CN215813668U - Light source module and backlight module - Google Patents

Abstract

A light source module includes a circuit substrate, a plurality of light emitting elements, and a high-reflectivity stack. The circuit substrate has a substrate surface. The light emitting elements are disposed on the circuit substrate and electrically connected to the circuit substrate. Each light-emitting element is provided with a light-emitting surface deviating from the circuit substrate. The high-reflectivity stack is disposed on the circuit substrate. The high-reflectivity lamination is formed by stacking at least two high-reflectivity layers and is provided with a plurality of openings. The light emitting elements are located within the openings. A first height is formed between the light-emitting surface of each light-emitting element and the surface of the substrate. The high-reflectivity lamination is farthest away from the second height between the top surface of the circuit substrate and the surface of the substrate, and the second height is larger than the first height. A backlight module using the light source module is also provided. The light emitted by the light source module has better collimation and higher light utilization rate.

Description

Light source module and backlight module

Technical Field

The present invention relates to a lighting source, and more particularly, to a light source module and a backlight module using the same.

Background

In recent years, Light Emitting Diodes (LEDs) have been rapidly developed, and low power consumption and high Light Emitting power have been the most advantages of the LEDs. Since the backlight module composed of leds can also improve the color performance of the lcd, most of the current panel manufacturers replace the backlight module composed of cold cathode tubes with the backlight module having leds. In recent years, in order to improve the image contrast of a liquid crystal display, a Direct type LED Backlight Module (Direct type LED Backlight Module) having Local Dimming (Local Dimming) capability has been proposed. However, such a light emitting diode has a large light emitting angle range, and tends to produce halo during local dimming.

SUMMERY OF THE UTILITY MODEL

The utility model provides a light source module, which has better collimation of emitted light and higher light utilization rate.

The utility model provides a backlight module which has better regional dimming performance.

To achieve one or a part of or all of the above or other objects, an embodiment of the utility model provides a light source module. The light source module includes a circuit substrate, a plurality of light emitting elements, and a high-reflectance stack. The circuit substrate has a substrate surface. The light emitting elements are disposed on the circuit substrate and electrically connected to the circuit substrate. Each light-emitting element is provided with a light-emitting surface deviating from the circuit substrate. The high-reflectivity stack is disposed on the circuit substrate. The high-reflectivity lamination is formed by stacking at least two high-reflectivity layers and is provided with a plurality of openings. The light emitting elements are located within the openings. A first height is formed between the light-emitting surface of each light-emitting element and the surface of the substrate. The high-reflectivity lamination is farthest away from the second height between the top surface of the circuit substrate and the surface of the substrate, and the second height is larger than the first height.

In order to achieve one or a part of or all of the above or other objects, an embodiment of the utility model provides a backlight module. The backlight module comprises a light source module and at least one optical film. The light source module includes a circuit substrate, a plurality of light emitting elements, and a high-reflectance stack. The circuit substrate has a substrate surface. The light emitting elements are disposed on the circuit substrate and electrically connected to the circuit substrate. Each light-emitting element is provided with a light-emitting surface deviating from the circuit substrate. The high-reflectivity stack is disposed on the circuit substrate. The high-reflectivity lamination is formed by stacking at least two high-reflectivity layers and is provided with a plurality of openings. The light emitting elements are located within the openings. A first height is formed between the light-emitting surface of each light-emitting element and the surface of the substrate. The high-reflectivity lamination is farthest away from the second height between the top surface of the circuit substrate and the surface of the substrate, and the second height is larger than the first height. The at least one optical film is arranged on one side of the light-emitting surface of the light source module.

In view of the above, in the light source module and the backlight module of an embodiment of the utility model, the plurality of openings of the high-reflectivity stack are provided with the plurality of light emitting elements, and the top surface of the high-reflectivity stack is higher than the light emitting surfaces of the light emitting elements. Therefore, the light source module can increase the light-emitting collimation and the light utilization rate, and can inhibit the halo phenomenon of the backlight module during regional dimming.

Drawings

Fig. 1 is a schematic cross-sectional view of a backlight module according to a first embodiment of the utility model.

Fig. 2 is a schematic cross-sectional view of a light source module according to a second embodiment of the present invention.

Fig. 3 is a schematic cross-sectional view of a light source module according to a third embodiment of the present invention.

Fig. 4 is a schematic cross-sectional view of a light source module according to a fourth embodiment of the present invention.

Fig. 5 is a schematic cross-sectional view of a light source module according to a fifth embodiment of the present invention.

Detailed Description

The foregoing and other features and advantages of the utility model will be apparent from the following, more particular description of preferred embodiments of the utility model, as illustrated in the accompanying drawings. Directional terms as referred to in the following examples, for example: up, down, left, right, front or rear, etc., are simply directions with reference to the drawings. Accordingly, the directional terminology is used for purposes of illustration and is in no way limiting.

Fig. 1 is a schematic cross-sectional view of a backlight module according to a first embodiment of the utility model. Referring to fig. 1, a backlight module 10 includes a light source module 100. The light source module 100 includes a circuit substrate 110, a high-reflectivity stack 120, and a plurality of light emitting elements 130. The circuit substrate 110 has a substrate surface 110s, and the high-reflectance stack 120 and the light-emitting elements 130 are disposed on the substrate surface 110s of the circuit substrate 110. The high-reflectivity stack 120 is formed by stacking at least two high-reflectivity layers and has a plurality of openings OP. The light emitting elements 130 are disposed in the openings OP. In the present embodiment, the reflectivity of the high reflectivity stack 120 is greater than 80%, and the material thereof may include a high molecular polymer, such as Polyimide (PI).

For example, the circuit substrate 110 has a plurality of pad sets (i.e., a combination of the first pads P1 and the second pads P2), and the material of the pad sets is Solder Paste (Solder Paste). Each light emitting device 130 can be electrically connected to the circuit substrate 110 by bonding with a pad on the circuit substrate 110. The circuit substrate 110 is provided with a driving circuit layer (not shown), for example, and the driving circuit layer can individually control the light emitting elements 130 to emit light. More specifically, the backlight module 10 of the present embodiment has a local dimming (local dimming) capability. In the present embodiment, the light emitting element 130 is, for example, but not limited to, a sub-millimeter light emitting diode (mini-LED), a micro-LED, and a Light Emitting Diode (LED).

It is particularly noted that the top surface 120t of the high-reflectivity stack 120 farthest from the circuit substrate 110 is higher than the light-emitting surface 130es of the light-emitting element 130. More specifically, the light-emitting surface 130es of the light-emitting device 130 has a first height H1 relative to the substrate surface 110s, the top surface 120t of the high-reflectivity stack 120 has a second height H2 relative to the substrate surface 110s, and the second height H2 is greater than the first height H1. Accordingly, the light-emitting collimation and the light utilization rate of the light source module 100 can be increased, and the halo phenomenon of the backlight module 10 during the local dimming can be suppressed.

That is, by adjusting the relative heights of the high-reflectivity stack 120 and the light-emitting device 130, the light-emitting angle range of the light beam LB emitted by the light-emitting device 130 after leaving the light source module 100 can be changed. For example, when the second height H2 of the high-reflectivity stack 120 is higher, the light-emitting angle range of the light ray LB leaving the light source module 100 is smaller. In contrast, when the second height H2 of the high-reflectivity stack 120 is lower than but still higher than the first height H1 of the light emitting element 130, the light ray LB leaves the light source module 100 with a large range of light-emitting angles, but still has a certain light-collecting property.

In the present embodiment, the high-reflectivity stack 120 may be formed by stacking four high-reflectivity layers, namely a first high-reflectivity layer 121, a second high-reflectivity layer 122, a third high-reflectivity layer 123 and a fourth high-reflectivity layer 124, which are sequentially disposed on the circuit substrate 110. It is particularly noted that the widths of the high-reflectivity layers along the arrangement direction (e.g., the direction D1) of any two adjacent light-emitting elements 130 may be the same and aligned with each other along the direction (e.g., the direction D2) perpendicular to the light-emitting surface 130 es. In the present embodiment, the number of high-reflectivity layers of the high-reflectivity stack 120 is exemplarily illustrated as four, which does not mean that the present invention is limited thereto. According to other embodiments, the number of stacked high-reflectivity layers of the high-reflectivity stack can be adjusted according to the actual application requirements.

Further, the light source module 100 may further optionally include an optical adhesive layer 150 covering the high-reflectivity stack 120 and the plurality of light emitting elements 130. The optical adhesive layer 150 not only has a protective effect, but also can reduce the probability of total reflection of the light beam LB from the light emitting layer (not shown) of the light emitting element 130 on the light emitting surface 130es, thereby contributing to improving the light emitting efficiency of the light source module 100.

On the other hand, the backlight module 10 may further optionally include an optical film 200 disposed on the light emitting side of the light source module 100 (i.e., the side of the light emitting surface 130es of the light emitting element 130). The optical film 200 may be a diffuser (diffuser), a prism sheet (prism sheet), or a light guide plate (light guide plate). In the present embodiment, the number of the optical films 200 is exemplarily illustrated as one example, and it does not mean that the present invention is limited thereto. In other embodiments, the number of the optical sheets 200 of the backlight module can be adjusted according to the actual application requirement, such as a combination of a diffusion sheet and at least two prism sheets.

The present disclosure will be described in detail below with reference to other embodiments, wherein like components are denoted by like reference numerals, and descriptions of the same technical contents are omitted, and detailed descriptions thereof are omitted.

Fig. 2 is a schematic cross-sectional view of a light source module according to a second embodiment of the present invention. Fig. 3 is a schematic cross-sectional view of a light source module according to a third embodiment of the present invention. Referring to fig. 2, a difference between the light source module 100A of the present embodiment and the light source module 100 of fig. 1 is: the high reflectivity stacks differ in configuration. In the present embodiment, the width of the high-reflectance stack 120A of the light source module 100A is reduced with distance from the substrate surface 110 s.

For example, the first, second, third, and fourth high- reflectance layers 121A, 122A, 123A, and 124A have widths W1, W2, W3, and W4 along the direction D1, respectively. Wherein the width W1 of the first high-reflectance layer 121A is greater than the width W2 of the second high-reflectance layer 122A. The width W3 of the third high-reflectance layer 123A is the same as the width W4 of the fourth high-reflectance layer 124A, and is smaller than the width W2 of the second high-reflectance layer 122A. Referring to fig. 3, in the light source module 100B of the present embodiment, the width W4 ″ of the fourth high-reflectivity layer 124B of the high-reflectivity stack 120B of the light source module 100B is smaller than the width W3 of the third high-reflectivity layer 123A (as shown in fig. 3).

Particularly, the different width configurations of the high-reflectivity layers can enable the light source module to emit light rays LB with different light-emitting patterns, for example: the high light-emitting light type of collimation nature, or have the light-emitting light type that has the light convergence characteristic, or send the light type of fixed luminous angle.

Fig. 4 is a schematic cross-sectional view of a light source module according to a fourth embodiment of the present invention. Referring to fig. 4, a difference between the light source module 100C of the present embodiment and the light source module 100A of fig. 2 is: the high reflectivity stacks differ in configuration. In the present embodiment, the thicknesses of the portions of the high-reflectivity layer of the light source module 100C along the direction perpendicular to the light emitting surface 130es (e.g., the direction D2) are different from each other.

For example, the first, second, third and fourth high- reflectance layers 121C, 122C, 123C and 124C of the high-reflectance stack 120C have a thickness T1, a thickness T2, a thickness T3 and a thickness T4, respectively, along the direction D2. Wherein the thickness T1 of the first high-reflectance layer 121C is greater than the thickness T2 of the second high-reflectance layer 122C. The thickness T4 of the fourth high-reflectance layer 124C is greater than the thickness T3 of the third high-reflectance layer 123C and the thickness T2 of the second high-reflectance layer 122C, and is less than the thickness T1 of the first high-reflectance layer 121C, but is not limited thereto. Through the thickness variation of these high-reflectivity layers, the adjustment flexibility of the light output pattern of the light source module 100C can be further increased. On the other hand, in the present embodiment, the reflectivities of the high-reflectivity layers may also be different from each other to increase the adjustment margin of the light pattern.

Fig. 5 is a schematic cross-sectional view of a light source module according to a fifth embodiment of the present invention. Referring to fig. 5, the light source module 100D of the present embodiment includes a circuit substrate 110, a high-reflectivity stack 120, a plurality of light emitting elements 130, and a fixing adhesive layer 140. The circuit substrate 110 has a substrate surface 110s, and the light emitting elements 130 are disposed on the substrate surface 110s of the circuit substrate 110. The fixing adhesive layer 140 is used to fix the high-reflectivity stack 120 on the substrate surface 110s of the circuit substrate 110. The high-reflectivity stack 120 is formed by stacking at least two high-reflectivity layers and has a plurality of openings OP. The light emitting elements 130 are disposed in the openings OP.

In summary, in the light source module and the backlight module having the light source module according to the embodiment of the utility model, the plurality of openings of the high-reflectivity stack are provided with a plurality of light emitting elements, and the top surface of the high-reflectivity stack is higher than the respective light emitting surfaces of the light emitting elements. Therefore, the light source module can increase the light-emitting collimation and the light utilization rate, and can inhibit the halo phenomenon of the backlight module during regional dimming.

However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention should not be limited thereby, and the utility model is still covered by the claims and the simple equivalent changes and modifications made by the present invention. It is not necessary for any embodiment or claim of the utility model to address all of the objects, advantages, or features disclosed herein. In addition, the abstract and the title (the title of the utility model) are provided for assisting the search of the patent document and are not intended to limit the scope of the right of the utility model. Furthermore, the terms "first", "second", and the like in the description or the claims are used only for naming elements (elements) or distinguishing different embodiments or ranges, and are not used for limiting the upper limit or the lower limit on the number of elements.

Description of reference numerals:

10 backlight module

100. 100A, 100B, 100C, 100D light source module

110 circuit board

110s the surface of the substrate

120. 120A, 120B, 120C high reflectivity stack

120t top surface

121. 122, 123, 124, 121A, 122A, 123A, 124B, 121C, 122C, 123C, 124C, a high-reflectivity layer

130 light emitting element

130es light-emitting surface

140 adhesive layer

150 optical adhesive layer

200 optical film

D1 and D2 directions

H1 first height

H2 second height

Light of LB

OP is an opening

P1 first pad

P2 second pad

T1, T2, T3, T4 thickness

W1, W2, W3, W4, W4 ": width.

Claims (10)

1. A light source module comprising a circuit substrate, a plurality of light emitting elements, and a high reflectivity stack, wherein:

the circuit substrate has a substrate surface;

the light-emitting elements are arranged on the circuit substrate and electrically connected with the circuit substrate, and each light-emitting element is provided with a light-emitting surface deviating from the circuit substrate; and

the high-reflectivity lamination layer is arranged on the circuit substrate, the high-reflectivity lamination layer is formed by stacking at least two high-reflectivity layers and is provided with a plurality of openings, the plurality of light-emitting elements are positioned in the plurality of openings,

the light-emitting surface of each light-emitting element and the surface of the substrate have a first height, the high-reflectivity lamination layer farthest from the circuit substrate has a second height, and the second height is greater than the first height.

2. The light source module of claim 1, wherein the at least two high reflectivity layers have a reflectivity of greater than 80%.

3. The light source module of claim 1, wherein the high reflectivity stack comprises:

the high-reflectivity circuit board comprises a first high-reflectivity layer and a second high-reflectivity layer, wherein the first high-reflectivity layer is positioned between the second high-reflectivity layer and the circuit substrate, the first high-reflectivity layer is provided with a first width along a direction parallel to the surface of the substrate, the second high-reflectivity layer is provided with a second width along the direction, and the second width is smaller than the first width.

4. The light source module of claim 1, wherein the high reflectivity stack comprises:

a first high-reflectivity layer having a first thickness along a direction perpendicular to the light exit surface; and

a second high-reflectance layer having a second thickness along the direction, and the first thickness is different from the second thickness, wherein the first high-reflectance layer is located between the second high-reflectance layer and the circuit substrate.

5. The light source module of claim 1, wherein the reflectivity of at least one of the at least two high reflectivity layers is different from the reflectivity of at least another of the at least two high reflectivity layers.

6. The light source module of claim 1, wherein the material of the high-reflectivity stack comprises a high-molecular polymer.

7. A backlight module, comprising a light source module and at least one optical film, wherein:

the light source module comprises a circuit substrate, a plurality of light emitting elements and a high-reflectivity lamination, wherein:

the circuit substrate has a substrate surface;

the light-emitting elements are arranged on the circuit substrate and electrically connected with the circuit substrate, and each light-emitting element is provided with a light-emitting surface deviating from the circuit substrate; and

the high-reflectivity lamination is arranged on the circuit substrate, the high-reflectivity lamination is formed by stacking at least two high-reflectivity layers and is provided with a plurality of openings, the light-emitting elements are positioned in the openings, a first height is formed between the light-emitting surface of each light-emitting element and the surface of the substrate, a second height is formed between the top surface of the high-reflectivity lamination, which is farthest away from the circuit substrate, and the surface of the substrate, and the second height is greater than the first height; and

the at least one optical film is arranged on one side of the light emitting surface of the light source module.

8. The backlight module of claim 7, wherein the high-reflectivity stack has a reflectivity of greater than 80%.

9. The backlight module of claim 7, wherein the high reflectivity stack comprises:

the high-reflectivity circuit board comprises a first high-reflectivity layer and a second high-reflectivity layer, wherein the first high-reflectivity layer is positioned between the second high-reflectivity layer and the circuit substrate, the first high-reflectivity layer is provided with a first width along a direction parallel to the surface of the substrate, the second high-reflectivity layer is provided with a second width along the direction, and the second width is smaller than the first width.

10. The backlight module of claim 7, wherein the optical film is a diffusion sheet, a prism sheet, or a light guide plate.

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