CN215881218U - Automatic grinding device of crystal bar sample wafer - Google Patents
Automatic grinding device of crystal bar sample wafer Download PDFInfo
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- CN215881218U CN215881218U CN202122028701.4U CN202122028701U CN215881218U CN 215881218 U CN215881218 U CN 215881218U CN 202122028701 U CN202122028701 U CN 202122028701U CN 215881218 U CN215881218 U CN 215881218U
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Abstract
The utility model discloses an automatic grinding device for a crystal bar sample wafer, which comprises a coarse grinding device and a fine grinding device which are matched; the rough grinding device comprises a grinding disc, a first connecting rod device, a lifting mechanism and a first die; the lifting mechanism drives the first connecting rod device to move up and down and drives the first die to move on the grinding disc in a reciprocating manner; the bottom of the first die is provided with a first sample groove; the fine grinding device comprises a second connecting rod device, a quartz glass plate, a swinging driving device and a second die; the swing driving device drives the second connecting rod device to swing so as to drive the second mold to swing on the quartz glass plate, and a second sample sheet groove is formed in the bottom of the second mold. The automatic grinding device for the crystal bar sample wafer realizes the mechanization of coarse grinding and accurate grinding, obviously improves the grinding consistency and the grinding efficiency, saves the cost, reduces the labor intensity and improves the grinding quality.
Description
Technical Field
The utility model relates to an automatic grinding device for a crystal bar sample wafer, and belongs to the technical field of grinding of crystal bar sample wafers.
Background
With the rapid development of aerospace industry in China, the usage amount of the germanium substrate serving as the most basic component of a plurality of space batteries increases year by year, and with the gradual improvement of the requirement on conversion efficiency, the requirement on the inherent quality of a germanium crystal is greatly improved, so that the requirements on the accuracy and the efficiency of the detection of a germanium crystal bar sample wafer are simultaneously provided. I have adopted zero-dislocation germanium single crystal (general standard EPD < 300 per square centimeter, actually far below the value) of CZ method growth to be few originally, if can't reach the requirement to the surface treatment of sample wafer, will have great influence to the corrosion process, make the testing result appear great error, the grinding process of the present sample wafer especially the accurate grinding step is manual grinding always, along with the increase of output, the problem that the uniformity that manual grinding impetus problem leads to is poor and the inefficiency is exposed thoroughly.
SUMMERY OF THE UTILITY MODEL
The utility model provides an automatic grinding device for a crystal bar sample wafer, which aims to solve the problems of uneven surface roughness and low grinding efficiency of the manual grinding of a zero-dislocation germanium single crystal sample wafer.
In order to solve the technical problems, the technical scheme adopted by the utility model is as follows:
an automatic grinding device for a crystal bar sample wafer comprises a coarse grinding device and a fine grinding device which are matched;
the rough grinding device comprises a grinding disc, a first connecting rod device, a lifting mechanism and a first die; the grinding disc is positioned right below the first connecting rod device; the first connecting rod device is connected with the lifting mechanism, can move up and down under the driving of the lifting mechanism, and is uniformly provided with more than three first mounting holes; the first die comprises a first pressure plate, a first connecting rod and a first balance weight, a first sample groove is formed in the lower surface of the first pressure plate, and the bottom of the first connecting rod is connected to the upper surface of the first pressure plate; the first die is arranged on the grinding disc, the first pressure disc is arranged below the first die and above the first connecting rod, the top of the first connecting rod extends into the first mounting hole from the bottom of the first mounting hole and exceeds the first mounting hole, the first counterweight is movably connected to the top of the first connecting rod, and the first die is driven to reciprocate on the grinding disc when the first connecting rod device moves up and down;
the fine grinding device comprises a second connecting rod device, a quartz glass plate, a swinging driving device and a second die; the second connecting rod device comprises a substrate, a swing rod and a rotating shaft, the swing rod can be rotatably arranged on the substrate through the rotating shaft, one end of the swing rod is a working end, the other end of the swing rod is a driving end, the rotating shaft is positioned between the working end and the swing end, and the working end of the swing rod is provided with more than two second mounting holes; the quartz glass plate is positioned right below the working end of the oscillating rod; the driving end of the swing rod is connected with a swing driving device, and the swing rod reciprocates under the driving of the swing driving device; the second die comprises a second pressure plate, a second connecting rod and a second balance weight, a second sample groove is formed in the lower surface of the second pressure plate, and the bottom of the second connecting rod is connected to the upper surface of the second pressure plate; the second die is arranged on the quartz glass plate, the second pressure plate is arranged below the second pressure plate, the second connecting rod is arranged above the second pressure plate, the top of the second connecting rod extends into the second mounting hole from the bottom of the second mounting hole and exceeds the second mounting hole, and the second counterweight is movably connected to the top of the second connecting rod.
The coarse grinding device and the accurate grinding device are matched for use, and the sample can reach the detection standard after being subjected to coarse grinding and accurate grinding.
Above-mentioned corase grind device and accurate grinding device have realized the automatic grinding of appearance piece, and once can grind the multi-disc, are showing and have improved grinding efficiency and grind the uniformity.
The specific steps of grinding by using the device comprise the following steps:
1) pressing the sample wafer in a first sample wafer groove of a first die, extending the top of a first connecting rod into a first mounting hole from the bottom of the first mounting hole and exceeding the first mounting hole, and movably connecting a first balance weight to the top of the first connecting rod;
2) spraying a rough grinding medium on the grinding disc, simultaneously starting the grinding disc and the lifting mechanism, driving the first connecting rod device to move up and down by the lifting mechanism, further driving the first die to move on the grinding disc in a reciprocating manner, finishing rough grinding under the combined action of the rotation of the grinding disc, the reciprocating movement of the first die and the rough grinding medium, then closing the grinding disc and the lifting mechanism, taking out and cleaning to obtain a rough grinding sample wafer;
3) pressing the rough grinding sample wafer in a second sample wafer groove of a second die, extending the top of a second connecting rod into a second mounting hole from the bottom of the second mounting hole and exceeding the second mounting hole, and movably connecting a second counterweight to the top of the second connecting rod;
4) spraying a fine grinding medium on the quartz glass plate, starting the swing driving device at the same time, driving the swing rod to do reciprocating motion under the driving of the swing driving device, further driving the second die to do reciprocating motion on the quartz glass plate, fully grinding in all directions under the combined action of the reciprocating motion of the second die and the fine grinding medium to finish fine grinding, then closing the swing driving device, taking out and cleaning the sample wafer to finish grinding of the sample wafer.
The inner diameters of the first mounting hole and the second mounting hole are respectively larger than the outer diameters of the first connecting rod and the second connecting rod.
In order to facilitate driving, as one preferred implementation scheme, the first connecting rod device comprises a driving column and a connecting rod assembly; the connecting rod assemblies are more than three groups with the same structure, all the connecting rod assemblies are uniformly distributed on the periphery of the driving column, and the driving column is connected with the lifting mechanism; the connecting rod assembly comprises a first connecting rod, a second connecting rod, a third connecting rod and a sliding block, one end of the first connecting rod is rotatably connected with the driving column, the other end of the first connecting rod is rotatably connected with the sliding block, one end of the second connecting rod is provided with a first mounting hole, the other end of the second connecting rod is a connecting end, the sliding block is in sliding fit with the second connecting rod, one end of the third connecting rod is rotatably connected with the driving column, the other end of the third connecting rod is rotatably connected with the connecting end of the second connecting rod, and the third connecting rod is located below the first connecting rod.
For the convenience of use, the bottom of the driving column is provided with a water dripping device.
To meet the general requirements, it is preferred that the connecting-rod assemblies have four sets of identical structures.
In order to improve the fine grinding effect, the working end of the oscillating rod is provided with a cross rod which is vertically connected, the second mounting hole is formed in the cross rod, the cross rod is further provided with a grinding fluid nozzle, and the spraying direction of the grinding fluid nozzle points to the quartz glass plate.
The nozzle, the grinding disc, the lifting mechanism, the swing driving device, the dripping device and the like are not particularly limited in structure, and the prior art is referred to as such.
In order to meet general requirements, preferably, the number of the second mounting holes is two, and the two second mounting holes are respectively arranged at the end parts of the two ends of the cross rod.
In order to improve the grinding stability and uniformity, the bottom of the first connecting rod is vertically connected to the central position of the upper surface of the first pressure plate; the bottom of the second connecting rod is vertically connected to the center of the upper surface of the second pressure plate.
In order to improve the grinding efficiency, the number of the first dies is equal to that of the first mounting holes, and the first dies correspond to the first mounting holes one by one; the number of the second dies is equal to that of the second mounting holes, and the second dies correspond to the second mounting holes one to one.
The prior art is referred to in the art for techniques not mentioned in the present invention.
The automatic grinding device for the crystal bar sample wafer realizes the mechanization of coarse grinding and accurate grinding, obviously improves the grinding consistency and the grinding efficiency, saves the cost, reduces the labor intensity and improves the grinding quality.
Drawings
FIG. 1 is a schematic structural view of a rough grinding apparatus according to the present invention (omitting a lifting mechanism, etc.);
fig. 2 is a schematic plan view of the distribution of four first dies on the grinding disc of the rough grinding device of the utility model (the balance weight and the like are omitted);
fig. 3 is a schematic view of the structure of the refining apparatus according to the utility model (the oscillating drive, etc., has been omitted);
FIG. 4 is a schematic top view of a second linkage arrangement of the refining apparatus of the present invention relative to a quartz glass sheet (base plate, counterweight, etc. omitted);
in the figure, 1 is a grinding disc, 2 is a first connecting rod device, 21 is a driving column, 22 is a first connecting rod, 23 is a second connecting rod, 24 is a third connecting rod, 25 is a sliding block, 26 is a first mounting hole, 27 is a water dripping device, 3 is a first mold, 31 is a first platen, 32 is a first sample groove, 33 is a first connecting rod, 34 is a first balance weight, 4 is a second connecting rod device, 41 is a swinging rod, 42 is a rotating shaft, 43 is a second mounting hole, 44 is a cross rod, 45 is a grinding fluid nozzle, 5 is a quartz glass plate, 6 is a second mold, 61 is a second platen, 62 is a second sample groove, 63 is a second connecting rod, 64 is a second balance weight, 7 is a sample, 8 is carborundum, and the direction indicated by an arrow is a moving direction.
Detailed Description
In order to better understand the present invention, the following examples are further provided to illustrate the present invention, but the present invention is not limited to the following examples.
The terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used herein as terms of orientation or positional relationship with respect to one another as shown in the drawings or in use, and are used for convenience in describing the present application and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be considered as limiting the present application.
Example 1
As shown in fig. 1-4, an automatic grinding device for a crystal bar sample wafer comprises a rough grinding device and a fine grinding device which are used together;
as shown in fig. 1-2, the rough grinding device comprises a grinding disc, a first connecting rod device, a lifting mechanism and a first die; the grinding disc is positioned right below the first connecting rod device; the first connecting rod device is connected with the lifting mechanism, can move up and down under the driving of the lifting mechanism, and is uniformly provided with more than three first mounting holes; the first die comprises a first pressure plate, a first connecting rod and a first balance weight, a first sample groove is formed in the lower surface of the first pressure plate, and the bottom of the first connecting rod is connected to the upper surface of the first pressure plate; the first die is arranged on the grinding disc, the first pressure disc is arranged below the first die and above the first connecting rod, the top of the first connecting rod extends into the first mounting hole from the bottom of the first mounting hole and exceeds the first mounting hole, the first counterweight is movably connected to the top of the first connecting rod, and the first die is driven to reciprocate on the grinding disc when the first connecting rod device moves up and down;
as shown in fig. 3 to 4, the refining apparatus comprises a second link means, a quartz glass plate, a swing drive means, and a second mold; the second connecting rod device comprises a substrate, a swing rod and a rotating shaft, the swing rod can be rotatably arranged on the substrate through the rotating shaft, one end of the swing rod is a working end, the other end of the swing rod is a driving end, the rotating shaft is positioned between the working end and the swing end, and the working end of the swing rod is provided with more than two second mounting holes; the quartz glass plate is positioned right below the working end of the oscillating rod; the driving end of the swing rod is connected with a swing driving device, and the swing rod reciprocates under the driving of the swing driving device; the second die comprises a second pressure plate, a second connecting rod and a second balance weight, a second sample groove is formed in the lower surface of the second pressure plate, and the bottom of the second connecting rod is connected to the upper surface of the second pressure plate; the second die is arranged on the quartz glass plate, the second pressure plate is arranged below the second pressure plate, the second connecting rod is arranged above the second pressure plate, the top of the second connecting rod extends into the second mounting hole from the bottom of the second mounting hole and exceeds the second mounting hole, and the second counterweight is movably connected to the top of the second connecting rod.
The coarse grinding device and the accurate grinding device are matched for use, and the sample can reach the detection standard after being subjected to coarse grinding and accurate grinding. Above-mentioned corase grind device and accurate grinding device have realized the automatic grinding of appearance piece, and once can grind the multi-disc, are showing and have improved grinding efficiency and grind the uniformity.
Example 2
On the basis of the embodiment 1, the following improvements are further made: in order to facilitate driving, the first connecting rod device comprises a driving column and a connecting rod assembly; the four connecting rod assemblies have the same structure, all the connecting rod assemblies are uniformly distributed on the periphery of the driving column, and the driving column is connected with the lifting mechanism; the connecting rod assembly comprises a first connecting rod, a second connecting rod, a third connecting rod and a sliding block, one end of the first connecting rod is rotatably connected with the driving column, the other end of the first connecting rod is rotatably connected with the sliding block, one end of the second connecting rod is provided with a first mounting hole, the other end of the second connecting rod is a connecting end, the sliding block is in sliding fit with the second connecting rod, one end of the third connecting rod is rotatably connected with the driving column, the other end of the third connecting rod is rotatably connected with the connecting end of the second connecting rod, and the third connecting rod is located below the first connecting rod.
Example 3
On the basis of the embodiment 2, the following improvements are further made: for the convenience of use, the bottom of the driving column is provided with a water dripping device.
Example 4
On the basis of the embodiment 3, the following improvements are further made: in order to improve the fine grinding effect, the working end of the oscillating rod is provided with two transverse rods which are vertically connected, the two second mounting holes are respectively arranged at the end parts of the two ends of the transverse rods, the transverse rods are also provided with grinding fluid nozzles, and the spraying directions of the grinding fluid nozzles point to the quartz glass plate.
Example 5
On the basis of the embodiment 4, the following improvements are further made: in order to improve the grinding stability and uniformity, the bottom of the first connecting rod is vertically connected to the central position of the upper surface of the first pressure plate; the bottom of the second connecting rod is vertically connected to the center of the upper surface of the second pressure plate. In order to improve the grinding efficiency, the number of the first dies is equal to that of the first mounting holes, and the first dies correspond to the first mounting holes one by one; the number of the second dies is equal to that of the second mounting holes, and the second dies correspond to the second mounting holes one to one.
The specific steps of grinding by using the device comprise the following steps:
1) pressing the sample wafer in a first sample wafer groove of a first mold, extending the top of a first connecting rod into a first mounting hole from the bottom of the first mounting hole and exceeding the first mounting hole, movably connecting a first balance weight to the top of the first connecting rod, and assembling four first molds according to the method;
2) putting carborundum in the center of a grinding disc, starting a water dripping device, simultaneously starting the grinding disc and a lifting mechanism, driving a first connecting rod device to move up and down by the lifting mechanism, further driving a first mould to move on the grinding disc in a reciprocating manner, enabling a mixture of water and carborundum to enter the bottom of a sample wafer under the rotation of the grinding disc and the reciprocating movement of the first mould, finishing coarse grinding under the combined action of the rotation of the grinding disc, the reciprocating movement of the first mould and a coarse grinding medium, then closing the grinding disc and the lifting mechanism, taking out and cleaning to obtain a coarse grinding sample wafer;
3) pressing the rough grinding sample wafer in a second sample wafer groove of a second mold, extending the top of a second connecting rod into a second mounting hole from the bottom of the second mounting hole and exceeding the second mounting hole, movably connecting a second counterweight to the top of the second connecting rod, and assembling the two second molds according to the method;
4) spraying a fine grinding medium (a mixture of white corundum micropowder and water) on the quartz glass plate through a grinding liquid nozzle, starting a swing driving device at the same time, enabling a swing rod to do 8-shaped reciprocating motion under the driving of the swing driving device, further driving a second die to do reciprocating motion on the quartz glass plate, fully grinding in all directions under the combined action of the reciprocating motion of the second die and the fine grinding medium to finish fine grinding, then closing the swing driving device, taking out and cleaning sample plates, and finishing the grinding of the sample plates; the refining medium is recyclable because of the small amount of losses during refining.
The existing manual coarse grinding has poor adaptability to linear cutting surfaces, and the planeness of each ground wafer is different among individuals, and after the device is changed into 4 wafers and automatically ground simultaneously, the consistency is greatly improved, and the promotion effect on the improvement of the subsequent fine grinding effect is achieved; the existing fine grinding adopts superfine micropowder as a grinding material, so that the dropping amount is very slow, the grinding time is long, staff generally need to continuously grind 4 pieces, the uniformity of the force and the force application point is difficult to control, particularly, sample pieces above 6 inches need to be repeatedly corrected by manual observation, and after the sample pieces are automatically ground, not only is the labor saved, but also the effect on the sample pieces with large size is the same.
Claims (8)
1. The utility model provides an automatic grinder of crystal bar sample wafer which characterized in that: comprises a coarse grinding device and a fine grinding device which are matched for use;
the rough grinding device comprises a grinding disc, a first connecting rod device, a lifting mechanism and a first die; the grinding disc is positioned right below the first connecting rod device; the first connecting rod device is connected with the lifting mechanism, can move up and down under the driving of the lifting mechanism, and is uniformly provided with more than three first mounting holes; the first die comprises a first pressure plate, a first connecting rod and a first balance weight, a first sample groove is formed in the lower surface of the first pressure plate, and the bottom of the first connecting rod is connected to the upper surface of the first pressure plate; the first die is arranged on the grinding disc, the first pressure disc is arranged below the first die and above the first connecting rod, the top of the first connecting rod extends into the first mounting hole from the bottom of the first mounting hole and exceeds the first mounting hole, the first counterweight is movably connected to the top of the first connecting rod, and the first die is driven to reciprocate on the grinding disc when the first connecting rod device moves up and down;
the fine grinding device comprises a second connecting rod device, a quartz glass plate, a swinging driving device and a second die; the second connecting rod device comprises a substrate, a swing rod and a rotating shaft, the swing rod can be rotatably arranged on the substrate through the rotating shaft, one end of the swing rod is a working end, the other end of the swing rod is a driving end, the rotating shaft is positioned between the working end and the swing end, and the working end of the swing rod is provided with more than two second mounting holes; the quartz glass plate is positioned right below the working end of the oscillating rod; the driving end of the swing rod is connected with a swing driving device, and the swing rod reciprocates under the driving of the swing driving device; the second die comprises a second pressure plate, a second connecting rod and a second balance weight, a second sample groove is formed in the lower surface of the second pressure plate, and the bottom of the second connecting rod is connected to the upper surface of the second pressure plate; the second die is arranged on the quartz glass plate, the second pressure plate is arranged below the second pressure plate, the second connecting rod is arranged above the second pressure plate, the top of the second connecting rod extends into the second mounting hole from the bottom of the second mounting hole and exceeds the second mounting hole, and the second counterweight is movably connected to the top of the second connecting rod.
2. The apparatus of claim 1, wherein: the first connecting rod device comprises a driving column and a connecting rod assembly; the connecting rod assemblies are more than three groups with the same structure, all the connecting rod assemblies are uniformly distributed on the periphery of the driving column, and the driving column is connected with the lifting mechanism; the connecting rod assembly comprises a first connecting rod, a second connecting rod, a third connecting rod and a sliding block, one end of the first connecting rod is rotatably connected with the driving column, the other end of the first connecting rod is rotatably connected with the sliding block, one end of the second connecting rod is provided with a first mounting hole, the other end of the second connecting rod is a connecting end, the sliding block is in sliding fit with the second connecting rod, one end of the third connecting rod is rotatably connected with the driving column, the other end of the third connecting rod is rotatably connected with the connecting end of the second connecting rod, and the third connecting rod is located below the first connecting rod.
3. The apparatus of claim 2, wherein: the bottom of the driving column is provided with a water dripping device.
4. The automatic polishing apparatus for an ingot-like wafer according to claim 2 or 3, wherein: the connecting rod assemblies have four groups with the same structure.
5. The automatic lapping apparatus for a crystal bar sample wafer according to any one of claims 1 to 3, wherein: the working end of the swinging rod is provided with a cross rod which is vertically connected, the second mounting hole is arranged on the cross rod, the cross rod is also provided with a grinding fluid nozzle, and the spraying direction of the grinding fluid nozzle points to the quartz glass plate.
6. The apparatus of claim 5, wherein: the quantity of second mounting hole is two, and two second mounting holes are established respectively at the both ends tip of horizontal pole.
7. The automatic lapping apparatus for a crystal bar sample wafer according to any one of claims 1 to 3, wherein: the bottom of the first connecting rod is vertically connected to the center of the upper surface of the first pressure plate; the bottom of the second connecting rod is vertically connected to the center of the upper surface of the second pressure plate.
8. The automatic lapping apparatus for a crystal bar sample wafer according to any one of claims 1 to 3, wherein: the number of the first dies is equal to that of the first mounting holes, and the first dies correspond to the first mounting holes one by one; the number of the second dies is equal to that of the second mounting holes, and the second dies correspond to the second mounting holes one to one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122028701.4U CN215881218U (en) | 2021-08-26 | 2021-08-26 | Automatic grinding device of crystal bar sample wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122028701.4U CN215881218U (en) | 2021-08-26 | 2021-08-26 | Automatic grinding device of crystal bar sample wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215881218U true CN215881218U (en) | 2022-02-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122028701.4U Active CN215881218U (en) | 2021-08-26 | 2021-08-26 | Automatic grinding device of crystal bar sample wafer |
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| CN (1) | CN215881218U (en) |
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2021
- 2021-08-26 CN CN202122028701.4U patent/CN215881218U/en active Active
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