area of the couplers and the frequency divider, thereby optimizing the design of the rf circuit.

Referring to fig. 5 again, the first coupler 541, the second coupler 542, and the combiner 510 may be replaced with the coupling structure 600 or the coupling structure 800 according to the embodiment of the present application, so as to reduce the layout area of the couplers and the combiner, thereby optimizing the design of the rf circuit.

The embodiment of the application also provides electronic equipment, and the electronic equipment comprises the radio frequency circuit.

The electronic device includes, but is not limited to, at least one of a smart phone, a tablet Computer, a Personal Computer (PC), an e-book reader, a workstation, a server, a Personal Digital Assistant (PDA), a Portable Multimedia Player (PMP), a mobile medical device, a camera, and a wearable device. The wearable Device includes at least one of an accessory type (e.g., watch, ring, bracelet, foot chain, necklace, glasses, contact lens, or Head-Mounted Device (HMD)), a fabric or garment integration type (e.g., electronic garment), a body-Mounted type (e.g., skin pad or tattoo), and a bio-implantable type (e.g., implantable circuitry).

The embodiments of the present application have been described in detail with reference to the drawings, but the present application is not limited to the embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present application.

Claims

1. A coupling structure based on multi-layer coupling is characterized in that the coupling structure comprises a first radiator, a second radiator, a first coupling body and a reference ground,

the first coupling body is arranged between the first radiating body and the second radiating body, and the second radiating body is arranged between the first coupling body and the reference ground;

the first radiator and the first coupler form a first coupling channel, and the second radiator and the first coupler form a second coupling channel.

2. The coupling structure of claim 1, wherein the minimum crossing angle of the projection of the first radiator and the first coupling body on a plane is a, 0 ≦ a ≦ 90,

the plane is a plane parallel to the reference ground.

3. The coupling structure of claim 2, wherein the minimum crossing angle of the projection of the second radiator and the first coupling body on the plane is b, and 0 ≦ b ≦ 90.

4. A coupling structure as claimed in claim 2 or 3, wherein the magnitude of a is inversely related to the magnitude of the degree of coupling of the first coupling channel.

5. The coupling structure of claim 3 wherein the magnitude of b is inversely related to the magnitude of the degree of coupling of said second coupling path.

6. The coupling structure according to any one of claims 2 to 5, wherein a cross angle of a projection of the first radiator and the second radiator on the plane is 90 degrees.

7. The coupling structure according to any one of claims 1 to 6, wherein the first radiator is a microstrip line, and the second radiator and the first coupling body are striplines.

8. The coupling structure according to any one of claims 1 to 7, wherein the coupling structure is a four-layer circuit board structure, the first radiator is disposed on a first layer of the four-layer circuit board, the first coupling body is disposed on a second layer of the four-layer circuit board, the second radiator is disposed on a third layer of the four-layer circuit board, and the ground reference is disposed on a fourth layer of the four-layer circuit board.

9. The coupling structure according to any one of claims 1 to 7, further comprising a third radiator and a second coupling body,

the second coupler is arranged between the second radiator and the third radiator, and the third radiator is arranged between the second coupler and the reference ground;

the second radiator and the second coupler form a third coupling channel, and the third radiator and the second coupler form a fourth coupling channel.

10. The coupling structure of claim 9, wherein the coupling directions of the second coupling channel and the third coupling channel are opposite.

11. The coupling structure according to claim 9 or 10, wherein the coupling structure is a six-layer circuit board structure, the first radiator is disposed on a first layer of the six-layer circuit board, the first coupling body is disposed on a second layer of the six-layer circuit board, the second radiator is disposed on a third layer of the six-layer circuit board, the second coupling body is disposed on a fourth layer of the six-layer circuit board, the third radiator is disposed on a fifth layer of the six-layer circuit board, and the reference ground is disposed on a sixth layer of the six-layer circuit board.

12. A coupling structure based on multi-layer coupling is characterized in that the coupling structure comprises a first coupling body, a second coupling body, a radiator and a reference ground,

the radiator is arranged between the first coupling body and the second coupling body, and the second coupling body is arranged between the radiator and the reference ground;

the radiator and the first coupler form a first coupling channel, and the radiator and the second coupler form a second coupling channel.

13. The coupling structure of claim 12, wherein the coupling directions of the first coupling channel and the second coupling channel are opposite.

14. The coupling structure according to claim 12 or 13, wherein the minimum crossing angle of the projection of the radiator and the first coupling body on a plane is c, the magnitude of c is inversely related to the magnitude of the coupling degree of the first coupling channel,

the plane is a plane parallel to the reference ground.

15. The coupling structure according to claim 14, wherein a minimum crossing angle of the projection of the radiator and the second coupling body on the plane is d, and a magnitude of d is inversely related to a magnitude of the coupling degree of the second coupling channel.

16. A coupling structure according to claim 14 or 15, wherein the angle of intersection of the projections of the first and second coupling bodies on the plane is 90 degrees.

17. The coupling structure according to any one of claims 12 to 16, wherein the first coupling body is a microstrip line, and the radiator and the second coupling body are striplines.

18. The coupling structure according to any one of claims 12 to 17, wherein the coupling structure is a four-layer circuit board structure, the first coupling body is disposed on a first layer of the four-layer circuit board, the radiator is disposed on a second layer of the four-layer circuit board, the second coupling body is disposed on a third layer of the four-layer circuit board, and the ground reference is disposed on a fourth layer of the four-layer circuit board.

19. A radio frequency circuit comprising a coupling structure as claimed in any one of claims 1 to 18.

20. An electronic device comprising radio frequency circuitry, characterized in that the radio frequency circuitry comprises a coupling structure according to any of claims 1 to 18.