CN215856414U - Electroplating device for metal surface treatment - Google Patents
Electroplating device for metal surface treatment Download PDFInfo
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- CN215856414U CN215856414U CN202121177216.7U CN202121177216U CN215856414U CN 215856414 U CN215856414 U CN 215856414U CN 202121177216 U CN202121177216 U CN 202121177216U CN 215856414 U CN215856414 U CN 215856414U
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Abstract
The utility model discloses an electroplating device for metal surface treatment, which relates to the field of metal electroplating and aims at solving the problems that the existing electroplating device for partial metal surface treatment is low in electroplating efficiency and cannot clean residual electroplating solution. The utility model has novel structure, improves the flexibility of the device, simultaneously improves the electroplating efficiency of the device, and can clean the residual electroplating solution.
Description
Technical Field
The utility model relates to the field of metal electroplating, in particular to an electroplating device for metal surface treatment.
Background
The electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the electrolysis principle, generally a metal film is attached to the surface of the metal or other material products by using the electrolysis method, thereby achieving the effects of preventing the metal from being oxidized, improving the wear resistance, the conductivity, the light reflection performance, the corrosion resistance, enhancing the appearance and the like.
SUMMERY OF THE UTILITY MODEL
The utility model provides an electroplating device for metal surface treatment, which solves the problems that the existing electroplating device for partial metal surface treatment has low electroplating efficiency and can not clean the residual electroplating solution.
In order to achieve the purpose, the utility model adopts the following technical scheme:
an electroplating device for metal surface treatment comprises a bottom plate, wherein a mounting plate is arranged on the upper surface of the bottom plate, a first slide bar is arranged inside the mounting plate, the surface of the first slide bar is slidably connected with a first slide block, an electric push rod is arranged on the lower surface of the first slide block, a top plate is arranged on the side surface of the first slide block, a second slide bar is arranged inside the top plate, the surface of the second slide bar is slidably connected with a second slide block, a mounting frame is arranged on the lower surface of the second slide block, a mounting block is arranged on the side surface of the mounting frame, a placing bin is arranged on the upper surface of the mounting block, a placing plate is arranged inside the placing bin, a telescopic rod is arranged on the lower surface of the placing plate, an electroplating pool is arranged on the upper surface of the bottom plate, an anode and a heating rod are arranged inside the electroplating pool, a liquid outlet pipe is arranged at the bottom of the electroplating pool, a valve is arranged inside the liquid outlet pipe, and a filter plate is arranged below the valve.
Preferably, the upper surface of the bottom plate is provided with an installation box, a power supply is arranged in the installation box, and the installation box is positioned on the side surface of the electroplating pool.
Preferably, the mounting block, the placing bin and the placing plate are all arranged in a net structure.
Preferably, the electric push rods are arranged inside the mounting plate and the top plate and are respectively connected with the first sliding block and the second sliding block.
Preferably, the inside of the electroplating pool is provided with two anodes and heating rods, and the two anodes and the heating rods are symmetrically arranged.
Preferably, the mounting bracket side is provided with a plurality of installation pieces, every the installation piece upper surface all is provided with places the storehouse, every the structure size of placing the storehouse is all the same.
The utility model has the beneficial effects that:
1. the electric push rod pushes the first sliding block to slide on the surface of the first sliding rod, the first sliding block slides to enable the top plate connected with the first sliding block to move up and down, and therefore the mounting frame drives the mounting block to move with the placing bin, and flexibility of the device is improved.
2. A plurality of metals can once be electroplated through a plurality of installation pieces that the mounting bracket both sides set up with place the storehouse, hoisting device's work efficiency.
3. The extension rod arranged inside the placing bin pushes the placing plate, so that the placing plate is separated from the placing bin, the placing and taking of metal are more convenient, and the practicability of the device is improved
4. Through the V type design of electroplating pool bottom, can deposit the fixed suspended solid that electroplates the production and collect to filter and clear up through the filter when electroplating solution discharges, increase the practicality of device.
In conclusion, the device not only promotes the flexibility of the device, but also promotes the electroplating efficiency of the device, and can clean up the residual electroplating solution, thereby solving the problems that the existing electroplating device for partial metal surface treatment has low electroplating efficiency and can not clean up the residual electroplating solution.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a side view of the present invention.
FIG. 3 is an enlarged view of the utility model at A in FIG. 1.
Reference numbers in the figures: 1. a base plate; 2. mounting a plate; 3. a first slide bar; 4. a first slider; 5. an electric push rod; 6. a top plate; 7. a second slider; 8. a second slide bar; 9. a mounting frame; 10. an electroplating pool; 11. an anode; 12. a heating rod; 13. installing a box; 14. a power source; 15. a liquid outlet pipe; 16. a valve; 17. a filter plate; 18. mounting blocks; 19. placing a bin; 20. placing the plate; 21. a telescopic rod.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1 to 3, the present invention provides the following technical solutions:
an electroplating device for metal surface treatment comprises a bottom plate 1, wherein a mounting plate 2 is arranged on the upper surface of the bottom plate 1, a first slide bar 3 is arranged inside the mounting plate 2, a first slide block 4 is connected on the surface of the first slide bar 3 in a sliding manner, an electric push rod 5 is arranged on the lower surface of the first slide block 4, a top plate 6 is arranged on the side surface of the first slide block 4, a second slide bar 8 is arranged inside the top plate 6, a second slide block 7 is connected on the surface of the second slide bar 8 in a sliding manner, a mounting frame 9 is arranged on the lower surface of the second slide block 7, a mounting block 18 is arranged on the side surface of the mounting frame 9, a placing bin 19 is arranged on the upper surface of the mounting block 18, a placing plate 20 is arranged inside the placing bin 19, a telescopic rod 21 is arranged on the lower surface of the placing plate 20, an electroplating pool 10 is arranged on the upper surface of the bottom plate 1, an anode 11 and a heating rod 12 are arranged inside the electroplating pool 10, the bottom of the electroplating pool 10 is provided with a liquid outlet pipe 15, a valve 16 is arranged inside the liquid outlet pipe 15, and a filter plate 17 is arranged below the valve 16.
In this embodiment, the installation box 13 is arranged on the upper surface of the bottom plate 1, the power supply 14 is arranged inside the installation box 13, the installation box 13 is located on the side surface of the electroplating pool 10, the installation block 18, the placing bin 19 and the placing plate 20 are all arranged in a mesh structure, and the installation block 18, the placing bin 19 and the placing plate 20 which are arranged in the mesh structure can increase the contact area between metal and electroplating solution and increase the electroplating efficiency.
Further, electric putter 5 all has the setting in mounting panel 2 and roof 6 inside, and two electric putter 5 is connected with first slider 4 and second slider 7 respectively, and the electric putter 5 through the setting promotes first slider 4 and slides on first slide bar 3 surface, and first slider 4 slides and makes roof 6 of being connected with it reciprocate to make mounting bracket 9 drive installation piece 18 and place storehouse 19 and remove, make the flexibility of device obtain promoting.
Besides, the inside two positive poles 11 and the heating rod 12 that are provided with of electroplating bath 10, and two positive pole 11 and heating rod 12 are the symmetry and set up, mounting bracket 9 side is provided with a plurality of installation pieces 18, every installation piece 18 upper surface all is provided with places storehouse 19, every place the structure size homogeneous phase of storehouse 19, through a plurality of installation pieces 18 that mounting bracket 9 both sides set up with place storehouse 19 can once electroplate a plurality of metals, hoisting device's work efficiency.
When the device is used, the device is firstly installed at a proper position through the bottom plate 1, electroplating solution is added into the electroplating pool 10, power is supplied to the anode 11 and the heating rod 12 through the power supply 14 in the installation box 13, the anode 11 and the heating rod 12 work, then the first slide block 4 is pushed to slide on the surface of the first slide bar 3 through the arranged electric push rod 5, the first slide block 4 slides to move the top plate 6 connected with the first slide block up and down, simultaneously the electric push rod 5 pushes the second slide block 7 to slide on the surface of the second slide bar 8, so that the installation frame 9 drives the installation block 18 and the placing bin 19 to move, the placing plate 20 is pushed through the telescopic rod 21 arranged in the placing bin 19, the placing plate 20 is separated from the placing bin 19, then metal is placed on the surface of the placing plate 20 and is retracted into the placing bin 19 through the telescopic rod 21, then the placing bin 19 is moved to the upper part of the electroplating pool 10 through the electric push rod 5, the first sliding block 4 is pushed to slide on the surface of the first sliding rod 3 through the arranged electric push rod 5, the first sliding block 4 slides to enable the top plate 6 connected with the first sliding block to move up and down, and therefore the mounting frame 9 drives the mounting block 18 and the placing bin 19 to move, and the placing bin 19 is located in the electroplating pool 10.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.
Claims (6)
1. The electroplating device for metal surface treatment comprises a bottom plate (1) and is characterized in that a mounting plate (2) is arranged on the upper surface of the bottom plate (1), a first slide bar (3) is arranged inside the mounting plate (2), a first slide block (4) is connected to the surface of the first slide bar (3) in a sliding manner, an electric push rod (5) is arranged on the lower surface of the first slide block (4), a top plate (6) is arranged on the side surface of the first slide block (4), a second slide bar (8) is arranged inside the top plate (6), a second slide block (7) is connected to the surface of the second slide bar (8) in a sliding manner, a mounting frame (9) is arranged on the lower surface of the second slide block (7), a mounting block (18) is arranged on the side surface of the mounting frame (9), a placing bin (19) is arranged on the upper surface of the mounting block (18), and a placing plate (20) is arranged inside the placing bin (19), the lower surface of the placing plate (20) is provided with a telescopic rod (21), the upper surface of the bottom plate (1) is provided with an electroplating pool (10), an anode (11) and a heating rod (12) are arranged inside the electroplating pool (10), a liquid outlet pipe (15) is arranged at the bottom of the electroplating pool (10), a valve (16) is arranged inside the liquid outlet pipe (15), and a filter plate (17) is arranged below the valve (16).
2. An electroplating device for metal surface treatment according to claim 1, wherein the upper surface of the base plate (1) is provided with a mounting box (13), a power supply (14) is arranged inside the mounting box (13), and the mounting box (13) is positioned at the side of the electroplating pool (10).
3. The plating apparatus for metal surface treatment according to claim 1, wherein the mounting block (18), the placing chamber (19), and the placing plate (20) are all provided in a net structure.
4. The electroplating apparatus for metal surface treatment according to claim 1, wherein the electric push rods (5) are arranged inside the mounting plate (2) and the top plate (6), and the two electric push rods (5) are respectively connected with the first slide block (4) and the second slide block (7).
5. An electroplating apparatus according to claim 1, wherein two anodes (11) and heating rods (12) are arranged in the electroplating bath (10), and the two anodes (11) and the heating rods (12) are symmetrically arranged.
6. The electroplating device for metal surface treatment according to claim 1, wherein a plurality of mounting blocks (18) are arranged on the side surface of the mounting frame (9), a placing bin (19) is arranged on the upper surface of each mounting block (18), and the placing bins (19) are identical in structure and size.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121177216.7U CN215856414U (en) | 2021-05-28 | 2021-05-28 | Electroplating device for metal surface treatment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121177216.7U CN215856414U (en) | 2021-05-28 | 2021-05-28 | Electroplating device for metal surface treatment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215856414U true CN215856414U (en) | 2022-02-18 |
Family
ID=80313501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121177216.7U Active CN215856414U (en) | 2021-05-28 | 2021-05-28 | Electroplating device for metal surface treatment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215856414U (en) |
-
2021
- 2021-05-28 CN CN202121177216.7U patent/CN215856414U/en active Active
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