CN215896184U - Super capacitor shell, super capacitor and super capacitor module - Google Patents
Super capacitor shell, super capacitor and super capacitor module Download PDFInfo
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- CN215896184U CN215896184U CN202121801138.3U CN202121801138U CN215896184U CN 215896184 U CN215896184 U CN 215896184U CN 202121801138 U CN202121801138 U CN 202121801138U CN 215896184 U CN215896184 U CN 215896184U
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Abstract
The utility model relates to the technical field of super capacitors, and discloses a super capacitor shell, a super capacitor and a super capacitor module, wherein the super capacitor shell comprises: the heat dissipation device comprises a shell, wherein a containing cavity and a heat dissipation channel for circulating a heat-conducting medium are arranged in the shell; the first connecting structure and the second connecting structure are arranged on the shell; one of the first connecting structure and the second connecting structure is provided with a flow inlet, the other of the first connecting structure and the second connecting structure is provided with a flow outlet, and the flow inlet and the flow outlet are both communicated with the heat dissipation channel; two adjacent supercapacitor housings may be connected by a first connection structure and a second connection structure. The utility model has the advantages that the adjacent super capacitors can be butted through the first connecting structure and the second connecting structure, the heat dissipation channels are sequentially communicated, the common heat dissipation requirements of different numbers of super capacitors are met, and the use flexibility of the super capacitors can be effectively improved.
Description
Technical Field
The utility model relates to the technical field of energy storage devices, in particular to a super capacitor shell, a super capacitor and a super capacitor module.
Background
The super capacitor is a novel energy storage device between a traditional capacitor and a rechargeable battery, and has the characteristics of quick charge and discharge of the capacitor and the energy storage characteristic of the battery. Compared with a storage battery and a traditional capacitor, the super capacitor is mainly characterized in that: high power density, long cycle life, wide working temperature limit, no maintenance, green and environmental protection, etc. Therefore, the super capacitor has wide application prospect in the fields of energy, automobiles, medical treatment and health, electronics, military and the like.
In the application of the super capacitor, the service life and the safety of the super capacitor are affected by heat generation or overheating of the use environment in the charging and discharging processes of the super capacitor. Most heat radiation structure all welds or with ultracapacitor system shell integrated into one piece at present, and most heat dissipation parts are the metal, and scrap when ultracapacitor system and handle the back, heat radiation structure retrieves the difficulty, hardly recycles.
At present, the super capacitor mainly utilizes natural convection heat dissipation or air-cooled heat dissipation, and the radiating efficiency is lower, and the structure is not compact, is unfavorable for the improvement of super capacitor module energy density, and in addition, the water-cooling mode is the higher structure of radiating efficiency, but need design complicated heat abstractor, and a heat abstractor can only realize the heat dissipation to single super capacitor, perhaps is unfavorable for promoting super capacitor's use flexibility to the heat dissipation of whole super capacitor module.
SUMMERY OF THE UTILITY MODEL
In view of the above disadvantages in the prior art, the present invention provides a super capacitor case, a super capacitor, and a super capacitor module, which can meet the heat dissipation requirements of different numbers of super capacitors and have high flexibility.
The technical scheme adopted by the utility model for solving the technical problem is to provide a super capacitor shell, which comprises the following components:
the heat dissipation device comprises a shell, wherein an accommodating cavity and a heat dissipation channel for circulating a heat-conducting medium are arranged in the shell;
the first connecting structure and the second connecting structure are arranged on the shell; one of the first connecting structure and the second connecting structure is provided with a flow inlet, the other of the first connecting structure and the second connecting structure is provided with a flow outlet, and the flow inlet and the flow outlet are both communicated with the heat dissipation channel; two adjacent supercapacitor housings may be connected by the first and second connection structures.
Furthermore, the first connecting structure is provided with an internal thread, and the second connecting structure is provided with an external thread;
two adjacent supercapacitor housings may be connected by said internal and external threads.
Further, the second connecting structure protrudes out of the outer wall of the shell;
and when the two super capacitors are adjacent, the second connecting structure can be embedded into the first connecting structure of the adjacent super capacitor, and the heat dissipation channels of the two adjacent super capacitors are communicated with each other.
Further, the heat dissipation channel is arranged around the outer side of the accommodating cavity.
Furthermore, the inlet and the outlet are both located at the bottom of the shell, and the inlet faces the outlet.
The technical scheme adopted by the utility model for solving the technical problem is to provide a super capacitor, which comprises the following components:
the supercapacitor housing described above;
the positive electrode, the negative electrode, the diaphragm and the electrolyte are all arranged in the accommodating cavity; the separator is between the positive electrode and the negative electrode; and the electrolyte is arranged between the anode and the diaphragm and between the cathode and the diaphragm.
Further, the positive electrode and the negative electrode are arranged in a finger-inserting manner.
The technical scheme adopted by the utility model for solving the technical problem is to provide a super capacitor module, which comprises the following components:
a plurality of the super capacitors are connected with each other through the first connecting structure and the second connecting structure; the heat dissipation channels of the plurality of super capacitors are sequentially communicated, and heat conducting media are arranged in the heat dissipation channels.
Further, the heat conducting medium is a phase-change material, and the phase-change temperature of the phase-change material is higher than room temperature and lower than the upper limit of the use temperature of the super capacitor.
Furthermore, a sealing gasket is arranged between the first connecting structure and the second connecting structure of two adjacent super capacitors;
and/or the supercapacitor comprises a flexible substrate, wherein a plurality of through holes are formed in the flexible substrate, and the supercapacitor is arranged on the flexible substrate; the positive electrode is provided with a positive electrode leading-out end, the negative electrode is provided with a negative electrode leading-out end, and the positive electrode leading-out end and the negative electrode leading-out end penetrate through the through hole and are connected to the flexible circuit; and a rigid base material detachably connected with the flexible base material is arranged below the flexible base material.
Further, still include at least one thermostatic switch, thermostatic switch connect in between ultracapacitor system module and the consumer, thermostatic switch's disconnection temperature is ultracapacitor system's service temperature upper limit.
Compared with the prior art, the utility model has at least the following beneficial effects:
according to the utility model, the heat dissipation channel is arranged in the shell of the super capacitor, the heat dissipation channel is arranged around the outer side of the accommodating cavity, the first connecting structure and the second connecting structure are both communicated with the heat dissipation channel, two adjacent super capacitors can be connected with each other through the first connecting structure and the second connecting structure and keep the communication of the heat dissipation channels, a heat conduction medium can flow in the heat dissipation channels of the plurality of super capacitors, the integral heat dissipation of the plurality of super capacitors is realized, and different numbers of super capacitors can be used according to actual requirements. Therefore, the scheme can meet the heat dissipation requirements of different quantities of super capacitors and has high flexibility; the first connecting structure and the second connecting structure of the two adjacent supercapacitors are connected, so that the assembly and disassembly are convenient, and other heat dissipation mechanisms do not need to be additionally arranged. In addition, the arrangement of the flow inlet and the flow outlet after the supercapacitor is scrapped can facilitate the recovery of the heat-conducting medium.
Drawings
FIG. 1 is a schematic structural diagram of a super capacitor of the present invention;
FIG. 2 is a schematic structural diagram of a supercapacitor module;
fig. 3 is another schematic structural diagram of the supercapacitor module.
In the figure:
1. a positive electrode; 2. a negative electrode; 3. an electrolyte; 4. a diaphragm; 5. a housing; 6. a positive electrode leading-out terminal; 7. a negative lead-out terminal; 8. a heat-conducting medium; 9. a first connecting structure; 10. a second connecting structure; 11. a flexible substrate; 12. a flexible circuit; 13. a rigid substrate.
Detailed Description
The following are specific embodiments of the present invention and are further described with reference to the drawings, but the present invention is not limited to these embodiments.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
Moreover, descriptions of the present invention as relating to "first," "second," "a," etc. are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit ly indicating a number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In addition, the technical solutions in the embodiments of the present invention may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination of technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The first embodiment is as follows:
as shown in fig. 1, an ultracapacitor housing comprises: the heat dissipation device comprises a shell 5, wherein an accommodating cavity and a heat dissipation channel for circulating a heat conducting medium 8 are arranged in the shell 5; the accommodating cavity is used for accommodating components such as the anode 1, the cathode 2, the electrolyte 3, the diaphragm 4 and the like, the heat dissipation channel accommodates the heat conducting medium 8 and is a circulation channel of the heat conducting medium 8, the heat dissipation channel is arranged around the outside of the accommodating cavity, so that the heat conducting medium can quickly take away heat generated in the accommodating cavity, the heat dissipation efficiency is improved, the surrounding arrangement is from bottom to top, the heat dissipation channel almost completely wraps the outside of the accommodating cavity, namely the heat dissipation channel is covered except the mounting positions of other parts, the heat dissipation channel is enabled to be optimal, and the heat dissipation channel is not communicated with the accommodating cavity; a first connecting structure 9 and a second connecting structure 10 both provided on the housing 5; one of the first connecting structure 9 and the second connecting structure 10 is provided with a flow inlet, and the other of the first connecting structure 9 and the second connecting structure 10 is provided with a flow outlet, wherein the flow inlet and the flow outlet can be used for the heat-conducting medium 8 to enter and flow out. The flow inlet and the flow outlet are both arranged at the bottom of the shell 5, and the flow inlet is right opposite to the flow outlet, so that the super capacitors can be conveniently and sequentially butted with each other. Generally, the heat transfer medium 8 is a liquid; the flow inlet and the flow outlet are communicated with the heat dissipation channel; two adjacent supercapacitor housings can be connected through the first connecting structure 9 and the second connecting structure 10, that is, the first connecting structure 9 and the second connecting structure 10 are adapted to realize the butt joint of two adjacent supercapacitors.
Wherein, the first connecting structure 9 is provided with an internal thread, and the second connecting structure 10 is provided with an external thread; the two adjacent supercapacitor shells can be detachably connected through the internal threads and the external threads, namely, the two adjacent supercapacitors can be detachably connected. Specifically, the second connection structure 10 is a screwed pipe with an external thread on the outer wall, the first connection structure 9 is an internal thread on the inner wall of the through hole on the shell 5, the screwed pipe and the internal thread are matched, and two adjacent supercapacitors can be connected to the hole with the internal thread through the screwed pipe, so that butt joint and communication are realized. Specifically, the second connecting structure 10 protrudes on the outer wall of the housing 5; when the two super capacitors are adjacent, the second connecting structure 10 can be embedded into the first connecting structure 9 of the adjacent super capacitor, the heat dissipation channels of the two adjacent super capacitors are communicated with each other, and the second connecting structure 10 is embedded into the first connecting structure 9, so that after the super capacitors are connected in a butt joint mode, the occupied mounting space is small, and the structure of the super capacitor module is more compact. This is a form of realizing threaded butt joint for the super capacitor, but it is not limited to this one form, such as: the butt joint mode of the large pipe and the small pipe can be realized, threads are not arranged, and interference fit and other modes are used.
Example two:
the super capacitor in the embodiment can be applied to a plurality of fields such as electric automobiles, electric power systems, intelligent meters, industrial instruments and equipment, electric toys and indicator lamps. The present embodiment will now explain each structure of the supercapacitor in detail.
As shown in fig. 1, a super capacitor includes: the above supercapacitor housing; the positive electrode 1, the negative electrode 2, the diaphragm 4 and the electrolyte 3 are all arranged in the accommodating cavity; the separator 4 is located between the positive electrode 1 and the negative electrode 2; the electrolyte 3 is arranged between the positive electrode 1 and the separator 4, and between the negative electrode 2 and the separator 4, that is, the electrolyte 3 is filled between the positive electrode 1 and the separator 4, and between the negative electrode 2 and the separator 4. Wherein, the positive electrode 1 and the negative electrode 2 are arranged in an inserting finger shape.
The explanation is that: the electrolyte 3 of the supercapacitor in this embodiment may be a lithium salt or an ammonium salt dissolved in an organic solvent, the organic solvent may be one or more of propylene carbonate, ethylene carbonate, acetonitrile, dimethyl carbonate or diethyl carbonate, the lithium salt may be lithium perchlorate (LiClO4), lithium hexafluorophosphate (LiPF6), lithium fluoroborate (LiBF4) or lithium trifluoromethanesulfonate (LiCF3SO3), and the ammonium salt may be tetraethylammonium fluoroborate (Et4NBF4) or tetrabutylammonium fluoroborate (Eu4NBF 4).
Alternatively, the separator 4 in the present embodiment may be a PP polypropylene separator having a thickness of 30 to 300 micrometers, or a cellulose separator having a thickness of 30 to 70 micrometers.
Optionally, the housing 5 in this embodiment is made of a high-strength and corrosion-resistant material, and the housing 5 may further be provided with an opening for adding the electrolyte 4 and a sealing member for sealing the opening.
Optionally, the material of the positive electrode 1 of the supercapacitor in this embodiment includes one or more of activated carbon, carbon nanotubes, graphene, activated carbon fiber cloth, carbon gel, high-density graphite, high-activity mesocarbon microbeads, cellular graphite with nano-voids, and conductive polymers. The surface of the positive electrode 1 contacting the electrolyte 3 may be a plane or a non-planar structure with a plurality of protruding structures to absorb more charges, and those skilled in the art can make reasonable selection according to the requirement on the performance of the supercapacitor.
Optionally, the material of the negative electrode 2 of the supercapacitor in this embodiment includes one or more of valve metal, valve metal oxide, valve metal carbide, and valve metal type nanocarbon. The surface of the negative electrode 2 contacting the electrolyte 3 may be a plane or a non-planar structure with a plurality of protruding structures, and those skilled in the art can make reasonable selection according to the requirements on the performance of the supercapacitor. Illustratively, the positive electrode 1 and the negative electrode 2 in the embodiment of the present invention are in a finger-inserted structure to increase the contact area of the positive electrode 1 and the negative electrode 2 with the electrolyte 3.
In the actual use process, the single supercapacitor is equivalent to the situation that the single supercapacitor is filled with the heat conducting medium 8, namely, the shell 5 of the supercapacitor is of a hollow structure filled with the heat conducting medium 8, so that the single supercapacitor can be effectively cooled.
Example three:
as shown in fig. 2-3, a super capacitor module includes: a plurality of super capacitors, and two adjacent super capacitors are connected through the first connection structure 9 and the second connection structure 10; the heat dissipation channels of the plurality of super capacitors are sequentially communicated, and heat conducting media 8 are arranged in the heat dissipation channels. The heat-conducting medium 8 is a phase-change material, and the phase-change temperature of the phase-change material is higher than room temperature and lower than the upper limit of the service temperature of the super capacitor. The phase-change material is solid at room temperature, and can absorb a large amount of heat under the condition of unchanging self temperature in the process of melting the heat absorbed by the super capacitor from solid to liquid, so that the heat dissipation effect is good. The phase-change material can be fatty acid, acetamide, sodium acetate trihydrate, low-melting-point metal and the like. When the first connecting structure 9 and the second connecting structure 10 of two adjacent supercapacitors are connected, a sealing gasket is further arranged to improve the connection tightness of the two supercapacitors.
Preferably, the supercapacitor module further comprises a flexible substrate 11, a plurality of through holes are formed in the flexible substrate 11, and the supercapacitor is arranged on the flexible substrate 11; the positive electrode 1 is provided with a positive electrode leading-out end 6, the negative electrode 2 is provided with a negative electrode leading-out end 7, and the positive electrode leading-out end 6 and the negative electrode leading-out end 7 are connected to the flexible circuit 12 through the through holes; a rigid substrate 13 is arranged below the flexible substrate 11. Specifically, the above flexible wiring 12 may be made of flexible copper foil, aluminum foil, or printed from flexible conductive paste. The flexible substrate 11 and the flexible circuit 12 are arranged, so that the installation mode and the wiring mode of the supercapacitor module are more flexible. Still including dismantling the rigid substrate 13 of connection, the setting of the rigid substrate 13 of dismantling can conveniently satisfy the high strength demand of the substrate to ultracapacitor system module under some circumstances. The flexible substrate 11 and the rigid substrate 13 can be detachably connected in various ways, such as bonding, bolting, etc., and are not limited herein.
The free ends of the positive lead-out end 6 and the negative lead-out end 7 far away from the positive electrode 1 or the negative electrode 2 in the embodiment extend out of the shell 5 through a channel penetrating through the shell 5, so that the free ends do not contact with the heat-conducting medium 8, and further the mutual influence between the positive lead-out end 6 and/or the negative lead-out end 7 and the heat-conducting medium 8 can be avoided.
Optionally, the supercapacitor module in this embodiment further includes at least one thermostatic switch, the thermostatic switch is connected between the supercapacitor module and the electric device, and an off temperature of the thermostatic switch is an upper limit of a service temperature of the supercapacitor. Once the temperature of the super capacitor module rises to the upper limit of the service temperature, the constant temperature switch automatically disconnects the electric connection between the super capacitor module and the electric equipment, and each super capacitor in the super capacitor module can be effectively protected from being damaged.
It should be noted that, in order to achieve a better heat dissipation effect, the heat conducting medium 8 should be flowing, and when only one supercapacitor works, the heat conducting medium should be driven to flow by communicating with the inflow port and the outflow port thereof through an external driving device, and when a plurality of supercapacitors are assembled together to work as shown in fig. 2, the heat conducting medium in the whole supercapacitor module should be driven to flow by communicating with the inflow port and the outflow port at the extreme edge in the whole supercapacitor module through the external driving device. When the heat-conducting medium is a phase-change material, the heat-conducting medium should be driven to flow by an external driving device after being melted.
In the use, this scheme is equipped with heat dissipation channel in the ultracapacitor system shell, heat dissipation channel encloses to be established in the outside that holds the chamber, and first connection structure 9 and second connection structure 10 all communicate with heat dissipation channel, two adjacent ultracapacitor system accessible first connection structure 9 and second connection structure 10 interconnect, and keep heat dissipation channel intercommunication, heat-conducting medium 8 can flow in a plurality of ultracapacitor system's heat dissipation channel, realize a plurality of ultracapacitor system's whole heat dissipation, and can be according to actual demand, use the ultracapacitor system of different quantity. Therefore, the scheme can meet the heat dissipation requirements of different quantities of super capacitors and has high flexibility; the first connecting structure 9 and the second connecting structure 10 of the two adjacent supercapacitors are connected, so that the assembly and disassembly are convenient, and other heat dissipation mechanisms do not need to be additionally arranged. In addition, the arrangement of the flow inlet and the flow outlet after the supercapacitor is scrapped can facilitate the recovery of the heat-conducting medium.
In this scheme, accessible first connection structure 9 and the butt joint of second connection structure 10 between the adjacent ultracapacitor system, heat dissipation channel communicates in proper order, satisfies the common heat dissipation demand of the ultracapacitor system of different quantity, and can effectively promote ultracapacitor system's use flexibility.
The specific embodiments described herein are merely illustrative of the spirit of the utility model. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the utility model as defined in the appended claims.
Claims (10)
1. An ultracapacitor housing, comprising:
the heat dissipation device comprises a shell, wherein an accommodating cavity and a heat dissipation channel for circulating a heat-conducting medium are arranged in the shell;
the first connecting structure and the second connecting structure are arranged on the shell; one of the first connecting structure and the second connecting structure is provided with a flow inlet, the other of the first connecting structure and the second connecting structure is provided with a flow outlet, and the flow inlet and the flow outlet are both communicated with the heat dissipation channel; two adjacent supercapacitor housings may be connected by the first and second connection structures.
2. The supercapacitor shell according to claim 1, wherein the first connection structure is provided with an internal thread, and the second connection structure is provided with an external thread;
two adjacent supercapacitor housings may be connected by said internal and external threads.
3. The supercapacitor shell according to claim 1 or 2, wherein the second connecting structure protrudes out of the outer wall of the casing;
and when the two super capacitors are adjacent, the second connecting structure can be embedded into the first connecting structure of the adjacent super capacitor, and the heat dissipation channels of the two adjacent super capacitors are communicated with each other.
4. The supercapacitor shell according to claim 1, wherein the heat dissipation channel is arranged around the outside of the accommodating cavity.
5. The shell of the super capacitor as claimed in claim 1, wherein the inlet and the outlet are located at the bottom of the shell, and the inlet faces the outlet.
6. An ultracapacitor, comprising:
the ultracapacitor housing according to any one of claims 1 to 5;
the positive electrode, the negative electrode, the diaphragm and the electrolyte are all arranged in the accommodating cavity; the separator is between the positive electrode and the negative electrode; and the electrolyte is arranged between the anode and the diaphragm and between the cathode and the diaphragm.
7. The supercapacitor of claim 6, wherein the positive and negative electrodes are interdigitated.
8. The utility model provides a super capacitor module which characterized in that, including:
a plurality of the super capacitors as claimed in any one of claims 6 to 7, and two adjacent super capacitors are connected through the first connection structure and the second connection structure; the heat dissipation channels of the plurality of super capacitors are sequentially communicated, and heat conducting media are arranged in the heat dissipation channels.
9. The supercapacitor module according to claim 8, wherein the heat conducting medium is a phase change material, and the phase change temperature of the phase change material is higher than room temperature and lower than the upper limit of the service temperature of the supercapacitor.
10. The supercapacitor module according to claim 8, wherein a sealing gasket is further disposed between the first connection structure and the second connection structure of two adjacent supercapacitors;
and/or the supercapacitor comprises a flexible substrate, wherein a plurality of through holes are formed in the flexible substrate, and the supercapacitor is arranged on the flexible substrate; the positive electrode is provided with a positive electrode leading-out end, the negative electrode is provided with a negative electrode leading-out end, and the positive electrode leading-out end and the negative electrode leading-out end penetrate through the through hole and are connected to the flexible circuit; and a rigid base material detachably connected with the flexible base material is arranged below the flexible base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121801138.3U CN215896184U (en) | 2021-08-03 | 2021-08-03 | Super capacitor shell, super capacitor and super capacitor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121801138.3U CN215896184U (en) | 2021-08-03 | 2021-08-03 | Super capacitor shell, super capacitor and super capacitor module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215896184U true CN215896184U (en) | 2022-02-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121801138.3U Active CN215896184U (en) | 2021-08-03 | 2021-08-03 | Super capacitor shell, super capacitor and super capacitor module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215896184U (en) |
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2021
- 2021-08-03 CN CN202121801138.3U patent/CN215896184U/en active Active
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Effective date of registration: 20230322 Address after: Room 771-315000 West Zhonghang Road, Zhongchuang Town, Ningbo Patentee after: Hesheng Technology (Ningbo) Co.,Ltd. Address before: 315201 No. 777, Zhong Guan Xi Road, Zhuang City Street, Zhenhai District, Ningbo, Zhejiang. Patentee before: Ningbo erhei Technology Co.,Ltd. |