CN215902096U - Electronic cooling system for dispenser - Google Patents
Electronic cooling system for dispenser Download PDFInfo
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- CN215902096U CN215902096U CN202121528996.5U CN202121528996U CN215902096U CN 215902096 U CN215902096 U CN 215902096U CN 202121528996 U CN202121528996 U CN 202121528996U CN 215902096 U CN215902096 U CN 215902096U
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Abstract
An electronic cooling system for a dispenser comprises a temperature control unit and a heat dissipation unit. The temperature control unit comprises a conduction module, a semiconductor refrigeration piece and a temperature control module. The transmission module is provided with a plate body and a connecting block, wherein the connecting block protrudes from the front surface of the plate body and is provided with a containing groove for embedding the rubber mixing pipe. The temperature control module is provided with a temperature sensor and a temperature controller, the temperature sensor is arranged on the connecting block, and the temperature controller is electrically connected with the temperature sensor and the semiconductor refrigerating sheet so as to receive a temperature signal measured by the temperature sensor and control the semiconductor refrigerating sheet to work. The heat dissipation unit comprises a heat dissipation seat, a liquid cooling module and a liquid supply module. The refrigerating surface of the semiconductor refrigerating sheet is connected with the back surface of the plate body, and the radiating surface is connected with the radiating seat. The liquid cooling module is connected with the heat radiating seat through a connecting pipeline. The liquid supply module is provided with a liquid storage container and a pump and is connected with the heat dissipation seat and the liquid cooling module through a connecting pipeline. The blocking of the dispensing needle can be reduced by cooling the rubber mixing tube.
Description
Technical Field
The utility model relates to a cooling system for cooling a glue mixing pipe of a glue dispenser, in particular to an electronic cooling system for the glue dispenser.
Background
When the existing full-automatic dispensing machine operates, glue A and glue B are extruded from glue cylinders respectively filled with the glue A and the glue B in equal proportion, so that the glue A and the glue B are mixed in a glue mixing pipe and flow into a needle tube for dispensing after mixing. Due to the characteristics of the AB glue, the curing time is shorter when the temperature of the mixed glue is higher, and the curing time is longer when the temperature is lower. Therefore, when the full-automatic dispensing machine is generally in a work waiting state or stops working at normal temperature, the glue in the glue mixing pipe is partially cured and becomes sticky, so that the dispensing needle head is easy to block, and the number of times of replacing the needle head in the work is increased.
How to effectively reduce the temperature of the mixing tube to prolong the curing time of the colloid in the tube is a problem to be improved.
Disclosure of Invention
The utility model aims to provide an electronic cooling system for a dispenser, which can effectively reduce the temperature of a rubber mixing tube.
The electronic cooling system for the dispenser of the utility model is suitable for being installed on a machine table of the dispenser to cool a glue mixing pipe in some implementation modes, and comprises the following components: temperature control unit and heat dissipation unit. The temperature control unit comprises a conduction module, a semiconductor refrigeration piece and a temperature control module. The conduction module is made by the heat conduction material and has upright plate body and connecting block, the plate body has the front and the back, the connecting block certainly the front protrusion of plate body just has and extends and run through from top to bottom along the upper and lower direction the storage tank of connecting block, the storage tank is used for supplying the rubber mixing pipe inlays to establish and makes the rubber mixing pipe with the connecting block contact. The semiconductor refrigeration piece is provided with a refrigeration surface and a heat dissipation surface, and the refrigeration surface is connected with the back surface of the plate body. The temperature control module is provided with a temperature sensor and a temperature controller, the temperature sensor is arranged on the connecting block, and the temperature controller is electrically connected with the temperature sensor and the semiconductor refrigerating sheet to receive a temperature signal measured by the temperature sensor and control the semiconductor refrigerating sheet to work. The heat dissipation unit comprises a heat dissipation seat, a liquid cooling module and a liquid supply module. The heat radiating seat is provided with a seat body connected with the heat radiating surface of the semiconductor refrigerating sheet and a liquid flow passage formed in the seat body. The liquid cooling module is connected with the liquid outlet end of the liquid flow passage through a connecting pipeline. The liquid supply module is provided with a liquid storage container and a pump and is connected with the liquid inlet end of the liquid flow channel and the liquid outlet end of the liquid cooling module through a connecting pipeline so as to supply working liquid to the heat dissipation seat to take away heat energy, and the working liquid returns to the liquid storage container after being cooled by the liquid cooling module to form a circulation loop.
The electronic cooling system for the dispenser comprises a temperature control unit, a heat insulation module and a transmission module, wherein the temperature control unit mainly comprises a heat insulation material and covers the transmission module.
The temperature control unit further comprises a fixing frame assembled and fixed with the heat radiating seat, a plate body of the conduction module and the semiconductor refrigerating sheet are contained in the fixing frame, the heat insulation module is provided with a fixing block assembled and fixed with the fixing frame and exposed out of the accommodating groove, and a cover plate detachably connected with the fixing block and covering the accommodating groove, and the conduction module is limited in the fixing frame by the fixing block and covers the conduction module together with the cover plate.
According to the electronic cooling system for the dispensing machine, the fixing block is provided with the first magnetic part, the cover plate is provided with the second magnetic part, and the first magnetic part corresponds to the second magnetic part in position so that the cover plate and the fixing block are connected and fixed through magnetic attraction.
The electronic cooling system for the dispenser is characterized in that the heat insulation module is also provided with a connecting wire for connecting the fixing block and the cover plate.
According to the electronic cooling system for the dispensing machine, the fixing block and the cover plate are made of polytetrafluoroethylene.
According to the electronic cooling system for the dispensing machine, the refrigerating surface and the radiating surface of the semiconductor refrigerating sheet are coated with a layer of heat-conducting glue respectively.
The electronic cooling system for the dispenser is characterized in that the liquid cooling module is a water cooling bar.
The glue mixing tube has the beneficial effects that the temperature control unit and the heat dissipation unit are used for keeping the glue mixing tube at a lower temperature, so that the mixed glue in the glue mixing tube is cooled to prolong the curing time of the glue, and the blocking condition of the glue dispensing needle head can be reduced.
Drawings
Other features and effects of the present invention will be apparent from the embodiments with reference to the accompanying drawings, in which:
FIG. 1 is a perspective view of an embodiment of an electronic cooling system for a dispenser of the present invention;
FIG. 2 is an enlarged view of a portion of FIG. 1;
FIG. 3 is a fragmentary exploded perspective view of the embodiment;
FIG. 4 is a fragmentary exploded perspective view of the embodiment; and
fig. 5 is a fragmentary exploded perspective view of this embodiment, with the thermic module not shown.
Detailed Description
Referring to fig. 1 and 2, the embodiment of the electronic cooling system for a dispenser of the present invention is adapted to be mounted on a machine table 11 of the dispenser 1 for cooling a mixed rubber tube 12, and the electronic cooling system for a dispenser includes a temperature control unit 2 and a heat dissipation unit 3.
The heat dissipation unit 3 is disposed on the machine 11 and includes a heat dissipation base 31, a liquid cooling module 32, and a liquid supply module 33.
Referring to fig. 5, the heat sink 31 has a copper base 311 fixed on the machine 11 and a liquid channel 312 formed in the base 311. The liquid channel 312 has a liquid inlet end 312a and a liquid outlet end 312b located at the side of the seat body 311, for allowing the working liquid to flow through the interior of the seat body 311 to take away the heat energy on the seat body 311.
The liquid cooling module 32 is used to cool the working liquid flowing through, and may be, for example, a water cooling drain, and has a liquid inlet 321 and a liquid outlet 322, wherein the liquid inlet 321 is connected to the liquid outlet 312b of the liquid channel 312 through the connecting pipeline 34.
The liquid supply module 33 has a liquid storage container 331 and a pump 332, and is connected to the liquid inlet 312a of the liquid flow channel 312 and the liquid outlet 322 of the liquid cooling module 32 through the connecting pipeline 34, so as to supply the working liquid to the heat sink 31 to take away heat energy, and then the working liquid is cooled by the liquid cooling module 32 and returns to the liquid storage container 331 to form a circulation loop.
With reference to fig. 3 to 5, the temperature control unit 2 includes a conductive module 21, a semiconductor cooling plate 22, a temperature control module 23, a fixing frame 24 and a heat insulation module 25.
The conduction module 21 is made of a heat conductive material, such as copper, and has a vertical plate body 211 and a connection block 212. The plate body 211 has a front surface and a back surface. The connecting block 212 protrudes from the front surface of the plate body 211 and has a receiving groove 213 extending in the vertical direction and vertically penetrating the connecting block 212. The receiving groove 213 is used for inserting the rubber mixing tube 12 so that the rubber mixing tube 12 contacts the connecting block 212.
The semiconductor cooling plate 22 has a cooling surface 221 and a heat dissipating surface 222, wherein the cooling surface 221 is connected to the back surface of the plate body 211 of the conduction module 21, and the heat dissipating surface 222 is connected to the seat body 311 of the heat dissipating seat 31. In the present embodiment, the cooling surface 221 and the heat dissipating surface 222 of the semiconductor cooling plate 22 are respectively coated with a layer of silicone heat-conducting glue, and are connected to the plate body 211 and the base body 311 through the heat-conducting glue, so that the heat conduction of the semiconductor cooling plate 22 is faster and more uniform.
The temperature control module 23 has a temperature sensor 231 and a temperature controller 232. The temperature sensor 231 is provided in the connection block 212, and the temperature sensor 231 is, for example, a thermocouple. The temperature controller 232 is electrically connected to the temperature sensor 231 and the semiconductor chilling plate 22 to receive the temperature signal detected by the temperature sensor 231 and control the semiconductor chilling plate 22 to work. The temperature sensor 231 mounted on the connection block 212 senses the real-time temperature and feeds back to the temperature controller 232, and the temperature controller 232 controls the semiconductor cooling plate 22 to work to cool and reduce the temperature of the conduction module 21 to reach the required temperature set by the temperature controller 232.
The fixing frame 24 is assembled and fixed with the heat sink 31, and the plate body 211 of the conduction module 21 and the semiconductor chilling plate 22 are accommodated in the fixing frame 24.
The heat insulating module 25 is mainly made of a heat insulating material and covers the conduction module 21 to insulate the conduction module 21. The heat insulation module 25 has a fixing block 251 assembled and fixed with the fixing frame 24 and exposed from the receiving groove 213, a cover plate 252 detachably connected with the fixing block 251 and covering the receiving groove 213, and a connecting wire 253 connecting the fixing block 251 and the cover plate 252. The fixing block 251 limits the conductive module 21 in the fixing frame 24 and covers the conductive module 21 together with the cover plate 252. In the embodiment, the fixing block 251 and the cover plate 252 are made of Polytetrafluoroethylene (abbreviated as PTFE), which can increase the heat preservation effect. The fixing block 251 is provided with a first magnetic member 254, the cover plate 252 is provided with a second magnetic member 255, and the first magnetic member 254 corresponds to the second magnetic member 255 in position so that the cover plate 252 and the fixing block 251 are connected and fixed through magnetic attraction. One of the first magnetic member 254 and the second magnetic member 255 may be a magnet, and the other may be an iron member capable of being magnetically attracted. In the present embodiment, three first magnetic members 254 are embedded in the fixing block 251. The number of the second magnetic members 255 is three corresponding to that of the first magnetic members 254, and the second magnetic members 255 are respectively embedded in the cover plate 252. The cover plate 252 is connected and fixed to the fixing block 251 by the magnetic attraction of the first magnetic member 254 and the second magnetic member 255, so that an operator can quickly take off the cover plate 252 and quickly install the cover plate 252 to observe the mixing condition of the rubber body of the rubber mixing tube 12. The cover plate 252 is connected to the fixing block 251 by a connecting wire 253, so that the cover plate 252 is not easily lost.
When in use, a desired temperature is set at the temperature controller 232, and the temperature sensor 231 senses the real-time temperature of the conduction module 21 and feeds the sensed temperature back to the temperature controller 232. The temperature controller 232 controls the semiconductor chilling plate 22 to work, the chilling surface 221 of the semiconductor chilling plate 22 transfers low temperature to the conduction module 21 through heat transfer, and the low temperature is transferred to the glue mixing pipe 12 through the conduction module 21 to cool the glue in the glue mixing pipe 12, so as to prolong the curing time of the glue. The heat energy radiated from the heat radiating surface 222 of the semiconductor cooling plate 22 is transferred to the heat radiating seat 31 by heat transfer. The working fluid in the fluid reservoir 331 is pumped by the pump 332 and is transported to the fluid channel 312 of the heat sink 31 through the connecting pipeline 34 to take away the heat energy on the base 311, so as to achieve the purpose of rapidly dissipating heat from the semiconductor cooling plate 22. The working fluid absorbs heat energy and then enters the liquid cooling module 32 through the connecting pipeline 34, and the working fluid dissipates heat in the liquid cooling module 32 and then returns to the liquid storage container 331 to complete a refrigeration and heat dissipation cycle. The temperature of the conduction module 21 can be brought to the desired temperature set by the thermostat 232 through a number of cycles. In addition, the heat insulation module 25 keeps the temperature of the conduction module 21 low, so that the time for operating the semiconductor cooling sheet 22 can be reduced.
In summary, the temperature control unit 2 and the heat dissipation unit 3 keep the temperature of the rubber mixing tube 12 at a low temperature, and further cool the rubber mixture in the rubber mixing tube 12 to prolong the curing time of the rubber mixture, thereby reducing the occurrence of blockage of the dispensing needle.
The above description is only an example of the present invention, and the scope of the present invention should not be limited thereby, and the utility model is still within the scope of the present invention by simple equivalent changes and modifications made according to the claims and the contents of the specification.
Claims (8)
1. The utility model provides an electronic type cooling system for point gum machine, is applicable to and installs on the board of point gum machine and is used for mixing the rubber tube cooling, its characterized in that: the electronic cooling system for the dispenser comprises:
a temperature control unit comprising
The conduction module is made of heat conduction materials and is provided with an upright plate body and a connecting block, the plate body is provided with a front surface and a back surface, the connecting block protrudes from the front surface of the plate body and is provided with a containing groove which extends along the vertical direction and vertically penetrates through the connecting block, the containing groove is used for embedding the rubber mixing pipe so that the rubber mixing pipe is contacted with the connecting block,
a semiconductor refrigerating plate having a refrigerating surface and a heat dissipating surface, the refrigerating surface being connected to the back surface of the plate body, an
The temperature control module is provided with a temperature sensor and a temperature controller, the temperature sensor is arranged on the connecting block, and the temperature controller is electrically connected with the temperature sensor and the semiconductor refrigerating sheet so as to receive a temperature signal measured by the temperature sensor and control the semiconductor refrigerating sheet to work; and
a heat dissipating unit comprising
A heat radiation seat which is provided with a seat body connected with the heat radiation surface of the semiconductor refrigeration piece and a liquid flow passage formed in the seat body,
a liquid cooling module connected with the liquid outlet end of the liquid flow passage through a connecting pipeline, an
And the liquid supply module is provided with a liquid storage container and a pump and is connected with the liquid inlet end of the liquid flow channel and the liquid outlet end of the liquid cooling module through a connecting pipeline so as to supply working liquid to the heat dissipation seat to take away heat energy, and the working liquid returns to the liquid storage container after being cooled by the liquid cooling module to form a circulation loop.
2. The electronic cooling system for a dispenser according to claim 1, characterized in that: the temperature control unit further includes an insulation module mainly made of an insulation material and covering the conductive module.
3. The electronic cooling system for a dispenser according to claim 2, characterized in that: the temperature control unit further comprises a fixing frame assembled and fixed with the heat radiating seat, the plate body of the conduction module and the semiconductor refrigeration piece are contained in the fixing frame, the heat insulation module is provided with a fixing block assembled and fixed with the fixing frame and exposed out of the accommodating groove, and a cover plate detachably connected with the fixing block and covering the accommodating groove, and the conduction module is limited in the fixing frame by the fixing block and jointly covered with the cover plate.
4. The electronic cooling system for a dispenser according to claim 3, characterized in that: the fixed block is equipped with first magnetism spare, the apron is equipped with second magnetism spare, first magnetism spare with second magnetism spare position is corresponding so that the apron with the fixed block is connected fixedly with magnetic attraction.
5. The electronic cooling system for a dispenser according to claim 4, characterized in that: the heat insulation module is also provided with a connecting line for connecting the fixing block and the cover plate.
6. The electronic cooling system for a dispenser according to claim 3, wherein: the fixed block and the cover plate are made of polytetrafluoroethylene.
7. The electronic cooling system for a dispenser according to claim 1, wherein: and the refrigerating surface and the radiating surface of the semiconductor refrigerating sheet are respectively coated with a layer of heat-conducting glue.
8. The electronic cooling system for a dispenser according to claim 1, wherein: the liquid cooling module is a water cooling bar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121528996.5U CN215902096U (en) | 2021-07-06 | 2021-07-06 | Electronic cooling system for dispenser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121528996.5U CN215902096U (en) | 2021-07-06 | 2021-07-06 | Electronic cooling system for dispenser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215902096U true CN215902096U (en) | 2022-02-25 |
Family
ID=80288911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121528996.5U Active CN215902096U (en) | 2021-07-06 | 2021-07-06 | Electronic cooling system for dispenser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215902096U (en) |
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2021
- 2021-07-06 CN CN202121528996.5U patent/CN215902096U/en active Active
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