CN215919940U - Processing device of piezoelectric ceramic piece - Google Patents
Processing device of piezoelectric ceramic piece Download PDFInfo
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- CN215919940U CN215919940U CN202122479344.3U CN202122479344U CN215919940U CN 215919940 U CN215919940 U CN 215919940U CN 202122479344 U CN202122479344 U CN 202122479344U CN 215919940 U CN215919940 U CN 215919940U
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Abstract
The application discloses processingequipment of piezoceramics piece, including locating component, dust absorption subassembly, cutter unit spare and retooling subassembly. The positioning assembly comprises a positioning table and a positioning hole, an air outlet space is arranged at the bottom of the positioning table and is communicated with the first air suction piece through a first air suction pipe, and the positioning hole, the air outlet space and the first air suction pipe form a positioning channel; the dust collection assembly comprises a dust collection hole arranged on the surface of the positioning table, the dust collection hole is communicated with the air outlet space, and the dust collection hole, the air outlet space and the first air suction pipe form a dust collection channel; the cutter assembly is arranged above the positioning assembly and can move along the vertical direction and the horizontal direction; the wafer replacing component is arranged above the positioning component and used for replacing the piezoelectric ceramic wafer of the positioning component, and the wafer replacing component can move in the horizontal direction, so that the wafer replacing component is provided with a first position capable of being stored on one side of the machining device and a second position capable of replacing the piezoelectric ceramic wafer. Through the setting of this application, machining efficiency has been improved.
Description
Technical Field
The application belongs to the technical field of piezoceramics piece production facility, especially relates to a production forming device of piezoceramics piece.
Background
The piezoelectric ceramic piece is an electronic sound producing element, a piezoelectric ceramic dielectric material is placed between two copper round electrodes, and when an alternating current audio signal is connected to the two electrodes, the piezoelectric piece can vibrate according to the magnitude frequency of the signal to produce corresponding sound. The piezoelectric ceramic piece has simple structure and low cost, and is widely applied to electronic appliances in the aspects of: toys, electronic phonic watches, electronic instruments, electronic clocks, timers, etc.
The production of the piezoelectric ceramic piece is carried out by the processes of material proportioning, mixing, levigating, secondary levigating, pelleting, forming, plastic discharging, sintering into porcelain, appearance processing, electrode coating, high-voltage polarization, aging test and the like, wherein in the appearance processing of the piezoelectric ceramic piece, the piezoelectric ceramic piece sintered into porcelain is usually placed on an appearance processing device to process and polish the surface roughness of the piezoelectric ceramic piece, but the existing appearance processing device needs to be stopped after the processing of one piezoelectric ceramic piece is finished, and the other piezoelectric ceramic piece is placed on a clamp, which wastes time and labor; in addition, the existing slicing device also has no dust collection function, which affects the subsequent production, and needs to be stopped for cleaning when the operation plane is dirty; in conclusion, frequent shutdown of the slicing machine is caused, so that the production efficiency of the slicing machine is reduced.
It will thus be seen that the prior art is susceptible to further improvement and enhancement.
SUMMERY OF THE UTILITY MODEL
The utility model provides a processing device of a piezoelectric ceramic piece, which aims to solve at least one of the technical problems.
In order to achieve the purpose, the utility model provides a processing device of a piezoelectric ceramic piece, which comprises a positioning component, a dust collection component, a cutter component and a piece changing component. The positioning assembly comprises a positioning table and a positioning hole arranged on the surface of the positioning table, an air outlet space is arranged at the bottom of the positioning table and is communicated with the first air suction piece through a first air suction pipe, and the positioning hole, the air outlet space and the first air suction pipe form a positioning channel; the dust collection assembly comprises a dust collection hole arranged on the surface of the positioning table, the dust collection hole is communicated with the air outlet space, and the dust collection hole, the air outlet space and the first air suction pipe form a dust collection channel; the cutter assembly is arranged above the positioning assembly and can move along the vertical direction and the horizontal direction; the wafer replacing component is arranged above the positioning component and used for replacing the piezoelectric ceramic wafer of the positioning component, and the wafer replacing component can move in the horizontal direction, so that the wafer replacing component is provided with a first position capable of being stored on one side of the machining device and a second position capable of replacing the piezoelectric ceramic wafer.
According to the piezoelectric ceramic piece positioning device, through the arrangement of the positioning channel, the piezoelectric ceramic piece can be positioned by forming negative pressure in the positioning hole; through the arrangement of the dust collection channel, the dust collection hole can play a role in collecting dust while working on the positioning table; this application can make processingequipment realize the change of piezoceramics piece under the condition of not shutting down through the setting of the mounting plate subassembly, has improved processingequipment's production efficiency.
In a preferred implementation mode, the sheet changing assembly comprises a first moving part and a sheet changing part which are connected with each other, the first moving part is provided with a second air suction pipe and a second air suction part, the surface of the sheet changing part is provided with an adsorption hole, the adsorption hole is connected with the second air suction pipe, and the second air suction pipe is connected with the second air suction part. This application is inhaled the cooperation of piece through absorption hole and second breathing pipe and second, has realized absorption and location to piezoceramics piece.
In a preferred implementation, the plurality of dust suction holes are uniformly arranged between the positioning holes. This application is through evenly setting up the dust absorption hole between the locating hole, and the piezoceramics piece that can effectual absorption be located on the locating hole produces the dirt bits in the course of working.
In a preferred implementation, the adsorption holes and the positioning holes are arranged corresponding to each other. This application has improved the butt joint precision between absorption hole and the locating hole through corresponding the setting each other with absorption hole and locating hole to the efficiency of changing piezoceramics piece has been improved.
In a preferred implementation manner, the processing device further includes a connecting plate, the cutter assembly includes a second moving portion and a grinding tool disposed on the second moving portion, the first moving portion and the second moving portion are disposed on the connecting plate, and the connecting plate is provided with a moving track. According to the piezoelectric ceramic wafer machining device, the wafer replacing component and the cutter component can move along the horizontal direction through the arrangement of the moving track, when the piezoelectric ceramic wafer is machined, the wafer replacing component is stored at one side of the machining device, and the cutter component machines the piezoelectric ceramic wafer on the positioning table; when the piezoelectric ceramic piece on the positioning table needs to be replaced, the piece replacing component moves to the positioning table, the piece of the piezoelectric ceramic piece on the positioning table is replaced, and the cutter component is accommodated on one side of the machining device.
In a preferred implementation mode, the device further comprises a supporting plate, wherein a lifting rail is arranged on the surface of the supporting plate, and the connecting plate can reciprocate along the lifting rail. This application can make cutter unit spare and commutation subassembly along vertical direction reciprocating motion through the orbital setting that goes up and down to the position of adjustment cutter unit spare and commutation subassembly.
In a preferred implementation mode, the diameter of the positioning hole is 0.5-0.8 times of the diameter of the piezoelectric ceramic piece, and the diameter of the adsorption hole is 0.5-0.8 times of the diameter of the piezoelectric ceramic piece. When the diameter of the positioning hole and the diameter of the adsorption hole are smaller than 0.5 time of the diameter of the piezoelectric ceramic piece, the adsorption force on the piezoelectric ceramic piece is small, and the piezoelectric ceramic piece is easy to fall off; when the diameter of the positioning hole and the diameter of the adsorption hole are larger than 0.8 of the diameter of the piezoelectric ceramic piece, the adsorption force of the positioning hole is too large, and the piezoelectric ceramic piece is easily damaged; when the diameter of the positioning hole and the diameter of the adsorption hole are larger than or equal to the diameter of the piezoelectric ceramic piece, the positioning hole and the adsorption hole cannot play a positioning role.
In a preferred implementation mode, the diameter of the dust suction hole is 1.2-2 times of that of the positioning hole. When the diameter of the dust collection hole is smaller than 1.2 times of the diameter of the positioning hole, the dust collection effect of the dust collection hole is small; when the diameter of the dust suction hole is larger than 2 times of the diameter of the positioning hole, the adsorption force is too large, and the piezoelectric ceramic piece adsorbed on the positioning hole is easy to displace.
In a preferred implementation, the cutter assembly further comprises a dust cover, and the dust cover is arranged on the top of the grinding tool. This application can play dirt-proof effect to the cutter unit spare through the setting of dust cover.
In a preferred implementation, the second suction duct is provided as a hose. This application sets up to the hose through breathing pipe second, can make the second breathing pipe follow the removal of removal portion, has improved the flexibility of removal portion.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model and not to limit the utility model. In the drawings:
fig. 1 is a structural view of a device for processing a piezoceramic wafer according to an embodiment of the present application, in which the displacement assembly is shown in the first position;
fig. 2 is a structural view of a device for processing a piezoceramic wafer according to an embodiment of the present application, in which the displacement assembly is shown in the second position;
description of reference numerals:
1. a positioning assembly; 101. a positioning table; 102. positioning holes; 103. an air outlet space; 104. a first inhalation tube; 105. a first getter member;
2. a dust collection assembly; 201. a dust collection hole;
3. a cutter assembly; 301. a second moving part; 302. an abrasive article; 303. a dust cover;
4. a disc changing assembly; 401. a first moving part; 4011. a second suction duct; 4012. a second suction duct; 402. a sheet changing part; 4021. an adsorption hole;
5. a connecting plate; 501. a moving track;
6. a support plate; 601. a lifting rail;
7. piezoelectric ceramic piece.
Detailed Description
In order to more clearly explain the overall concept of the present invention, the following detailed description is given by way of example in conjunction with the accompanying drawings.
It should be noted that in the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and thus the scope of the present invention is not limited by the specific embodiments disclosed below.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate.
In the present invention, unless otherwise expressly stated or limited, the terms "connected" and "connected" are to be construed broadly, e.g., as meaning either a fixed connection or a removable connection, or an integral part; either directly or indirectly through intervening media, either internally or in any other relationship. However, the direct connection means that the two bodies are not connected to each other by the intermediate structure but connected to each other by the connecting structure to form a whole. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Descriptions in this specification as relating to "first", "second", etc. are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to any indicated technical feature or quantity. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.
As shown in fig. 1-2, the present invention provides a processing apparatus for piezoelectric ceramic plates, which comprises a positioning assembly 1, a dust suction assembly 2, a cutter assembly 3 and a plate changing assembly 4. The positioning assembly 1 comprises a positioning table 101 and a positioning hole 102 arranged on the surface of the positioning table 101, an air outlet space 103 is arranged at the bottom of the positioning table 101, the air outlet space 103 is communicated with a first air suction piece 105 through a first air suction pipe 104, and the positioning hole 102, the air outlet space 103 and the first air suction pipe 104 form a positioning channel; the dust collection assembly 2 comprises a dust collection hole 201 arranged on the surface of the positioning table 101, the dust collection hole 201 is communicated with the air outlet space 103, and the dust collection hole 201, the air outlet space 103 and the first suction pipe 104 form a dust collection channel; the cutter assembly 3 is arranged above the positioning assembly 1, and the cutter assembly 3 can move along the vertical direction and the horizontal direction; the disc changing assembly 4 is arranged above the positioning assembly 1, the disc changing assembly 4 is used for changing the piezoelectric ceramic plate 7 of the positioning assembly 1, and the disc changing assembly 4 can move in the horizontal direction, so that the disc changing assembly 4 is provided with a first position capable of being stored on one side of the processing device and a second position capable of being used for replacing the piezoelectric ceramic plate 7. The disc changer assembly 4 is shown in a first position in fig. 1, and the disc changer assembly 4 is shown in a second position in fig. 2.
From the above description, it can be seen that the present invention achieves the following technical effects:
through the arrangement of the positioning channel, the piezoelectric ceramic piece 7 can be positioned by forming negative pressure in the positioning hole 102; through the arrangement of the dust collection channel, the dust collection hole 201 can play a role in collecting dust while working on the positioning table 101; this application can make processingequipment realize piezoceramics piece 7's change under the condition of not shutting down through the setting of the replacement piece subassembly 4, has improved processingequipment's production efficiency.
In one embodiment, in a preferred implementation, blade changing assembly 4 includes a first moving portion 401 and a blade changing portion 402 connected to each other, first moving portion 401 is provided with a second air suction pipe 4011 and a second air suction part 4012, a surface of blade changing portion 402 is provided with a suction hole 4021, suction hole 4021 is connected to second air suction pipe 4011, and second air suction pipe 4011 is connected to second air suction part 4012. This application is through adsorbing hole 4021 and second breathing pipe 4011 and second piece 4012's cooperation of breathing in, has realized the absorption and the location to piezoceramics piece 7. Of course, it can be understood by those skilled in the art that when the replacing assembly 4 moves from the first position to the second position to replace the piezoelectric ceramic plate 7, the first air-absorbing member 105 stops working, and after the replacing assembly 4 places the piezoelectric ceramic plate 7 in the positioning hole 102, the first air-absorbing member 105 starts working, and the positioning hole 102 absorbs the piezoelectric ceramic plate 7 to position the piezoelectric ceramic plate 7.
In one embodiment, the plurality of dust suction holes 201 are uniformly disposed between the positioning holes 102. This application is through evenly setting up dust absorption hole 201 between locating hole 102, and the piezoceramics piece 7 that can effectual absorption be located on locating hole 102 produces the dirt bits in the course of working.
In one embodiment, the adsorption holes 4021 and the positioning holes 102 are disposed corresponding to each other. According to the piezoelectric ceramic piece 7 replacing device, the adsorption holes 4021 and the positioning holes 102 are arranged correspondingly, so that the butting precision between the adsorption holes 4021 and the positioning holes 102 is improved, and the efficiency of replacing the piezoelectric ceramic pieces 7 is improved.
In one embodiment, the processing apparatus further includes a connecting plate 5, the cutter assembly 3 includes a second moving portion 301 and a grinder 302 disposed on the second moving portion 301, the first moving portion 401 and the second moving portion 301 are disposed on the connecting plate 5, and the connecting plate 5 is provided with a moving track 501. According to the piezoelectric ceramic chip machining device, the wafer replacing component 4 and the cutter component 3 can move along the horizontal direction through the arrangement of the moving track 501, when the piezoelectric ceramic chip 7 is machined, the wafer replacing component 4 is stored at one side of the machining device, and the cutter component 3 is used for machining the piezoelectric ceramic chip 7 on the positioning table 101; when the piezoelectric ceramic plate 7 on the positioning table 101 needs to be replaced, the plate changing assembly 4 moves to the positioning table 101, the piezoelectric ceramic plate 7 on the positioning table 101 is changed, and the cutter assembly 3 is accommodated on one side of the processing device.
In one embodiment, the device further comprises a support plate 6, wherein the surface of the support plate 6 is provided with a lifting rail 601, and the connecting plate 5 can reciprocate along the lifting rail 601. This application can make cutter unit 3 and commutation subassembly 4 along vertical direction reciprocating motion through lifting track 601's setting to the position of adjustment cutter unit 3 and commutation subassembly 4.
In one embodiment, the diameter of the positioning hole 102 is 0.5 to 0.8 times of the diameter of the piezoelectric ceramic plate 7, and the diameter of the adsorption hole 4021 is 0.5 to 0.8 times of the diameter of the piezoelectric ceramic plate 7. When the diameter of the positioning hole 102 and the diameter of the adsorption hole 4021 are smaller than 0.5 times of the diameter of the piezoelectric ceramic piece 7, the adsorption force on the piezoelectric ceramic piece 7 is small, and the piezoelectric ceramic piece 7 is easy to fall off; when the diameter of the positioning hole 102 and the diameter of the adsorption hole 4021 are larger than 0.8 of the diameter of the piezoelectric ceramic piece 7, the adsorption force of the positioning hole 102 is too large, so that the piezoelectric ceramic piece 7 is easily damaged; when the diameter of the positioning hole 102 and the diameter of the adsorption hole 4021 are larger than or equal to the diameter of the piezoelectric ceramic sheet 7, the positioning hole 102 and the adsorption hole 4021 do not play a positioning role. Of course, those skilled in the art can understand that a limiting boss is arranged around the positioning hole 102 to limit the piezoelectric ceramic plate 7, so as to prevent the piezoelectric ceramic plate 7 from displacing; in specific implementation, a limit boss may also be disposed around the adsorption hole 4021.
In one embodiment, the diameter of the dust suction hole 201 is 1.2 to 2 times the diameter of the positioning hole 102. When the diameter of the dust suction hole 201 is smaller than 1.2 times of the diameter of the positioning hole 102, the dust suction effect of the dust suction hole 201 is smaller; when the diameter of the dust suction hole 201 is larger than 2 times of the diameter of the positioning hole 102, the adsorption force is too large, and the piezoelectric ceramic plate 7 adsorbed on the positioning hole 102 is easily displaced.
In one embodiment, the cutter assembly 3 further comprises a dust cover 303, the dust cover 303 covering the top of the sharpener 302. This application can play dirt-proof effect to cutter unit 3 through the setting of dust cover 303. Of course, those skilled in the art will appreciate that the dust cover 303 can be covered over the dust suction hole 201 to improve the dust suction effect of the dust suction hole 201.
In one embodiment, the second suction line 4011 is provided as a hose. This application is through setting up second breathing pipe 4011 to the hose, can make second breathing pipe 4011 follow first removal portion 401 and remove, has improved first removal portion 401's flexibility.
The method can be realized by adopting or referring to the prior art in places which are not described in the utility model.
The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments.
The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (10)
1. The utility model provides a processingequipment of piezoceramics piece which characterized in that includes:
the positioning assembly comprises a positioning table and a positioning hole arranged on the surface of the positioning table, an air outlet space is arranged at the bottom of the positioning table and is communicated with the first air suction piece through a first air suction pipe, and the positioning hole, the air outlet space and the first air suction pipe form a positioning channel;
the dust collection assembly comprises a dust collection hole arranged on the surface of the positioning table, the dust collection hole is communicated with the air outlet space, and the dust collection hole, the air outlet space and the first air suction pipe form a dust collection channel;
a cutter assembly disposed above the positioning assembly, the cutter assembly being movable in a vertical direction and a horizontal direction;
the wafer replacing component is arranged above the positioning component and used for replacing the piezoelectric ceramic wafer of the positioning component, and the wafer replacing component can move in the horizontal direction, so that the wafer replacing component is provided with a first position which can be stored in one side of the processing device and a second position which can be used for replacing the piezoelectric ceramic wafer.
2. The processing device of the piezoelectric ceramic plate as claimed in claim 1, wherein the plate changing assembly comprises a first moving portion and a plate changing portion connected to each other, the first moving portion is provided with a second air suction pipe and a second air suction member, the surface of the plate changing portion is provided with an adsorption hole, the adsorption hole is connected to the second air suction pipe, and the second air suction pipe is connected to the second air suction member.
3. The processing apparatus of the piezoelectric ceramic plate as claimed in claim 1, wherein the dust suction holes are uniformly disposed between the positioning holes.
4. The processing device of the piezoelectric ceramic plate as claimed in claim 2, wherein the absorption holes and the positioning holes are disposed corresponding to each other.
5. The processing device of the piezoelectric ceramic plate as claimed in claim 2, wherein the processing device further comprises a connecting plate, the cutter assembly comprises a second moving portion and a grinding tool disposed on the second moving portion, the first moving portion and the second moving portion are disposed on the connecting plate, and the connecting plate is provided with a moving track.
6. The processing device of the piezoelectric ceramic plate as claimed in claim 5, further comprising a support plate, wherein a lifting rail is disposed on the surface of the support plate, and the connecting plate can reciprocate along the lifting rail.
7. The processing device of the piezoelectric ceramic plate as claimed in claim 2, wherein the diameter of the positioning hole is 0.5 to 0.8 times of the diameter of the piezoelectric ceramic plate, and the diameter of the adsorption hole is 0.5 to 0.8 times of the diameter of the piezoelectric ceramic plate.
8. The processing device of the piezoelectric ceramic plate as claimed in claim 1, wherein the diameter of the dust suction hole is 1.2-2 times of the diameter of the positioning hole.
9. The processing device of the piezoelectric ceramic plate as claimed in claim 5, wherein the cutter assembly further comprises a dust cover, and the dust cover is arranged on the top of the grinding tool.
10. The processing device of the piezoelectric ceramic plate as claimed in claim 2, wherein the second air suction pipe is provided as a hose.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122479344.3U CN215919940U (en) | 2021-10-14 | 2021-10-14 | Processing device of piezoelectric ceramic piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122479344.3U CN215919940U (en) | 2021-10-14 | 2021-10-14 | Processing device of piezoelectric ceramic piece |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215919940U true CN215919940U (en) | 2022-03-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122479344.3U Active CN215919940U (en) | 2021-10-14 | 2021-10-14 | Processing device of piezoelectric ceramic piece |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215919940U (en) |
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2021
- 2021-10-14 CN CN202122479344.3U patent/CN215919940U/en active Active
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