CN215754148U

CN215754148U - Wafer packaging structure

Info

Publication number: CN215754148U
Application number: CN202122017154.XU
Authority: CN
Inventors: 唐伟民; 尹士平
Original assignee: Anhui Guangzhi Technology Co Ltd
Current assignee: Anhui Guangzhi Technology Co Ltd
Priority date: 2021-08-25
Filing date: 2021-08-25
Publication date: 2022-02-08
Anticipated expiration: 2031-08-25

Abstract

The utility model provides a wafer packaging structure, which comprises a wafer packaging box and an outer packaging box; the wafer packaging box comprises a box body, a box bottom and a box cover, wherein the box body is composed of a plurality of layers of wafer packaging bodies, each layer of wafer packaging body comprises a plurality of holes for containing wafers, the box bottom is arranged at the bottom of each layer of wafer packaging body, the box cover covers the top of each layer of wafer packaging body, and the wafer packaging box is contained in the outer packaging box. According to the wafer packaging structure provided by the utility model, the pearl cotton with proper density is selected as the buffer material in the wafer packaging structure, the pearl cotton is subjected to molding design according to the size of the wafer to form a layer of wafer packaging body, and the outer surface of the outer double-corrugated paper box is made of the E-paper with good toughness, so that the hardness of the paper box is enhanced, a certain external force can be applied to extrude and impact the paper box, and the problems existing in the conventional wafer packaging structure are well solved.

Description

Wafer packaging structure

Technical Field

The utility model belongs to the field of infrared material packaging, and particularly relates to a packaging box for storing and transporting infrared optical wafers.

Background

The infrared material refers to a material which is applied to guidance technology and infrared imaging and used for manufacturing optical filters, lenses, prisms, window pieces, fairings and the like. Infrared materials mainly include zinc selenide wafers, zinc sulfide wafers, germanium single/multi-wafers, silicon wafers, chalcogenide glass sheets, and the like, and most of these materials are relatively hard and brittle, and therefore require the inner packaging material to be soft in texture. If it is also to be ensured that the product is not damaged during transport, the outer packaging design also requires the use of a packaging material with a certain stiffness in order to withstand the external pressure that is not expected during transport, and also the pressure or impact from the sides.

The main packaging schemes before are: the characteristic of expansion with heat and contraction with cold of the sticking film is utilized, the wafer is attached to the paper board in a mode of heating the sticking film, then the wafer attached to the paper board and the paper board are vertically inserted into a common paper box, and the space between the boards and the periphery of the paper box are separated by pearl cotton. Such a packaging method has the following problems.

(1) The used film is made of PE material, the wafer is attached to the paperboard in a mode of cooling after heating, the film is required to be torn from the paperboard when the wafer is detached, then the wafer is pulled from the film, and a certain pulling force is required, so that the wafer is easy to have edge breakage and corner breakage;

(2) the contact surface of the film and the product is coated with a small amount of glue, and after the packaged wafer is placed for a long time, the surface of the product can leave marks of the glue, so that the appearance of the blank sheet is unqualified easily.

(3) When the weight of the product is heavy, the film layer and the paper surface can be separated due to vibration during the transportation of the wafer, the wafer runs out of the film layer, and the wafer can be collided to cause damage.

(4) The material of the common double-corrugated paper box is softer, and when the common double-corrugated paper box is impacted or extruded by certain external force, the paper box is easy to damage, so that the wafer is damaged.

Disclosure of Invention

In order to solve the above problems in the prior art, the present invention provides a package structure of an optical wafer, and the specific technical solution is as follows.

A chip package structure comprises a chip package box and an outer package box; the wafer packaging box comprises a box body, a box cover and a box bottom, wherein the box body is composed of a plurality of layers of wafer packaging bodies, each layer of wafer packaging bodies comprise a plurality of holes for containing wafers, the box bottom is arranged at the bottom of each layer of wafer packaging body, the box cover covers the top of each layer of wafer packaging body, and the wafer packaging box is contained in the outer packaging box.

Preferably, the box body is bonded with the box bottom.

Preferably, the box cover, the box body and the box body are wound into a shape like a Chinese character 'tian' through adhesive tapes to be fixed.

Preferably, the positions of the holes of the two adjacent layers of the wafer packages are staggered in the vertical direction.

Preferably, the outer packing box is a double-corrugated paper box, and the outer layer material of the paper box is manicure paper.

Preferably, the material of the wafer packaging body is low-density pearl cotton, and the material of the box cover and the box bottom is high-density pearl cotton.

Preferably, the distance from the opening of the edge of each layer of the wafer package body to the edge of the wafer package body is not less than 20 mm.

Preferably, the wafer packaging structure further comprises a box body high section, and the box body high section is matched with the wafer packaging body for use.

The wafer packaging structure provided by the utility model has the following advantages.

(1) Each layer of the wafer packaging body is made of pearl wool materials, so that the wafer packaging body not only can play a good buffering role, but also can restore to the original shape to form a secondary protection role after being deformed by external force after the external force is eliminated.

(2) The pearl cotton material is perforated in each layer of the wafer packaging body, the wafer is placed in the pearl cotton material, the wafer is easy to put in and take out from the jack, and the wafer can not be imprinted on the surface of the wafer along with the storage time.

(3) According to the packaging scheme, the positions for containing the wafers in the upper and lower wafer packaging bodies are completely staggered, and a certain buffering effect is achieved on the pressure generated in the vertical direction.

(4) According to the packaging scheme, the box body, the box cover and the box bottom are wound by the adhesive tape to be integrated, and a product is not easy to run out of the jack.

(5) The packaging scheme of the utility model can design corresponding pearl cotton holes for placing the wafers according to different specifications of the wafers, and can be suitable for packaging wafers of various specifications.

(6) The packaging scheme of the utility model adopts the paper of Meiniu paper as the paper surface outside the box, which can bear the extrusion of external force and better protect the wafer.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Description of the drawings fig. 1 is a top view of a lid of a wafer packaging structure according to the present invention.

Description figure 2 is a top view of two adjacent layers of wafer packages of the wafer packaging structure of the present invention.

Description figure 3 is a side view of the bottom wafer package and the bottom of the high density EPE box of the present invention.

Description figure 4 is a side view of the elevated section of the body of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The utility model provides a wafer packaging structure, which comprises a wafer packaging box and an outer packaging box; the wafer packaging box comprises a box body, a box cover and a box bottom, wherein the box body is composed of a plurality of layers of wafer packaging bodies, each layer of wafer packaging bodies comprise a plurality of holes for containing wafers, the box bottom is arranged at the bottom of each layer of wafer packaging body, the box cover covers the top of each layer of wafer packaging body, and the wafer packaging box is contained in the outer packaging box.

The specific design points are as follows.

(1) Multilayer wafer package made of pearl wool material

The wafer packaging structure of the utility model selects pearl wool as a built-in material to manufacture a multilayer wafer packaging body. Each layer of the wafer packaging body adopts a low-density pearl cotton (25 g/L) structure, and the wafer is inserted after the hole is punched in the low-density pearl cotton, so that the positions in contact with the upper surface and the lower surface of the wafer are made of low-density pearl cotton materials (25 g/L), the materials are relatively soft, namely, holes suitable for various wafer specifications are punched by the low-density pearl cotton materials for placing the wafer.

EPE pearl cotton refers to polyethylene foam cotton, belongs to a non-crosslinked closed pore structure, and is a novel environment-friendly packaging material. The low-density polyethylene foam plastic is formed by innumerable independent bubbles generated by physically foaming low-density polyethylene, overcomes the defects of fragility, deformation and poor recovery of common foam rubber, has the advantages of water resistance, moisture resistance, shock resistance, sound insulation, heat preservation, good plastic property, strong toughness, cyclic reconstruction, environmental protection, strong impact resistance and the like, also has good chemical resistance, and is an ideal substitute of the traditional packaging material.

(2) The positions of the holes in the upper and lower adjacent two layers of wafer packages are staggered

In the formed multilayer wafer packaging body, the positions of the wafer openings of the adjacent upper and lower packaging bodies are completely staggered, so that the design is that the product can bear the pressure from the upper side, after the double-layer wafer packaging body is stacked into a paper box, the positions of the wafers are required to be staggered, the positions of the upper and lower product devices can be completely staggered by the design that the distances between the holes in the pearl cotton wafer packaging body and the edges of the packaging bodies are different.

The method can be concretely adopted as follows: the distance from the first row of holes to the edge of the package above the first row of holes is different from the distance from the last row of holes to the edge of the package below the last row of holes. The distance from the first row of holes of the upper layer of packaging body to the edge of the packaging body above the first row of packaging body is narrow, and the second layer of packaging body rotates for 180 degrees to be placed, so that the distance from the first row of holes of the second layer of packaging body to the edge of the packaging body above the second row of packaging body is wide, and the positions of placing the wafers of the adjacent upper and lower layers of packaging bodies can be completely staggered.

When the whole package is subjected to pressure from top to bottom, the wafers placed on the upper package body are stressed and then the pressure is transferred to the positions among the openings of the lower package body, so that the wafers on the upper layer are not directly transferred to the wafers on the lower layer when the wafers on the lower layer are stressed, and the goods are damaged.

In order to prevent the periphery from being accidentally collided, the distance between the holes at the side edges of each layer of the wafer packaging body which is internally molded and the edges of the packaging body cannot be less than 20 mm.

In practical use, if the depth of the insertion hole of the wafer packaging body is not enough, the box body heightening section can be added to be matched with the wafer packaging body for use, so that the depth of the insertion hole is deepened.

(3) The multilayer packaging body further has a box cover and a box bottom protection

In order to keep the whole package not easy to deform and bear extrusion of a certain side face, the box bottom is made of high-density pearl cotton (35 g/L) and is bonded with a multi-layer wafer package body made of low-density pearl cotton after holes are punched. After the multi-layer packaging body with the wafer and the box bottom are filled into an outer packaging box, a layer of high-density pearl cotton (35 g/L) is placed at the top to serve as a box cover of the pearl cotton packaging body, and the high-density pearl cotton box cover and the box bottom which are arranged at the upper layer and the lower layer are filled into a paper box, so that the effect of protecting the external force around the paper box can be achieved.

(4) The chip package is wound into a whole

After the multilayer chip package body is placed in the chip, the multilayer chip package body, the box cover and the box bottom are wound by transparent adhesive according to the shape of Chinese character tian, so that the multilayer chip package body, the box cover and the box bottom are integrated, the phenomenon that the single-layer package body is collided or extruded by external force, the box cover and the package body deform in two different directions upwards/downwards is avoided, a certain gap is formed, and the chip can be shaken off to cause goods loss along with vibration in the transportation process.

(5) Hard outer packing case

The outer packing box is a double-corrugated paper box, the outer layer material of the paper box is American paper with better hardness and toughness, the hardness and the toughness of the paper box are enhanced compared with those of a common corrugated paper box, and the impact resistance of the paper box is obviously stronger than that of a common paper box.

Taking a wafer packaging structure with a receptacle size of 40 × 9 × 30mm in length, the wafer packaging structure can be used for packaging sample wafers with a diameter of 38-42 mm, such as zinc selenide green sheets with a diameter of 38.1mm × 9.0mm in thickness. The structures of the packaging body, the box bottom, the box cover and the like are shown in the attached figures 1-3 of the specification.

Description attached figure 1 is a high density pearl cotton box cover, and size is 305 x 20 mm.

Description attached figure 2 provides two layers of wafer packages which are adjacent up and down, and as shown in the figure, 9 rows and 5 columns of 45 holes are distributed on each layer of wafer package, and the holes are orderly arranged and have uniform intervals.

The upper layer of the wafer package body is shown in the left side of the graph 2, the distance from the first row of the holes to the edge above the first row of the holes is 20.5mm, the distance from the last row of the holes to the edge of the lower layer of the wafer package body is 35.5mm, and the lower layer of the wafer package body is placed as shown in the right side (the structure of the lower layer of the wafer package body is completely the same as that of the upper layer). It can be seen that the positions of the wafers in the upper and lower packages are staggered.

Description figure 3 is a side view of the bottommost wafer package bonded to the bottom of a high density EPE box.

If the depth of the insertion hole of each layer of the wafer packaging body is not enough to place the wafers with larger thickness, a box body heightening section can be additionally arranged on the packaging body, as shown in the attached figure 4 of the specification, the heightening section is 10mm thick and is used for placing the wafers together with the packaging body, and therefore the packaging body can be suitable for packaging wafers with various specifications.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.

Claims

1. A wafer packaging structure is characterized by comprising a wafer packaging box and an outer packaging box; the wafer packaging box comprises a box body, a box cover and a box bottom, wherein the box body is composed of a plurality of layers of wafer packaging bodies, each layer of wafer packaging bodies comprise a plurality of holes for containing wafers, the box bottom is arranged at the bottom of each layer of wafer packaging body, the box cover covers the top of each layer of wafer packaging body, and the wafer packaging box is contained in the outer packaging box.

2. A wafer packaging structure as recited in claim 1, wherein the box body is bonded to the box bottom.

3. The wafer packaging structure of claim 2, wherein the box cover is fixed to the box body and the box bottom by a tape wound in a "tian" shape.

4. The wafer packaging structure as claimed in claim 1, wherein the positions of the openings of two adjacent layers of the wafer packages are vertically staggered.

5. The wafer packaging structure of claim 4, wherein the distance from the first row of openings to the edge of the package above the first row of openings is different from the distance from the last row of openings to the edge of the package below the last row of openings in each layer of the wafer package.

6. The wafer packaging structure of claim 1, wherein the outer packaging box is a double corrugated carton and the outer material of the carton is E-paper.

7. The wafer packaging structure of claim 1, wherein the wafer packaging body is made of low-density pearl wool, and the box cover and the box bottom are made of high-density pearl wool.

8. A wafer packaging structure as recited in claim 1, wherein the distance from the edge opening of each layer of said wafer package to the edge of the wafer package is not less than 20 mm.

9. The wafer packaging structure of claim 1, further comprising a box body height section for cooperating with the wafer packaging body.