CN215812951U - IC test support plate is with exempting from equipment of welding - Google Patents
IC test support plate is with exempting from equipment of welding Download PDFInfo
- Publication number
- CN215812951U CN215812951U CN202122130488.8U CN202122130488U CN215812951U CN 215812951 U CN215812951 U CN 215812951U CN 202122130488 U CN202122130488 U CN 202122130488U CN 215812951 U CN215812951 U CN 215812951U
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- Prior art keywords
- groove
- test
- air outlet
- electric telescopic
- wall
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- Expired - Fee Related
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- 238000003466 welding Methods 0.000 title description 2
- 230000006835 compression Effects 0.000 claims abstract description 19
- 238000007906 compression Methods 0.000 claims abstract description 19
- 238000002788 crimping Methods 0.000 claims abstract description 5
- 238000007789 sealing Methods 0.000 claims description 10
- 238000005538 encapsulation Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model discloses welding-free assembling equipment for an IC test support plate, which comprises an L-shaped support frame, a test seat and an electric telescopic rod, wherein the bottom end inside the L-shaped support frame is provided with the test seat, the top end inside the L-shaped support frame is provided with a hydraulic lifting rod, the output end of the hydraulic lifting rod is provided with a fixing frame body, two sides inside the fixing frame body are provided with slide rails, a compression joint block is arranged inside the slide rails, a hollow groove is formed inside the compression joint block, an air suction mechanism for fixing is arranged inside the hollow groove, one side wall of the compression joint block is provided with a first air outlet groove, the top end of the first air outlet groove is provided with a first groove, and a first fixing shaft is arranged inside the first groove through a bearing. This IC test support plate is with exempting from welded equipment for through taking out trapezoidal inslot air for form suction in the trapezoidal inslot, be convenient for inhale the below of crimping piece to IC test support plate, and then be convenient for with IC test support plate automatic fixation.
Description
Technical Field
The utility model relates to the technical field of IC test carrier plates, in particular to a welding-free assembling device for an IC test carrier plate.
Background
IC-card encapsulation frame refers to the special basic material of a key that is used for integrated circuit card module encapsulation usefulness, mainly play the protection chip and as the effect of integrated circuit chip and external interface, its form is generally banded, and can divide into according to the material of IC-card encapsulation frame, metal IC-card encapsulation frame, epoxy group IC-card encapsulation frame are two kinds, and IC test carrier plate needs the wafer test in process of production, it is exactly to carry out the electrical property to every crystalline grain on the wafer and detect, traditional IC test carrier plate can satisfy people's user demand with solderless's equipment basically, but still has certain problem, specific problem is as follows:
1. when most IC test carrier plates in the current market are used by welding-free assembling equipment, the IC test plate is too small in size, so that an operator cannot conveniently take up and assemble the IC test plate, the assembling difficulty is high, and the practicability is not high;
2. most IC test support plates in the existing market are extruded easily when being used by welding-free assembly equipment, so that the IC test support plates deform and the normal use of the IC test support plates is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a welding-free assembling device for an IC test carrier plate, which solves the problems that the prior art is inconvenient for operators to take up and assemble and the IC test carrier plate is deformed.
In order to achieve the purpose, the utility model provides the following technical scheme: IC test support plate is with exempting from welded equipment, including L type support frame, test seat and electric telescopic handle, the inside bottom of L type support frame is provided with the test seat, the inside top of L type support frame is provided with hydraulic lifting rod, and hydraulic lifting rod's output is provided with fixed framework, the inside both sides of fixed framework are provided with the slide rail, and the inside of slide rail is provided with the pressure joint piece, the dead slot has been seted up to the inside of pressure joint piece, and the inside suction mechanism that is used for fixing that is provided with of dead slot, first air outlet groove has been seted up to one side lateral wall of pressure joint piece, and the first recess has been seted up on the top in first air outlet groove, first fixed axle is installed through the bearing to the inside of first recess, the second air outlet groove has been seted up to the bottom in dead slot, and the second recess has been seted up to one side in second air outlet groove.
Preferably, an annular elastic plate is arranged at the top end inside the fixed frame body, the bottom end of the annular elastic plate is connected with the top end of the pressure connection block, and a plurality of springs are arranged inside the annular elastic plate.
Preferably, the air suction mechanism comprises an empty groove and an electric telescopic rod, the electric telescopic rod is arranged at the top end inside the empty groove, and a piston moving block matched with the inner wall of the empty groove is arranged at the output end of the electric telescopic rod.
Preferably, the outer wall of the first fixing shaft is provided with a first sealing plate matched with the first air outlet groove, and the outer wall of the first fixing shaft is sleeved with a first torsion spring connected with the inside of the first groove.
Preferably, a second fixing shaft is arranged inside the second groove through a bearing, a second sealing plate matched with the second air outlet groove is arranged on the outer wall of the second fixing shaft, a second torsion spring is sleeved on the outer wall of the second fixing shaft, and one end of the second torsion spring is connected with the inside of the second groove.
Preferably, a trapezoidal groove is formed in the bottom end of the pressure connection block below the second air outlet groove, and a plurality of through holes are formed in the bottom end of the pressure connection block below the trapezoidal groove.
Compared with the prior art, the utility model has the beneficial effects that:
1. by installing the electric telescopic rod, the piston moving block and the trapezoidal groove, the structure drives the piston moving block to move up and down in the hollow groove by starting the electric telescopic rod, so that air in the trapezoidal groove is conveniently pumped out, suction force is formed in the trapezoidal groove, the IC test support plate is conveniently sucked below the compression block, and the IC test support plate is conveniently and automatically fixed;
2. meanwhile, the device is provided with the annular elastic plate, the spring and the compression joint block, the compression joint block moves in the slide rail to extrude the annular elastic plate, so that the annular elastic plate and the spring are contracted, and the annular elastic plate and the spring both belong to elastic elements and drive the IC test support plate and the test seat to be fixed under the action of the elastic force of the annular elastic plate and the spring.
Drawings
FIG. 1 is a front sectional view of the present invention;
FIG. 2 is a schematic perspective view of the present invention;
FIG. 3 is an enlarged view of portion A of FIG. 1 according to the present invention;
FIG. 4 is an enlarged view of the portion B of FIG. 1 according to the present invention.
In the figure: 1. an L-shaped support frame; 2. a test seat; 3. a hydraulic lifting rod; 4. fixing the frame body; 5. a slide rail; 6. an annular elastic plate; 7. a spring; 8. a crimping block; 9. an empty groove; 10. an electric telescopic rod; 11. a piston moving block; 12. a first air outlet groove; 13. a first groove; 14. a first fixed shaft; 15. a first sealing plate; 16. a first torsion spring; 17. a second air outlet groove; 18. a second groove; 19. a second fixed shaft; 20. a second sealing plate; 21. a second torsion spring; 22. a trapezoidal groove; 23. and a through hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: the welding-free assembling equipment for the IC test carrier plate comprises an L-shaped support frame 1, a test seat 2 and an electric telescopic rod 10, wherein the test seat 2 is arranged at the bottom end inside the L-shaped support frame 1, a hydraulic lifting rod 3 is arranged at the top end inside the L-shaped support frame 1, and a fixing frame body 4 is arranged at the output end of the hydraulic lifting rod 3;
an annular elastic plate 6 is arranged at the top end inside the fixed frame 4, the bottom end of the annular elastic plate 6 is connected with the top end of a compression joint block 8, a plurality of springs 7 are arranged inside the annular elastic plate 6, and after the IC test carrier plate at the bottom end of the compression joint block 8 is contacted, the hydraulic lifting rod 3 drives the compression joint block 8 to extrude the IC test carrier plate, so that the IC test carrier plate is easily extruded when being assembled, the IC test carrier plate is easily deformed, and the normal use is influenced;
two sides of the inside of the fixed frame body 4 are provided with slide rails 5, a pressure joint block 8 is arranged inside the slide rails 5, a hollow groove 9 is formed inside the pressure joint block 8, and a suction mechanism for fixing is arranged inside the hollow groove 9;
the air suction mechanism comprises an empty groove 9 and an electric telescopic rod 10, the electric telescopic rod 10 is arranged at the top end inside the empty groove 9, a piston moving block 11 matched with the inner wall of the empty groove 9 is arranged at the output end of the electric telescopic rod 10, the electric telescopic rod 10 is started to drive the piston moving block 11 to move up and down in the empty groove 9, and then air in the trapezoidal groove 22 is conveniently drawn out, so that suction is formed in the trapezoidal groove 22, an IC test carrier plate is conveniently sucked into the position below the compression block 8, and the IC test carrier plate is conveniently and automatically fixed;
a first air outlet groove 12 is formed in the side wall of one side of the compression joint block 8, a first groove 13 is formed in the top end of the first air outlet groove 12, and a first fixed shaft 14 is mounted inside the first groove 13 through a bearing;
a first sealing plate 15 matched with the first air outlet groove 12 is arranged on the outer wall of the first fixing shaft 14, a first torsion spring 16 connected with the inside of the first groove 13 is sleeved on the outer wall of the first fixing shaft 14, when the first torsion spring is extruded downwards through the piston moving block 11, the electric telescopic rod 10 enables air in the hollow groove 9 to enter the first air outlet groove 12, the first sealing plate 15 overturns around the first fixing shaft 14, the air from the trapezoidal groove 22 is conveniently sucked into the first air outlet groove 12 and then discharged out of the compression joint block 8, and a second air outlet groove 17 is formed in the bottom end of the hollow groove 9;
a trapezoidal groove 22 is formed in the bottom end of the pressure connecting block 8 below the second air outlet groove 17, a plurality of through holes 23 are formed in the bottom end of the pressure connecting block 8 below the trapezoidal groove 22, the IC test carrier plate is fixed below the pressure connecting block 8 through the through holes 23, then the IC test carrier plate can be fixed and assembled without contact, and a second groove 18 is formed in one side of the second air outlet groove 17;
the inside of second recess 18 is provided with second fixed axle 19 through the bearing, and the outer wall of second fixed axle 19 be provided with second go out gas groove 17 assorted second closing plate 20, the outer wall cover of second fixed axle 19 is equipped with second torsional spring 21, and second torsional spring 21 one end is connected with the inside of second recess 18, through piston movable block 11 rebound, take place to overturn in dead slot 9 through suction second closing plate 20, thereby the air admission dead slot 9 of dovetail groove 22 department, the below of the IC test support plate of being convenient for and crimping piece 8 is fixed.
The working principle is as follows: when the welding-free assembling device for the IC test carrier is used, an operator firstly switches on an external power supply, then the IC test carrier is placed below the compression joint block 8, then the electric telescopic rod 10 is started to drive the piston moving block 11 to move upwards, so that air at the positions of the IC test carrier and the trapezoidal groove 22 at the compression joint block 8 is sucked into the second air outlet groove 17 through the through hole 23, the second sealing plate 20 turns upwards, the second torsion spring 21 contracts, then the operator starts the electric telescopic rod 10 to drive the piston moving block 11 to extrude downwards, the second sealing plate 20 seals and closes the position of the second air outlet groove 17 under the self elastic force of the second torsion spring 21, meanwhile, the first sealing plate 15 at the other side turns around the first fixed shaft 14, so that the first torsion spring 16 contracts, air is sucked into the first air outlet groove 12 from the trapezoidal groove 22 and then is discharged out of the compression joint block 8, the structure is convenient for rapidly positioning the IC test carrier plate;
then, the hydraulic lifting rod 3 is started to drive the IC test carrier plate to move towards the test seat 2, and the IC test carrier plate is extruded, the compression joint block 8 moves in the slide rail 5 to extrude the annular elastic plate 6, so that the annular elastic plate 6 and the spring 7 are contracted, and the annular elastic plate 6 and the spring 7 both belong to elastic elements and drive the IC test carrier plate to be fixed with the test seat 2 under the action of the elastic force of the annular elastic plate 6 and the spring 7.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the utility model can be made, and equivalents and modifications of some features of the utility model can be made without departing from the spirit and scope of the utility model.
Claims (6)
1. The utility model provides a IC test support plate is with exempting from welded equipment, includes L type support frame (1), test seat (2) and electric telescopic handle (10), its characterized in that: the testing device is characterized in that a testing seat (2) is arranged at the bottom end inside the L-shaped supporting frame (1), a hydraulic lifting rod (3) is arranged at the top end inside the L-shaped supporting frame (1), a fixing frame body (4) is arranged at the output end of the hydraulic lifting rod (3), slide rails (5) are arranged on two sides inside the fixing frame body (4), a compression block (8) is arranged inside the slide rails (5), a hollow groove (9) is formed inside the compression block (8), an air suction mechanism for fixing is arranged inside the hollow groove (9), a first air outlet groove (12) is formed in the side wall of one side of the compression block (8), a first groove (13) is formed in the top end of the first air outlet groove (12), a first fixing shaft (14) is arranged inside the first groove (13) through a bearing, a second air outlet groove (17) is formed in the bottom end of the hollow groove (9), and one side of the second air outlet groove (17) is provided with a second groove (18).
2. The IC test carrier plate solder-free assembly apparatus of claim 1, wherein: the top of the interior of the fixed frame body (4) is provided with an annular elastic plate (6), the bottom end of the annular elastic plate (6) is connected with the top end of the pressure connection block (8), and a plurality of springs (7) are arranged in the interior of the annular elastic plate (6).
3. The IC test carrier plate solder-free assembly apparatus of claim 1, wherein: the air suction mechanism comprises an empty groove (9) and an electric telescopic rod (10), the electric telescopic rod (10) is arranged at the top end inside the empty groove (9), and a piston moving block (11) matched with the inner wall of the empty groove (9) is arranged at the output end of the electric telescopic rod (10).
4. The IC test carrier plate solder-free assembly apparatus of claim 1, wherein: the outer wall of the first fixing shaft (14) is provided with a first sealing plate (15) matched with the first air outlet groove (12), and a first torsion spring (16) connected with the inside of the first groove (13) is sleeved on the outer wall of the first fixing shaft (14).
5. The IC test carrier plate solder-free assembly apparatus of claim 1, wherein: the inside of second recess (18) is provided with second fixed axle (19) through the bearing, and the outer wall of second fixed axle (19) is provided with and goes out gas groove (17) assorted second closing plate (20) with the second, the outer wall cover of second fixed axle (19) is equipped with second torsional spring (21), and second torsional spring (21) one end is connected with the inside of second recess (18).
6. The IC test carrier plate solder-free assembly apparatus of claim 1, wherein: trapezoidal groove (22) have been seted up to the bottom of second air outlet groove (17) below crimping piece (8), and a plurality of through-holes (23) have been seted up to the bottom of trapezoidal groove (22) below crimping piece (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122130488.8U CN215812951U (en) | 2021-09-06 | 2021-09-06 | IC test support plate is with exempting from equipment of welding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122130488.8U CN215812951U (en) | 2021-09-06 | 2021-09-06 | IC test support plate is with exempting from equipment of welding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215812951U true CN215812951U (en) | 2022-02-11 |
Family
ID=80156075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122130488.8U Expired - Fee Related CN215812951U (en) | 2021-09-06 | 2021-09-06 | IC test support plate is with exempting from equipment of welding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215812951U (en) |
-
2021
- 2021-09-06 CN CN202122130488.8U patent/CN215812951U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220211 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |