CN215762132U

CN215762132U - Cooling device of air compressor

Info

Publication number: CN215762132U
Application number: CN202122081752.3U
Authority: CN
Inventors: 杨晶
Original assignee: Tianjin Linkstrong Technology Development Co ltd
Current assignee: Tianjin Linkstrong Technology Development Co ltd
Priority date: 2021-08-31
Filing date: 2021-08-31
Publication date: 2022-02-08
Anticipated expiration: 2031-08-31

Abstract

The utility model discloses a cooling device of an air compressor, which comprises a cooling box, wherein a circulating mechanism is arranged on one side of the outer side wall of the cooling box, and a backflow port is arranged on one side of the cooling box, which is far away from the circulating mechanism. When the device is used, the winding pipe is wound on the surface of the compressor, the water in the cooling tank and the water in the winding pipe are continuously circulated through the circulating pump, so that the compressor is cooled, the refrigerating mechanism can further cool the water in the cooling tank, and the compressor is cooled by ensuring that the water in the winding pipe is always at a lower temperature, so that the waste utilization of the condensed water is realized, and the cooling effect of the compressor is improved.

Description

Cooling device of air compressor

Technical Field

The utility model relates to the technical field of compressor cooling, in particular to a cooling device of an air compressor.

Background

An air compressor is a device used to compress gas, and is similar in construction to a water pump, most of which are reciprocating piston type, rotating vane or rotating screw, and centrifugal compressor is a very large application. Air compressors are of many types and are classified according to the working principle: volumetric, dynamic (speed or turbine), thermal compressors; according to the application, the method comprises the following steps: refrigerator compressors, air conditioner compressors, refrigeration compressors, and the like.

The air compressor can generate large heat in the working process, generally, the heat is dissipated through the fan, and the heat dissipation effect is poor. In addition, the air compressor can generate condensed water in the working process, and the condensed water can be directly discharged generally, so that the condensed water is wasted.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defects in the prior art and provides a cooling device of an air compressor.

In order to achieve the purpose, the utility model adopts the following technical scheme: the utility model provides an air compressor's cooling device, includes the cooler bin, cooler bin lateral wall one side is equipped with circulation mechanism, one side that circulation mechanism was kept away from to the cooler bin is equipped with the backward flow mouth, cooler bin lateral wall top is equipped with the oral siphon, the one end that the cooler bin was kept away from to the oral siphon is connected with the condenser pipe of compressor, the cooler bin bottom is equipped with the overflow pipe, one side that circulation mechanism was kept away from to the cooler bin lateral wall is equipped with refrigerating mechanism, the refrigerating mechanism top is equipped with heat dissipation mechanism.

Furthermore, the filter is arranged in the middle of the water inlet pipe, and condensed water can be filtered.

Further, the overflow pipe middle part is equipped with the solenoid valve, one side that the circulation mechanism was kept away from to the cooler bin lateral wall is equipped with the controller, cooler bin inside wall top is equipped with level sensor, solenoid valve and level sensor all with controller electric connection, have the comdenstion water to flow into the back always in the cooler bin, the controller can control the solenoid valve and open and drain off partly water, guarantees that the water in the cooler bin is in dynamic balance always for the water in the cooler bin is enough to circulate.

Furthermore, one side of the top end of the cooling box is provided with a steam port, water returns to the cooling box through the winding pipe and is evaporated in a small amount, and the steam port is convenient for discharging hot steam in the cooling box.

Further, the circulation mechanism includes the circulating pump, the circulating pump is connected with drinking-water pipe and drain pipe, the drinking-water pipe other end and the inside intercommunication of cooler bin, the drain pipe other end is connected with the winding pipe, the one end that the drain pipe was kept away from to the winding pipe is connected with the backward flow mouth for the water in cooler bin and the winding pipe can the circulation flow.

Further, refrigerating mechanism includes semiconductor refrigeration piece and a plurality of fin, the refrigeration side and the laminating of cooler bin lateral wall of semiconductor refrigeration piece, it is a plurality of the fin all with the heat dissipation side fixed connection of semiconductor refrigeration piece, can carry out quick cooling to the water in the cooler bin through the semiconductor refrigeration piece.

Further, heat dissipation mechanism includes two curb plates, motor and a plurality of flabellum, two the curb plate rotates jointly and is connected with the pivot, motor and arbitrary curb plate fixed connection, curb plate and motor drive end fixed connection are passed to pivot one end, and is a plurality of the flabellum all is connected with pivot fixed surface, improves the radiating effect of semiconductor refrigeration piece, and then improves the refrigeration effect of semiconductor refrigeration piece system cold side.

The utility model has the beneficial effects that:

1. when the device is used, the water inlet is connected with the condenser pipe of the compressor, so that condensed water discharged from the condenser pipe of the compressor can be collected into the cooling box, the circulating mechanism comprises the circulating pump, the water pumping pipe, the water discharging pipe and the winding pipe, when the device is used, the winding pipe is wound on the surface of the compressor, the water in the cooling box and the water in the winding pipe are continuously circulated through the circulating pump, the compressor is cooled, the refrigerating mechanism can further cool the water in the cooling box, and therefore the compressor is cooled by ensuring that the water in the winding pipe is always at a low temperature, waste utilization of the condensed water is achieved, and the cooling effect of the compressor is improved.

2. When the semiconductor refrigeration device is used, the heat dissipation mechanism is arranged and comprises the side plate, the rotating shaft, the motor and the fan blades, and the fan blades are driven to rotate by the motor, so that the heat dissipation effect of the heat dissipation side of the semiconductor refrigeration sheet on the refrigeration mechanism is improved, the refrigeration effect of the semiconductor refrigeration sheet is further enhanced, and the water cooling speed in the cooling box is higher.

3. When the water level sensor is used, when the water level in the cooling tank reaches the liquid level sensor, the controller can control the electromagnetic valve to be opened, and water in the cooling tank can be discharged from the overflow pipe, so that the water in the cooling tank is always kept at a fixed amount.

Drawings

FIG. 1 is a perspective view of the present invention;

FIG. 2 is a main sectional view of the present invention;

fig. 3 is a front view of the present invention.

Illustration of the drawings:

1. a cooling tank; 2. a circulating mechanism; 21. a circulation pump; 22. a water pumping pipe; 23. a drain pipe; 24. winding the tube; 3. a return port; 4. a water inlet pipe; 5. a filter; 6. an overflow pipe; 7. an electromagnetic valve; 8. a liquid level sensor; 9. a controller; 10. a steam port; 11. a refrigeration mechanism; 111. a semiconductor refrigeration sheet; 112. a heat sink; 12. a heat dissipation mechanism; 121. a side plate; 122. a rotating shaft; 123. a motor; 124. a fan blade.

Detailed Description

As shown in fig. 1-3, a cooling device of an air compressor is provided, which includes a cooling box 1, a circulation mechanism 2 is disposed on one side of the outer side wall of the cooling box 1, a backflow port 3 is disposed on one side of the cooling box 1 away from the circulation mechanism 2, an inlet pipe 4 is disposed on the top end of the side wall of the cooling box 1, one end of the inlet pipe 4 away from the cooling box 1 is connected to a condensation pipe of the compressor, an overflow pipe 6 is disposed at the bottom end of the cooling box 1, a refrigeration mechanism 11 is disposed on one side of the outer side wall of the cooling box 1 away from the circulation mechanism 2, and a heat dissipation mechanism 12 is disposed on the top end of the refrigeration mechanism 11. The middle part of the water inlet pipe 4 is provided with a filter 5. A steam port 10 is arranged at one side of the top end of the cooling box 1.

As shown in fig. 1, the refrigeration mechanism 11 includes a semiconductor refrigeration piece 111 and a plurality of heat dissipation fins 112, a refrigeration side of the semiconductor refrigeration piece 111 is attached to an outer side wall of the cooling box 1, and the plurality of heat dissipation fins 112 are all fixedly connected to a heat dissipation side of the semiconductor refrigeration piece 111. The heat dissipation mechanism 12 includes two side plates 121, a motor 123 and a plurality of fan blades 124, the two side plates 121 rotate together and are connected with a rotating shaft 122, the motor 123 is fixedly connected with any one side plate 121, one end of the rotating shaft 122 penetrates through the side plates 121 and is fixedly connected with a driving end of the motor 123, and the plurality of fan blades 124 are fixedly connected with the surface of the rotating shaft 122.

As shown in FIG. 2, an electromagnetic valve 7 is arranged in the middle of the overflow pipe 6, a controller 9 is arranged on one side, away from the circulating mechanism 2, of the outer side wall of the cooling box 1, a liquid level sensor 8 is arranged at the top end of the inner side wall of the cooling box 1, and the electromagnetic valve 7 and the liquid level sensor 8 are both electrically connected with the controller 9. The circulating mechanism 2 comprises a circulating pump 21, the circulating pump 21 is connected with a water pumping pipe 22 and a water draining pipe 23, the other end of the water pumping pipe 22 is communicated with the inside of the cooling box 1, the other end of the water draining pipe 23 is connected with a winding pipe 24, and one end, away from the water draining pipe 23, of the winding pipe 24 is connected with the return port 3.

When in use: winding pipe 24 twines on the air compressor surface, and the comdenstion water that air compressor produced can be followed inlet tube 4 and get into inside cooler bin 1, and filter 5 the comdenstion water, semiconductor refrigeration piece 111 begins to cool off the water in cooler bin 1 this moment, motor 123 drives pivot 122 and flabellum 124 rotation simultaneously in this moment, can improve the radiating rate of fin 112 on semiconductor refrigeration piece 111, circulating pump 21 can take out the cold water in cooler bin 1 and send into in winding pipe 24, and then cool off the compressor, the cold water heats after the heat is exchanged to this moment, and return to cooler bin 1 from return opening 3, form circulative cooling from this.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.

Claims

1. A cooling device of an air compressor comprises a cooling box (1), and is characterized in that: cooler bin (1) lateral wall one side is equipped with circulation mechanism (2), one side that circulation mechanism (2) were kept away from in cooler bin (1) is equipped with backward flow mouth (3), cooler bin (1) lateral wall top is equipped with oral siphon (4), the one end that cooling bin (1) were kept away from in oral siphon (4) is connected with the condenser pipe of compressor, cooler bin (1) bottom is equipped with overflow pipe (6), one side that circulation mechanism (2) were kept away from to cooler bin (1) lateral wall is equipped with refrigeration mechanism (11), refrigeration mechanism (11) top is equipped with heat dissipation mechanism (12).

2. The cooling device of an air compressor according to claim 1, wherein: and a filter (5) is arranged in the middle of the water inlet pipe (4).

3. The cooling device of an air compressor according to claim 1, wherein: overflow pipe (6) middle part is equipped with solenoid valve (7), one side that circulation mechanism (2) was kept away from to cooler bin (1) lateral wall is equipped with controller (9), cooler bin (1) inside wall top is equipped with level sensor (8), equal and controller (9) electric connection of solenoid valve (7) and level sensor (8).

4. The cooling device of an air compressor according to claim 1, wherein: a steam port (10) is arranged on one side of the top end of the cooling box (1).

5. The cooling device of an air compressor according to claim 1, wherein: circulating mechanism (2) are including circulating pump (21), circulating pump (21) are connected with drinking-water pipe (22) and drain pipe (23), the inside intercommunication of drinking-water pipe (22) other end and cooler bin (1), drain pipe (23) other end is connected with winding pipe (24), the one end that drain pipe (23) were kept away from in winding pipe (24) is connected with backward flow mouth (3).

6. The cooling device of an air compressor according to claim 1, wherein: refrigerating mechanism (11) include semiconductor refrigeration piece (111) and a plurality of fin (112), the system cold side and the laminating of cooler bin (1) lateral wall of semiconductor refrigeration piece (111) are a plurality of fin (112) all with the heat dissipation side fixed connection of semiconductor refrigeration piece (111).

7. The cooling device of an air compressor according to claim 1, wherein: heat dissipation mechanism (12) include two curb plates (121), motor (123) and a plurality of flabellum (124), two curb plate (121) rotate jointly and are connected with pivot (122), motor (123) and arbitrary curb plate (121) fixed connection, curb plate (121) and motor (123) drive end fixed connection are passed to pivot (122) one end, and are a plurality of flabellum (124) all are connected with pivot (122) fixed surface.