CN215833737U

CN215833737U - Display device

Info

Publication number: CN215833737U
Application number: CN202122181326.7U
Authority: CN
Inventors: 宗志豪; 李富琳; 张楠楠; 刘晓杰
Original assignee: Hisense Visual Technology Co Ltd
Current assignee: Hisense Visual Technology Co Ltd
Priority date: 2021-09-09
Filing date: 2021-09-09
Publication date: 2022-02-15
Anticipated expiration: 2031-09-09

Abstract

The utility model discloses a display device, comprising: display panel and backlight unit. Wherein the backlight includes: the flexible circuit board and the light source that is located on the flexible circuit board, one side that deviates from the light source at the flexible circuit board, the position that corresponds to the light source is provided with the sclerosis structure, and the sclerosis structure is used for strengthening the hardness of the flexible circuit board that corresponds the position, and after the angle increase of buckling at the flexible circuit board, the stress of buckling is mainly born by the substrate of sclerosis to reduce the degree of buckling of the substrate of welding light source position department, weaken the substrate when buckling and the effort between the light source, avoid the light source to drop.

Description

Display device

Technical Field

The utility model relates to the technical field of display, in particular to a display device.

Background

With the development of technology, the chip size of the Light Emitting Diode can reach the level of micron or sub-millimeter, and when the micro Light Emitting Diode is adopted, the micro Light Emitting Diode includes but is not limited to a Mini LED (Mini Light Emitting Diode, abbreviated as Mini LED). The Mini LED inherits the characteristics of high efficiency, high brightness, high reliability, quick response time and the like of an inorganic LED, has the characteristic of self luminescence without a backlight source, and has the advantages of energy conservation, simple mechanism, small volume, thinness and the like. The backlight module has longer light-emitting life, higher brightness and better material stability, and can realize multi-partition regional dimming of the display device by applying the backlight module to the backlight module so as to improve the display effect of the display device.

The flexible panel of the flexible Display device also needs to be a flexible panel, and the flexible panel cooperates with a Liquid Crystal Display (LCD) panel to realize curved surface Display, which can also realize curved surface Display similar to an Organic Light Emitting Diode (OLED) Display device under the condition of ensuring image quality.

The light source on the present flexible lamp plate is rigid packaging, and the adhesive force of laminating between flexible substrate, circuit layer and light source is limited, consequently when lamp plate bending angle was too big, the light source can't be crooked, great stress that can produce between substrate and light source causes the problem that the light source drops easily.

SUMMERY OF THE UTILITY MODEL

In some embodiments of the present invention, a display device includes: display panel and backlight unit. Wherein the backlight includes: the flexible circuit board and the light source that is located on the flexible circuit board, one side that deviates from the light source at the flexible circuit board, the position that corresponds to the light source is provided with the sclerosis structure, and the sclerosis structure is used for strengthening the hardness of the flexible circuit board that corresponds the position, and after the angle increase of buckling at the flexible circuit board, the stress of buckling is mainly born by the substrate of sclerosis to reduce the degree of buckling of the substrate of welding light source position department, weaken the substrate when buckling and the effort between the light source, avoid the light source to drop.

In some embodiments of the utility model, a flexible circuit board comprises: the circuit comprises a base material, a circuit layer and a solder mask layer. The hardening structure is arranged on the surface of one side of the substrate, which is far away from the circuit layer. After the surface of the substrate on the side departing from the light source is provided with the hardening structure, the substrate is locally hardened at the position corresponding to the light source, and meanwhile, the hardening structure is arranged on the side departing from the circuit layer, so that the adhesive force of the surface of the substrate on the circuit layer cannot be reduced. The hardness of the base material at the position of the hardening structure is enhanced, and when the flexible substrate is bent, the position is not easy to deform, so that greater support is provided.

In some embodiments of the present invention, the hardening structure is a hardening layer formed by hardening treatment on the surface of the substrate, and the hardening layer may be formed by applying materials such as polymethyl methacrylate or polycarbonate to corresponding positions by hot melt coating or ultraviolet coating.

In some embodiments of the present invention, the stiffening structure is a stiffening film attached to the surface of the substrate, the stiffening film itself having a certain hardness, and the stiffening film is attached to the surface of the substrate to increase the hardness of the substrate at the location. The rigidifying film may be a hardened film, specifically, a material such as a resin.

In some embodiments of the present invention, the stiffening structure includes a plurality of strip-shaped protruding ribs arranged in parallel, and an extending direction of the strip-shaped protruding ribs is parallel to a bending direction of the flexible circuit board. Like this flexible circuit board when crooked along this direction, the protruding arris of bar can play the effect of strengthening the local hardness of substrate, is difficult to produce deformation at the position substrate that is provided with the protruding arris of bar, plays the effect of anti buckling. Therefore, the problem that the base material is separated from the circuit layer is avoided, and the light source is prevented from falling off in the bending process of the flexible circuit board.

In some embodiments of the present invention, the hardening structure only needs to be disposed at the position corresponding to the light source, and does not need to be disposed too large. In an embodiment of the utility model, the orthographic projection of the light source on the substrate is located within the orthographic projection of the hardened structure on the substrate.

In some embodiments of the present invention, the hardened structure is a recessed groove recessed toward one side of the circuit layer; the groove is arranged at a position close to the edge of the light source, and the extending direction of the groove is perpendicular to the bending direction of the flexible circuit board. The groove is arranged at the position corresponding to the edge of the light source, so that after the flexible circuit board is bent, the groove is deformed at first, the stress on the base material corresponding to the position of the light source can be reduced, and the relative hardness of the base material corresponding to the position of the light source is increased, so that the connection between the base material at the position and the circuit layer is protected, and the light source is prevented from falling off.

In some embodiments of the utility model, the annular groove is arranged on the substrate along the edge of the light source, so that no matter which direction the flexible circuit board is bent along, the stress of the substrate corresponding to the light source can be relieved, and the light source is prevented from falling off.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments of the present invention will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic cross-sectional structure diagram of a display device according to an embodiment of the present invention;

fig. 2 is a schematic cross-sectional structure view of a backlight module according to an embodiment of the utility model;

fig. 3 is a schematic cross-sectional view of a backlight according to an embodiment of the utility model;

fig. 4 is one of the structural schematic diagrams of the backlight source after being bent according to the embodiment of the utility model;

fig. 5 is a second schematic cross-sectional structure diagram of a backlight according to an embodiment of the utility model;

fig. 6 is a second schematic structural view of the backlight source provided in the embodiment of the present invention after being bent;

FIG. 7 is a top view of a backlight provided by an embodiment of the utility model;

fig. 8 is a third schematic cross-sectional structure diagram of a backlight according to an embodiment of the present invention;

fig. 9 is a third schematic structural view of the backlight source provided in the embodiment of the present invention after being bent;

fig. 10 is a fourth schematic cross-sectional view of a backlight according to an embodiment of the present invention;

fig. 11 is a fourth schematic structural view of the backlight source after being bent according to the embodiment of the present invention.

The backlight module comprises a backlight module 100, a display panel 200, a backboard 11, a backlight source 12, a diffuser plate 13, an optical film 14, a flexible circuit board 121, a light source 122, a hardening structure 123, a substrate 1211, a circuit layer 1212, a solder resist 1213, an s-strip-shaped raised ridge and an o-groove.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, the present invention is further described with reference to the accompanying drawings and examples. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their repetitive description will be omitted. The words expressing the position and direction described in the present invention are illustrated in the accompanying drawings, but may be changed as required and still be within the scope of the present invention. The drawings of the present invention are for illustrative purposes only and do not represent true scale.

The liquid crystal display device mainly comprises a backlight module and a liquid crystal display panel. The liquid crystal display panel does not emit light, and brightness display needs to be realized by a light source provided by the backlight module.

The display principle of the liquid crystal display device is that liquid crystal is placed between two pieces of conductive glass, and the electric field effect of liquid crystal molecule distortion is caused by the driving of an electric field between two electrodes so as to control the transmission or shielding function of a backlight source, thereby displaying an image. If a color filter is added, a color image can be displayed.

Fig. 1 is a schematic cross-sectional structure diagram of a display device according to an embodiment of the present invention.

As shown in fig. 1, the display device includes: the backlight module 100 is used for providing backlight to the display panel 200, and the display panel 200 is used for displaying images.

The backlight module 100 is generally disposed at the bottom of the display device, and has a shape and size corresponding to those of the display device. When applied to the field of televisions or mobile terminals, the backlight module generally takes a rectangular shape.

The backlight module in the embodiment of the utility model adopts the direct type backlight module, is used for uniformly emitting light rays in the whole light emitting surface, and provides light rays with sufficient brightness and uniform distribution for the display panel, so that the display panel can normally display images.

The display panel 200 is located at the light-emitting side of the backlight module 100, and the shape and size of the display panel are generally matched with those of the backlight module. In general, the display panel 200 may be configured in a rectangular shape including a top side, a bottom side, a left side and a right side, wherein the top side is opposite to the bottom side, the left side is opposite to the right side, the top side is connected to one end of the left side and one side of the right side, and the bottom side is connected to the other end of the left side and the other end of the right side.

The display panel 200 is a transmissive display panel, which can modulate the transmittance of light, but does not emit light by itself. The display panel 200 has a plurality of pixel units arranged in an array, and each pixel unit can independently control the transmittance and color of light incident to the pixel unit from the backlight module 100, so that the light transmitted by all the pixel units forms a displayed image.

Fig. 2 is a schematic cross-sectional structure view of a backlight module according to an embodiment of the utility model.

As shown in fig. 2, the backlight module includes: a back plate 11, a backlight 12, a diffuser plate 13, and an optical film 14.

The back plate 11 is located at the bottom of the backlight module and has supporting and bearing functions. The back plate 11 is typically a square structure, the shape of which is adapted to the shape of the display device when applied to a profiled display device. The back panel 11 includes a top side, a bottom side, a left side, and a right side. Wherein the antenna side is opposite to the ground side, the left side is opposite to the right side, the antenna side is connected with one end of the left side and one side of the right side respectively, and the ground side is connected with the other end of the left side and the other end of the right side respectively.

The material of the back plate 11 is aluminum, iron, aluminum alloy or iron alloy. The back plate 11 is used for supporting the backlight 12 and supporting and fixing the edge positions of the diffusion plate 13 and the optical film 14, and the back plate 11 also plays a role of heat dissipation for the backlight 12.

In the embodiment of the present invention, the backlight module is a direct type backlight module, and the backlight source 12 is located on the back plate 11 and directly emits light to one side of the display panel. The backlight 12 may be a lamp panel or a light bar, which is not limited herein.

When the backlight 12 is a lamp panel, the lamp panel may be square or rectangular, and the size of the lamp panel is suitable for the display device and slightly smaller than the display device. In some embodiments, the backlight module may also include a plurality of lamp panels, and the lamp panels are spliced together to provide a backlight source for the backlight module. When the concatenation, the piece between the adjacent lamp plate is accomplished lessly as far as possible, realizes seamless concatenation even.

When the backlight source 12 is a light bar, a plurality of light bars are arranged in parallel on the back plate, and a set distance is reserved between adjacent light bars. The number of the light bars may be selected according to the size of the display device, and is not limited herein.

The diffusion plate 13 is located on the light emitting side of the backlight source 12, and the diffusion plate 13 is away from the backlight source 12 by a set distance to protect the backlight source from being capable of fully mixing light, so that the brightness uniformity of the backlight module is protected.

The diffuser plate 13 is shaped and sized to fit the display device and may be generally rectangular or square in shape.

The diffuser plate 13 is used to diffuse incident light sufficiently to produce optical diffusion effect, and may be made of polystyrene, polycarbonate, or other diffusing materials; has the advantages of good light source diffusivity, good light transmittance and the like. The diffuser plate can be manufactured by using the existing mature diffuser plate manufacturing process.

The diffusion plate 13 may further include a quantum dot material disposed therein to form a quantum dot diffusion plate, when the backlight 12 emits blue light, the quantum dot material includes a red quantum dot material and a green quantum dot material, the red quantum dot material emits red light under excitation of the blue light, the green quantum dot material emits green light under excitation of the blue light, and the excited emitted red light, green light and transmitted blue light are mixed to form a white light emission.

When the quantum dot diffusion plate is adopted, a quantum dot film is not arranged in the subsequent process of manufacturing the backlight module, so that the cost is reduced, and the display device is lighter and thinner.

The optical film 14 is located on the side of the diffuser 13 facing away from the backlight 12 and is dimensioned to fit the display device, slightly smaller than the display device, and is typically arranged in a rectangular or square shape.

In embodiments of the present invention, the backlight 12 may emit only blue light. At this time, the optical film 14 includes a color conversion layer such as a quantum dot layer or a fluorescent layer.

The quantum dot layer comprises a red quantum dot material and a green quantum dot material, the red quantum dot material emits red light under the excitation of blue light, the green quantum dot material emits green light under the excitation of the blue light, and the red light, the green light and the transmitted blue light which are emitted by excitation are mixed to form white light for emitting.

The fluorescent layer comprises fluorescent materials which are stimulated to emit red light and green light, and the stimulated red light, the green light and the transmitted blue light are mixed into white light to be emitted.

In addition, the optical film 14 may further include a prism sheet, which can change the exit angle of light, thereby changing the viewable angle of the display device.

The optical film 14 may further include a reflective polarizer, which is a brightness enhancement film, and can improve the brightness of the backlight module, improve the utilization efficiency of light, and make the emergent light have polarization property, thereby omitting the use of the polarizer under the lcd panel.

The optical film 14 not only can achieve the corresponding function, but also has the atomization and covering effects.

The display device provided by the utility model can be a flexible display device, wherein the backlight source 12 in the backlight module also needs to adopt a flexible backlight source.

Fig. 3 is a schematic cross-sectional structure diagram of a backlight according to an embodiment of the utility model.

As shown in fig. 3, the backlight includes: a flexible circuit board 121 and a light source 122 located on the flexible circuit board.

The flexible circuit board 121 is located on the back plate 11, and the shape of the flexible circuit board 121 is adapted to the form of the backlight source. When the lamp panel is used, the flexible circuit board 121 may be provided in a plate shape, generally rectangular or square. When the light bar is used, the flexible circuit board 121 may be configured as a long strip, which is not limited herein.

In the embodiment of the present invention, the Flexible Circuit board 121 may be an FPC (Flexible Printed Circuit, abbreviated as FPC). The flexible circuit board 121 includes: substrate 1211, wiring layer 1212, and solder resist layer 1213.

The shape and size of the substrate 1211 are the same as the overall shape and size of the flexible circuit board 121. In the embodiment of the present invention, the substrate 1211 is made of a flexible material, for example, a material such as polyethylene terephthalate (PET) or Polyimide (PI).

The surface of the substrate 1211 is first coated to form an insulating layer, which mainly functions as adhesion, insulation and heat conduction. After the insulating layer is formed, a wiring layer 1212 is formed by imprinting a wiring on the insulating layer. The circuit layer 1212 may be one of a plurality of metal foils such as copper, nickel, aluminum, etc. In the embodiment of the present invention, a copper foil may be selected as the material of the circuit layer 1212.

The solder resist layer 1213 is located on the circuit layer 1212 for insulating and protecting the circuit layer 1212. The solder resist layer 1213 may be made of an insulating material, for example, white oil may be coated on the surface of the circuit layer 1212 to insulate the circuit layer and reflect the incident light, thereby improving the utilization rate of the light source.

The solder resist layer 1213 includes openings that expose the light sources for soldering, and the electrodes of the light sources 122 are spliced to the corresponding pads to be electrically connected to the wiring layer.

In the embodiment of the present invention, the Light source 122 may adopt a Micro Light Emitting Diode, where the Micro Light Emitting Diode includes a Mini LED and a Micro LED (Micro Light Emitting Diode, Micro LED for short). The Micro light-emitting diode chip is a Micro light-emitting diode chip, and the size of the Micro light-emitting diode chip can reach the micron level, wherein the size of the Mini LED is larger than that of the Micro LED. In general, a Micro light emitting diode having a diameter of 100 μm or less is referred to as a Micro LED, and a Micro light emitting diode having a diameter of 100 μm or more is referred to as a Mini LED.

Because the micro light-emitting diode chip has small size, when the micro light-emitting diode is applied to backlight, the micro light-emitting diode has the characteristics of high color gamut, wide visual angle, low power consumption, ultra-thin, energy conservation and the like, and by means of more fine partitioning, the dynamic dimming of the whole picture is realized, and the dynamic contrast of display is greatly improved.

When the size of the micro light-emitting diode chip reaches the pixel level, the micro light-emitting diode chip can be directly used for image display.

In the embodiment of the utility model, the micro light-emitting diode is packaged in a rigid way, usually in a POB packaging way, specifically, a packaging support is arranged on the outer side of the micro light-emitting diode chip, a patch electrode is arranged at the bottom of the packaging support, and the patch electrode and a corresponding bonding pad on the flexible circuit board can be welded by adopting a reflow soldering process so as to realize the electric connection between the micro light-emitting diode and the flexible circuit board.

Fig. 4 is a schematic structural diagram of a backlight source after being bent according to an embodiment of the present invention.

As shown in fig. 4, since the flexible circuit board 121 is made of a flexible base material, the flexible circuit board 121 can be bent when applied to a flexible display device. However, the adhesion between the substrate 1211 and the circuit layer 1212 and between the circuit layer 1212 and the light source 122 are limited, and the light source 122 cannot be bent due to the rigid package, so that a large stress is generated between the substrate 1211 and the circuit layer 1212 during the bending process of the flexible circuit board, and the light source 122 falls off from the flexible circuit board.

In view of this, the backlight provided in the embodiment of the utility model performs the hardening process on the corresponding position of the light source 122, thereby avoiding the above-mentioned problems.

Fig. 5 is a second schematic cross-sectional structure diagram of a backlight source according to an embodiment of the utility model.

As shown in fig. 5, in the embodiment of the utility model, a hardening structure 123 is disposed on the flexible circuit board 121 on a side facing away from the light source 122 and corresponds to the light source 122. Specifically, the hardening structure 123 may be disposed on a surface of the substrate 1211 facing away from the light source 122.

The hardened structure 123 is used to enhance the hardness of the flexible circuit board at the corresponding position, when the hardened structure 123 is disposed on the surface of the base 1211, the hardness of the base 1211 at the position is enhanced, and when the flexible substrate is bent, the position is not easily deformed, thereby providing greater support.

Fig. 6 is a second schematic structural view of the backlight source provided in the embodiment of the utility model after being bent.

As shown in fig. 6, after the hardening structure 123 is disposed on the surface of the substrate 1211 on the side facing away from the light source 122, the substrate is partially hardened at the position corresponding to the light source 122, and the hardening structure is disposed on the side facing away from the wiring layer 1212, so that the adhesion of the substrate surface to the wiring layer is not reduced. After the bending angle of the flexible circuit board 121 is increased, the bending stress is mainly borne by the hardened base material, so that the bending degree of the base material at the position of the welding light source 122 is reduced, the acting force between the base material and the light source 122 during bending is weakened, and the light source 122 is prevented from falling off.

In some embodiments, a hardening process may be performed on the surface of the substrate 1211 facing away from the light source 122 to form a hardened layer, which is the hardened structure.

In specific implementation, the hardened layer may be formed by applying a material such as polymethyl methacrylate (PMMA) or Polycarbonate (PC) to a corresponding position of the substrate by hot melt coating or ultraviolet coating. The specific material ratio, coating process and other parameters can be selected and adjusted according to the difference of the substrate and the equipment used, and are not limited herein.

In some embodiments, a rigidizing film may be attached to the surface of the substrate 1211 facing away from the light source 122, and the rigidizing film is the aforementioned rigidizing structure.

The rigidizing film has certain hardness, so that the rigidizing film with set size can be directly attached to the surface of the base material to increase the hardness of the base material at the position.

The stiffening film may be a cured film, and may be made of a material such as a resin, which is not limited herein.

It should be noted that the stiffening structure is to reinforce the strength of the substrate corresponding to the position of the light source, so that the substrate is less deformed at the position when the flexible circuit board is bent. Therefore, the hardened structure only needs to be disposed at the position corresponding to the light source 122, and does not need to be disposed excessively. In the embodiment of the present invention, the orthographic projection of the light source 122 on the substrate 1211 is located within the orthographic projection of the hardened structure 123 on the substrate 1211. The hardened structure 123 (hardened layer or hardened film) may be the same size as the light source, or may be slightly larger than the light source, and is not limited herein.

FIG. 7 is a top view of a backlight provided by an embodiment of the utility model; fig. 8 is a third schematic cross-sectional structure diagram of a backlight source according to an embodiment of the present invention.

As shown in fig. 7 and 8, in some embodiments, the hardened structures 123 may be a microstructure of reinforcing ribs formed on the surface of the substrate 1211. Specifically, the hardened structure 123 includes a plurality of strip-shaped protruding ribs s arranged in parallel.

A plurality of parallel strip-shaped protruding ribs s are disposed on the surface of the substrate 1211 facing away from the light source 122, and the extending direction of the strip-shaped protruding ribs s is parallel to the bending direction of the flexible circuit board. Like this flexible circuit board 121 when crooked along this direction, the protruding arris of bar can play the effect of strengthening the local hardness of substrate, is difficult to produce deformation at the position substrate that is provided with the protruding arris s of bar, plays the effect of anti buckling. Therefore, the problem of separation between the substrate and the circuit layer is avoided, and the light source 122 is prevented from falling off in the bending process of the flexible circuit board.

Fig. 9 is a third schematic structural view of the backlight source provided in the embodiment of the present invention after being bent.

As shown in fig. 9, when the flexible circuit board needs to be bent along the horizontal direction in fig. 9, the strip-shaped protruding ribs s may be set to extend along the horizontal direction, so that when the flexible circuit board is bent, the hardness of the base material at the position of the light source 122 may be enhanced, the deformation of the base material during the bending process may be reduced, and the light source 122 may be prevented from falling off.

In a specific implementation, the above stripe-shaped protruding rib structure may be formed on the surface of the substrate 1211 by using an imprinting method. In addition, the hard film having the strip-shaped protruding edge may be formed first and then attached to the surface of the substrate, which is not limited herein.

Similarly, the stiffening structure is used to reinforce the strength of the substrate corresponding to the position of the light source, so that the substrate is less deformed at the position when the flexible circuit board is bent. Therefore, the hardened structure only needs to be disposed at the position corresponding to the light source 122, and does not need to be disposed excessively. In the embodiment of the present invention, the orthographic projection of the light source 122 on the substrate 1211 is located within the orthographic projection of the hardened structure 123 on the substrate 1211. The size of the area on which the strip-shaped protruding ribs are distributed may be completely the same as the size of the light source, or may be slightly larger than the size of the light source, which is not limited herein.

In the embodiment of the present invention, the light source 122 may adopt a mini light emitting diode in a POB package form, and the mini light emitting diode after being packaged is generally in a rectangular structure, so that when the flexible circuit board is bent along the long side direction of the mini light emitting diode, a stress is generated more, and the problem of dropping of the mini light emitting diode is more easily caused, so that in practical application, the extending direction of the strip-shaped protruding edge can be parallel to the long side direction of the mini light emitting diode.

Fig. 10 is a fourth schematic cross-sectional structure diagram of a backlight source provided in the embodiment of the present invention.

As shown in fig. 10, in some embodiments, the hardened structure 123 may be a groove o recessed from the surface of the substrate 1211 toward the circuit layer 1212; the groove o is disposed near the edge of the light source 122.

The groove is arranged at the position corresponding to the edge of the light source 122, so that after the flexible circuit board is bent, the position of the groove is firstly deformed, the stress on the base material corresponding to the position of the light source 122 can be reduced, and the relative hardness of the base material corresponding to the position of the light source is increased, so that the connection between the base material at the position and the circuit layer is protected, and the light source is prevented from falling off.

As shown in fig. 11, in the specific implementation, the extending direction of the groove o is perpendicular to the bending direction of the flexible circuit board. As shown in fig. 11, the bending direction of the flexible circuit board is the horizontal direction in fig. 11, and the extending direction of the groove can be set to be the direction perpendicular to the plane of fig. 11, so that when the flexible circuit board is bent, the groove o is deformed first to replace the position of the substrate corresponding to the light source 122 to generate large deformation, thereby avoiding the problem of light source falling.

In some embodiments, an annular groove can be formed in the substrate along the edge of the light source, so that the flexible circuit board can play a role in relieving stress of the substrate corresponding to the light source no matter which direction the flexible circuit board bends, and the light source is prevented from falling off.

The flexible lamp panel or the flexible lamp strip provided by the embodiment of the utility model can be applied to a backlight module as a backlight source; the flexible lamp panel or the flexible lamp strip can be directly adopted for image display, and the light-emitting units on the flexible lamp panel or the flexible lamp strip are used as sub-pixel units. In a specific implementation, the selection may be performed according to a specific application scenario, which is not limited herein.

According to the utility model discloses think about, in the one side that the flexible circuit board deviates from the light source, the position corresponding to the light source is provided with the sclerosis structure, and the hardness that the sclerosis structure is used for the flexible circuit board of reinforcing corresponding position, after the angle increase of buckling of flexible circuit board, the stress of buckling mainly bears by the substrate of sclerosis to reduce the degree of buckling of the substrate of welding light source position department, weaken the substrate when buckling and the effort between the light source, avoid the light source to drop.

According to a second utility model, the flexible circuit board includes: the circuit comprises a base material, a circuit layer and a solder mask layer. The hardening structure is arranged on the surface of one side of the substrate, which is far away from the circuit layer. After the surface of the substrate on the side departing from the light source is provided with the hardening structure, the substrate is locally hardened at the position corresponding to the light source, and meanwhile, the hardening structure is arranged on the side departing from the circuit layer, so that the adhesive force of the surface of the substrate on the circuit layer cannot be reduced. The hardness of the base material at the position of the hardening structure is enhanced, and when the flexible substrate is bent, the position is not easy to deform, so that greater support is provided.

According to the third utility model, the hardened structure is a hardened layer formed by hardening treatment on the surface of the substrate, and the hardened layer can be coated with polymethyl methacrylate or polycarbonate or other materials at corresponding positions by hot melt coating or ultraviolet coating.

According to the fourth utility model, the stiffening structure is the attached stiffening membrane on the substrate surface, and the stiffening membrane itself has certain hardness, attaches the stiffening membrane on the surface of substrate to increase the hardness of this position department substrate. The rigidifying film may be a hardened film, specifically, a material such as a resin.

According to a fifth novel concept, the hardened structure includes a plurality of strip-shaped protruding ribs arranged in parallel, and an extending direction of the strip-shaped protruding ribs is parallel to a bending direction of the flexible circuit board. Like this flexible circuit board when crooked along this direction, the protruding arris of bar can play the effect of strengthening the local hardness of substrate, is difficult to produce deformation at the position substrate that is provided with the protruding arris of bar, plays the effect of anti buckling. Therefore, the problem that the base material is separated from the circuit layer is avoided, and the light source is prevented from falling off in the bending process of the flexible circuit board.

According to the sixth aspect of the present invention, the hardened structure only needs to be provided at a position corresponding to the light source, and does not need to be provided excessively large. In an embodiment of the utility model, the orthographic projection of the light source on the substrate is located within the orthographic projection of the hardened structure on the substrate.

According to the concept of the seventh utility model, the hardened structure is a groove which is formed by sinking the surface of the base material towards one side of the circuit layer; the groove is arranged at a position close to the edge of the light source, and the extending direction of the groove is perpendicular to the bending direction of the flexible circuit board. The groove is arranged at the position corresponding to the edge of the light source, so that after the flexible circuit board is bent, the groove is deformed at first, the stress on the base material corresponding to the position of the light source can be reduced, and the relative hardness of the base material corresponding to the position of the light source is increased, so that the connection between the base material at the position and the circuit layer is protected, and the light source is prevented from falling off.

According to the eighth utility model discloses think about, set up the annular groove along the edge of light source on the substrate, no matter flexible circuit board is buckled along which direction, all can play the effect of alleviating the stress that the substrate position that the light source corresponds to avoid the light source to drop.

While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the utility model.

It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the utility model. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims

1. A display device, comprising:

a display panel for image display;

the backlight module is positioned at the light incidence side of the display panel and used for providing backlight; the backlight module comprises a backlight source, and the backlight source comprises:

a flexible circuit board for providing a driving signal;

the light source is positioned on the flexible circuit board and is electrically connected with the flexible circuit board;

the flexible circuit board is arranged on one side, away from the light source, of the flexible circuit board, a hardening structure is arranged at a position corresponding to the light source, and the hardening structure is used for enhancing the hardness of the flexible circuit board at the corresponding position.

2. The display device of claim 1, wherein the flexible circuit board comprises:

a substrate;

the circuit layer is positioned on one side, facing the display panel, of the substrate;

the solder mask layer is positioned on one side of the circuit layer, which is far away from the substrate;

the hardening structure is positioned on one side of the substrate, which faces away from the circuit layer.

3. The display device of claim 2, wherein the stiffening structure is a stiffening layer coated on the surface of the substrate.

4. The display device according to claim 3, wherein a material of the hardened layer is polymethyl methacrylate or polycarbonate.

5. The display device of claim 2, wherein the stiffening structure is a rigidified film attached to the surface of the substrate.

6. The display device of claim 2, wherein the stiffening structure comprises a plurality of parallel arranged raised ribs.

7. The display device according to claim 6, wherein an extending direction of the stripe-shaped protruding ribs and a bending direction of the flexible circuit board are parallel to each other.

8. The display apparatus of claim 3, 5 or 6, wherein an orthographic projection of the light source on the substrate is within an orthographic projection of the stiffening structure on the substrate.

9. The display device of claim 2, wherein the hardened structure is a groove recessed from the substrate surface toward the wiring layer side; the groove is disposed at a position close to an edge of the light source.

10. The display device according to claim 9, wherein an extending direction of the groove is perpendicular to a bending direction of the flexible circuit board;

alternatively, the groove is an annular groove surrounding the edge of the light source.