CN215795212U - Semiconductor chip storage device - Google Patents

Abstract

The utility model discloses a semiconductor chip storage device, and relates to the technical field of semiconductor storage. The novel box comprises a bottom plate, four upright posts are arranged at four corners of the upper surface of the bottom plate, an upper cover is arranged at the top of the bottom plate, a plurality of layers of box bodies are arranged between the bottom plate and the upper cover, transverse partition plates and vertical partition plates are arranged inside the box bodies, the transverse partition plates and the vertical partition plates are staggered to form a plurality of placing grooves, and silica gel base plates are arranged above the box bodies. The utility model utilizes the upright post and the screw rod to match the upper cover and the locking nut, and then seals the box body, the upper cover, the box body and the bottom plate through the groove and the convex body on the box body, thereby preventing dust and water vapor from entering the box body and ensuring that the device can be locked and sealed.

Description

Semiconductor chip storage device

Technical Field

The utility model belongs to the technical field of rubber production and processing, and particularly relates to a semiconductor chip storage device.

Background

Semiconductor chip is a semiconductor device which is made by etching and wiring on a semiconductor wafer and can realize a certain function, the chip is a way of miniaturizing a circuit (mainly comprising semiconductor equipment and also comprising passive components) in electronics, and is often manufactured on the surface of a semiconductor wafer.

The application number is CN 201921324918.6's chinese patent, a semiconductor chip places box is proposed, including placing the box main part, sealed lid and seal box, it includes one side articulated upper cover and lower box to place the box main part, the spacing groove has been seted up in the upper cover, the embedding of spacing inslot is connected with magnet, the sealed lid of spacing inslot adsorption connection, set up a plurality of standing grooves that correspond with the spacing groove in the lower box, it has the seal box to peg graft in the standing groove, seal box and sealed lid correspond, semiconductor chip has been placed in the seal box, the device adopts and sets up rubber cushion etc. in the chip inslot, come rocking of less chip, and use iron sheet and magnet to be used for making the absorption of spacing groove and sealed lid, because the chip size is unsettled, the chip groove that its set for can appear nonconformity with the chip, secondly the use of magnet can lead to the fact the influence to some magnetic induction formula chips, make the chip damage even.

An effective solution to the problems in the related art has not been proposed yet.

SUMMERY OF THE UTILITY MODEL

In view of the problems in the related art, the present invention provides a semiconductor chip storage device to overcome the above-mentioned problems in the related art.

In order to solve the technical problems, the utility model is realized by the following technical scheme:

the utility model relates to a semiconductor chip storage device which comprises a bottom plate, wherein four upright posts are arranged at four corners of the upper surface of the bottom plate, an upper cover is arranged at the top of the bottom plate, a plurality of layers of box bodies are arranged between the bottom plate and the upper cover, transverse partition plates and vertical partition plates are arranged in the box bodies, the transverse partition plates and the vertical partition plates are staggered to form a plurality of placing grooves, and silica gel base plates are arranged above the box bodies.

Furthermore, screw holes are formed in four corners of the upper cover, screw rods are arranged at the tops of the stand columns and penetrate through the screw holes, locking nuts are arranged above the screw rods and located inside the screw holes, and a handle is arranged in the middle of the upper surface of the upper cover.

Further, the box body is provided with the hole all around, the stand passes the hole, the box body with bottom plate week side upper surface week side is provided with the convex body, the box body with upper cover lower surface week side is provided with the recess, the convex body with the recess cooperation sets up.

Further, the transverse partition plates and the vertical partition plates are arranged in a staggered mode, the transverse partition plates and the vertical partition plates are lower than the interior of the box body, sponge blocks are arranged inside the placing grooves, and cross-shaped cracks are formed in the middle of the sponge blocks.

Further, silica gel backing plate bottom is provided with a plurality of block rubber, the block rubber corresponds the standing groove, the silica gel backing plate is located inside the box body top.

The utility model has the following beneficial effects:

when the semiconductor chip storage device is used, a user firstly unscrews the locking nut above the upper cover from the screw rod, and respectively takes out the upper cover and the box body, further takes off the silica gel base plate above the box body, inserts the semiconductor chip to be stored into the sponge block in the placing groove on the box body, wherein the cross-shaped crack in the middle of the sponge block can ensure that the chip can not slide and rock when being stored in the sponge block, after the chip is further placed perfectly, the rubber block at the bottom of the silica gel base plate is aligned with the placing groove in the box body, after the silica gel base plate is completely matched with the box body, the holes on the peripheral side of the box body are aligned with the upright posts, the box body is stacked above the bottom plate, the convex body and the groove are completely matched during placement, the box body is prevented from tilting, the device is unstable, further, the screw holes on the peripheral side of the upper cover are aligned with the screw rod, and the locking nut is matched with the screw rod to lock the upper cover, and finishing the storage of the chip. The upright posts and the screw rods are matched with the upper cover and the locking nuts, and the box body, the upper cover, the box body and the bottom plate are sealed through the grooves and the protrusions on the box body, so that dust and water vapor are prevented from entering the box body, and the device can be locked and sealed; utilize the inside sponge piece that adopts of standing groove to the cross crack that sets up in the sponge piece is used for placing the chip, makes the chip be the inside relatively stable of cross crack, can not take place to rock, and sponge piece and cross crack length are enough big, can place the different chip of multiple size.

Of course, it is not necessary for any product in which the utility model is practiced to achieve all of the above-described advantages at the same time.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the description below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive work.

FIG. 1 is an overall perspective view of the present invention;

FIG. 2 is one of the overall exploded perspective views of the present invention;

fig. 3 is a second perspective view of the overall explosion of the present invention.

In the drawings, the components represented by the respective reference numerals are listed below:

1. a base plate; 2. a column; 201. a screw; 202. locking the nut; 3. an upper cover; 301. a screw hole; 302. a handle; 4. a box body; 401. a hole; 402. a convex body; 403. a groove; 5. a diaphragm plate; 6. a vertical partition plate; 7. a placement groove; 701. a sponge block; 702. cross crack; 8. a silica gel pad; 801. a rubber block.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by a person skilled in the art without any inventive work based on the embodiments of the present invention belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "open", "upper", "lower", "top", "middle", "inner", and the like, indicate positional or orientational relationships and are used merely for convenience in describing the utility model and for simplicity in description, and do not indicate or imply that the referenced components or elements must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the utility model.

Referring to fig. 1-3, the present invention is a semiconductor chip storage device, including a bottom plate 1, four vertical columns 2 are disposed at four corners of the upper surface of the bottom plate 1, an upper cover 3 is disposed on the top of the bottom plate 1, a plurality of layers of box bodies 4 are disposed between the bottom plate 1 and the upper cover 3, a transverse partition plate 5 and a vertical partition plate 6 are disposed inside the box bodies 4, the transverse partition plate 5 and the vertical partition plate 6 are staggered to form a plurality of placing grooves 7, and a silica gel pad 8 is disposed above the box bodies 4.

In one embodiment, for the upper cover 3, screw holes 301 are formed at four corners of the upper cover 3, a screw 201 is arranged at the top of the upright post 2, the screw 201 penetrates through the screw holes 301, a locking nut 202 is arranged above the screw 201, the locking nut 202 is located inside the screw hole 301, a handle 302 is arranged in the middle of the upper surface of the upper cover 3, and the upright post 2 and the screw 201 are matched with the upper cover 3 and the locking nut 202, so that the device can be locked and sealed.

In an embodiment, for the above-mentioned box body 4, the box body 4 is provided with holes 401 all around, the pillar 2 passes the hole 401, the box body 4 with 1 week side upper surface week side of bottom plate is provided with convex body 402, the box body 4 with 3 lower surface week sides of upper cover are provided with recess 403, convex body 402 with recess 403 cooperation setting utilizes 4 week side hole 401 of box body to cooperate pillar 2, fixes box body 4, recycles recess 403 and convex body 402 and makes box body 4 and upper cover 3 and box body 4 and bottom plate 1, seals, prevents that dust and steam from entering into in the box body 4.

In an embodiment, for the above transverse partition plate 5, the transverse partition plate 5 and the vertical partition plate 6 are arranged in a staggered manner, the transverse partition plate 5 and the vertical partition plate 6 are lower than the inside of the box body 4, the inside of the placing groove 7 is provided with the sponge block 701, the middle part of the sponge block 701 is provided with the cross-shaped gap 702, the cross-shaped gap 702 between the sponge block 701 and the sponge block 701 arranged in the placing groove 7 is used for placing chips, so that the chips are relatively stable inside the cross-shaped gap 702 and cannot shake, and the sponge block 701 and the cross-shaped gap 702 are large enough in length to place various chips with different sizes.

In one embodiment, to above-mentioned silica gel backing plate 8, silica gel backing plate 8 bottom is provided with a plurality of rubber piece 801, rubber piece 801 corresponds standing groove 7, silica gel backing plate 8 is located inside 4 tops of box body, utilize silica gel backing plate 8 to cover box body 4 and standing groove 7 with rubber piece 801, make the chip all the time in sponge piece 701 when storing to silica gel backing plate 8 has fine dampproofing effect.

To sum up, with the above technical solution of the present invention, when using the semiconductor chip storage device, a user first unscrews the lock nut 202 above the upper cover 3 from the screw 201, and respectively takes out the upper cover 3 and the case 4, further takes off the silicone pad 8 above the case 4, inserts the semiconductor chip to be stored into the sponge block 701 in the placement groove 7 on the case 4, wherein the cross-shaped slit 702 in the middle of the sponge block 701 enables the chip to be stored in the sponge block 701 without sliding or shaking, further, after the chip is placed perfectly, aligns the rubber block 801 at the bottom of the silicone pad 8 with the placement groove 7 in the case 4, aligns the silicone pad 8 with the case 4 completely, aligns the holes 401 on the peripheral side of the case 4 with the upright posts 2, so that the case 4 is stacked above the bottom plate 1, and when placing, the convex bodies 402 and the concave grooves 403 should be completely aligned, the box body 4 is prevented from tilting, so that the device is unstable, the screw holes 301 on the peripheral side of the upper cover 3 are aligned to the screw rods 201, the locking nuts 202 are matched with the screw rods 201, the upper cover 3 is locked, and the storage of chips is completed.

Through above-mentioned technical scheme, 1, utilize stand and screw rod cooperation upper cover and lock nut, recess and convex body on the rethread box body make box body and upper cover and box body and bottom plate, seal, prevent that dust and steam from entering into the box body, make the device can be locked tightly and sealed.

2. Utilize the inside sponge piece that adopts of standing groove to the cross crack that sets up in the sponge piece is used for placing the chip, makes the chip be the inside relatively stable of cross crack, can not take place to rock, and sponge piece and cross crack length are enough big, can place the different chip of multiple size.

In the description of the present specification, reference to the description of "one embodiment," "an example," "a specific example" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the utility model disclosed above are intended only to help illustrate the utility model. The preferred embodiments are not intended to be exhaustive or to limit the utility model to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the utility model and its practical application, to thereby enable others skilled in the art to best understand and utilize the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims (5)

1. A semiconductor chip storage device comprising a base plate (1), characterized in that: the novel multifunctional box is characterized in that four stand columns (2) are arranged at four corners of the upper surface of the base plate (1), an upper cover (3) is arranged at the top of the base plate (1), a plurality of layers of box bodies (4) are arranged between the base plate (1) and the upper cover (3), transverse partition plates (5) and vertical partition plates (6) are arranged inside the box bodies (4), the transverse partition plates (5) and the vertical partition plates (6) are staggered to form a plurality of placing grooves (7), and silica gel base plates (8) are arranged above the box bodies (4).

2. The semiconductor chip storage device according to claim 1, wherein screw holes (301) are formed in four corners of the upper cover (3), a screw rod (201) is arranged at the top of the upright post (2), the screw rod (201) penetrates through the screw holes (301), a locking nut (202) is arranged above the screw rod (201), the locking nut (202) is located inside the screw holes (301), and a handle (302) is arranged in the middle of the upper surface of the upper cover (3).

3. The semiconductor chip storage device according to claim 1, wherein the case (4) is provided with holes (401) around the circumference, the pillars (2) pass through the holes (401), the case (4) and the bottom plate (1) are provided with protrusions (402) around the upper surface, the case (4) and the top cover (3) are provided with grooves (403) around the lower surface, and the protrusions (402) are matched with the grooves (403).

4. The semiconductor chip storage device according to claim 1, wherein the transverse partition plates (5) and the vertical partition plates (6) are arranged in a staggered manner, the transverse partition plates (5) and the vertical partition plates (6) are lower than the interior of the box body (4), a sponge block (701) is arranged in the placing groove (7), and a cross-shaped crack (702) is arranged in the middle of the sponge block (701).

5. The semiconductor chip storage device according to claim 1, wherein a plurality of rubber blocks (801) are arranged at the bottom of the silicone pad (8), the rubber blocks (801) correspond to the placing grooves (7), and the silicone pad (8) is located inside the box body (4) above.

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