CN215799259U - High-temperature adhesive tape for printed circuit board - Google Patents
High-temperature adhesive tape for printed circuit board Download PDFInfo
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- CN215799259U CN215799259U CN202122310710.2U CN202122310710U CN215799259U CN 215799259 U CN215799259 U CN 215799259U CN 202122310710 U CN202122310710 U CN 202122310710U CN 215799259 U CN215799259 U CN 215799259U
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Abstract
The utility model relates to a high-temperature adhesive tape for a printed circuit board, which comprises a plurality of adhesive tape units which are sequentially connected, wherein each adhesive tape unit comprises a release film layer, a core layer and an acrylic adhesive layer which are stacked; the core layer comprises a plurality of high-temperature glue units, and the high-temperature glue units are arranged in an array; the high temperature glue unit includes high temperature adhesive layer and pressure sensitive adhesive layer, pressure sensitive adhesive layer locates a side surface of high temperature adhesive layer, locate from the type rete and be close to one side of high temperature adhesive layer, the ya keli glue film is located and is close to one side of pressure sensitive adhesive layer. The utility model can effectively improve the efficiency and the precision of the high-temperature glue adhesion.
Description
Technical Field
The utility model relates to the technical field of circuit board production, in particular to a high-temperature adhesive tape for a printed circuit board.
Background
In the production process of the circuit board, the high-temperature glue is mainly used for being attached to a specific area of the circuit board to prevent the area from being coated with tin during wave soldering. The mother board of current circuit board generally is formed by the concatenation of the same daughter board of a plurality of shapes, and high temperature is glued and is designed for the independent monolithic formula structure with daughter board assorted usually, when gluing high temperature to this type of circuit board, the operation personnel need glue the high temperature through manual and tear from the protection paper, then glue the high temperature and paste with daughter board counterpoint one by one, the inefficiency of pasting, and work load is big, and causes high temperature glue and circuit board edge not parallel and level easily, influences the welding effect.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a high-temperature adhesive tape for a printed circuit board, which is of a continuous structure, can be rolled into a roll shape, is convenient to store and place, can be pasted on a whole board, and effectively improves the pasting efficiency and precision.
A high-temperature adhesive tape for a printed circuit board comprises a plurality of adhesive tape units which are sequentially connected, wherein each adhesive tape unit comprises a release film layer, a core layer and an acrylic adhesive layer which are arranged in a laminated manner; the core layer comprises a plurality of high-temperature glue units, and the high-temperature glue units are arranged in an array; the high temperature glue unit includes high temperature adhesive layer and pressure sensitive adhesive layer, pressure sensitive adhesive layer locates a side surface of high temperature adhesive layer, locate from the type rete and be close to one side of high temperature adhesive layer, the ya keli glue film is located and is close to one side of pressure sensitive adhesive layer.
Further, have from type rete along the length direction's of sticky tape unit both sides and leave white district, ya keli glue film corresponds it is equipped with protruding edge to leave white district, protruding edge with offset from type rete.
Further, the height of the convex edge is matched with the thickness of the core layer.
Furthermore, a connecting part is arranged between two adjacent high-temperature adhesive units in the width direction of the adhesive tape unit, and two ends of the connecting part are respectively connected with the two high-temperature adhesive units.
Furthermore, a virtual line hole is formed between every two adjacent adhesive tape units.
Furthermore, the corner of the adhesive tape unit is provided with a positioning hole.
Further, the corner of the adhesive tape unit is a round corner.
Compared with the prior art, the utility model has the beneficial effects that: the adhesive tape is composed of continuous adhesive tape units, each adhesive tape unit is matched with the mother board of the circuit board in shape, the high-temperature adhesive units in the adhesive tape units correspond to the daughter circuit boards one by one, the acrylic adhesive layer is torn off during adhesive tape pasting, then the whole adhesive tape unit is pasted on the mother board in a contraposition mode, the high-temperature adhesive units can be pasted on the corresponding daughter circuit boards, the release film layer on the back face of the high-temperature adhesive is torn off at last, the operation is simple and convenient, and the pasting efficiency is effectively improved. The corner of the adhesive tape unit is provided with the positioning hole, so that the adhesive tape unit is convenient to align when being pasted, and the pasting precision is effectively improved. The both sides of ya keli glue film are equipped with protruding edge, protruding edge with offset from type rete, can guarantee the ya keli glue film, from the position relatively fixed of type rete and core layer, the rolling of being convenient for, and can avoid dust and foreign matter to get into the core layer from the clearance of both sides, guarantee the cleanness of high temperature glue unit.
Drawings
Fig. 1 is a schematic structural view of a high-temperature adhesive tape for a printed circuit board according to the present invention.
Fig. 2 is a schematic structural view of a tape unit of the high temperature tape for a printed circuit board according to the present invention.
Fig. 3 is a schematic cross-sectional view illustrating a tape unit of the high temperature tape for a printed circuit board according to the present invention.
Detailed Description
To facilitate an understanding of the utility model, the utility model will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
As shown in fig. 1 to 3, in a preferred embodiment, the high temperature adhesive tape for printed circuit boards of the present invention comprises a plurality of sequentially connected adhesive tape units 1, the adhesive tape units 1 match with the shape and size of the mother board of the circuit board, and the plurality of adhesive tape units 1 are connected end to end and can be rolled into a roll shape, so as to be convenient for placement and movement.
Each adhesive tape unit 1 includes a release film layer 11, a core layer 12, and an acrylic adhesive layer 13, which are stacked. The core layer 12 includes a plurality of high temperature glue units 121, and the plurality of high temperature glue units 121 are arranged in an array, and when the application is specific, each high temperature glue unit 121 corresponds to a sub-circuit board in shape and position.
The high temperature adhesive unit 121 includes a high temperature adhesive 1211 and a pressure sensitive adhesive layer 1212, the high temperature adhesive 1211 is made of high temperature resistant silica gel, the pressure sensitive adhesive layer 1212 is disposed on one side surface of the high temperature adhesive 1211, and the acrylic adhesive layer 13 is disposed on one side close to the pressure sensitive adhesive layer 1212, for protecting the high temperature adhesive unit 121 and ensuring the viscosity of the pressure sensitive adhesive layer 1212. The release film layer 11 is disposed on a side close to the high temperature adhesive layer 1211 for protecting the high temperature adhesive unit 121 and facilitating the whole board to move the high temperature adhesive unit 121 after tearing off the acrylic adhesive layer 13.
In this embodiment, the two sides of the release film layer 11 along the length direction of the tape unit 1 have the blank regions 111, the acrylic adhesive layer 13 is provided with the convex edge 131 corresponding to the blank regions 111, and the height of the convex edge 131 is matched with the thickness of the core layer 12, so that the convex edge 131 can abut against the surface of the release film layer 11. This structure can guarantee ya keli glue film 13, from type rete 11 and core layer 12's position relatively fixed, the rolling of being convenient for, and can avoid dust and foreign matter to get into core layer 12 from the clearance of both sides, guarantees the cleanness of high temperature glue unit 121, and then improves welded quality.
A connecting part is arranged between two adjacent high-temperature adhesive units 121 in the width direction of the adhesive tape unit 1, and two ends of the connecting part are respectively connected with the two high-temperature adhesive units 121. Connecting portion can be connected a plurality of high temperature glue units 121 of same row as a whole to guarantee that the position relatively fixed between the high temperature glue unit 121, avoid the high temperature glue unit 121 when the rolling or receive exogenic action off normal.
In order to facilitate the separation of the adjacent adhesive tape units 1, a virtual line hole 14 is formed between the two adjacent adhesive tape units 1, during the specific implementation, the virtual line hole 14 can be formed in the release film layer 11, and it can be understood that the acrylic adhesive layer 13 has a cutting opening at the connecting position of the two adjacent adhesive tape units 1, so that the acrylic adhesive layers 13 of the adjacent adhesive tape units 1 are independent of each other. In this embodiment, the corners of the adhesive tape units 1 are rounded, which further facilitates the separation of the adjacent adhesive tape units 1.
In this embodiment, the corner of the tape unit 1 is provided with the positioning hole 15, and in specific implementation, a mark or a positioning column can be arranged at a position of the mother board corresponding to the positioning hole 15, so that alignment is convenient in pasting, and pasting precision is effectively improved.
In the description of the present invention, it is to be understood that terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, which indicate orientations or positional relationships, are used based on the orientations or positional relationships shown in the drawings only for the convenience of describing the present invention and for the simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
While the utility model has been described in conjunction with the specific embodiments set forth above, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art in light of the foregoing description. Accordingly, it is intended to embrace all such alternatives, modifications, and variations that fall within the spirit and scope of the appended claims.
Claims (7)
1. The high-temperature adhesive tape for the printed circuit board is characterized by comprising a plurality of adhesive tape units which are sequentially connected, wherein each adhesive tape unit comprises a release film layer, a core layer and an acrylic adhesive layer which are stacked; the core layer comprises a plurality of high-temperature glue units, and the high-temperature glue units are arranged in an array; the high temperature glue unit includes high temperature adhesive layer and pressure sensitive adhesive layer, pressure sensitive adhesive layer locates a side surface of high temperature adhesive layer, locate from the type rete and be close to one side of high temperature adhesive layer, the ya keli glue film is located and is close to one side of pressure sensitive adhesive layer.
2. The high-temperature adhesive tape for printed circuit boards according to claim 1, wherein the release film layer has a blank region at two sides along the length direction of the adhesive tape unit, the acrylic adhesive layer has a protruding edge corresponding to the blank region, and the protruding edge abuts against the release film layer.
3. A high temperature adhesive tape for printed circuit boards according to claim 2 wherein the height of the ledge matches the thickness of the core layer.
4. A high-temperature adhesive tape for a printed circuit board according to claim 1, wherein a connecting portion is provided between two adjacent high-temperature adhesive units in a width direction of the adhesive tape unit, and both ends of the connecting portion are connected to the two high-temperature adhesive units, respectively.
5. A high temperature adhesive tape for printed circuit boards according to claim 1, wherein a dotted hole is provided between adjacent two of said tape units.
6. A high-temperature adhesive tape for printed circuit boards according to claim 1, wherein the corner portions of the tape unit are provided with positioning holes.
7. A high temperature adhesive tape for printed circuit boards according to claim 1, wherein the corners of the tape unit are rounded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122310710.2U CN215799259U (en) | 2021-09-24 | 2021-09-24 | High-temperature adhesive tape for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122310710.2U CN215799259U (en) | 2021-09-24 | 2021-09-24 | High-temperature adhesive tape for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215799259U true CN215799259U (en) | 2022-02-11 |
Family
ID=80165820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122310710.2U Active CN215799259U (en) | 2021-09-24 | 2021-09-24 | High-temperature adhesive tape for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215799259U (en) |
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2021
- 2021-09-24 CN CN202122310710.2U patent/CN215799259U/en active Active
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