CN215872394U - Temperature regulation structure, controller and moving tool - Google Patents
Temperature regulation structure, controller and moving tool Download PDFInfo
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- CN215872394U CN215872394U CN202121226587.XU CN202121226587U CN215872394U CN 215872394 U CN215872394 U CN 215872394U CN 202121226587 U CN202121226587 U CN 202121226587U CN 215872394 U CN215872394 U CN 215872394U
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Abstract
The embodiment of the utility model relates to a temperature adjusting structure, a controller and a mobile tool, wherein the temperature adjusting structure comprises a first shell, a semiconductor refrigerating sheet, a temperature sensor and a temperature control module; the outer side of the upper surface of the first shell is provided with a plurality of heat exchange convex structures; the upper surface of the semiconductor refrigeration piece is attached to the inner side of the upper surface of the first shell, and the lower surface of the semiconductor refrigeration piece is attached to the temperature module to be regulated; the temperature sensor is electrically connected with the temperature module to be regulated; the temperature control module is electrically connected with the semiconductor refrigerating sheet; the temperature sensor collects temperature data of the module to be regulated and sends the temperature data to the temperature control module; the temperature control module adjusts the current and the voltage of the semiconductor refrigeration piece according to the temperature data, so that the temperature of the module to be adjusted in temperature is adjusted.
Description
Technical Field
The utility model relates to the technical field of electronic element temperature control, in particular to a temperature adjusting structure, a controller and a moving tool.
Background
Mechanical equipment such as unmanned vehicles and unmanned cleaning vehicles need to be provided with an automatic driving operation module with high power and ultrahigh operation speed. The existing automatic driving operation module is developed from the field of industrial electronics, and an automatic driving operation module which completely accords with a vehicle gauge is not formed yet. The working temperature of the automatic driving operation module is-20-70 ℃, and the working temperature required by the whole automobile is-40-85 ℃, so that the unmanned automobile and the unmanned sweeper provided with the automatic driving operation module have certain limitation on the environmental temperature during working, and are not beneficial to large-area popularization and application.
In order to ensure that the automatic driving operation module operates in a normal temperature working range, the prior temperature control structure adopts the following scheme:
under a low-temperature environment state (lower than minus 20 ℃), a PI electric heating film is pasted on the control shell or in the controller, the PI electric heating film is started at low temperature to process the whole controller, and the automatic driving operation module is started to work after the temperature of the whole controller rises to minus 20 ℃. The PI electric heating film can not be directly attached to the module and can only be adhered to the inside or the outside of the shell of the controller, so that the PI electric heating film is required to heat the whole controller by heating the PI electric heating film at low temperature when the PI electric heating film is started at a low temperature, the temperature of the PI electric heating film is increased by transferring the heat to the automatic driving module, and the automatic driving operation module starts to work when the temperature is increased to-20 ℃. The size of the controller is increased due to the fact that the PI electric heating film is pasted, the cost of the controller is increased, and the applicability of the controller is reduced due to the fact that the size of the controller is increased; the scheme adopts the heating of the whole controller instead of the independent heating of the automatic driving operation module, the heating efficiency is low, and the starting time of the controller in a low-temperature state can be greatly increased.
When the controller is in a high-temperature environment state, a large amount of heat is emitted during the operation of the controller (the heat productivity is mainly concentrated on the operation module), and in order to meet the work heat dissipation requirement of the operation module, a heat dissipation fan is additionally arranged around the controller or the controller is directly cooled by water. The use of a radiator fan solution involves the cost of the fan itself, the cost of the fan harness and its control unit and assembly, and the cost of later maintenance of the fan (the fan is prone to dust build-up during long-term use and requires periodic cleaning, the life of the fan is also less than that of the controller, and therefore replacement of the fan may be required during the life of the controller). The addition of the fan also causes the increase of the installation space required for the controller, which causes the controller to have a certain limitation in product arrangement. A water-cooling scheme is used, and a set of water circulation system needs to be manufactured, and the water circulation system relates to parts such as a water tank, a water pump, a guide pipe and a radiator.
Disclosure of Invention
The utility model aims to provide a temperature adjusting structure aiming at the defects in the prior art, which does not need additional installation space and later maintenance of products and can adjust the temperature of a module to be adjusted so that the module to be adjusted can adapt to different working environment temperatures.
In order to achieve the above object, the present invention provides a temperature adjustment structure, which includes a first housing, a semiconductor cooling plate, a temperature sensor, and a temperature control module;
the outer side of the upper surface of the first shell is provided with a plurality of heat exchange convex structures;
the upper surface of the semiconductor refrigeration piece is attached to the inner side of the upper surface of the first shell, and the lower surface of the semiconductor refrigeration piece is attached to the temperature module to be regulated;
the temperature sensor is electrically connected with the module to be regulated in temperature;
the temperature control module is electrically connected with the semiconductor refrigerating sheet;
the temperature sensor collects temperature data of the module to be regulated in temperature and sends the temperature data to the temperature control module; the temperature control module adjusts the current and the voltage of the semiconductor refrigerating sheet according to the temperature data, so that the temperature of the module to be adjusted is adjusted.
Preferably, the temperature adjusting structure further comprises a heat conducting module;
the heat conduction module is arranged between the semiconductor refrigeration piece and the inner side of the upper surface of the first shell, and between the semiconductor refrigeration piece and the temperature to-be-adjusted module.
Preferably, the temperature adjusting structure further comprises an insulating module;
the heat insulation module is arranged around the semiconductor refrigerating sheet.
Preferably, the temperature adjustment structure further comprises a second housing;
the second shell is buckled with the first shell; the side wall of the second shell is provided with a fixing structure.
Preferably, the plurality of heat exchanging protrusion structures are arranged in parallel at equal intervals on the upper surface of the first housing.
Preferably, the module to be temperature regulated is arranged on a printed circuit assembly board PCBA of the controller.
Further preferably, one side of the first shell is provided with a plurality of notches; a signal transmission interface of the printed circuit assembly board PCBA penetrates through the notch to extend to the outer side of the first shell; the height of the notch is smaller than that of the side wall of the first shell.
Preferably, the temperature adjusting structure further comprises a current direction adjusting module and a power management module;
the current direction adjusting module is electrically connected with the semiconductor refrigerating sheet and the temperature control module respectively;
the power management module is electrically connected with the semiconductor refrigeration piece and the temperature control module respectively.
Further preferably, the adjusting, by the temperature control module, the current and the voltage of the semiconductor chilling plate according to the temperature data specifically includes:
when the temperature control module judges that the temperature data falls into a preset first preset temperature range, the current direction and the voltage of the semiconductor chilling plate are adjusted so as to control the semiconductor chilling plate to chill;
when the temperature control module judges that the temperature data falls into a preset second preset temperature range, the current direction and the voltage of the semiconductor chilling plate are adjusted so as to control the semiconductor chilling plate to heat;
and when the temperature control module judges that the temperature data falls into a preset third preset temperature range, the voltage of the semiconductor chilling plate is cut off.
Preferably, the heat conducting module comprises heat conducting silicone grease.
On the other hand, the present application further provides a controller, which includes the temperature adjustment structure provided in any of the foregoing embodiments.
In a final aspect, the present application further provides a mobile tool comprising the aforementioned controller.
According to the temperature adjusting structure provided by the embodiment of the utility model, the semiconductor refrigerating sheet is arranged between the first shell and the module to be adjusted in temperature, then the working temperature data of the module to be adjusted in temperature is monitored in real time by adopting the temperature sensor, and the working temperature data is sent to the temperature control module, so that the temperature control module can adjust the current direction and the voltage of the semiconductor refrigerating sheet, the working state of the semiconductor refrigerating sheet is adjusted, and the temperature adjustment of the module to be adjusted in temperature is further realized, and the temperature adjusting structure is suitable for different working environment temperatures.
Drawings
Fig. 1 is a schematic view of a temperature adjustment structure according to an embodiment of the present invention.
Detailed Description
The technical solution of the present invention is further described in detail by the accompanying drawings and embodiments.
The temperature adjusting structure provided by the utility model can be applied to a controller on a mobile tool to realize temperature adjustment of a module to be adjusted in temperature of the controller, so that the module to be adjusted in temperature is adaptive to the working environment temperature of a vehicle. The technical scheme of the utility model is explained below by adjusting the temperature of the module to be adjusted of the controller. The moving means may be any means that can be moved, such as a Vehicle (e.g. a passenger car, a bus, a van, a truck, a trailer, a dump truck, a crane, an excavator, a scraper, a road train, a sweeper, a sprinkler, a garbage truck, an engineering truck, a rescue Vehicle, a logistics car, an AGV (Automated Guided Vehicle), etc.), a motorcycle, a bicycle, a tricycle, a trolley, a robot, a sweeper, a balance car, a crown block, a tire crane, etc., which is not strictly limited to the type of moving means and is not exhaustive.
Fig. 1 is a schematic diagram of a temperature adjustment structure according to an embodiment of the present invention, and the temperature adjustment structure is described below with reference to fig. 1.
As shown in fig. 1, a temperature adjustment structure according to an embodiment of the present invention includes: the refrigerator comprises a first shell 1, a semiconductor refrigerating sheet 2, a temperature sensor (not shown in the figure) and a temperature control module (not shown in the figure).
The first casing 1 is a main structure of the temperature regulation structure for heat exchange. The outer side of the upper surface of the first case 1 has a plurality of heat exchange protrusion structures 11. The plurality of heat exchange protrusion structures 11 are arranged on the upper surface of the first housing 1 in parallel at equal intervals, and of course, those skilled in the art may also flexibly arrange the arrangement structure of the heat exchange protrusion structures 11 on the first housing 1 according to actual requirements, which is not strictly limited in this application. In a specific example, the heat exchanging protrusion structure 11 may employ an air supply passage. The present invention is not limited to this, as long as the requirement that the inside and the outside of the temperature adjustment structure can exchange heat is satisfied.
By way of example and not limitation, one side of the first housing 1 is provided with a plurality of notches 12 to facilitate connection of internal components of the temperature regulating structure with the outside, and in a specific example, a signal transmission interface of the printed circuit assembly board PCBA200 of the controller extends to the outside of the first housing 1 through the notches 12. The height of the notch 12 is smaller than that of the side wall of the first shell 1, so that the internal components are limited.
The temperature sensor can monitor the temperature in real time, so that it is electrically connected to the module to be temperature-regulated, in this case the temperature sensor is electrically connected to the module to be temperature-regulated 100, and can collect the operating temperature data of the module to be temperature-regulated 100.
The temperature control module may receive the operating temperature data of the module to be regulated 100, which is sent by the temperature sensor, compare the operating temperature data with a preset temperature range set, and control the operating state of the semiconductor chilling plate 2 according to the comparison result. Wherein, predetermine the temperature range set and include: a first preset temperature range, a second preset temperature range and a third preset temperature range. In a specific example, the first predetermined temperature range is not less than 50 ℃; the second preset temperature range is not more than 0 ℃; the third preset temperature range is 0-50 ℃. It should be noted that the set of preset temperature ranges is determined according to the normal operating temperature of the operation module 100.
Specifically, in an alternative embodiment, the temperature adjustment structure further includes a current direction adjustment module (not shown in the figure) and a power management module (not shown in the figure); the current direction adjusting module is respectively and electrically connected with the semiconductor refrigerating sheet 2 and the temperature control module; the power management module is respectively and electrically connected with the semiconductor refrigerating sheet 2 and the temperature control module. The current direction adjusting module is specifically an H-bridge circuit and is mainly used for changing the current direction of the semiconductor chilling plate 2, and the power supply management module is mainly used for adjusting the voltage and the on-off of the semiconductor chilling plate 2.
In a preferred example, the temperature adjustment structure further includes a heat conduction module (not shown in the drawings). The heat conducting module is arranged between the semiconductor chilling plate 2 and the inner side of the upper surface of the first shell 1 and between the semiconductor chilling plate 2 and the temperature module to be regulated 100. The heat conduction module can specifically adopt heat conduction silicone grease, and the heat conduction silicone grease is coated in a gap between the semiconductor refrigeration piece 2 and the first shell 1, or in a gap between the semiconductor refrigeration piece 2 and the temperature module 100 to be regulated, so that the heat propagation efficiency among the first shell 1, the semiconductor refrigeration piece 2 and the temperature module 100 to be regulated can be improved.
In another preferred example, the temperature adjustment structure further includes an insulating module 3. The heat insulation module 3 is arranged around the semiconductor chilling plate 2 and is mainly used for filling a gap between the temperature to-be-regulated module 100 and the first shell 1, preventing heat exchange between the first shell 1 and the temperature to-be-regulated module 100, reducing reverse heat conduction and improving the capability of the semiconductor chilling plate 2 for regulating and controlling the temperature of the temperature to-be-regulated module 100. The heat insulation module 3 can adopt heat insulation cotton.
The temperature regulating structure further includes a second housing 4. The second shell 4 is arranged below the first shell 1 and can be buckled with the first shell 1, so that the temperature adjusting structure is integrally compact; on the other hand, make things convenient for the inside heat of temperature regulation structure to exchange that can only go on through first casing 1 to reach rapid cooling or the effect that heaies up. To facilitate the fixing of the temperature adjustment structure, the side wall of the second housing 4 has a fixing structure 41.
The components and the connection relationship of the temperature adjustment structure have been described above. Generally, the normal working temperature range of a module to be regulated for the temperature of a controller of an automatic driving automobile is-20 ℃ to 70 ℃, and the working temperature range of the automatic driving automobile is-40 ℃ to 85 ℃. The operation principle of the temperature adjustment structure will be described below by taking as an example that the temperature adjustment structure adjusts the temperature of the module to be temperature adjusted 100 to adapt to the operating temperature of the autonomous vehicle. However, this temperature adjustment structure is not meant to be able to adjust only the temperature of the module to be temperature-adjusted 100.
The temperature sensor collects temperature data of the module to be temperature-regulated 100 and sends the temperature data to the temperature control module. The temperature control module compares the temperature data to a set of preset temperature ranges. According to the comparison result, the temperature adjustment of the module to be temperature adjusted 100 is realized.
Specifically, when the temperature data falls into a first preset temperature range, the temperature control module generates a first control signal and sends the first control signal to the power management module and the current direction adjusting module; the current direction adjusting module is connected with the semiconductor refrigerating sheet 2 according to the first control signal; the power supply management module controls the voltage of the semiconductor refrigeration piece 2 according to the first control signal and a preset voltage threshold range. The first control signal may be understood as a cooling signal. The preset voltage threshold is determined according to the working voltage of the semiconductor chilling plate 2, and according to the foregoing, the working voltage of the semiconductor chilling plate 2 in the embodiment of the present invention is 5V to 12V.
In a specific example, when the temperature sensor collects that the temperature of the module to be temperature regulated 100 reaches 50 ℃, the H-bridge circuit switches on the semiconductor refrigeration sheet 2 when receiving a refrigeration signal sent by the temperature control module, so that the surface of the semiconductor refrigeration sheet 2, which is in contact with the module to be temperature regulated 100, is a refrigeration surface. The power management module adjusts the voltage of the semiconductor refrigerating sheet 2 according to the working voltage of the refrigerating signal and the semiconductor refrigerating sheet 2, so that the semiconductor refrigerating sheet 2 starts to work, the semiconductor refrigerating sheet is controlled to refrigerate, the temperature of the adjusting module 100 is absorbed through the refrigerating surface, the adjusting module 100 is cooled to the temperature, and the heat is released to the external space through the first shell 1.
When the temperature data fall into a second preset temperature range, the temperature control module generates a second control signal and sends the second control signal to the power management module and the current direction adjusting module; the current direction adjusting module changes the current direction of the semiconductor chilling plate 2 according to the second control signal; and the power supply management module controls the voltage of the semiconductor refrigerating sheet 2 according to the second control signal and the preset voltage threshold range so as to control the heating of the semiconductor refrigerating sheet. The second control signal can be understood as a heating signal.
In a specific example, when the temperature sensor collects that the temperature of the module to be temperature regulated 100 reaches 0 ℃, the temperature control module sends a heating signal to the H-bridge circuit, so that the H-bridge circuit changes the current direction of the semiconductor chilling plate 2, the surface of the H-bridge circuit, which is in contact with the module to be temperature regulated 100, is a heating surface, and the module to be temperature regulated 100 is heated by heat released from the heating surface, so that the module to be temperature regulated 100 can normally operate. The working process of the power management module is the same as the refrigeration process, and details are not repeated here.
When the temperature data fall into a third preset temperature range, the temperature control module generates a third control signal and sends the third control signal to the power management module, and the power management module cuts off the voltage of the semiconductor chilling plate 2 according to the third control signal. The third control signal may be understood as a control signal indicating that the module to be temperature regulated 100 can normally operate, i.e., the semiconductor chilling plate 2 is in a non-operating state.
When the temperature sensor collects that the temperature of the module to be regulated 100 is 0-50 ℃, the power management module cuts off the voltage of the semiconductor refrigerating sheet 2 when receiving the non-working state control signal of the semiconductor refrigerating sheet sent by the temperature control module, and the semiconductor refrigerating sheet 2 does not work, so that the temperature of the module to be regulated 100 is regulated, and the temperature sensor can adapt to the working environment of an automatic driving automobile.
According to the temperature adjusting structure provided by the embodiment of the utility model, the semiconductor refrigerating sheet is arranged between the first shell and the module to be adjusted in temperature, then the working temperature data of the module to be adjusted in temperature is monitored in real time by adopting the temperature sensor, and the working temperature data is sent to the temperature control module, so that the temperature control module can adjust the current direction and the voltage of the semiconductor refrigerating sheet, the working state of the semiconductor refrigerating sheet is adjusted, the temperature adjustment of the module to be adjusted in temperature is further realized, the heat conduction rate is accelerated, the heat loss is reduced, and the temperature adjusting structure is suitable for different working environment temperatures.
An embodiment of the present application further provides a controller, including the temperature adjustment structure provided in any one of the foregoing embodiments. The controller can be a vehicle gauge level controller or a computer server system.
The embodiment of the application also provides a moving tool, which comprises the controller.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are merely exemplary embodiments of the present invention, and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (12)
1. A temperature adjusting structure is characterized by comprising a first shell, a semiconductor refrigerating sheet, a temperature sensor and a temperature control module;
the outer side of the upper surface of the first shell is provided with a plurality of heat exchange convex structures;
the upper surface of the semiconductor refrigeration piece is attached to the inner side of the upper surface of the first shell, and the lower surface of the semiconductor refrigeration piece is attached to the temperature module to be regulated;
the temperature sensor is electrically connected with the module to be regulated in temperature;
the temperature control module is electrically connected with the semiconductor refrigerating sheet;
the temperature sensor collects temperature data of the module to be regulated in temperature and sends the temperature data to the temperature control module; the temperature control module adjusts the current and the voltage of the semiconductor refrigerating sheet according to the temperature data, so that the temperature of the module to be adjusted is adjusted.
2. The temperature conditioning structure of claim 1, further comprising a heat conducting module;
the heat conduction module is arranged between the semiconductor refrigeration piece and the inner side of the upper surface of the first shell, and between the semiconductor refrigeration piece and the temperature to-be-adjusted module.
3. The temperature regulating structure according to claim 1, further comprising an insulating module;
the heat insulation module is arranged around the semiconductor refrigerating sheet.
4. The temperature conditioning structure of claim 1, further comprising a second housing;
the second shell is buckled with the first shell; the side wall of the second shell is provided with a fixing structure.
5. The temperature regulating structure according to claim 1, wherein the plurality of heat exchanging protrusion structures are arranged in parallel at equal intervals on the upper surface of the first housing.
6. The temperature regulating structure according to claim 1, wherein the module to be regulated in temperature is provided on a printed circuit assembly board PCBA of a controller.
7. The structure of claim 6, wherein a side of the first housing is provided with a plurality of notches; a signal transmission interface of the printed circuit assembly board PCBA penetrates through the notch to extend to the outer side of the first shell; the height of the notch is smaller than that of the side wall of the first shell.
8. The temperature regulating structure of claim 1, further comprising a current direction regulating module and a power management module;
the current direction adjusting module is electrically connected with the semiconductor refrigerating sheet and the temperature control module respectively;
the power management module is electrically connected with the semiconductor refrigeration piece and the temperature control module respectively.
9. The temperature adjustment structure of claim 8, wherein the temperature control module adjusting the current and the voltage of the semiconductor chilling plate according to the temperature data specifically comprises:
when the temperature control module judges that the temperature data falls into a preset first preset temperature range, the current direction and the voltage of the semiconductor chilling plate are adjusted so as to control the semiconductor chilling plate to chill;
when the temperature control module judges that the temperature data falls into a preset second preset temperature range, the current direction and the voltage of the semiconductor chilling plate are adjusted so as to control the semiconductor chilling plate to heat;
and when the temperature control module judges that the temperature data falls into a preset third preset temperature range, the voltage of the semiconductor chilling plate is cut off.
10. The temperature regulating structure of claim 2, wherein the heat conducting module comprises a heat conducting silicone grease.
11. A controller comprising the temperature adjustment structure according to any one of claims 1 to 10.
12. A mobile tool comprising the controller of claim 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121226587.XU CN215872394U (en) | 2021-06-02 | 2021-06-02 | Temperature regulation structure, controller and moving tool |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121226587.XU CN215872394U (en) | 2021-06-02 | 2021-06-02 | Temperature regulation structure, controller and moving tool |
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| CN215872394U true CN215872394U (en) | 2022-02-18 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115443026A (en) * | 2021-06-02 | 2022-12-06 | 北京智行者科技股份有限公司 | Temperature regulation structure, controller and moving tool |
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2021
- 2021-06-02 CN CN202121226587.XU patent/CN215872394U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115443026A (en) * | 2021-06-02 | 2022-12-06 | 北京智行者科技股份有限公司 | Temperature regulation structure, controller and moving tool |
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Address after: B4-006, maker Plaza, 338 East Street, Huilongguan town, Changping District, Beijing 100096 Patentee after: Beijing Idriverplus Technology Co.,Ltd. Patentee after: Dongfeng Motor Corp. Address before: B4-006, maker Plaza, 338 East Street, Huilongguan town, Changping District, Beijing 100096 Patentee before: Beijing Idriverplus Technology Co.,Ltd. Patentee before: Dongfeng Motor Corp. |
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