CN215791295U - Mould structure for semiconductor plastic package - Google Patents
Mould structure for semiconductor plastic package Download PDFInfo
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- CN215791295U CN215791295U CN202122040012.5U CN202122040012U CN215791295U CN 215791295 U CN215791295 U CN 215791295U CN 202122040012 U CN202122040012 U CN 202122040012U CN 215791295 U CN215791295 U CN 215791295U
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- mold
- substrate
- plastic package
- lower die
- side push
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Abstract
The utility model relates to a mold structure for semiconductor plastic package, comprising: the upper die is internally provided with an upper die cavity, and the upper die is provided with a glue injection port communicated with the upper die cavity; the lower die is matched with the upper die, a lower die cavity is arranged on the lower die, and a positioning needle is arranged on the lower die; the base plate is arranged in the lower die cavity, a positioning hole is formed in the base plate corresponding to the positioning needle, and the size of the positioning hole is smaller than that of the positioning needle; the side push pins are arranged on the upper die and face the lower die, and the side push pins are arranged on one side, far away from the glue injection port, of the substrate; and the concave structure is arranged on the lower die and corresponds to the side push needle. When the mold is closed, the side push pins are contacted with the side part of the substrate to push the substrate towards the direction of the glue injection port, so that the generation of gaps is reduced, the phenomenon of frame glue overflow is avoided, and the quality of plastic package is ensured.
Description
Technical Field
The utility model relates to the technical field of semiconductor packaging, in particular to a mold structure for semiconductor plastic packaging.
Background
The base plate hole size that sets up on current mould will be greater than the pilot pin of bed die for the pilot pin has certain activity space, and when the mould compound die, the unsteady of base plate appears easily, makes the clearance fit appear in one side and the mould inner wall that the base plate is being close to the injecting glue mouth, thereby produces the excessive glue of base plate frame easily, leads to follow-up operation difficulty and causes the risk of bad material.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the defects of the prior art, provides a die structure for semiconductor plastic package, and solves the problems that the prior die is not firm in substrate positioning due to the fact that a positioning hole has a certain moving space in a positioning pin, the substrate is easy to float to form a gap, and then the frame glue overflow phenomenon is generated, so that the follow-up operation is difficult and the material is damaged.
The technical scheme for realizing the purpose is as follows:
the utility model provides a mold structure for semiconductor plastic package, which comprises:
the upper die is internally provided with an upper die cavity, and the upper die is provided with a glue injection port communicated with the upper die cavity;
the lower die is matched with the upper die, a lower die cavity is arranged on the lower die, and a positioning needle is arranged on the lower die;
the base plate is arranged in the lower die cavity, a positioning hole is formed in the base plate corresponding to the positioning needle, and the size of the positioning hole is smaller than that of the positioning needle;
the side push pins are arranged on the upper die and face the lower die, and the side push pins are arranged on one side, far away from the glue injection port, of the substrate; and
and the concave structure is arranged on the lower die and corresponds to the side push needle.
The side push pins are arranged on the upper die, and when the die is closed, the side push pins are contacted with the side part of the substrate to push the substrate towards the glue injection port, so that the generation of gaps is reduced, the frame glue overflow phenomenon is avoided, the plastic package quality and the product quality are ensured, and the problems of difficult follow-up operation and material damage are avoided.
The mold structure for semiconductor plastic package is further improved in that the side push pin is in a conical shape, and the size of the side push pin gradually decreases from the top to the bottom.
The mold structure for semiconductor plastic package is further improved in that the side push pins are arranged on the upper mold at intervals.
The structure of the mold for semiconductor plastic package is further improved in that when the lower mold and the upper mold are closed, the side push pins can be connected with the side part of the substrate and push the substrate to move towards the side close to the glue injection port.
The mold structure for semiconductor plastic package is further improved in that the upper mold is provided with an exhaust groove which is arranged at the side part of the upper mold cavity;
the side push pin is arranged in the exhaust groove.
The mold structure for semiconductor plastic package is further improved in that a plurality of exhaust grooves are arranged at intervals.
The utility model further improves the die structure for semiconductor plastic package, and a part of the top of the substrate protrudes out of the top of the lower die.
The utility model further improves the die structure for semiconductor plastic package, wherein the concave structure is a strip-shaped groove and is arranged at the bottom of the lower die cavity
Drawings
Fig. 1 is a schematic perspective view of a mold structure for plastic packaging of semiconductors according to the present invention in an unmolded state.
Fig. 2 is a cross-sectional view of the mold structure for molding a semiconductor of the present invention in a clamped state.
Fig. 3 is a schematic perspective view of the upper mold cavity of the upper mold of the mold structure for semiconductor plastic package according to the present invention.
Fig. 4 is a schematic perspective view of a lower mold in the mold structure for plastic packaging of semiconductors according to the present invention.
Detailed Description
The utility model is further described with reference to the following figures and specific examples.
Referring to fig. 1, the utility model provides a mold structure for semiconductor plastic packaging, which is used in a semiconductor plastic packaging workshop, and changes the floating phenomenon of a substrate subjected to external force in the mold closing process, when the mold is closed, the substrate is pushed towards the direction of a glue injection port through a side push pin, and the side push pin pushes and extrudes the substrate, so that the substrate is not floated, the substrate can be attached to the side wall of the mold after the mold is closed, a gap is avoided, and the glue overflow phenomenon can be avoided. The following describes a mold structure for plastic packaging of semiconductors according to the present invention with reference to the accompanying drawings.
Referring to fig. 1, a schematic perspective view of a mold structure for plastic packaging of semiconductors of the present invention in an un-mold state is shown. Referring to fig. 2, a cross-sectional view of the mold structure for molding semiconductor plastic of the present invention in a clamped state is shown. The structure of the mold for molding a semiconductor of the present invention will be described with reference to fig. 1 and 2.
As shown in fig. 1 and 2, the mold structure for semiconductor plastic package of the present invention includes an upper mold 21, a lower mold 22, a substrate 23, a side push pin 24, and a concave structure 25, and as shown in fig. 3, an upper mold cavity 211 is formed inside the upper mold 21, a plastic injection port 212 is formed on the upper mold 21 and is communicated with the upper mold cavity 211, the plastic injection port 212 is formed on the top of the upper mold cavity 211, a plastic injection channel is formed on the upper mold 21 and is communicated with the plastic injection port 212, and a plastic package material is injected into the upper mold cavity 211 through the plastic injection channel and the plastic injection port 212 for plastic package. Referring to fig. 4, the lower mold 22 is adapted to the upper mold 21, a lower mold cavity 221 is provided on the lower mold 22, a positioning pin 222 is provided on the lower mold 22, and the positioning pin 222 is provided at the bottom of the lower mold cavity 221. The lower mold cavity 221 and the upper mold cavity 211 can be butted to form a space for accommodating the substrate 23, and plastic package materials are injected into the space through the glue injection port 212, so that plastic package of products placed on the substrate 23 is realized. The substrate 23 is provided with positioning holes corresponding to the positioning pins 222, the substrate 23 is placed in the lower mold cavity 221, the positioning holes are inserted into the corresponding positioning pins 222, and the size of the positioning holes is smaller than that of the positioning pins 222. The side push pins 24 are disposed on the upper mold 21 and toward the lower mold 22, and the side push pins 24 are disposed on a side of the substrate 23 away from the glue injection port 212. A recessed structure 25 is provided on the lower mold 22 and is provided corresponding to the side push pins 24, and the recessed structure 25 is used for accommodating the end portions of the side push pins 24 when the upper mold 21 and the lower mold 22 are closed.
The upper mold 21 and the lower mold 22 can be butted and fixed to realize mold clamping, the mold clamping pressure is high, usually tens of tons, after mold clamping, the substrate 23 is limited in the mold, and then a plastic injection material is injected into the mold through the injection port 212 to perform plastic injection. In the process of die assembly, the side push pins 24 are in contact with the side portion of the substrate 23, so that the side push pins 24 can limit the substrate 23, the lateral movement of the substrate 23 is limited, the other side of the substrate 23 can be attached to the side wall corresponding to the die, a gap is prevented from being generated on one side of the substrate 23 corresponding to the glue injection port 212, and the occurrence of glue overflow is avoided.
In one embodiment of the present invention, as shown in fig. 3, the side push pins 24 have a tapered shape, and the size of the side push pins 24 is gradually reduced from the top to the bottom. When the mold is closed, the bottom of the side push pin 24 is small in size, the side push pin is close to the frame of the substrate 23, the side push pin may not touch the frame of the substrate 23, the substrate 23 moves towards the upper mold 21 along with the movement of the lower mold 22 as shown in fig. 2, the frame of the substrate 23 gradually moves upwards, the frame of the substrate 23 is in contact with the part with the larger size on the side push pin 24, and the side push pin 24 applies a lateral push force to the substrate 23 and pushes the substrate 23 towards the other side, so that the substrate 23 moves towards the direction close to the glue injection port 212.
Preferably, the side push pin 24 is conical.
In one embodiment of the present invention, a plurality of side push pins 24 are provided on the upper mold 21 at intervals. The side push pins 24 are arranged on one side of the upper cavity 211 of the upper mold 21 far away from the glue injection port 212, and the side push pins 24 are arranged at intervals along the side part of the upper cavity 211.
The concave structure 25 is a strip-shaped groove and is disposed at the bottom of the lower mold cavity 221, the notch of the strip-shaped groove is disposed upward, and the strip-shaped groove is disposed corresponding to the position of the side push pin 24 and is used for accommodating the end of the side push pin 24.
In an embodiment of the present invention, when the upper mold 21 and the lower mold 22 are clamped, the side push pins 24 may contact the side portion of the substrate 23 and push the substrate 23 to move toward the side close to the glue injection opening 212. After the mold is closed, the side portion of the substrate 23 close to the glue injection port 212 is made to closely contact the side wall of the mold, and the occurrence of a gap is avoided.
In one embodiment of the present invention, as shown in fig. 3, the upper mold 21 is provided with a vent groove 213, the vent groove 213 is provided at a side portion of the upper cavity 211, and the vent groove 213 is communicated with the upper cavity 211; the side push pin 24 is disposed in the air exhaust groove 213.
The side push pins 24 are arranged in the exhaust grooves 213, so that the plastic package process can be prevented from being influenced, and the exhaust function of the exhaust grooves 213 cannot be influenced.
Further, the exhaust grooves 213 are plural and spaced apart. Preferably, the exhaust groove 213 is a strip-shaped groove with a U-shaped cross section.
Preferably, the side push pins 24 are disposed at the connection position of the exhaust groove 213 and the upper mold cavity 211, and the side push pins 24 are disposed near the side portion of the upper mold cavity 211, so that when the mold is closed, the side push pins 24 can be ensured to contact with the frame of the substrate 23, and further apply a side push force to the substrate 23 to push the substrate toward the glue injection opening.
In one embodiment of the present invention, as shown in fig. 1, the top of the substrate 23 has a portion protruding out of the top of the lower mold 22, and the protruding portion protrudes into the upper cavity of the upper mold 21.
Preferably, the upper mold 21 and the lower mold 22 are both rectangular parallelepiped structures.
The mold structure for semiconductor plastic package is mainly used for solving the problem of positioning floating of the substrate, if the substrate floats during mold closing, a gap is generated between a frame of the substrate and the side wall of the mold at a glue injection port, glue overflowing occurs at the gap and is combined on the frame of the substrate, the width of the substrate is increased, subsequent processes of the substrate are further influenced, and product damage and rear-end operation difficulty are caused. The side push pins are arranged in the exhaust grooves on the side part of the upper die, and are used for abutting against the side part of the substrate, so that the substrate is not floated, and the uniform pressure distribution of the glue injection and die assembly is ensured. The concave structure on the upper die can protect the side push pins, and the side push pins are prevented from being damaged in the die assembly process.
While the present invention has been described in detail and with reference to the embodiments thereof as illustrated in the accompanying drawings, it will be apparent to one skilled in the art that various changes and modifications can be made therein. Therefore, certain details of the embodiments are not to be interpreted as limiting, and the scope of the utility model is to be determined by the appended claims.
Claims (8)
1. A mold structure for plastic package of semiconductors is characterized by comprising:
the upper die is internally provided with an upper die cavity, and the upper die is provided with a glue injection port communicated with the upper die cavity;
the lower die is matched with the upper die, a lower die cavity is arranged on the lower die, and a positioning needle is arranged on the lower die;
the base plate is arranged in the lower die cavity, a positioning hole is formed in the base plate corresponding to the positioning needle, and the size of the positioning hole is larger than that of the positioning needle;
the side push pins are arranged on the upper die and face the lower die, and the side push pins are arranged on one side, far away from the glue injection port, of the substrate; and
and the concave structure is arranged on the lower die and corresponds to the side push needle.
2. A mold structure for plastic package of semiconductor according to claim 1, wherein said side-push pins are tapered and gradually decrease in size from top to bottom.
3. A mold structure for plastic package of semiconductor according to claim 1, wherein a plurality of said side-push pins are provided at intervals on said upper mold.
4. A mold structure for plastic package of semiconductor according to claim 1, wherein said side push pins are adapted to contact a side portion of said substrate and push said substrate to move toward a side close to said gate when said lower mold and said upper mold are closed.
5. A mold structure for plastic package of semiconductor according to claim 1, wherein said upper mold is provided with a venting groove, said venting groove being provided at a side portion of said upper mold cavity;
the side push pin is arranged in the exhaust groove.
6. A mold structure for plastic package of semiconductor according to claim 5, wherein said plurality of venting grooves are provided at intervals.
7. A mold structure for plastic package of semiconductor as claimed in claim 1, wherein a portion of the top of said substrate protrudes out of the top of said bottom mold.
8. A mold structure for plastic package of semiconductor according to claim 1, wherein said recessed structure is a strip-shaped groove formed in the bottom of said lower cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122040012.5U CN215791295U (en) | 2021-08-26 | 2021-08-26 | Mould structure for semiconductor plastic package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122040012.5U CN215791295U (en) | 2021-08-26 | 2021-08-26 | Mould structure for semiconductor plastic package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215791295U true CN215791295U (en) | 2022-02-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122040012.5U Active CN215791295U (en) | 2021-08-26 | 2021-08-26 | Mould structure for semiconductor plastic package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215791295U (en) |
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2021
- 2021-08-26 CN CN202122040012.5U patent/CN215791295U/en active Active
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