CN215835592U - Circuit board structure for solid-state high-frequency induction heating equipment - Google Patents
Circuit board structure for solid-state high-frequency induction heating equipment Download PDFInfo
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- CN215835592U CN215835592U CN202121838345.6U CN202121838345U CN215835592U CN 215835592 U CN215835592 U CN 215835592U CN 202121838345 U CN202121838345 U CN 202121838345U CN 215835592 U CN215835592 U CN 215835592U
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Abstract
The utility model discloses a circuit board structure for solid high-frequency induction heating equipment, which comprises a circuit board body, wherein the left end and the right end of the circuit board body are respectively provided with a first heat dissipation module and a second heat dissipation module; the first heat dissipation module and the second heat dissipation module are respectively provided with a fixing leg at the front end and the rear end of the lower side to be fixedly connected with the circuit board body; the first heat dissipation module and the second heat dissipation module are fixedly connected with the circuit board body through a plurality of fixing pins uniformly distributed in the middle of the lower side of the first heat dissipation module and the second heat dissipation module. The circuit board structure increases the heat dissipation area of the original heat dissipation module, optimizes the fixed mounting structure and effectively solves the problems of slow heat dissipation and unstable structure of the original circuit board.
Description
Technical Field
The utility model relates to the technical field of induction heating equipment, in particular to a circuit board structure for solid high-frequency induction heating equipment.
Background
The induction heating equipment is characterized in that three-phase power frequency alternating current is rectified and then converted into direct current, the direct current is converted into adjustable current, the adjustable current is supplied to alternating current flowing through a capacitor and an induction coil, high-density magnetic lines are generated in the induction coil, metal materials contained in the induction coil are cut, and large eddy current is generated in the metal materials; this eddy current also has some properties of medium frequency current, i.e. the free electrons of the metal itself flow in the resistive metal body to generate heat. The solid-state induction heating has the advantages of small power supply volume, low loss, high inverter conversion efficiency, easiness in operation and control, good safety and the like. The device comprises a power supply control box of the solid-state induction heat treatment equipment, an induction coil and a conveying device. The radiating modules adopted in the rectifier circuit board and the inverter circuit board in the conventional power control box have small radiating areas and unstable circuit board body structures, and are easy to vibrate and damage, so that the shutdown is caused, the production is influenced, and the maintenance cost is increased. Therefore, there is a need for a circuit board structure with simple structure, low cost, good heat dissipation effect, and reliable stability, which is optimized to solve the above problems, so as to solve the problems that the prior art always puzzles the technicians in the field.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a circuit board structure for solid high-frequency induction heating equipment, which aims at solving the problems that radiating modules adopted in a rectifier circuit board and an inverter circuit board in a conventional power control box have small radiating area, are unstable and are easy to vibrate and damage and the like.
In order to achieve the purpose, the utility model adopts the following technical scheme:
a circuit board structure for a solid-state high-frequency induction heating apparatus, comprising a circuit board body, characterized in that: the circuit board comprises a circuit board body and is characterized in that a first heat dissipation module and a second heat dissipation module are arranged at the left end and the right end of the circuit board body respectively, the first heat dissipation module and the second heat dissipation module are fixedly connected through a first insulating strip and a second insulating strip respectively at the upper sides of the front end and the rear end, and the first insulating strip and the second insulating strip are connected with the circuit board body structure at the middle positions; the first heat dissipation module and the second heat dissipation module are respectively provided with a fixing leg at the front end and the rear end of the lower side to be fixedly connected with the circuit board body; the first heat dissipation module and the second heat dissipation module are fixedly connected with the circuit board body through a plurality of fixing pins uniformly distributed in the middle of the lower side of the first heat dissipation module and the second heat dissipation module.
Further preferably, the first heat dissipation module is provided with an upper flange at the upper side, and a lower flange at the lower side; the second heat dissipation module is provided with an upper flanging at the upper side and a lower flanging at the lower side.
Further preferably, the first heat dissipation module is an aluminum heat dissipation module, and the second heat dissipation module is an aluminum heat dissipation module.
The utility model has the beneficial effects that:
when the circuit board structure for the solid high-frequency induction heating equipment is used, the first radiating module and the second radiating module are directly replaced by the original radiating module, the first radiating module and the second radiating module are fixedly connected through the first insulating strip and the second insulating strip respectively on the upper sides of the front end and the rear end, and the first insulating strip and the second insulating strip are connected with the circuit board body structure in the middle; the first heat dissipation module and the second heat dissipation module are respectively provided with a fixing leg at the front end and the rear end of the lower side to be fixedly connected with the circuit board body; the first radiating module and the second radiating module are fixedly connected with the circuit board body through a plurality of fixing pins uniformly distributed at the middle position of the lower side, so that the fixed installation of the first radiating module and the second radiating module is completed, and the problem of unstable structure of the original circuit board is effectively solved through a multi-position and multi-direction fixing mode. The upper side of the first heat dissipation module is provided with an upper flange, and the lower side of the first heat dissipation module is provided with a lower flange; the second heat dissipation module is provided with an upper flanging at the upper side and a lower flanging at the lower side, and the effect of increasing the heat dissipation area to the maximum extent in a limited space and ensuring the heat dissipation efficiency is achieved. The first heat dissipation module is an aluminum heat dissipation module, the second heat dissipation module is an aluminum heat dissipation module, and the aluminum material has high-efficiency heat transfer and heat conduction efficiency, so that quick heat dissipation of the circuit board body structure is facilitated. The circuit board structure increases the heat dissipation area of the original heat dissipation module, optimizes the fixed mounting structure and effectively solves the problems of slow heat dissipation and unstable structure of the original circuit board.
Drawings
FIG. 1 is a schematic view of the circuit board structure of the present invention.
In the drawings, the components represented by the respective reference numerals are listed below:
1. upward flanging; 2. a first heat dissipation module; 3. downward flanging; 4. a first bolt; 5. a second bolt; 6. a first insulating strip; 7. a front fixed leg; 8. a third bolt; 9. a second heat dissipation module; 10. a rear fixed leg; 11. a second insulating strip; 12. a circuit board body; .
Detailed Description
The utility model will be further explained with reference to the accompanying drawings:
as shown in fig. 1, the present embodiment includes a circuit board body 12, a first heat dissipation module 2 and a second heat dissipation module 9 are respectively disposed at the left and right ends of the circuit board body 12, the first heat dissipation module 2 is provided with an upper flange 1 at the upper side, and the first heat dissipation module 2 is provided with a lower flange 3 at the lower side; the second heat dissipation module 9 is provided with an upper flanging 1 at the upper side, and the second heat dissipation module 9 is provided with a lower flanging 3 at the lower side, so that the heat dissipation area is increased to the maximum extent in a limited space, and the heat dissipation efficiency is ensured. The front end and the rear end of the upper flange 1 of the first heat dissipation module 2 and the front end and the rear end of the upper flange 1 of the second heat dissipation module 9 are respectively provided with an internal threaded hole, the front end and the rear end of the upper flange 1 of the first heat dissipation module 2 and the front end and the rear end of the upper flange 1 of the second heat dissipation module 9 are respectively connected through a first insulation strip 6 and a second insulation strip 11, the front end and the rear end of the first heat dissipation module 2 and the front end and the rear end of the second heat dissipation module 9 are respectively connected through a second bolt 5 and an insulation strip 6 and a second insulation strip 11, and the first insulation strip 6 and the second insulation strip 11 are structurally and fixedly connected with a circuit board body 12 through the second bolt 5 at the middle positions; the front and rear ends of the lower side of each of the first heat dissipation module 2 and the second heat dissipation module 9 are respectively provided with a front fixing leg 7 and a rear fixing leg 10 which are fixedly connected with the circuit board body 12 through a first bolt 4; first heat dissipation module 2 and second heat dissipation module 9 are all in the lower side intermediate position three fixed foot of equipartition and circuit board body 12 pass through third bolt 8 fixed continuous, and the unstable problem of former circuit board structure has effectively been solved to multiposition, multidirectional fixed mode. The first heat dissipation module 2 is an aluminum heat dissipation module, and the second heat dissipation module 9 is an aluminum heat dissipation module, so that the aluminum material has high heat transfer and heat conduction efficiency, and quick heat dissipation of the circuit board body structure is facilitated.
The embodiment is only an illustration of the concept and implementation of the present invention, and is not a limitation, and technical solutions without substantial changes are still within the protection scope under the inventive concept.
Claims (3)
1. A circuit board structure for a solid-state high-frequency induction heating apparatus, comprising a circuit board body, characterized in that: the circuit board comprises a circuit board body and is characterized in that a first heat dissipation module and a second heat dissipation module are arranged at the left end and the right end of the circuit board body respectively, the first heat dissipation module and the second heat dissipation module are fixedly connected through a first insulating strip and a second insulating strip respectively at the upper sides of the front end and the rear end, and the first insulating strip and the second insulating strip are connected with the circuit board body structure at the middle positions; the first heat dissipation module and the second heat dissipation module are respectively provided with a fixing leg at the front end and the rear end of the lower side to be fixedly connected with the circuit board body; the first heat dissipation module and the second heat dissipation module are fixedly connected with the circuit board body through a plurality of fixing pins uniformly distributed in the middle of the lower side of the first heat dissipation module and the second heat dissipation module.
2. The circuit board structure for a solid high-frequency induction heating apparatus according to claim 1, characterized in that: the upper side of the first heat dissipation module is provided with an upper flange, and the lower side of the first heat dissipation module is provided with a lower flange; the second heat dissipation module is provided with an upper flanging at the upper side and a lower flanging at the lower side.
3. The circuit board structure for a solid high-frequency induction heating apparatus according to claim 1, characterized in that: the first heat dissipation module is an aluminum heat dissipation module, and the second heat dissipation module is an aluminum heat dissipation module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121838345.6U CN215835592U (en) | 2021-08-09 | 2021-08-09 | Circuit board structure for solid-state high-frequency induction heating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121838345.6U CN215835592U (en) | 2021-08-09 | 2021-08-09 | Circuit board structure for solid-state high-frequency induction heating equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215835592U true CN215835592U (en) | 2022-02-15 |
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ID=80194297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121838345.6U Active CN215835592U (en) | 2021-08-09 | 2021-08-09 | Circuit board structure for solid-state high-frequency induction heating equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215835592U (en) |
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2021
- 2021-08-09 CN CN202121838345.6U patent/CN215835592U/en active Active
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