CN215903106U - Wafer chamfer C angle location frock - Google Patents

Abstract

The utility model discloses a wafer chamfering C-angle positioning tool, and belongs to the field of ring wafer processing. The utility model provides a disk chamfer C angle location frock, includes the operation panel and installs the bench drill spare on the operation panel, still includes: the operation frame is connected to the operation table; wherein, a dropping groove is arranged on the operating frame; the disc is provided with a plurality of groups of empty slots and is rotationally connected to the operating frame; the empty grooves are used for placing the wafer pieces and matched with the falling grooves, and one group of empty grooves are positioned at the lower end of the bench drill piece; the sliding frame is connected to the operating platform and is positioned at the lower end of the falling groove; according to the utility model, the rotatable disc and the empty groove arranged on the disc are convenient for positioning the wafer piece needing chamfering the C angle, and the wafer piece which is finished chamfering the C angle can be collected and synchronously carried out when the wafer piece is placed to be positioned through the arranged falling groove and the sliding frame, so that the chamfering effect is improved.

Description

Wafer chamfer C angle location frock

Technical Field

The utility model relates to the technical field of circular sheet processing, in particular to a circular sheet chamfering C angle positioning tool.

Background

Chamfering refers to cutting the workpiece to 45 degrees;

the wafer is an annular part, and the inner ring of the wafer needs to be chamfered by a bench drill during processing;

at present, when chamfering is carried out on a wafer, chamfering is carried out on the lower end of a bench drill machine by placing the wafer, the position of placing the wafer is mostly confirmed manually, the working precision is not high, the wafer is directly placed at the lower end of the bench drill machine, potential safety hazards exist, the wafer is taken out after chamfering, the wafer is placed again, and the operation efficiency is low.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the problems that when chamfering is carried out on a wafer, the wafer needs to be placed at the lower end of a bench drill to chamfer, the position for placing the wafer is mostly confirmed manually, the working precision is not high, the wafer is directly placed at the lower end of the bench drill, potential safety hazards exist, the wafer is taken out after chamfering, the wafer is placed again, and the operation efficiency is low.

In order to achieve the purpose, the utility model adopts the following technical scheme:

the utility model provides a disk chamfer C angle location frock, includes the operation panel and installs the bench drill spare on the operation panel, still includes: the operation frame is connected to the operation table; wherein, a dropping groove is arranged on the operating frame; the disc is provided with a plurality of groups of empty slots and is rotationally connected to the operating frame; the empty grooves are used for placing the wafer pieces and matched with the falling grooves, and one group of empty grooves are positioned at the lower end of the bench drill piece; and the sliding frame is connected to the operating platform and is positioned at the lower end of the falling groove.

In order to facilitate the installation of the disc member, it is preferable that the handling frame is rotatably connected with an installation bolt, and the disc is rotatably connected with the installation bolt.

In order to facilitate the collection of the powder when the angle C is ground, preferably, the operation frame is provided with an annular groove.

In order to facilitate the installation of the sliding frame, preferably, a sliding frame is fixedly connected to the sliding frame, and the sliding frame is fixedly connected to the operating platform.

In order to reduce damage of the wafer piece when the wafer piece falls, preferably, one end of the sliding frame, which is far away from the falling groove, is connected with a U-shaped frame, and a rubber plate is fixedly connected to the U-shaped frame.

In order to improve the buffering effect of the rubber plate, preferably, the U-shaped frame is slidably connected to the carriage, and an elastic rope is fixedly connected to the carriage and fixedly connected to the U-shaped frame.

Compared with the prior art, the utility model provides a wafer chamfering C angle positioning tool, which has the following beneficial effects:

the device has the advantages that the rotatable disc and the empty groove arranged on the disc are convenient for positioning the wafer piece needing chamfering the C angle, and the falling groove and the sliding frame are arranged, so that the wafer piece which is finished by chamfering the C angle can be collected and synchronously positioned when the wafer piece is placed to be positioned, and the chamfering effect is improved.

Drawings

Fig. 1 is a schematic structural diagram of a wafer chamfering C-angle positioning tool provided by the utility model;

fig. 2 is a schematic structural diagram of a disc of the disc chamfering C-angle positioning tool provided by the utility model;

fig. 3 is a schematic structural diagram of a drop groove of the wafer chamfering and C-angle positioning tool provided by the utility model;

fig. 4 is a schematic structural diagram of a U-shaped frame of the wafer chamfering C-angle positioning tool provided by the utility model.

In the figure: 1. an operation table; 101. a bench drill piece; 2. a carriage; 201. a sliding connection frame; 202. a U-shaped frame; 203. a rubber plate; 204. an elastic cord; 3. an operation frame; 301. an annular groove; 302. a drop tank; 303. installing a bolt; 4. a wafer piece; 401. a disk.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

Example (b):

referring to fig. 1-4, a disc chamfer angle location frock includes operation panel 1 and installs bench drill 101 on operation panel 1, and bench drill 101 is used for carrying out chamfer angle to 4 centers of disc spare, still includes: an operation frame 3 connected to the operation table 1; wherein, the operation frame 3 is provided with a falling groove 302; a disc 401 provided with a plurality of groups of empty slots and rotatably connected to the operation frame 3; the empty slots are used for placing the wafer pieces 4 and matched with the falling slots 302, and one group of empty slots are located at the lower end of the bench drill piece 101; and a carriage 2 connected to the operation table 1 and located at a lower end of the drop tank 302.

When the device is used, the wafer piece 4 with the C-shaped angle to be chamfered is prevented from being in the empty groove, and the disc 401 is rotated, so that the disc 401 can convey the wafer piece 4 to the lower end of the bench drill piece 101 through the empty groove, and the C-shaped angle chamfering is conveniently carried out on the wafer piece 4;

repeating the above operation, the C-angle chamfering can be continuously performed on the different wafer pieces 4, and it should be noted that, in the process of continuously rotating the disc 401, the wafer pieces 4 with the chamfered C-angle can be rotated and moved out to the upper end of the dropping groove 302, so that the wafer pieces 4 with the chamfered C-angle can drop on the inclined sliding frame 2, move out under the action of self gravity, and drop into the collection box body preset at the lower end of the outlet of the sliding frame 2;

the handling frame 3 is rotatably connected with a mounting bolt 303, the disc 401 is rotatably connected to the mounting bolt 303, and the disc 401 is conveniently detached or fixed on the handling frame 3 by rotating the mounting bolt 303 forward and backward.

Be equipped with ring channel 301 on handling frame 3, the piece that grinds out during the chamfer can drop in ring channel 301, and is further, can set up the dust catcher in ring channel 301 for collect the sweeps.

The sliding connection frame 201 is fixedly connected to the sliding frame 2, the sliding connection frame 201 is fixedly connected to the operating platform 1, and the sliding frame 2 is conveniently mounted on the operating platform 1 through the arranged sliding connection frame 201 and matched bolts.

One end of the carriage 2, which is far away from the drop groove 302, is connected with a U-shaped frame 202, the rubber plate 203 is fixedly connected to the U-shaped frame 202, and when the wafer piece 4 drops, the rubber plate 203 can be impacted to reduce the impact force of the wafer piece 4 and prevent the wafer piece 4 from being damaged.

U-shaped frame 202 sliding connection is on carriage 2, fixedly connected with elasticity rope 204 on the carriage 2, and elasticity rope 204 links to each other with U-shaped frame 202 is fixed, can make rubber slab 203 further slide the buffering when receiving the impact through elasticity rope 204, improves the protection effect to disk spare 4.

According to the utility model, the rotatable disc 401 and the empty groove arranged on the disc 401 are arranged, so that the wafer piece 4 with the C-shaped chamfer can be conveniently positioned, and the falling groove 302 and the sliding frame 2 are arranged, so that the wafer piece 4 with the C-shaped chamfer can be collected and synchronously positioned when the wafer piece 4 is placed and positioned, the C-shaped chamfer effect is improved, and the safety is high.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.

Claims (6)

1. The utility model provides a disk chamfer C angle location frock, includes operation panel (1) and installs bench drill spare (101) on operation panel (1), its characterized in that still includes:

an operation frame (3) connected to the operation table (1);

wherein a dropping groove (302) is arranged on the operating frame (3);

a disc (401) provided with a plurality of groups of empty slots and rotatably connected to the operation frame (3);

the empty grooves are used for placing the wafer pieces (4), the empty grooves are matched with the falling grooves (302), and one group of empty grooves are located at the lower end of the bench drill piece (101);

and the sliding frame (2) is connected to the operating platform (1) and is positioned at the lower end of the falling groove (302).

2. The tool for positioning the C-shaped chamfer of the disc as claimed in claim 1, wherein the handling frame (3) is rotatably connected with a mounting bolt (303), and the disc (401) is rotatably connected with the mounting bolt (303).

3. The tool for positioning the C-shaped chamfer of the disc as claimed in claim 1, wherein the handling frame (3) is provided with an annular groove (301).

4. The tool for positioning the C-shaped chamfer of the wafer as claimed in claim 1, wherein the sliding frame (201) is fixedly connected to the sliding frame (2), and the sliding frame (201) is fixedly connected to the operating table (1).

5. The tool for positioning the C-shaped chamfer of the wafer as claimed in claim 4, wherein one end of the carriage (2) far away from the dropping groove (302) is connected with a U-shaped frame (202), and a rubber plate (203) is fixedly connected to the U-shaped frame (202).

6. The disc chamfering tool according to claim 5, wherein the U-shaped frame (202) is slidably connected to the carriage (2), an elastic rope (204) is fixedly connected to the carriage (2), and the elastic rope (204) is fixedly connected to the U-shaped frame (202).

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