CN215920952U - Scribing device for integrated wafer processing - Google Patents

Abstract

The utility model discloses a scribing device for integrated wafer processing, which comprises: the wafer cutting assembly and the cooling assembly are mounted at the upper end of the processing table, the upper end of the processing table is provided with a through hole, a placing ring is fixedly connected to the wall of the through hole of the processing table, an inner cavity is formed in the processing table and located below the through hole, a collecting disc is arranged in the inner cavity and rotatably connected into the inner cavity, and the side face of the collecting disc is attached to the inner cavity. Through setting up the catch tray, the coolant liquid is collected in the collecting vat of catch tray, avoids the coolant liquid accumulation to cause the influence to processing at the wafer surface, and when the collecting vat one side of catch tray rotated to relative through-hole, the through-hole discharge can be followed to the coolant liquid, and through setting up the push pedal, the wafer can be released to the push pedal in the catch tray, conveniently takes the wafer, has avoided the problem that the coolant liquid on wafer surface is wet and slippery to lead to inconvenient taking.

Description

Scribing device for integrated wafer processing

Technical Field

The utility model relates to the technical field of wafer processing, in particular to a scribing device for integrated wafer processing.

Background

Wafers are important parts in semiconductor circuits, and when wafers are manufactured, wafers are cut into individual wafers, that is, a wafer scribing process is performed, and the wafers are affected by heat generated in the wafer cutting process, so that cooling liquid is required for cooling.

Under the prior art, when cutting the wafer and spraying the coolant liquid, the coolant liquid directly spills in the processing groove, does not discharge in time, and the coolant liquid accumulation can cause the influence to the processing of wafer in the processing groove to processing is accomplished the back and is leaded to the wafer surface to be wet and smooth because the coolant liquid accumulation leads to in the processing groove, also is inconvenient to take out the wafer.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problems that when a wafer is cut and sprayed with cooling liquid, the cooling liquid directly falls into a processing groove and is not discharged in time, the cooling liquid is accumulated in the processing groove to influence the processing of the wafer, and the surface of the wafer is wet and smooth due to the accumulation of the cooling liquid in the processing groove after the processing is finished, so that the wafer is not convenient to take out, and the scribing device for integrated wafer processing is provided.

The technical scheme adopted by the utility model for solving the technical problem is as follows: a dicing apparatus for integrated wafer processing, comprising: processing platform, wafer cutting subassembly and cooling module are installed to the upper end of processing platform, the opening has been seted up to the upper end of processing platform, fixedly connected with places the ring on the opening mouth wall of processing platform, the inside of processing platform and the below that is located the opening have seted up the inner chamber, the inside of inner chamber is provided with the catch tray, the catch tray rotates to be connected in the inner chamber, the side and the inner chamber laminating of catch tray, the opening has been seted up to the bottom of catch tray, be provided with the push pedal in the opening, the length of push pedal is less than the inner length of placing the ring.

Preferably, the motor is installed in the gomphosis of inner wall one side middle part of inner chamber, the output shaft fixed connection of one side middle part and the motor of collecting tray, the motor drives the collecting tray and rotates, and when the collecting vat one side of collecting tray rotated to relative through-hole, the through-hole discharge can be followed to the coolant liquid.

Preferably, open-ended roof middle part fixedly connected with electric telescopic handle, push pedal upper end middle part fixed connection is in electric telescopic handle's output, and the wafer is released to the push pedal, conveniently takes the wafer, has avoided the problem that the coolant liquid on wafer surface is wet and slippery to lead to inconvenient taking.

Preferably, a through hole is formed in the lower portion of the side wall of one side of the processing table, the through hole penetrates through the side wall of the processing table and is communicated with the inner cavity, one end, far away from the inner cavity, of the through hole is obliquely arranged downwards, cooling liquid is discharged from the through hole, and the cooling liquid is prevented from being accumulated in the collecting tank.

Preferably, the transverse caliber of the collecting groove is larger than the length of the through opening, the longitudinal caliber of the collecting groove is larger than the width of the through opening, and cooling liquid flowing down from the through opening can be completely collected in the collecting groove.

The utility model has the following advantages:

through setting up the collecting tray, the coolant liquid is collected in the collecting vat of collecting tray, avoids the coolant liquid accumulation to cause the influence at the wafer surface to processing, when the collecting vat one side of collecting tray rotated to relative through-hole, and the through-hole discharge can be followed to the coolant liquid.

Through setting up the push pedal, the wafer can be released to the push pedal in the catch tray, conveniently takes the wafer, has avoided the problem that the coolant liquid on wafer surface is wet and slippery to lead to inconvenient taking.

Drawings

Fig. 1 is a front view, cut-away structural diagram of a dicing apparatus for integrated wafer processing according to a preferred embodiment of the present invention;

fig. 2 is a schematic structural diagram of a collection tray of the dicing apparatus for integrated wafer processing according to a preferred embodiment of the present invention in a rotating state;

fig. 3 is a schematic structural diagram of a motor joint of the dicing apparatus for integrated wafer processing according to a preferred embodiment of the present invention;

fig. 4 is a schematic perspective view of a dicing apparatus for integrated wafer processing according to a preferred embodiment of the utility model.

Description of reference numerals: 1. a processing table; 2. a port; 3. placing a ring; 4. an inner cavity; 5. a collection tray; 6. collecting tank; 7. a motor; 8. a through hole; 9. an opening; 10. an electric telescopic rod; 11. a push plate.

Detailed Description

The technical scheme of the utility model is clearly and completely described in the following with reference to the accompanying drawings. In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Examples

As shown in fig. 1-4, a scribing device for processing an integrated wafer includes a processing table 1, a wafer cutting assembly and a cooling assembly are installed at the upper end of the processing table 1, the cutting assembly at the upper end of the processing table 1 performs cutting, and the cooling assembly sprays cooling liquid to the surface of a wafer for cooling, a port 2 is formed at the upper end of the processing table 1, a placing ring 3 is fixedly connected to the wall of the port 2 of the processing table 1, the wafer is placed on the placing ring 3 for processing, an inner cavity 4 is formed in the processing table 1 and below the port 2, a collecting tray 5 is arranged in the inner cavity 4, the collecting tray 5 can collect the cooling liquid to prevent the cooling liquid from accumulating on the surface of the wafer to affect processing, the collecting tray 5 is rotatably connected in the inner cavity 4, the side surface of the collecting tray 5 is attached to the inner cavity 4, an opening 9 is formed at the bottom end of the collecting tray 5, and a push plate 11 is arranged in the opening 9, the length of the push plate 11 is smaller than the inner length of the placing ring 3, and when the collecting disc 5 rotates to the state that the push plate 11 is opposite to the through opening 2, the push plate 11 can push out the wafer to facilitate taking the wafer.

Wherein, because the bore of collecting vat 6 length direction is greater than the length of opening 2, the bore of collecting vat 6 width direction is greater than the width of opening 2, but the coolant liquid flows down from opening 2 and can all collect in collecting vat 6.

Wherein, motor 7 gomphosis is in the middle part of inner wall one side of inner chamber 4, and the output shaft fixed connection of one side middle part of catch tray 5 and motor 7, and when motor 7 ran, its output shaft fixed connection's catch tray 5 rotated along with it.

Wherein, electric telescopic handle 10 fixed connection is in the roof middle part of opening 9, and 11 upper ends middle part fixed connection in electric telescopic handle 10's output of push pedal, electric telescopic handle 10's output drive push pedal 11 and move up and can release the wafer, the wafer of being convenient for to take.

Wherein, through-hole 8 is seted up in one side lateral wall lower part of processing platform 1, and through-hole 8 runs through the lateral wall of processing platform 1, and through-hole 8 and inner chamber 4 intercommunication, the one end that inner chamber 4 was kept away from to through-hole 8 sets up to one side downwards, and when collecting tray 5's collecting vat 6 one side rotated to relative through-hole 8, the coolant liquid was discharged from through-hole 8, avoided the coolant liquid accumulation in collecting vat 6.

The working principle is as follows: when the wafer is processed, the wafer is placed at the upper end of the placing ring 3, the cutting assembly at the upper end of the processing table 1 cuts, meanwhile, the cooling assembly sprays cooling liquid to the surface of the wafer to be cooled, the cooling liquid falls into the inner cavity 4 from a gap between the placing ring 3 and the wafer, so that the cooling liquid is collected in the collecting tank 6 of the collecting tray 5, the influence on processing caused by the accumulation of the cooling liquid on the surface of the wafer is avoided, after the cutting is completed, the motor 7 is opened to drive the collecting tray 5 to rotate, when one side of the collecting tank 6 of the collecting tray 5 rotates to be opposite to the through hole 8, the cooling liquid is discharged from the through hole 8, the accumulation of the cooling liquid on the collecting tank 6 is avoided, after the cooling liquid is discharged, the cut wafer can be taken out, the motor 7 is opened to drive the collecting tray 5 to rotate until the opening 9 is opposite to the through hole 2, the electric telescopic rod 10 is opened, the output end of the electric telescopic rod 10 extends to drive the push plate 11 to push the wafer out, the wafer is convenient to take, and the problem that the cooling liquid on the surface of the wafer is wet and slippery and is inconvenient to take is avoided.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of the present invention, and these improvements and modifications should also be construed as the protection scope of the present invention.

Other parts of the utility model not described in detail are prior art and are not described in detail herein.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the utility model has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims (5)

1. A scribing apparatus for integrated wafer processing, comprising: processing platform (1), its characterized in that, wafer cutting subassembly and cooling module are installed to the upper end of processing platform (1), opening (2) have been seted up to the upper end of processing platform (1), fixedly connected with places ring (3) on opening (2) oral wall of processing platform (1), inner chamber (4) have been seted up to the inside of processing platform (1) and the below that is located opening (2), the inside of inner chamber (4) is provided with catch tray (5), catch tray (5) rotate to be connected in inner chamber (4), the side and the inner chamber (4) laminating of catch tray (5), opening (9) have been seted up to the bottom of catch tray (5), be provided with push pedal (11) in opening (9), the length of push pedal (11) is less than the internal length of placing ring (3).

2. The scribing device for integrated wafer processing according to claim 1, wherein a motor (7) is embedded in the middle of one side of the inner wall of the inner cavity (4), and the middle of one side of the collecting tray (5) is fixedly connected with an output shaft of the motor (7).

3. The scribing device for integrated wafer processing according to claim 1, wherein an electric telescopic rod (10) is fixedly connected to a middle portion of a top wall of the opening (9), and an upper middle portion of the push plate (11) is fixedly connected to an output end of the electric telescopic rod (10).

4. The scribing device for integrated wafer processing according to claim 1, wherein a through hole (8) is formed in a lower portion of a side wall of the processing table (1), the through hole (8) penetrates through the side wall of the processing table (1) and is communicated with the inner cavity (4), and one end of the through hole (8) far away from the inner cavity (4) is arranged obliquely downward.

5. The dicing apparatus for integrated wafer processing according to claim 1, wherein the lateral diameter of the collection groove (6) is larger than the length of the through opening (2), and the longitudinal diameter of the collection groove (6) is larger than the width of the through opening (2).

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