CN215932568U - Thing networking singlechip that radiating effect is good - Google Patents
Thing networking singlechip that radiating effect is good Download PDFInfo
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- CN215932568U CN215932568U CN202122401298.5U CN202122401298U CN215932568U CN 215932568 U CN215932568 U CN 215932568U CN 202122401298 U CN202122401298 U CN 202122401298U CN 215932568 U CN215932568 U CN 215932568U
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- shell
- casing
- heat dissipation
- cushion
- singlechip
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- 230000006855 networking Effects 0.000 title claims description 6
- 230000017525 heat dissipation Effects 0.000 claims abstract description 42
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- 239000010949 copper Substances 0.000 claims description 16
- 238000009434 installation Methods 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 230000008901 benefit Effects 0.000 description 6
- 230000006870 function Effects 0.000 description 6
- 230000008859 change Effects 0.000 description 4
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- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
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- 229910052710 silicon Inorganic materials 0.000 description 1
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- 239000000725 suspension Substances 0.000 description 1
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Abstract
The utility model discloses an Internet of things single chip microcomputer with a good heat dissipation effect, which comprises a shell, wherein a power switch is movably mounted on the front surface of the shell, a rectangular groove is formed in the top of the shell, a supporting frame is fixedly mounted in the shell, a mounting groove is formed in the back surface of the shell, a cover plate is movably mounted in the mounting groove, and a fastening bolt is hinged to the top of the shell. Through the casing that sets up, when the casing is being removed, inside circuit board will vibrate and alleviate through first cushion and second cushion and damping spring, prevent because vibrate or fall the functional damage that produces, the security has been increased, the rectangular channel can provide certain field of vision window for transparent apron, can carry out firm in connection through fastening bolt when the apron is at mounting groove internally mounted, the installation that has increased the device is dismantled and the ability of maintaining, convenient to use.
Description
Technical Field
The utility model belongs to the technical field of single-chip microcomputers, and particularly relates to an Internet of things single-chip microcomputer with a good heat dissipation effect.
Background
The single chip microcomputer is an integrated circuit chip, which is a small and perfect microcomputer system formed by integrating a central processing unit CPU with data processing capacity, a random access memory RAM, a read only memory ROM, various I/O ports, interrupt systems, a timer/counter and other functions (possibly comprising a display driving circuit, a pulse width modulation circuit, an analog multiplexer, an A/D converter and other circuits) on a silicon chip by adopting a super-large scale integrated circuit technology, is widely applied in the field of industrial control, and is developed to the current 300M high-speed single chip microcomputer from 4-bit and 8-bit single chip microcomputers in the last 80 years.
The singlechip is used as a production tool to play an important role, the development of the singlechip is indirectly promoted along with the rise of the development of the society, but the calculation power and the power of the singlechip are relatively improved along with the increase of equipment of the Internet of things, and the existing singlechip cannot meet the high-power heat dissipation requirement, so certain inconvenience is possibly caused.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects in the prior art, the utility model aims to provide the Internet of things singlechip with a good heat dissipation effect, and solves the problem that the existing singlechip cannot meet the high-power heat dissipation requirement.
In order to achieve the purpose, the utility model provides the following technical scheme: an Internet of things single chip microcomputer with a good heat dissipation effect comprises a shell, wherein a power switch is movably mounted on the front side of the shell, a rectangular groove is formed in the top of the shell, a supporting frame is fixedly mounted in the shell, a mounting groove is formed in the back side of the shell, a cover plate is movably mounted in the mounting groove, a fastening bolt is hinged to the top of the shell, three connectors are movably mounted on the back side of the shell, a data interface is movably mounted on the back side of the shell, a power interface is movably mounted on the back side of the shell, two heat dissipation ports are formed in the back side of the shell, a heat dissipation fan is movably mounted in the shell, four sleeve columns are fixedly mounted at the bottom of the supporting frame, two damping springs are sleeved on the outer sides of the four sleeve columns, a first cushion is fixedly mounted at one end of each damping spring, and a second cushion is fixedly mounted at the other end of each damping spring, the circuit board is movably sleeved on the outer sides of the middle parts of the four sleeve columns, a heat conduction copper pipe is fixedly mounted at the bottom of the circuit board, one end of the heat conduction copper pipe is communicated with an inlet pipe, and the other end of the heat conduction copper pipe is communicated with an outlet pipe.
Preferably, four first anti-slip pads are fixedly mounted on one side of the shell, and four second anti-slip pads are fixedly mounted at the bottom of the shell.
Through adopting above-mentioned technical scheme, the advantage lies in making the singlechip operation more stable to can place the angle according to the user demand change, do not account for the space.
Preferably, the cover plate is located between the support frame and the shell, and the cover plate is of a transparent structure.
Through adopting above-mentioned technical scheme, the advantage lies in that the apron can provide certain field of vision for singlechip is inside, and the operation personnel of being convenient for observe inside operation condition reduces the dismantlement formula and maintains.
Preferably, the fastening bolt is hinged to penetrate through the shell and the cover plate and extends to the inner part of the support frame.
Through adopting above-mentioned technical scheme, the advantage lies in making to articulate between apron and the carriage and be connected closely, prevents the entering of dust, has increased the protectiveness.
Preferably, the position of the heat dissipation fan corresponds to the position of the heat dissipation port.
Through adopting above-mentioned technical scheme, the advantage lies in that two heat dissipation fans have increased radiating ability to the setting of hanging of cooperation circuit board makes the heat derive more evenly, prevents the heat siltation.
Preferably, the first cushion contacts with the outside of circuit board, the second cushion contacts with carriage and casing respectively, first cushion and the equal activity of second cushion cup joint in the outside of cover post.
Through adopting above-mentioned technical scheme, the advantage lies in first cushion and second cushion and damping spring and alleviates, prevents because vibrate or fall the functional damage that produces, has increased the security.
Preferably, the inlet pipe and the outlet pipe both penetrate through the housing and extend to the outside thereof.
Through adopting above-mentioned technical scheme, the advantage lies in advancing the pipe and can connecting the little water pump of circulation with the exit tube according to the demand, increases water-cooled alternative, need not install additional the change, only need the connecting tube can for the power of singlechip can increase to the biggest.
Compared with the prior art, the utility model has the beneficial effects that:
1. the heat dissipation fan through setting up takes out the heat that the chip of circuit board dispels, and the heat conduction copper pipe of circuit board bottom has two functions, and one of them derives the heat of circuit board, and the heat dissipation fan of being convenient for is taken out through the thermovent, and its two then is through advancing the external circulating water pump of pipe and exit tube, derives the heat of heat conduction copper inside pipe through rivers, and this scheme can further increase the heat-sinking capability of device, has increased the power that the singlechip was handled.
2. Through the casing that sets up, when the casing is being removed, inside circuit board will vibrate and alleviate through first cushion and second cushion and damping spring, prevent because vibrate or fall the functional damage that produces, the security has been increased, the rectangular channel can provide certain field of vision window for transparent apron, can carry out firm in connection through fastening bolt when the apron is at mounting groove internally mounted, the installation that has increased the device is dismantled and the ability of maintaining, convenient to use.
Drawings
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a schematic perspective view of the rear view of the present invention;
FIG. 3 is a schematic top cross-sectional view of the present invention;
FIG. 4 is a schematic bottom sectional view of the present invention;
FIG. 5 is a front sectional structural view of the present invention.
In the figure: 1. a housing; 2. a power switch; 3. fastening a bolt; 4. a cover plate; 5. a rectangular groove; 6. a first non-slip mat; 7. mounting grooves; 8. feeding a pipe; 9. a connecting port; 10. a data interface; 11. a heat dissipation port; 12. discharging a pipe; 13. a power interface; 14. a circuit board; 15. a heat dissipation fan; 16. sleeving a column; 17. a heat conducting copper pipe; 18. a support frame; 19. a second non-slip mat; 20. a damping spring; 21. a first cushion; 22. a second cushion.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1-5, an internet of things singlechip with good heat dissipation effect comprises a shell 1, a power switch 2 is movably mounted on the front surface of the shell 1, a rectangular groove 5 is formed in the top of the shell 1, a support frame 18 is fixedly mounted in the shell 1, a mounting groove 7 is formed in the back surface of the shell 1, a cover plate 4 is movably mounted in the mounting groove 7, a fastening bolt 3 is hinged to the top of the shell 1, three connectors 9 are movably mounted on the back surface of the shell 1, a data interface 10 is movably mounted on the back surface of the shell 1, a power interface 13 is movably mounted on the back surface of the shell 1, two heat dissipation ports 11 are formed in the back surface of the shell 1, a heat dissipation fan 15 is movably mounted in the shell 1, four casing columns 16 are fixedly mounted at the bottom of the support frame 18, two damping springs 20 are respectively sleeved on the outer sides of the four casing columns 16, and first cushions 21 are respectively fixedly mounted at one ends of the two damping springs 20, the other ends of the two damping springs 20 are fixedly provided with a second cushion 22, the circuit board 14 is movably sleeved on the outer side of the middle part of the four sleeve columns 16, the bottom of the circuit board 14 is fixedly provided with a heat conduction copper pipe 17, one end of the heat conduction copper pipe 17 is communicated with the inlet pipe 8, and the other end of the heat conduction copper pipe 17 is communicated with the outlet pipe 12.
The working principle of the technical scheme is as follows:
during operation, an operator connects the internet of things equipment through the connector 9, then connects the data interface 10 with an external network and operating equipment, and is convenient for networking control, then connects the power interface 13 with an external power supply, the single chip microcomputer is started through the power switch 2, the circuit board 14 inside the shell 1 bears the main chip function of the single chip microcomputer, the data interface 10, the connector 9 and the power interface 13 are all connected with the circuit board 14, when the single chip microcomputer works, the heat dissipation fan 15 is started, the heat dissipation fan 15 extracts the heat dissipated by the chip of the circuit board 14, the heat conduction copper pipe 17 at the bottom of the circuit board 14 has two functions, one of which guides out the heat of the circuit board 14, the heat dissipation fan 15 is convenient to extract through the heat dissipation port 11, and the other of which guides out the heat inside the heat conduction copper pipe 17 through water flow through the external circulating water pump of the inlet pipe 8 and the outlet pipe 12, and the scheme can further increase the heat dissipation capacity of the device, increased the power that the singlechip was handled, simultaneously when casing 1 is being removed, inside circuit board 14 will vibrate and alleviate through first cushion 21 and second cushion 22 and damping spring 20, prevent because vibrate or fall the functional damage that produces, the security has been increased, rectangular channel 5 can provide certain view window for transparent apron 4, can carry out firm in connection through fastening bolt 3 when apron 4 is at mounting groove 7 internally mounted, the installation dismantlement of device and the ability of maintaining have been increased, and convenient to use.
In another embodiment, as shown in fig. 1 and 5, four first non-slip mats 6 are fixedly mounted on one side of the housing 1, and four second non-slip mats 19 are fixedly mounted on the bottom of the housing 1.
In another embodiment, as shown in fig. 1 and 2, the cover plate 4 is positioned between the support frame 18 and the housing 1, and the cover plate 4 is a transparent structure.
The cover plate 4 is fixedly installed by the fastening bolts 3 under the support of the support frame 18, the cover plate 4 can provide a certain visual field for the inside of the single chip microcomputer, the operation personnel can observe the inside operation condition conveniently, and the disassembly type maintenance is reduced.
In another embodiment, as shown in fig. 1 and 5, the fastening bolt 3 is hinged through the case 1 and the cover plate 4 and extends to the inside of the support frame 18.
The fastening bolts 3 provide mounting support for the cover plate 4, and make the hinged connection between the cover plate 4 and the support frame 18 tight, prevent dust from entering, and increase the protection.
In another embodiment, as shown in fig. 3 to 5, the position of the heat dissipation fan 15 corresponds to the position of the heat dissipation port 11.
The heat dissipation fan 15 can lead out the heat inside the housing 1 when rotating, and the two heat dissipation fans 15 increase the heat dissipation capability, and the heat is led out more evenly by the suspension arrangement of the circuit board 14, so that the heat is prevented from being accumulated.
In another embodiment, as shown in fig. 5, the first cushion 21 contacts with the outer side of the circuit board 14, the second cushion 22 contacts with the supporting frame 18 and the housing 1, respectively, and both the first cushion 21 and the second cushion 22 are movably sleeved on the outer side of the sleeve post 16.
The one end fixed mounting that the stay 16 is kept away from the carriage 18 is in the bottom of casing 1 inner chamber, and when casing 1 was being removed, inside circuit board 14 will vibrate and carry out spacing slip through the stay 16, is alleviated by first cushion 21 and second cushion 22 and damping spring 20 afterwards, prevents because vibrate or fall the functional damage that produces, has increased the security.
In another embodiment, as shown in fig. 2 and 4, both the inlet pipe 8 and the outlet pipe 12 extend through the housing 1 to the outside thereof.
The working principle and the using process of the utility model are as follows: during operation, an operator connects the internet of things equipment through the connector 9, then connects the data interface 10 with an external network and operating equipment, and is convenient for networking control, then connects the power interface 13 with an external power supply, the single chip microcomputer is started through the power switch 2, the circuit board 14 inside the shell 1 bears the main chip function of the single chip microcomputer, the data interface 10, the connector 9 and the power interface 13 are all connected with the circuit board 14, when the single chip microcomputer works, the heat dissipation fan 15 is started, the heat dissipation fan 15 extracts the heat dissipated by the chip of the circuit board 14, the heat conduction copper pipe 17 at the bottom of the circuit board 14 has two functions, one of which guides out the heat of the circuit board 14, the heat dissipation fan 15 is convenient to extract through the heat dissipation port 11, and the other of which guides out the heat inside the heat conduction copper pipe 17 through water flow through the external circulating water pump of the inlet pipe 8 and the outlet pipe 12, and the scheme can further increase the heat dissipation capacity of the device, increased the power that the singlechip was handled, simultaneously when casing 1 is being removed, inside circuit board 14 will vibrate and alleviate through first cushion 21 and second cushion 22 and damping spring 20, prevent because vibrate or fall the functional damage that produces, the security has been increased, rectangular channel 5 can provide certain view window for transparent apron 4, can carry out firm in connection through fastening bolt 3 when apron 4 is at mounting groove 7 internally mounted, the installation dismantlement of device and the ability of maintaining have been increased, and convenient to use.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a thing networking singlechip that radiating effect is good, includes casing (1), its characterized in that: the front movable mounting of casing (1) has switch (2), rectangular channel (5) have been seted up at the top of casing (1), the inside fixed mounting of casing (1) has carriage (18), mounting groove (7) have been seted up at the back of casing (1), the inside movable mounting of mounting groove (7) has apron (4), the top of casing (1) articulates there is fastening bolt (3), the back movable mounting of casing (1) has three connector (9), the back movable mounting of casing (1) has data interface (10), the back movable mounting of casing (1) has power source (13), two thermovents (11) have been seted up at the back of casing (1), the inside movable mounting of casing (1) has heat dissipation fan (15), the bottom fixed mounting of carriage (18) has four set posts (16), four two damping spring (20), two have all been cup jointed in the outside of cover post (16) the equal fixed mounting in one end of damping spring (20) has first cushion (21), two the equal fixed mounting of the other end of damping spring (20) has second cushion (22), four the outside activity of cover post (16) intermediate part has cup jointed circuit board (14), the bottom fixed mounting of circuit board (14) has heat conduction copper pipe (17), the one end intercommunication of heat conduction copper pipe (17) has into pipe (8), the other end intercommunication of heat conduction copper pipe (17) has exit tube (12).
2. The Internet of things singlechip with good heat dissipation effect as claimed in claim 1, wherein: one side of the shell (1) is fixedly provided with four first anti-skid pads (6), and the bottom of the shell (1) is fixedly provided with four second anti-skid pads (19).
3. The Internet of things singlechip with good heat dissipation effect as claimed in claim 1, wherein: the cover plate (4) is located between the supporting frame (18) and the shell (1), and the cover plate (4) is of a transparent structure.
4. The Internet of things singlechip with good heat dissipation effect as claimed in claim 1, wherein: the fastening bolt (3) is hinged to penetrate through the shell (1) and the cover plate (4) and extends to the inside of the supporting frame (18).
5. The Internet of things singlechip with good heat dissipation effect as claimed in claim 1, wherein: the position of the heat dissipation fan (15) corresponds to the position of the heat dissipation port (11).
6. The Internet of things singlechip with good heat dissipation effect as claimed in claim 1, wherein: the outer side of first cushion (21) and circuit board (14) contacts, second cushion (22) contact with carriage (18) and casing (1) respectively, first cushion (21) and second cushion (22) all activity cup joint in the outside of set post (16).
7. The Internet of things singlechip with good heat dissipation effect as claimed in claim 1, wherein: the inlet pipe (8) and the outlet pipe (12) both penetrate through the shell (1) and extend to the outer side of the shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122401298.5U CN215932568U (en) | 2021-10-04 | 2021-10-04 | Thing networking singlechip that radiating effect is good |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122401298.5U CN215932568U (en) | 2021-10-04 | 2021-10-04 | Thing networking singlechip that radiating effect is good |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215932568U true CN215932568U (en) | 2022-03-01 |
Family
ID=80407312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122401298.5U Expired - Fee Related CN215932568U (en) | 2021-10-04 | 2021-10-04 | Thing networking singlechip that radiating effect is good |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215932568U (en) |
-
2021
- 2021-10-04 CN CN202122401298.5U patent/CN215932568U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220301 |