CN215771075U - Chip jointing device for chip processing - Google Patents
Chip jointing device for chip processing Download PDFInfo
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- CN215771075U CN215771075U CN202121890603.5U CN202121890603U CN215771075U CN 215771075 U CN215771075 U CN 215771075U CN 202121890603 U CN202121890603 U CN 202121890603U CN 215771075 U CN215771075 U CN 215771075U
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- guide rail
- fixed
- hydraulic rod
- workbench
- sliding block
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Abstract
The utility model discloses a chip jointing device for chip processing, which comprises a fixing plate, wherein a first hydraulic rod is arranged at the upper end of the fixing plate, and a workbench is arranged at the upper end of the first hydraulic rod; a sliding groove is formed in the workbench, a limiting hole is formed in the outer side of the sliding groove, a first sliding block is arranged at the upper end of the workbench, a first connecting plate is arranged at the upper end of the first sliding block, and a supporting plate is arranged at the upper end of the first connecting plate; the utility model discloses a novel guide rail, including backup pad, backup pad lower extreme, No. two sliders are provided with No. two, No. two slider lower extremes are provided with No. two guide rails, No. two guide rail lower extremes are provided with No. three sliders. Has the advantages that: the device can be fixed by arranging a first hydraulic rod; the height of the jointing device can be adjusted by arranging a second hydraulic rod; through being provided with the sliding tray, can adjust a connecting plate position, raise the efficiency.
Description
Technical Field
The utility model relates to the field of chip bonding, in particular to a chip bonding device for chip processing.
Background
If the central processing unit CPU is compared to the heart of the entire computer system, the chipset on the motherboard is the torso of the entire body. For the motherboard, the chipset almost determines the function of the motherboard, thereby affecting the performance of the whole computer system, and the chipset is the soul of the motherboard.
The height of the existing chip jointing device for chip processing cannot be adjusted, the device cannot be fixed well, and the jointing efficiency is low.
SUMMERY OF THE UTILITY MODEL
The present invention provides a chip bonding apparatus for chip processing, which can effectively solve the problems of the prior art proposed in the background art.
In order to achieve the purpose, the utility model provides the following technical scheme: a chip jointing device for chip processing comprises a fixing plate, wherein a first hydraulic rod is arranged at the upper end of the fixing plate, and a workbench is arranged at the upper end of the first hydraulic rod; a sliding groove is formed in the workbench, a limiting hole is formed in the outer side of the sliding groove, a first sliding block is arranged at the upper end of the workbench, a first connecting plate is arranged at the upper end of the first sliding block, and a first supporting plate is arranged at the upper end of the first connecting plate; the lower end of the first support plate is provided with a first guide rail, the lower end of the first guide rail is provided with a second sliding block, the lower end of the second sliding block is provided with a second guide rail, and the lower end of the second guide rail is provided with a third sliding block; a second hydraulic rod is arranged at the lower end of the third sliding block, a second supporting plate is arranged at the lower end of the second hydraulic rod, a suction nozzle is arranged at the lower end of the second supporting plate, a soldering tin head is arranged outside the suction nozzle, and a cold air blast lamp is arranged outside the suction nozzle; the workbench is characterized in that a fixed table is arranged at the upper end of the workbench, and a fixed frame is arranged at the upper end of the fixed table.
Preferably, the fixed plate is welded with the first hydraulic rod, and the first hydraulic rod is welded with the workbench.
Preferably, the sliding groove integrated into one piece in the workstation, spacing hole integrated into one piece in the workstation, the workstation with a slider sliding connection, a slider with a connecting plate passes through the bolt fastening, a connecting plate with a backup pad passes through the bolt fastening.
Preferably, the first guide rail and the first support plate are fixed through bolts, the first guide rail and the second slide block are connected in a sliding mode and fixed through bolts, the second slide block and the second guide rail are fixed through bolts, and the third slide block and the second guide rail are connected in a sliding mode and fixed through bolts.
Preferably, the third sliding block and the second hydraulic rod are fixed through bolts, the second hydraulic rod and the second supporting plate are fixed through bolts, the second supporting plate and the suction nozzle are fixed through bolts, the second supporting plate and the soldering tin head are fixed through bolts, and the second supporting plate and the cold air blast lamp are fixed through bolts.
Preferably, the workbench and the fixed platform are fixed through bolts, and the fixed platform and the fixed frame are fixed through bolts.
Compared with the prior art, the utility model has the beneficial effects that:
1. the first hydraulic rod is arranged, so that the device can be fixed.
2. The height of the jointing device can be adjusted by arranging the second hydraulic rod.
3. The sliding groove is arranged, so that the position of the first connecting plate can be adjusted, and the efficiency is improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model and not to limit the utility model. In the drawings:
FIG. 1 is a front view of a die bonding apparatus for die processing according to the present invention;
FIG. 2 is a left side view of a die bonding apparatus for die processing according to the present invention;
FIG. 3 is a top view of a die bonding apparatus for die processing according to the present invention;
fig. 4 is an isometric view of a die bonding apparatus for die processing according to the present invention.
Reference numbers in the figures:
1. a fixing plate; 2. a first hydraulic rod; 3. a work table; 4. a sliding groove; 5. a limiting hole; 6. a first sliding block; 7. a first connecting plate; 8. a first support plate; 9. a first guide rail; 10. a second sliding block; 11. a second guide rail; 12. a third sliding block; 13. a second hydraulic rod; 14. a second support plate; 15. a suction nozzle; 16. soldering a tin head; 17. a cold air blast lamp; 18. a fixed table; 19. a fixing frame.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
Example (b): as shown in fig. 1 to 4, the present invention provides a technical solution, a chip bonding apparatus for chip processing, including a fixing plate 1, a first hydraulic rod 2 is arranged at the upper end of the fixing plate 1, and a worktable 3 is arranged at the upper end of the first hydraulic rod 2; fixed plate 1 and a hydraulic stem 2 cooperation use, can fixed workstation 3, can joint the chip on the workstation 3.
A sliding groove 4 is formed in the workbench 3, a limiting hole 5 is formed in the outer side of the sliding groove 4, a first sliding block 6 is arranged at the upper end of the workbench 3, a first connecting plate 7 is arranged at the upper end of the first sliding block 6, and a first supporting plate 8 is arranged at the upper end of the first connecting plate 7; the sliding groove 4 is integrally formed in the workbench 3, the limiting hole 5 is integrally formed in the workbench 3, and the first sliding block 6 can drive the first connecting plate 7 and the first supporting plate 8 to move and be fixed on the workbench 3 through the sliding groove 4 and the limiting hole 5.
The lower end of the first support plate 8 is provided with a first guide rail 9, the lower end of the first guide rail 9 is provided with a second sliding block 10, the lower end of the second sliding block 10 is provided with a second guide rail 11, and the lower end of the second guide rail 11 is provided with a third sliding block 12; the first guide rail 9 and the second sliding block 10 are matched for use, so that the vertical movement can be realized, and the second guide rail 11 and the third sliding block 12 are matched for use, so that the horizontal movement can be realized.
A second hydraulic rod 13 is arranged at the lower end of the third sliding block 12, a second supporting plate 14 is arranged at the lower end of the second hydraulic rod 13, a suction nozzle 15 is arranged at the lower end of the second supporting plate 14, a soldering tin head 16 is arranged outside the suction nozzle 15, and a cold air lamp 17 is arranged outside the suction nozzle 15; the second hydraulic rod 13 and the second support plate 14 are matched for use, and the heights of the suction nozzle 15, the soldering tin head 16 and the cold air blast lamp 17 can be adjusted.
A fixed table 18 is arranged at the upper end of the workbench 3, and a fixed frame 19 is arranged at the upper end of the fixed table 18; the workbench 3 is matched with the fixed table 18 for use, the fixed table 18 can be fixed, the fixed table 18 is matched with the fixed frame 19 for use, and the fixed frame 19 can be fixed.
Preferably, the fixing plate 1 is welded with the first hydraulic rod 2, and the first hydraulic rod 2 is welded with the workbench 3; the sliding groove 4 is integrally formed in the workbench 3, the limiting hole 5 is integrally formed in the workbench 3, the workbench 3 is in sliding connection with the first sliding block 6, the first sliding block 6 and the first connecting plate 7 are fixed through bolts, and the first connecting plate 7 and the first supporting plate 8 are fixed through bolts; the first guide rail 9 and the first support plate 8 are fixed through bolts, the first guide rail 9 and the second slide block 10 are in sliding connection and fixed through bolts, the second slide block 10 and the second guide rail 11 are fixed through bolts, and the third slide block 12 and the second guide rail 11 are in sliding connection and fixed through bolts; the third sliding block 12 and the second hydraulic rod 13 are fixed through bolts, the second hydraulic rod 13 and the second supporting plate 14 are fixed through bolts, the second supporting plate 14 and the suction nozzle 15 are fixed through bolts, the second supporting plate 14 and the soldering tin head 16 are fixed through bolts, and the second supporting plate 14 and the cold air lamp 17 are fixed through bolts; the table 3 and the fixed table 18 are fixed by bolts, and the fixed table 18 and the fixed frame 19 are fixed by bolts.
The working principle and the using process of the utility model are as follows:
the four first hydraulic rods 2 are independent from each other, and the first hydraulic rods 2 extend to drive the fixing plate 1 to contact the ground until reaching the fixing device; the sliding groove 4 and the limiting hole 5 are matched with the first sliding block 6 to realize horizontal movement and fixation, the first sliding block 6 is fixed with the first connecting plate 7, and the first connecting plate 7 is fixed with the first supporting plate 8; the second sliding block 10 can vertically move on the first guide rail 9, the second sliding block 10 is fixed with the second guide rail 11, the third sliding block 12 can horizontally move on the second guide rail 11, and the third sliding block 12 is matched with the second guide rail 11 and can vertically move; the second hydraulic rod 13 drives the suction nozzle 15, the soldering tin head 16 and the cold air blast lamp 17 to move, the height is adjusted, the chip is adsorbed on the suction nozzle 15, the soldering tin head 16 is used for soldering the chip, and hydrogen and inert gas are contained in the cold air blast lamp 17 and can be released; the fixed platform 18 is fixed with a fixed frame 19, and the discharge circuit board and the main board are arranged on the fixed frame 19.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the utility model. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. A chip bonding apparatus for chip processing, comprising a fixing plate (1), characterized in that: a first hydraulic rod (2) is arranged at the upper end of the fixing plate (1), and a workbench (3) is arranged at the upper end of the first hydraulic rod (2); a sliding groove (4) is formed in the workbench (3), a limiting hole (5) is formed in the outer side of the sliding groove (4), a first sliding block (6) is arranged at the upper end of the workbench (3), a first connecting plate (7) is arranged at the upper end of the first sliding block (6), and a first supporting plate (8) is arranged at the upper end of the first connecting plate (7); a first guide rail (9) is arranged at the lower end of the first support plate (8), a second sliding block (10) is arranged at the lower end of the first guide rail (9), a second guide rail (11) is arranged at the lower end of the second sliding block (10), and a third sliding block (12) is arranged at the lower end of the second guide rail (11); a second hydraulic rod (13) is arranged at the lower end of the third sliding block (12), a second supporting plate (14) is arranged at the lower end of the second hydraulic rod (13), a suction nozzle (15) is arranged at the lower end of the second supporting plate (14), a soldering tin head (16) is arranged outside the suction nozzle (15), and a cold air lamp (17) is arranged outside the suction nozzle (15); the upper end of the workbench (3) is provided with a fixed table (18), and the upper end of the fixed table (18) is provided with a fixed frame (19).
2. The die bonding apparatus for die processing according to claim 1, wherein: the fixing plate (1) is welded with the first hydraulic rod (2), and the first hydraulic rod (2) is welded with the workbench (3).
3. The die bonding apparatus for die processing according to claim 1, wherein: sliding tray (4) integrated into one piece in workstation (3), spacing hole (5) integrated into one piece in workstation (3), workstation (3) with slider (6) sliding connection, slider (6) with connecting plate (7) pass through the bolt fastening, connecting plate (7) with backup pad (8) pass through the bolt fastening.
4. The die bonding apparatus for die processing according to claim 1, wherein: a guide rail (9) with a backup pad (8) passes through the bolt fastening, a guide rail (9) with No. two slider (10) sliding connection and pass through the bolt fastening, No. two slider (10) with No. two guide rail (11) pass through the bolt fastening, No. three slider (12) with No. two guide rail (11) sliding connection and pass through the bolt fastening.
5. The die bonding apparatus for die processing according to claim 1, wherein: no. three slider (12) with No. two hydraulic stem (13) pass through the bolt fastening, No. two hydraulic stem (13) with No. two backup pad (14) pass through the bolt fastening, No. two backup pad (14) with suction nozzle (15) pass through the bolt fastening, No. two backup pad (14) with soldering tin head (16) pass through the bolt fastening, No. two backup pad (14) with cold air blast lamp (17) pass through the bolt fastening.
6. The die bonding apparatus for die processing according to claim 1, wherein: the workbench (3) and the fixed platform (18) are fixed through bolts, and the fixed platform (18) and the fixed frame (19) are fixed through bolts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121890603.5U CN215771075U (en) | 2021-08-13 | 2021-08-13 | Chip jointing device for chip processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121890603.5U CN215771075U (en) | 2021-08-13 | 2021-08-13 | Chip jointing device for chip processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215771075U true CN215771075U (en) | 2022-02-08 |
Family
ID=80074096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121890603.5U Active CN215771075U (en) | 2021-08-13 | 2021-08-13 | Chip jointing device for chip processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215771075U (en) |
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2021
- 2021-08-13 CN CN202121890603.5U patent/CN215771075U/en active Active
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