CN215815872U

CN215815872U - LED light-emitting device capable of increasing light-emitting angle

Info

Publication number: CN215815872U
Application number: CN202121915303.8U
Authority: CN
Inventors: 李秀富
Original assignee: Suzhou Dongyan Electronic Technology Co ltd
Current assignee: Suzhou Dongyan Electronic Technology Co ltd
Priority date: 2021-01-12
Filing date: 2021-08-16
Publication date: 2022-02-11
Anticipated expiration: 2031-08-16

Abstract

The utility model provides an LED light-emitting device capable of increasing a light-emitting angle, which comprises a substrate, LED particles and a lens layer, wherein the lens layer is arranged above the LED particles and encapsulates the LED particles, the number of the LED particles and the number of the lens layer are multiple, one LED particle is provided with the lens layer, the LED particles are arranged in the substrate, the upper surfaces of the LED particles are flush with the upper surface of the substrate, the lens layer is fixed with the LED particles and the upper surface of the substrate, the lens layer is hemispherical, the diameter of the lens layer is larger than the length of the LED particles, and the lens layer has two structures: the LED lens comprises a first lens layer and a second lens layer, wherein the first lens layer is in a hemispherical shape with the diameter larger than the length of the LED particles, and the second lens layer is composed of a small hemispherical shape with the diameter equal to the length of the LED particles and a fan-shaped shape with the inner diameter equal to the diameter of the small hemispherical shape.

Description

LED light-emitting device capable of increasing light-emitting angle

Technical Field

The utility model relates to the technical field of display devices, in particular to an LED light-emitting device capable of increasing a light-emitting angle.

Background

The backlight module of the television or the computer display device is divided into an edge type backlight module and a direct type backlight module, and the edge type backlight module is the biggest difference between the edge type backlight module and the direct type backlight module; meanwhile, the direct type backlight module adopts an LED backlight source to make an intensive dot matrix, is placed behind a screen, directly irradiates the screen, and forms a uniform luminous surface light source after light is homogenized by an optical film, so that the direct type backlight module is clear in image quality and good in picture effect, and is widely applied.

Direct type backlight module, generally from the bottom up includes: backplate, LED backlight, diffuser plate, other optics diaphragms, LED backlight includes a plurality of LED luminescent device, adopts LED luminescent device to make intensive dot matrix, and LED luminescent device includes: the direct type backlight module adopts the light emitted by the LED backlight source to directly irradiate the screen, so that the thickness of a cavity is required to be larger. The LED light emitting device generally comprises a substrate and LED particles, the number of the LED particles is large and dense, especially for a Miniled lamp panel, in order to pursue the slimness of the direct type backlight module, the LED light emitting device may attach a lens above the LED particles, but even if the lens is attached, the thickness of the direct type backlight module is still larger than that of the side type backlight module, and the thickness of the direct type backlight module needs to be further reduced.

In view of this, the present invention provides an LED light emitting device with an increased light emitting angle, which can increase the light emitting angle of the LED light emitting device, thereby reducing the thickness of the direct type backlight module and reducing the number of LED particles.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide an LED light-emitting device with an increased light-emitting angle, which can increase the light-emitting angle of the LED light-emitting device, thereby reducing the thickness of a direct type backlight module and reducing the number of LED particles.

The LED light-emitting device with the increased light-emitting angle changes the traditional lens, the cross section of the traditional lens is in a double arch shape, the lens adopts a hemispherical convex glue layer to replace the lens, and the hemispherical lens layer is designed with two structures; further, the LED particles are arranged in the substrate, and the upper surfaces of the LED particles are flush with the substrate; further, the lens layer is provided with diffusion particles; through measurement, the light-emitting angle of the LED light-emitting device is 140-150 degrees, so that the light-emitting angle is obviously increased, the thickness of the direct type backlight module can be reduced, and the number of LED particles is reduced.

The utility model provides an increase LED luminescent device who sends out light angle, including base plate 1, LED granule 2, lens layer 3 sets up in LED granule 2's top and encapsulates LED granule 2, LED granule 2 and lens layer 3 have a plurality ofly, be provided with a lens layer 3 on the LED granule 2, a serial communication port, LED granule 2 sets up in base plate 1, and the upper surface of LED granule 2 is equal with the upper surface of base plate 1, lens layer 3 is fixed with the upper surface of LED granule 2 and base plate 1, lens layer 3 is the hemisphere, the diameter of lens layer 3 is greater than the length of LED granule 2, lens layer 3 has two kinds of structures: a first lens layer 31 and a second lens layer 32, the first lens layer 31 being a hemisphere having a diameter larger than the length of the LED pellet 2, the second lens layer 32 being composed of a small hemisphere 321 having a diameter equal to the length of the LED pellet 2 and a sector 322 having an inner diameter equal to the diameter of the small hemisphere 321.

In some embodiments, the lower surface of the first lens layer 31 contacts the upper surfaces of the LED chip 2 and the substrate 1, the middle portion of the lower surface of the fan-shaped section 322 of the second lens layer 32 contacts the upper surface of the hemispherical section 321, the left and right portions of the lower surface of the fan-shaped section 322 contact the upper surface of the substrate 1, and the lower surface of the hemispherical section 321 of the second lens layer 32 contacts the upper surface of the LED chip 2.

Further, the first lens layer 31 is one of pure silica gel, silicone resin and epoxy resin, and the diffusion particles 4 are distributed in the first lens layer 31, the small hemispheric shape 321 is one of pure silica gel, silicone resin and epoxy resin, the fan shape 322 is one of pure silica gel, silicone resin and epoxy resin, and the diffusion particles 4 are distributed in the first lens layer 31.

Further, the diffusion particles 4 are inorganic particles or organic polymer particles, and the inorganic particles include: SiO 2₂、TiO₂、Al₂O₃、CaCO₃、BaSO₄The organic polymer particles include: polymethyl methacrylate (PMMA), Polystyrene (PS), acrylonitrile-butadiene-styrene copolymer (ABS), Polyurethane (PU) and organic silicon polymer.

Further, the diameter of the diffusion particle 4 is 0.1um to 20 um. Preferably, the diffusion particles 4 have a diameter of 1um to 15 um.

Furthermore, the diffusion particles 4 account for 0.5-5% of the mass of the base transparent adhesive. Preferably, the diffusion particles 4 account for 3% -5% of the mass of the base transparent adhesive.

In some embodiments, the LED particles 2 include LED chips and a support, the LED chips are located at the bottom and the middle position of the support, a cavity between the LED chips and the support is filled with a transparent adhesive, the LED chips are packaged inside the support by the transparent adhesive, the upper surface of the transparent adhesive is a horizontal surface, and the upper surface of the transparent adhesive is flush with the upper surface of the support.

Further, the transparent adhesive is one of pure silica gel, silicone resin and epoxy resin.

Furthermore, the support comprises a bottom surface and two side surfaces, the bottom surface and the two side surfaces have a light reflecting effect, and the reflectivity of the bottom surface and the two side surfaces is more than 90%.

Further, the LED chip in one LED particle 2 is a single LED chip or a group of LED chips consisting of a plurality of LED chips.

Further, the LED chip includes: one or more of a blue light LED chip, a red light LED chip, a green light LED chip, a blue-green light LED chip, a yellow light LED chip, an orange light LED chip and an amber light LED chip.

Furthermore, the LED light-emitting chips of the same group are arranged according to rows, columns or delta shapes.

Furthermore, the dominant wavelength range of the LED light-emitting chip is 380-470 nm.

In some embodiments, the substrate 1 is one of a PCB substrate, an FPC substrate, a glass substrate, a polyimide substrate, a transparent polyimide substrate, and a polyester resin substrate.

Drawings

Fig. 1 is a schematic structural diagram of an LED light-emitting device with an increased light-emitting angle according to embodiment 1 of the present application.

Fig. 2 is a schematic structural diagram of an LED light-emitting device with an increased light-emitting angle according to embodiment 2 of the present application.

Description of the main element symbols:

substrate 1, LED pellet 2, lens layer 3, diffusing particles 4, first lens layer 31, second lens layer 32, small hemispheres 321, and fan-shaped 322.

Detailed Description

The following examples are described to aid in the understanding of the present invention and are not, and should not be construed to limit the scope of the present invention in any way.

In the following description, those skilled in the art will recognize that components may be described throughout this discussion as separate functional units (which may include sub-units), but those skilled in the art will recognize that various components or portions thereof may be divided into separate components or may be integrated together (including being integrated within a single system or component).

Also, connections between components or systems are not intended to be limited to direct connections. Rather, data between these components may be modified, reformatted, or otherwise changed by the intermediate components. Additionally, additional or fewer connections may be used. It should also be noted that the terms "coupled," "connected," or "input" and "fixed" are understood to encompass direct connections, indirect connections, or fixed through one or more intermediaries. In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "side", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships commonly recognized in the product of the application, and are only used for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application.

Example 1:

an LED light-emitting device capable of increasing a light-emitting angle is disclosed, as shown in fig. 1, and comprises a substrate 1, LED particles 2 and a lens layer 3, wherein the lens layer 3 is arranged above the LED particles 2 and encapsulates the LED particles 2, the LED particles 2 and the lens layer 3 are multiple, one lens layer 3 is arranged on one LED particle 2, the LED particles 2 are arranged in the substrate 1, the upper surface of the LED particles 2 is flush with the upper surface of the substrate 1, the lens layer 3 is fixed with the LED particles 2 and the upper surface of the substrate 1, the lens layer 3 is hemispherical, the diameter of the lens layer 3 is larger than the length of the LED particles 2, the lens layer 3 is a first lens layer 31, and the first lens layer 31 is hemispherical, and the diameter of the first lens layer 31 is larger than the length of the LED particles 2.

The lower surface of the first lens layer 31 is in contact with the LED particles 2 and the upper surface of the substrate 1. The first lens layer 31 is made of pure silica gel, and the diffusion particles 4 are distributed in the first lens layer 31. The diffusion particles 4 are inorganic particles, and the inorganic particles are SiO₂The diameter of the diffusion particles 4 is 12um, and the diffusion particles 4 account for 3% of the mass of the base transparent adhesive. The LED particles 2 comprise LED chips and supports, the LED chips are located at the bottom and the middle positions of the supports, transparent adhesive tapes are filled in cavities between the LED chips and the supports, the LED chips are packaged inside the supports through the transparent adhesive tapes, the upper surfaces of the transparent adhesive tapes are horizontal planes, and the upper surfaces of the transparent adhesive tapes are flush with the upper surfaces of the supports. The transparent adhesive is silicon resin, the support comprises a bottom surface and two side surfaces, the bottom surface and the two side surfaces have a light reflecting effect, and the reflectivity of the bottom surface and the two side surfaces is larger than 90%. The LED chip in the LED particle 2 is an independent LED chip, the LED chip is a blue LED chip, the dominant wavelength range of the LED light-emitting chip is 450nm, and the substrate 1 is PA CB substrate.

Utility model 2:

an LED light-emitting device capable of increasing a light-emitting angle is disclosed, as shown in FIG. 2, and comprises a substrate 1, LED particles 2 and a lens layer 3, wherein the lens layer 3 is arranged above the LED particles 2 and encapsulates the LED particles 2, the LED particles 2 and the lens layer 3 are multiple, one lens layer 3 is arranged on one LED particle 2, the LED particles 2 are arranged in the substrate 1, the upper surface of the LED particle 2 is flush with the upper surface of the substrate 1, the lens layer 3 is fixed with the LED particles 2 and the upper surface of the substrate 1, the lens layer 3 is hemispherical, the diameter of the lens layer 3 is larger than the length of the LED particles 2, the lens layer 3 is a second lens layer 32, and the second lens layer 32 is composed of a small hemispherical shape 321 with the diameter equal to the length of the LED particles 2 and a fan shape 322 with the inner diameter equal to the diameter of the small hemispherical shape 321.

The middle of the lower surface of the fan shape 322 of the second lens layer 32 is in contact with the upper surface of the small hemispheroid 321, the left and right portions of the lower surface of the fan shape 322 are in contact with the upper surface of the substrate 1, and the lower surface of the small hemispheroid 321 of the second lens layer 32 is in contact with the upper surface of the LED particle 2. The small hemispheres 321 are pure silica gel, the sectors 322 are silicone resin, and the diffusion particles 4 are distributed in the first lens layer 31. The diffusion particles 4 are organic polymer particles, and the organic polymer particles are polymethyl methacrylate (PMMA). The diameter of the diffusion particles 4 is 2um, and the diffusion particles 4 account for 5% of the mass of the base transparent adhesive. The LED particles 2 comprise LED chips and supports, the LED chips are located at the bottom and the middle positions of the supports, transparent adhesive tapes are filled in cavities between the LED chips and the supports, the LED chips are packaged inside the supports through the transparent adhesive tapes, the upper surfaces of the transparent adhesive tapes are horizontal planes, and the upper surfaces of the transparent adhesive tapes are flush with the upper surfaces of the supports. The transparent adhesive is pure silica gel, the support comprises a bottom surface and two side surfaces, the bottom surface and the two side surfaces have a light reflecting effect, and the reflectivity of the bottom surface and the two side surfaces is larger than 90%. The LED chips in one LED particle 2 are a group of LED chips consisting of a plurality of LED chips. The LED chips are blue LED chips, red LED chips and green LED chips, the same group of LED light-emitting chips are arranged in a delta shape, the dominant wavelength range of the LED light-emitting chips is 390nm, and the substrate 1 is a polyimide substrate.

While various aspects and embodiments have been disclosed herein, it will be apparent to those skilled in the art that other aspects and embodiments can be made without departing from the spirit of the disclosure, and that several modifications and improvements can be made without departing from the spirit of the disclosure. The various aspects and embodiments disclosed herein are presented by way of example only and are not intended to limit the present disclosure, which is to be controlled in the spirit and scope of the appended claims.

Claims

1. The utility model provides an increase LED luminescent device who sends out light angle, including base plate (1), LED granule (2), lens layer (3) set up in the top of LED granule (2) and encapsulate LED granule (2), LED granule (2) and lens layer (3) have a plurality ofly, be provided with a lens layer (3) on one LED granule (2), a serial communication port, LED granule (2) set up in base plate (1) and the upper surface of LED granule (2) is equal with the upper surface of base plate (1), lens layer (3) are fixed with the upper surface of LED granule (2) and base plate (1), lens layer (3) are the hemisphere, the diameter of lens layer (3) is greater than the length of LED granule (2), lens layer (3) have two kinds of structures: a first lens layer (31) and a second lens layer (32), the first lens layer (31) being a hemisphere having a diameter larger than the length of the LED pellet (2), the second lens layer (32) being composed of a small hemisphere (321) having a diameter equal to the length of the LED pellet (2) and a sector (322) having an inner diameter equal to the diameter of the small hemisphere (321).

2. The LED light emitting device for increasing the light emitting angle according to claim 1, wherein the lower surface of the first lens layer (31) is in contact with the LED pellet (2) and the upper surface of the substrate (1), the middle portion of the lower surface of the fan-shaped (322) of the second lens layer (32) is in contact with the upper surface of the small hemispheroid (321), the left and right portions of the lower surface of the fan-shaped (322) are in contact with the upper surface of the substrate (1), and the lower surface of the small hemispheroid (321) of the second lens layer (32) is in contact with the upper surface of the LED pellet (2).

3. The LED light emitting device for increasing the light emitting angle as set forth in claim 2, wherein the first lens layer (31) is one of pure silicone, and epoxy, and the diffusion particles (4) are distributed in the first lens layer (31), the small hemispheres (321) are one of pure silicone, and epoxy, the sectors (322) are one of pure silicone, and epoxy, and the diffusion particles (4) are distributed in the first lens layer (31).

4. The LED light-emitting device for increasing the light-emitting angle according to claim 3, wherein the diameter of the diffusion particles (4) is 0.1um to 20um, and the diffusion particles (4) account for 0.5 percent to 5 percent of the mass of the basic transparent adhesive.

5. The LED light-emitting device for increasing the light-emitting angle according to claim 4, wherein the diameter of the diffusion particles (4) is 1um to 15um, and the diffusion particles (4) account for 3% to 5% of the mass of the base transparent adhesive.

6. The LED light-emitting device for increasing the light-emitting angle according to claim 1, wherein the LED particles (2) comprise LED chips and a support, the LED chips are positioned at the bottom and in the middle of the support, a cavity between the LED chips and the support is filled with transparent adhesive, the LED chips are packaged inside the support by the transparent adhesive, the upper surface of the transparent adhesive is a horizontal plane, and the upper surface of the transparent adhesive is flush with the upper surface of the support.

7. The LED light emitting device for increasing the light emitting angle as set forth in claim 6, wherein the LED chip in one LED particle (2) is a single LED chip or a group of LED chips consisting of a plurality of LED chips.

8. The LED light emitting device for increasing a light emission angle as set forth in claim 7, wherein the LED chip includes: one or more of a blue light LED chip, a red light LED chip, a green light LED chip, a blue-green light LED chip, a yellow light LED chip, an orange light LED chip and an amber light LED chip.

9. The LED light emitting device with an increased light emission angle as set forth in claim 8, wherein the same group of LED light emitting chips are arranged in rows, columns or delta shapes.

10. The LED light emitting device for increasing a light emitting angle as set forth in claim 1, wherein the substrate (1) is one of a PCB substrate, an FPC substrate, a glass substrate, a polyimide substrate, a transparent polyimide substrate, a polyester resin substrate.