CN215930806U - Integrated circuit material strip warpage measuring device - Google Patents

Abstract

An integrated circuit material strip warpage measuring device. The integrated circuit material strip warpage measuring device comprises a sensor, a first fulcrum, a second fulcrum and a material strip bearing seat. The sensor is used for measuring the warping amount of the integrated circuit material strip. The sensor is connected with the first fulcrum, and the sensor can move on the first fulcrum along the length extension direction of the first fulcrum. The first support shaft is connected to the second support shaft, and the first support shaft is movable on the second support shaft in a direction in which the second support shaft extends along the length thereof. The material strip bearing seat is used for bearing the integrated circuit material strip, wherein the second fulcrum shaft is erected on the material strip bearing seat through a support. The integrated circuit material strip warpage measuring device that provides through this application can reduce the operating time of measuring integrated circuit material strip warpage volume by a wide margin, promotes work efficiency.

Description

Integrated circuit material strip warpage measuring device

Technical Field

The present application relates to an apparatus, and more particularly, to an apparatus for measuring warpage of an integrated circuit strip.

Background

In the prior art, when the deformation quantity of the integrated circuit material strip is measured, high power microscopes are required to be used for measuring the deformation quantity of the integrated circuit material strip in front, back, left and right directions, and the deformation quantity is obtained through formula artificial calculation, so that the whole operation flow is complicated, the operation time is long, and the efficiency is low.

SUMMERY OF THE UTILITY MODEL

In view of the above, the present application provides an apparatus for measuring warpage of an ic strip to solve the above problems.

According to an embodiment of the present application, an apparatus for measuring warpage of a strip of integrated circuits is provided. The integrated circuit material strip warpage measuring device comprises a sensor, a first fulcrum, a second fulcrum and a material strip bearing seat. The sensor is used for measuring the warping amount of the integrated circuit material strip. The sensor is connected with the first fulcrum, and the sensor can move on the first fulcrum along the length extension direction of the first fulcrum. The first support shaft is connected to the second support shaft, and the first support shaft is movable on the second support shaft in a direction in which the second support shaft extends along the length thereof. The material strip bearing seat is used for bearing the integrated circuit material strip, wherein the second fulcrum shaft is erected on the material strip bearing seat through a support.

According to an embodiment of the present application, the device for measuring warpage of an ic strip further includes an adjusting bracket. The adjustment bracket is configured to connect the sensor to the first fulcrum such that the sensor moves on the first fulcrum through the adjustment bracket along a length extension of the first fulcrum.

According to an embodiment of the present application, the adjusting bracket may be movable in an up-down direction on the first fulcrum.

According to an embodiment of the present application, the adjusting bracket includes a height indicator configured to indicate a height of the sensor in an up-down direction.

According to an embodiment of the present application, a length extending direction of the first fulcrum is perpendicular to a length extending direction of the second fulcrum.

According to an embodiment of the present application, the second support shaft includes a first sub support shaft and a second sub support shaft respectively disposed at two ends of the bar carrier, and the first support shaft is connected between the first sub support shaft and the second sub support shaft.

According to an embodiment of the application, the second fulcrum comprises a collar, the first fulcrum being a long axis passing through a centre of the collar.

According to an embodiment of the present application, the first fulcrum includes a plurality of sub-fulcrums arranged in parallel.

According to an embodiment of the present application, the device for measuring warpage of a material strip of an integrated circuit further includes a display panel. The display panel is used for displaying the measured value of the sensor.

According to an embodiment of the present application, the apparatus for measuring warpage of an integrated circuit strip further includes a stepping motor. The stepping motor is used for driving the sensor to move on the first fulcrum along the length extending direction of the first fulcrum.

According to an embodiment of the present application, the sensor is a laser displacement sensor.

The integrated circuit material strip warpage measuring device that provides through this application can reduce the operating time of measuring integrated circuit material strip warpage volume by a wide margin, promotes work efficiency.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application and not to limit the application. In the drawings:

FIG. 1 is a schematic diagram illustrating an apparatus for measuring warpage of an IC strip according to an embodiment of the present disclosure.

FIG. 2 is a schematic diagram of an apparatus for measuring warpage in an IC strip according to another embodiment of the present application.

FIG. 3 illustrates a schematic diagram of an apparatus for measuring warpage in an IC strip according to yet another embodiment of the present application.

Detailed Description

The following disclosure provides various embodiments or illustrations that can be used to implement various features of the disclosure. The embodiments of components and arrangements described below serve to simplify the present disclosure. It is to be understood that such descriptions are merely illustrative and are not intended to limit the present disclosure. For example, in the description that follows, forming a first feature on or over a second feature may include certain embodiments in which the first and second features are in direct contact with each other; and may also include embodiments in which additional elements are formed between the first and second features described above, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or characters in the various embodiments. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

Moreover, spatially relative terms, such as "under," "below," "over," "above," and the like, may be used herein to facilitate describing a relationship between one element or feature relative to another element or feature as illustrated in the figures. These spatially relative terms are intended to encompass a variety of different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

Although numerical ranges and parameters setting forth the broad scope of the application are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. Any numerical value, however, inherently contains certain standard deviations found in their respective testing measurements. As used herein, "about" generally refers to actual values within plus or minus 10%, 5%, 1%, or 0.5% of a particular value or range. Alternatively, the term "about" means that the actual value falls within the acceptable standard error of the mean, subject to consideration by those of ordinary skill in the art to which this application pertains. It is understood that all ranges, amounts, values and percentages used herein (e.g., to describe amounts of materials, length of time, temperature, operating conditions, quantitative ratios, and the like) are modified by the term "about" in addition to the experimental examples or unless otherwise expressly stated. Accordingly, unless indicated to the contrary, the numerical parameters set forth in the specification and attached claims are approximations that may vary depending upon the desired properties sought to be obtained. At the very least, these numerical parameters are to be understood as meaning the number of significant digits recited and the number resulting from applying ordinary carry notation. Herein, numerical ranges are expressed from one end to the other or between the two ends; unless otherwise indicated, all numerical ranges set forth herein are inclusive of the endpoints.

Fig. 1 illustrates a schematic diagram of an apparatus 1 for measuring warpage in an ic strip according to an embodiment of the present application. In some embodiments, the apparatus 1 is used for measuring the warpage of the ic strip. In some embodiments, the apparatus 1 for measuring warpage of an ic strip includes a sensor 11, a first shaft 12, a second shaft 13, and a strip carrier 14. In some embodiments, the sensor 11 may be a laser displacement sensor, wherein the sensor 11 emits laser light toward the surface of the integrated circuit strip, and the strip surface reflects the laser light into the sensor 11, so that the sensor 11 can detect the warping amount of the integrated circuit strip according to the angle of the light reflection and the distance between the sensor 11 and the integrated circuit strip. However, this is not a limitation of the present application. In other embodiments, the sensor 11 may be other types of sensors, as long as the sensor can detect the warpage of the ic strip, and all of them are within the scope of the present application.

In some embodiments, the sensor 11 is connected to the first shaft 12, and the sensor 11 can move on the first shaft 11 along the length of the first shaft 11. In some embodiments, the first fulcrum 11 is connected to the second fulcrum 12, and the first fulcrum 11 can move on the second fulcrum 12 along the length extension direction of the second fulcrum 12. In some embodiments, the strip carrier 14 carries the strip of integrated circuits. In some embodiments, the second support shaft 12 is supported on the strip carrier 14.

It should be noted that the integrated circuit material strip warpage measuring apparatus 1 shown in fig. 1 is only an example. In other embodiments, the integrated circuit strip warpage measuring apparatus 1 may further include other components. For example, the integrated circuit strip warpage measuring apparatus 1 can further include an adjusting bracket (not shown), wherein the adjusting bracket connects the sensor 11 to the first supporting shaft 12, so that the sensor 11 can move along the length of the first supporting shaft 12 on the first supporting shaft 12 through the adjusting bracket. For example, the apparatus 1 may further include a display panel (not shown) for displaying the measurement value of the sensor 11. For example, the apparatus 1 may further include a stepping motor (not shown) for driving the sensor 11 to move on the first shaft 12 along the length of the first shaft 12.

Fig. 2 is a perspective view of an apparatus 2 for measuring warpage in an ic strip according to an embodiment of the present application. In some embodiments, the integrated circuit strip warp measurement device 2 may be used to implement the integrated circuit strip warp measurement device 1. In some embodiments, the apparatus 2 for measuring warpage of an ic strip includes a sensor 21, a first pivot 22, a second pivot 23, a strip holder 24, an adjusting bracket 25, and a bracket 26. In some embodiments, the second fulcrum 23 stands on the strip carrier 24 through four brackets 26. In some embodiments, the second fulcrum 23 can stand on the bar carrier 24 by a greater or lesser number of brackets 26, which is not a limitation of the present application.

In some embodiments, the direction of longitudinal extension of first fulcrum 22 is perpendicular to the direction of longitudinal extension of second fulcrum 23. As shown in fig. 2, the length of the first support shaft extends in the x-axis direction, and the length of the second support shaft 23 extends in the y-axis direction. In some embodiments, the second support shaft 23 includes a first sub-support shaft 231 and a second sub-support shaft 232 respectively disposed at two ends of the bar carrier 24. In some embodiments, the first fulcrum 22 is connected between the first sub-fulcrum 231 and the second sub-fulcrum 232. In some embodiments, first fulcrum 22 is movable between first fulcrum 231 and second fulcrum 232 along the direction of extension of the length of second fulcrum 23 (i.e., the y-axis). In some embodiments, the two ends of the first fulcrum 22 may be connected to the first sub-fulcrum 231 and the second sub-fulcrum 232 through two sliders (e.g., the illustrated sliders K1 and K2) respectively to assist the movement of the first fulcrum 22 in the y-axis direction.

In some embodiments, first fulcrum 22 includes a plurality of sub-fulcrums (two as shown) arranged in parallel. The bearing capacity and strength of the first fulcrum 22 can be increased by the plurality of sub-fulcrum shafts arranged in parallel, and the first fulcrum shaft 22 is prevented from being deformed or inclined. In some embodiments, first fulcrum 22 may include a greater or lesser number of sub-fulcrums, which is not a limitation of the present application.

In some embodiments, the sensor 21 may be a laser displacement sensor as described in the embodiment of FIG. 1. In some embodiments, the adjustment bracket 25 connects the sensor 21 to the first shaft 22 such that the sensor 21 can be moved on the first shaft 22 along the length extension direction (i.e., x-axis) of the first shaft 22 by the adjustment bracket 25. In some embodiments, the adjusting bracket 25 can move up and down (i.e., z-axis) on the first fulcrum 22 to adjust the distance between the sensor 21 and the IC strip. In certain embodiments, the adjustment bracket 25 includes a height indicator S25 to indicate the height of the sensor 21 in the up-down direction (i.e., z-axis). In some embodiments, the adjustment bracket 25 may be coupled to the first pivot 22 via a slider (e.g., slider K3 as shown) to assist in movement of the adjustment bracket 25 in conjunction with the sensor 21 in the x-axis direction. In some embodiments, the cross-section of the adjusting bracket 25 may be any shape other than circular, so as to avoid the connecting point between the adjusting bracket 25 and the slider (e.g., the slider K3 shown in the figure) from being too smooth to facilitate the rotation or shaking of the sensor 21.

In some embodiments, the strip carrier 24 includes a strip placement area S24 for carrying the ic strips, wherein the range of the strip placement area S24 defines the placement position of the ic strips. In some embodiments, the apparatus 2 may further include a display panel (not shown) for displaying the measurement value of the sensor 21. In some embodiments, the apparatus 2 may further include a stepping motor (not shown) for driving the sensor 21 to move on the first shaft 22 along the length extension direction (i.e. x-axis) of the first shaft 22.

When the warping amount of the ic strip is to be measured, the ic strip is first placed in the strip placing area S24 on the strip bearing seat 24. Then, if the warpage amount of the ic strip in the x-axis direction is to be measured, the sensor 21 is moved from the left side (or right side) to the right side (or left side) of the ic strip along the first supporting axis 22, thereby obtaining the maximum warpage amount of the ic strip in the x-axis direction. If the y-axis warpage of the ic strip is to be measured, the sensor 21 and the first fulcrum 22 are moved along the second fulcrum 23 from the front side (or back side) to the back side (or front side) of the ic strip, thereby obtaining the maximum y-axis warpage of the ic strip.

Fig. 3 is a perspective view of an apparatus 3 for measuring warpage in an ic strip according to an embodiment of the present application. In some embodiments, the integrated circuit strip warp measurement device 3 may be used to implement the integrated circuit strip warp measurement device 1. In some embodiments, the apparatus 3 for measuring warpage of an ic strip includes a sensor 31, a first fulcrum 32, a second fulcrum 33, a strip holder 34, an adjusting bracket 35, and a bracket 36. In some embodiments, the second fulcrum 33 stands on the strip holder 34 through two brackets 36. In some embodiments, the second fulcrum 33 can stand on the strip carrier 34 by a greater or lesser number of brackets 36, which is not a limitation of the present application.

In certain embodiments, second fulcrum 33 includes a collar 331. In some embodiments, the direction of the length extension of the first fulcrum 32 is perpendicular to the direction of the length extension of the second fulcrum 33. As shown in fig. 3, the length of the first fulcrum 32 extends in the radial direction of the collar 331, and the length of the second fulcrum 33 extends in the circumferential direction of the collar 331. In some embodiments, first fulcrum 32 is a long axis passing through the center of collar 33. In some embodiments, the first fulcrum 32 can rotate on the ring of the collar 331 along the direction of extension of the length of the second fulcrum 33 (i.e. along the ring of the collar 331). In some embodiments, both ends of the first shaft 32 may be connected to the collar 331 by two sliders (e.g., the illustrated sliders K1 'and K2') to assist the first shaft 32 to rotate on the ring of the collar 331.

In some embodiments, first fulcrum 32 includes a plurality of sub-fulcrums (two as shown) arranged in parallel. The bearing capacity and strength of the first fulcrum 32 can be increased by the plurality of sub-fulcrum shafts arranged in parallel, and the first fulcrum shaft 32 is prevented from being deformed or inclined. In some embodiments, the first fulcrum 32 may include a greater or lesser number of sub-fulcrums, which is not a limitation of the present application.

In some embodiments, the sensor 31 may be a laser displacement sensor as described in the embodiment of FIG. 1. In some embodiments, the adjusting bracket 35 connects the sensor 31 to the first shaft 32, so that the sensor 31 can move on the first shaft 32 along the length extension direction of the first shaft 32 (i.e., the radial direction of the collar 331) by the adjusting bracket 35. In some embodiments, the adjusting bracket 35 can move along the first shaft 32 in the up-down direction (i.e., the axial direction of the central axis of the collar 331) to adjust the distance between the sensor 31 and the ic strip. In some embodiments, the adjustment bracket 35 includes a height indicator S35 to indicate the height of the sensor 31 in the up-down direction (i.e., the axial direction of the central axis of the collar 331). In some embodiments, the adjustment bracket 35 may be connected to the first shaft 32 by a slider (e.g., slider K3' as shown) to assist the adjustment bracket 35 in moving in a radial direction of the collar 331 in cooperation with the sensor 31. In some embodiments, the cross-section of the adjusting bracket 35 may be any shape other than circular, so as to avoid the connecting portion between the adjusting bracket 35 and the slider (e.g., the slider K3') from being too smooth to facilitate the rotation or shaking of the sensor 31.

In some embodiments, the strip carrier 34 includes a strip placement area S34 for carrying the ic strips, wherein the range of the strip placement area S34 defines the placement position of the ic strips. In some embodiments, the apparatus 3 may further include a display panel (not shown) for displaying the measurement value of the sensor 31. In some embodiments, the apparatus 3 may further include a stepping motor (not shown) for driving the sensor 31 to move on the first shaft 32 along the length of the first shaft 32 (i.e. the radial direction of the collar 331).

When the warpage amount of the ic strip is to be measured, the ic strip is first placed in the strip placement area S34 on the strip carrier 34. Then, if the warpage amount of the ic strip in the x-axis direction is to be measured, the first supporting shaft 32 is rotated along the circular ring of the collar 331 until the first supporting shaft 32 is parallel to the x-axis direction, and then the sensor 31 is moved along the first supporting shaft 32, thereby obtaining the maximum warpage amount of the ic strip in the x-axis direction. If the warpage amount of the ic strip in the y-axis direction is to be measured, the first shaft 32 is rotated along the circular ring of the collar 331 until the first shaft 32 is parallel to the y-axis direction, and then the sensor 31 is moved along the first shaft 32, thereby obtaining the maximum warpage amount of the ic strip in the y-axis direction. It can be understood that, when the integrated circuit material strip warpage measuring device 3 is used, the warpage amount of the integrated circuit material strip on the x axis or the y axis is not limited to be measured. The first shaft 32 is rotated along the ring of the collar 331 until the first shaft 32 is parallel to the direction to be measured, and then the sensor 31 is moved along the first shaft 32.

As used herein, the terms "approximately," "substantially," "essentially," and "about" are used to describe and account for minor variations. When used in conjunction with an event or circumstance, the terms can refer to an instance in which the event or circumstance occurs precisely as well as an instance in which the event or circumstance occurs in close proximity. As used herein with respect to a given value or range, the term "about" generally means within ± 10%, ± 5%, ± 1%, or ± 0.5% of the given value or range. Ranges may be expressed herein as from one end point to another end point or between two end points. Unless otherwise specified, all ranges disclosed herein are inclusive of the endpoints. The term "substantially coplanar" may refer to two surfaces located within a few micrometers (μm) along the same plane, e.g., within 10 μm, within 5 μm, within 1 μm, or within 0.5 μm located along the same plane. When referring to "substantially" the same numerical value or property, the term can refer to values that are within ± 10%, ± 5%, ± 1%, or ± 0.5% of the mean of the stated values.

As used herein, the terms "approximately," "substantially," "essentially," and "about" are used to describe and explain minor variations. When used in conjunction with an event or circumstance, the terms can refer to an instance in which the event or circumstance occurs precisely as well as an instance in which the event or circumstance occurs in close proximity. For example, when used in conjunction with numerical values, the terms can refer to a range of variation that is less than or equal to ± 10% of the stated numerical value, e.g., less than or equal to ± 5%, less than or equal to ± 4%, less than or equal to ± 3%, less than or equal to ± 2%, less than or equal to ± 1%, less than or equal to ± 0.5%, less than or equal to ± 0.1%, or less than or equal to ± 0.05%. For example, two numerical values are considered to be "substantially" or "about" the same if the difference between the two numerical values is less than or equal to ± 10% (e.g., less than or equal to ± 5%, less than or equal to ± 4%, less than or equal to ± 3%, less than or equal to ± 2%, less than or equal to ± 1%, less than or equal to ± 0.5%, less than or equal to ± 0.1%, or less than or equal to ± 0.05%) of the mean of the values. For example, "substantially" parallel may refer to a range of angular variation of less than or equal to ± 10 ° from 0 °, e.g., less than or equal to ± 5 °, less than or equal to ± 4 °, less than or equal to ± 3 °, less than or equal to ± 2 °, less than or equal to ± 1 °, less than or equal to ± 0.5 °, less than or equal to ± 0.1 °, or less than or equal to ± 0.05 °. For example, "substantially" perpendicular may refer to a range of angular variation of less than or equal to ± 10 ° from 90 °, e.g., less than or equal to ± 5 °, less than or equal to ± 4 °, less than or equal to ± 3 °, less than or equal to ± 2 °, less than or equal to ± 1 °, less than or equal to ± 0.5 °, less than or equal to ± 0.1 °, or less than or equal to ± 0.05 °.

For example, two surfaces may be considered coplanar or substantially coplanar if the displacement between the two surfaces is equal to or less than 5 μm, equal to or less than 2 μm, equal to or less than 1 μm, or equal to or less than 0.5 μm. A surface may be considered planar or substantially planar if the displacement of the surface relative to the plane between any two points on the surface is equal to or less than 5 μm, equal to or less than 2 μm, equal to or less than 1 μm, or equal to or less than 0.5 μm.

As used herein, the terms "conductive", "electrically conductive" and "conductivity" refer to the ability to transfer electrical current. Conductive materials generally indicate those materials that are minimally or zero antagonistic to current flow. One measure of conductivity is siemens per meter (S/m). Typically, the electrically conductive material is one having an electrical conductivity greater than approximately 104S/m (e.g., at least 105S/m or at least 106S/m). The conductivity of a material can sometimes vary with temperature. Unless otherwise specified, the electrical conductivity of a material is measured at room temperature.

As used herein, the singular terms "a" and "the" may include plural referents unless the context clearly dictates otherwise. In the description of some embodiments, a component provided "on" or "over" another component may encompass the case where the preceding component is directly on (e.g., in physical contact with) the succeeding component, as well as the case where one or more intervening components are located between the preceding and succeeding components.

As used herein, spatially relative terms, such as "below," "lower," "above," "upper," "lower," "left," "right," and the like, may be used herein for ease of description to describe one component or feature's relationship to another component or feature as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may be present.

The foregoing summarizes features of several embodiments and detailed aspects of the present disclosure. The embodiments described in this disclosure may be readily used as a basis for designing or modifying other processes and structures for carrying out the same or similar purposes and/or obtaining the same or similar advantages of the embodiments introduced herein. Such equivalent constructions do not depart from the spirit and scope of the present disclosure and various changes, substitutions, and alterations can be made therein without departing from the spirit and scope of the present disclosure.

Claims (11)

1. An integrated circuit material strip warpage measuring device, comprising:

the sensor is used for measuring the warping amount of the integrated circuit material strip;

a first fulcrum, wherein the sensor is connected with the first fulcrum and can move on the first fulcrum along the length extension direction of the first fulcrum;

a second fulcrum, wherein the first fulcrum is connected with the second fulcrum, and the first fulcrum can move on the second fulcrum along the length extending direction of the second fulcrum; and

the material strip bearing seat is used for bearing the integrated circuit material strip, wherein the second fulcrum shaft is erected on the material strip bearing seat through a support.

2. The apparatus according to claim 1, further comprising:

an adjustment bracket configured to connect the sensor to the first fulcrum such that the sensor moves on the first fulcrum through the adjustment bracket along a length extension of the first fulcrum.

3. The apparatus according to claim 2, wherein the adjusting bracket is movable in an up-and-down direction on the first fulcrum.

4. The apparatus according to claim 3, wherein the adjustment bracket comprises a height indicator configured to indicate a height of the sensor in an up-down direction.

5. The apparatus according to claim 1, wherein the first fulcrum has a length extending direction perpendicular to a length extending direction of the second fulcrum.

6. The apparatus according to claim 5, wherein the second supporting shaft comprises a first supporting sub-shaft and a second supporting sub-shaft respectively disposed at two ends of the strip carrier, and the first supporting shaft is connected between the first supporting sub-shaft and the second supporting sub-shaft.

7. The apparatus according to claim 5, wherein the second fulcrum comprises a collar, and the first fulcrum is a long axis passing through a center of the collar.

8. The apparatus according to claim 5, wherein the first support shaft comprises a plurality of sub-support shafts arranged in parallel.

9. The apparatus according to claim 1, further comprising a display panel for displaying the measurement value of the sensor.

10. The apparatus according to claim 1, further comprising a stepping motor for driving the sensor to move on the first shaft along a length of the first shaft.

11. The apparatus of claim 1, wherein the sensor is a laser displacement sensor.

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